Surface Mount PPTC FSMD2920 Series RoHS Compliant & Halogen Free Application: All high-density boards Product Features: 2920 Dimension, Surface mountable, Solid state, Faster time to trip than standard SMD devices. Operation Current: 0.3A~3.0A Maximum Voltage: 6V~60VDC Temperature Range: -40℃ to 85℃ Agency Recognition : UL (E211981) . C-UL (E211981) TÜV (R50090556) Electrical Characteristics (23℃ ℃) Part Number FSMD030-2920-R FSMD050-2920-R FSMD075-2920-R FSMD100-2920-R FSMD125-2920-R FSMD150-2920-R FSMD185-2920-R FSMD200-2920-R FSMD250-2920-R FSMD260-2920-R FSMD300-2920-R Hold Current Trip Current Rated Voltage Max Current Typ. Power IH, A 0.30 0.50 0.75 1.10 1.25 1.50 1.85 2.00 2.50 2.60 3.00 IT, A 0.60 1.00 1.50 2.20 2.50 3.00 3.70 4.00 5.00 5.20 5.20 VMAX,VDC 60 60 33 33 33 33 33 16 16 6 6 IMAX, A 10 10 40 40 40 40 40 40 40 40 40 Pd, W 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 Max Time to Trip Current A 1.5 2.5 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 Resistance Time Sec 3.0 4.0 0.3 0.5 2.0 2.0 2.5 4.5 16.0 20.0 25.0 RMIN Ohms 1.000 0.300 0.180 0.090 0.050 0.050 0.040 0.035 0.025 0.020 0.010 R1MAX Ohms 4.800 1.400 1.000 0.410 0.250 0.230 0.150 0.120 0.085 0.075 0.048 Termination pad characteristics Termination pad materials: Pure Tin Thermal Derating for PPTC Device at Various Ambient Temperatures TEMPERATURE DERATING % -40 -20 158% 134% 0 117% FSMD2920 Product Dimensions (mm) 23 30 40 50 60 70 85 100% 92% 83% 75% 66% 58% 45% Part A B C D E Min Max Min Max Min Max Min Max Min Max Number FSMD030-2920-R 6.73 7.98 4.80 5.44 0.60 1.15 0.50 1.20 0.50 0.90 FSMD050-2920-R 6.73 7.98 4.80 5.44 0.60 1.15 0.50 1.20 0.50 0.90 FSMD075-2920-R 6.73 7.98 4.80 5.44 0.40 1.15 0.50 1.20 0.50 0.90 FSMD100-2920-R 6.73 7.98 4.80 5.44 0.40 1.00 0.50 1.20 0.50 0.90 FSMD125-2920-R 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90 FSMD150-2920-R 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90 FSMD185-2920-R 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 FSMD200-2920-R 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 FSMD250-2920-R 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 FSMD260-2920-R 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 FSMD300-2920-R 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90 Surface Mount PPTC Thermal Derating Curve Thermal Derating Curve - FSMD2920 Series Percentage of Rated Hold and Trip Current 200% 150% A=FSMD125-2920~ 100% FSMD300-2920 50% 0% -40 -20 0 20 40 Ambient Temperature ( ℃) 60 80 B=FSMD030-2920~ FSMD100-2920 Typical Time-To-Trip at 23℃ ℃ A = FSMD030-2920-R B = FSMD050-2920-R C = FSMD075-2920-R D = FSMD100-2920-R E = FSMD125-2920-R F = FSMD150-2920-R G = FSMD185-2920-R H = FSMD200-2920-R I = FSMD250-2920-R J = FSMD260-2920-R K= FSMD300-2920-R A B C D EFGHIJK 100 Time-to-trip (s) 10 1 0.1 0.01 0.001 0.1 1 10 Fault current (A) Part Numbering System Part Marking System F S M D □ □ □ - 2920 - R F200L Current Rating □ □ □ L Part Identification Example Standard Package FSMD030-2920-R~FSMD300-2920-R F : 2.0K Reel/Tape 100 Surface Mount PPTC Pad Layouts、 、Solder Reflow Recommendations The dimensions in the table below provide the recommended pad layout for Surface Mount Device in different footprints. Pad dimensions (Millimeter) A Device Nominal All 2920 Series 5.10 All 1812 Series 3.45 All 1210 Series 2.00 All 1206 Series 2.00 All 0805 Series 1.20 Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max. Preheat : Temperature Min (Tsmin) 150 ℃ Temperature Max (Tsmax) 200 ℃ Time (tsmin to tsmax) 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ ℃ of actual Peak : 20-40 seconds Temperature (tp) Ramp-Down Rate : 6 ℃/second max. 8 minutes max. Time 25 ℃ to Peak Temperature : Note 1: All temperatures refer to the package, measured on the package body surface. B Nominal 2.30 1.78 1.00 1.00 1.00 C Nominal 5.60 3.50 2.80 1.90 1.50 Solder reflow ※ Due to “Lead Free” nature, Temperature and Dwelling Time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended max paste thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Environment : < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board