TSF30U45C Taiwan Semiconductor Trench Schottky Rectifier FEATURES - Patented Trench Schottky technology - Excellent high temperature stability - Low forward voltage - Lower power loss/ High efficiency - High forward surge capability - Compliant to RoHS directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition ITO-220AB MECHANICAL DATA Case: ITO-220AB Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - halogen-free Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test Polarity: As marked Mounting torque: 0.56 Nm max. Weight: 1.7g (approximately) o MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25 C unless otherwise noted) PARAMETER Maximum repetitive peak reverse voltage per device Maximum average forward rectified current per diode Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load per diode Voltage rate of change (rated VR) Isolation voltage from terminal to heatsink t = 1 min Breakdown voltage ( IR =1.0mA ) Maximum instantaneous forward voltage per diode ( Note1 ) SYMBOL TSF30U45C UNIT VRRM 45 V 30 IF(AV) A 15 IFSM 250 A dV/dt 10000 V/μs VAC 1500 V Min. TYP. MAX. VBR 45 - - V IF = 15A TJ = 25°C VF - 0.450 0.50 IF = 15A TJ = 125°C VF - 0.415 0.45 - 150 500 μA - 50 100 mA Maximum instantaneous reverse current per diode at rated reverse voltage TJ = 25°C TJ = 125°C Typical thermal resistance per diode Operating temperature range Storage temperature range IR V O RθjC 4 TJ - 55 to +150 O C TSTG - 55 to +150 O C C/W Note 1: Pulse Test with Pulse Width=300 μs, 1% Duty Cycle Document Number: DS_D1401021 Version: B14 TSF30U45C Taiwan Semiconductor ORDERING INFORMATION PART NO. PACKING CODE GREEN COMPOUND PACKAGE PACKING ITO-220AB 50 / Tube CODE TSF30U45C C0 Suffix "G" EXAMPLE PREFERRED P/N PART NO. PACKING CODE TSF30U45C C0 TSF30U45C C0 TSF30U45C C0G TSF30U45C C0 GREEN COMPOUND DESCRIPTION CODE G Green compound RATINGS AND CHARACTERISTICS CURVES (TA=25oC unless otherwise noted) FIG.1 FORWARD CURRENT DERATING CURVE FIG. 2 TYPICAL FORWARD CHARACTERISTICS 100 INSTANTANEOUS FORWARD CURRENT (A) AVERAGE FORWARD CURRENT (A) 20 15 10 5 WITH HEATSINK 4in x 6in x 0.25in Al-Plate 0 0 25 50 75 100 CASE TEMPERATURE 125 TJ=150oC 10 1 TJ=25oC 0.1 TJ=100oC 0.01 150 0 0.2 (oC) 0.4 0.6 0.8 FORWARD VOLTAGE (V) FIG. 3 TYPICAL REVERSE CHARACTERISTICS FIG. 4 TYPICAL JUNCTION CAPACITANCE 100 10000 TJ=125oC TJ=100oC 10 CAPACITANCE (pF) INSTANTANEOUS REVERSE CURRENT (mA) TJ=125oC 1 TJ=25oC 0.1 1000 100 f=1.0MHz Vslg=50mVp-p 0.01 10 20 30 40 50 60 70 80 90 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Document Number: DS_D1401021 100 10 0.1 1 10 REVERSE VOLTAGE (V) 100 Version: B14 TSF30U45C Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) Min Max Min Max A 4.30 4.70 0.169 0.185 B 2.50 3.16 0.098 0.124 C 2.30 2.96 0.091 0.117 D 0.46 0.76 0.018 0.030 E 6.30 6.90 0.248 0.272 F 9.60 10.30 0.378 0.406 G 3.00 3.40 0.118 0.134 H I 0.95 0.50 1.45 0.90 0.037 0.020 0.057 0.035 J 2.40 3.20 0.094 0.126 K 14.80 15.50 0.583 0.610 L - 4.10 - 0.161 M 12.60 13.80 0.496 0.543 N - 1.45 - 0.057 O 2.41 2.67 0.095 0.105 MARKING DIAGRAM P/N = Specific Device Code G = Green Compound YWW = Date Code F = Factory Code Document Number: DS_D1401021 Version: B14 TSF30U45C Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1401021 Version: B14