TESDQ5V0 Taiwan Semiconductor Small Signal Product Bi-directional ESD Protection Diode FEATURES - Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) - Meet IEC61000-4-4 (EFT) rating. 40A (5/50μs) - 100W peak pulse power per line (tp=8/20μs) - Protects one bi-directional I/O line - Working Voltage: 5V - Packing code with suffix "G" means green compound (halogen free) DFN1006 (0402) MECHANICAL DATA - Case: DFN1006 (0402) - Molding compound flammability rating: UL 94V-0 - Terminal: Gold plated, solderable per MIL-STD-750, method 2026 - High temperature soldering guaranteed : 260oC/10s - Weight: 0.5 mg (approximately) - Marking code: M APPLICATIONS -Cell Phone Handsets and Accessories -Notebooks, Desktops, and Servers -Keypads, Side Keys, LCD Displays -Portable Instrumentation -Touch Panel MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER Peak Pulse Power (tp=8/20μs waveform) ESD per IEC 61000-4-2 (Air) PARAMETER Junction Capacitance KV ±8 o -55 to +150 C MIN MAX UNIT VWM - 5 V IR = 1 mA V(BR) 6 - V VRWM = 5 V IR - 1 μA - 12.5 - 20 IPP = 1 A IPP = 2 A VR = 0 V , f = 1.0 MHz Document Number: DS_S1412016 W ± 15 SYMBOL Stand-Off Voltage Clamping Voltage UNIT 100 TJ , TSTG Junction and Storage Temperature Range Reverse Leakage Current VALUE PPP VESD ESD per IEC 61000-4-2 (Contact) Reverse Breakdown Voltage SYMBOL VC CJ 10 V pF Version: D14 TESDQ5V0 Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 2 Pulse Waveform Fig. 1 Admissible Power Derating Curve 110 120 100 100 Waveform parameters: tr = 8 μs , td = 20 μs 90 70 Percent of IPP Power Rating (%) 80 80 60 40 60 e-1 50 40 td = Ipp / 2 30 20 20 10 0 0 0 20 40 60 80 100 120 Ambient Temperature 140 160 0 180 10 15 20 25 30 Time (us) Fig. 4 Typical Junction Capacitance Fig. 3 Max. Clamping Voltage VS. Peak Pulse Current 15 25 20 Normalized Capacitance (pF) Clamping Voltage, Vc (V) 5 (oC) 15 10 Waveform parameters: tr = 8 μs , td = 20 μs 5 10 5 f = 1.0 MHz 0 0 0 1 2 3 4 5 0 Peak Pulse Current, Ipp (A) 1 2 3 4 5 Reverse Voltage (V) Applications Information ◇ Designed to protect one data, I/O, or power supply line ◇ Designed to protect sensitive electronics from damage or latch-up due to ESD ◇ Designed to replace multilayer varistors (MLVs) in portable applications ◇ Features large cross-sectional area junctions for conducting, high transient currents ◇ Offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLV ◇ The combination of small size and high ESD surge capability makes them ideal for use in portable applications Circuit Board Layout Recommendations Good circuit board layout is critical for suppresion of ESD induced transients ◇ Place the ESD Protection Diode near the input terminals or connectors to restrict transient ◇ Minimize the path length between the ESD Protection Diode and the protected line ◇ Minimize all conductive loops including power and ground loops ◇ The ESD transient return path to ground should be kept as short as possible ◇ Never run critical signals near board edges ◇ Use ground planes whenever possible Document Number: DS_S1412016 Version: D14 TESDQ5V0 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PART NO. SUFFIX (Note 1) TESDQ5V0 PACKING CODE -xx PACKING CODE SUFFIX RJ G PACKAGE PACKING DFN1006 (0402) 10K / 7" Reel Note 1: Part No. Suffix „-xx “ would be used for special requirement EXAMPLE PREFERRED P/N PART NO. TESDQ5V0 RJG TESDQ5V0 TESDQ5V0-E0 RJG TESDQ5V0 PART NO. SUFFIX PACKING CODE PACKING CODE RJ -E0 DESCRIPTION SUFFIX RJ G Multiple manufacture source Green compound G Define manufacture source Green compound PACKAGE OUTLINE DIMENSION DFN1006 (0402) DIM. A Unit (mm) Unit (inch) Min Max Min Max 0.95 1.05 0.037 0.041 B 0.55 0.65 0.022 0.026 C 0.45 0.55 0.018 0.022 D 0.30 TYP. 0.012 TYP. E 0.50 TYP. 0.020 TYP. Unit (mm) Unit (inch) TYP. TYP. X 0.354 0.014 X1 1.110 0.044 Y 0.354 0.014 SUGGEST PAD LAYOUT DIM. Document Number: DS_S1412016 Version: D14 TESDQ5V0 Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1412016 Version: D14