LC5560LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulator ICs Features and Benefits Description • Integrated on-time control circuit (it realizes high power factor by average current control) • Integrated startup circuit (no external startup circuit necessary) • Integrated soft-start circuit (reduces power stress during start-up on the incorporated power MOSFET and output rectifier) • Integrated bias assist circuit (improves startup performance, suppresses VCC voltage droop during operation, and allows use of low-rated ceramic capacitor on VCC pin) • Integrated Leading Edge Blanking (LEB) circuit • Integrated maximum on-time limit circuit • Protection features: ▫ Overcurrent protection (OCP): pulse-by-pulse ▫ Overvoltage protection (OVP): latched shutdown ▫ Overload protection (OLP): latched shutdown ▫ Thermal shutdown (TSD): latched shutdown The LC5560LD series is the power IC for the non-isolated type LED driver which has an incorporated power MOSFET, designed for input capacitorless applications, and making it possible for systems to comply with the harmonics standard (IEC61000-3-2 class C), even during light load condition. The controller adapts the average current control method for realizing high power factors, and the quasi-resonant topology contributes to high efficiency and low EMI noise. The series is housed in DIP8 packages. The rich set of protection features helps to realize low component counts, and high performance-to-cost power supply. The incorporated MOSFET has a VDSS(min) rating of 650 V. The RDS(on)(max) is 1.9 Ω (LC5566LD) to 3.95 Ω (LC5565LD). It is capable of a maximum output power of 20 W on 230 VAC supply to 16 W on universal input supply (85 to 265VAC) (LC5566LD) based on the thermal rating. Note that the maximum output power can be up to 120% to 140% of this value. However, it may be limited in applications with low output voltage or short duty cycle. The PWM oscillation frequency ranges from 60 kHz (LC5566LD) to 72 kHz (LC5565LD). Package: 8-pin DIP Applications • LED lighting fixtures • LED light bulbs Not to scale Typical Application F1 VAC L1 D1 D2 D3 D4 T1 L2 C1 C8 R5 C11 D8 C2 C9 D9 D5 U1 LC556x LD 8 6 D/ST ISENSE 5 LED DZ1 R1 C10 R6 DZ2 R7 R8 C12 C4 VREF C3 Control Part D6 S/GND VCC OCP COMP 1 2 3 4 C5 ROCP LC5560LD-DS R3 R4 C6 D7 C7 SANKEN ELECTRIC CO., LTD. http://www.sanken-ele.co.jp/en/ November 26, 2012 LC5560LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulator ICs Selection Guide POUT* (W) Part Number MOSFET VDSS(min) (V) RDS(on) (max) (Ω) PWM Operation Frequency, fOSC(typ) (kHz) On-Time tON(MAX)(typ) (μs) 230 VAC 85 to 265 VAC LC5565LD 650 3.95 72 9.3 13 10 LC5566LD 650 1.9 60 11.2 20 16 *Based on the thermal rating; the allowable maximum output power can be up to 120% to 140% of this value. However, maximum output power may be limited in such an application with low output voltage or short duty cycle. The polarity value for current specifies a sink as "+," and a source as “−,” referencing the IC. Absolute Maximum Ratings Unless specifically noted, TA is 25°C Characteristic Drain Current1 Single Pulse Avalanche Energy2 Symbol IDPeak EAS Pins Rating Unit LC5565LD Single pulse Notes 8–1 2.5 A LC5566LD Single pulse 8–1 4.0 A LC5565LD ILPeak = 2.0 A, VDD = 99 V, L = 20 mH 8–1 47 mJ LC5566LD ILPeak = 2.7 A, VDD = 99 V, L = 20 mH 8–1 86 mJ Control Part Input Voltage VCC 2–1 35 V OCP Pin Voltage VOCP 3–1 −2.0 to 5.0 V COMP Pin Voltage VCOMP 4–1 −0.3 to 7.0 V VREF Pin Voltage VREF 5–1 −0.3 to 5.0 V ISENSE Pin Voltage VSEN 6–1 −0.3 to 5.0 V Allowable Power Dissipation of MOSFET3 PD1 8–1 0.97 W Operating Ambient Temperature TOP ― −55 to 125 °C Storage Temperature Tstg ― −55 to 125 °C Channel Temperature Tch ― 150 °C Mounted on a 15 mm × 15 mm PCB 1Refer to MOSFET Safe Operating Area Curve. 2Refer to MOSFET Avalanche Energy Derating Coefficient Curve. 3Refer to MOSFET Temperature versus Power Dissipation Curve. LC5560LD-DS SANKEN ELECTRIC CO., LTD. 2 November 26, 2012 LC5560LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulator ICs Electrical Characteristics of Control Part Unless specifically noted, TA is 25°C, VCC is 20 V Characteristic Symbol Test Conditions Pins Min. Typ. Max. Unit Power Supply Startup Operation Operation Start Voltage VCC(ON) 2–1 13.8 15.1 17.3 V Operation Stop Voltage* VCC(OFF) 2–1 8.4 9.4 10.7 V ICC(ON) 2–1 – – 4.7 mA VSTARTUP 8–1 18 21 24 V 2–1 −8.5 −4.0 −1.5 mA 2–1 9.5 11.0 12.5 V 60 72 84 kHz Circuit Current in Operation Startup Circuit Operation Voltage Startup Current Startup Current Threshold Biasing Voltage* ICC(STARTUP) VCC = 13 V VCC(BIAS) Normal Operation PWM Operation Frequency Maximum On-Time COMP Pin Control Minimum Voltage LC5565LD fOSC LC5566LD LC5565LD tON(MAX) LC5566LD 8–1 8–1 50 60 70 kHz 8.0 9.3 11.2 μs 9.0 11.2 13.4 μs VCOMP(MIN) 4–1 0.30 0.55 0.80 V VSEN(TH) 6–1 0.312 0.335 0.358 V ISEN(SOURCE) 4–1 −22 −14 −6 μA Error Amplifier Sink Current ISEN(SINK) 4–1 6 14 22 μA Error Amplifier Reference Voltage Error Amplifier Source Current Leading Edge Blanking Time tON(LEB) 3–1 − 600 − ns Quasi-Resonant Operation Threshold Voltage-1 VBD(TH1) 3–1 0.14 0.24 0.34 V Quasi-Resonant Operation Threshold Voltage-2 VBD(TH2) 3–1 0.11 0.16 0.21 V OCP Pin Overcurrent Protection (OCP) Threshold Voltage VOCP 3–1 −0.66 −0.60 −0.54 V OCP Pin Source Current IOCP 3–1 −120 −40 −10 μA VBD(OVP) 3–1 2.2 2.6 3.0 V Overload Protection (OLP) Threshold Voltage VCOMP(OLP) 4–1 4.1 4.5 4.9 V ISENSE Pin OVP Threshold Voltage VSEN(OVP) 6–1 1.6 2.0 2.4 V VCC Pin OVP Threshold Voltage VCC(OVP) 2–1 28.5 31.5 34.0 V TJ(TSD) – 135 – – °C Protection Operation OCP Pin Overvoltage Protection (OVP) Operation Voltage Thermal Shutdown Activating Temperature *VCC(BIAS) > VCC(OFF) always. LC5560LD-DS SANKEN ELECTRIC CO., LTD. 3 November 26, 2012 LC5560LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulator ICs Electrical Characteristics of MOSFET Unless specifically noted, TA is 25°C Characteristic Symbol Drain-to-Source Breakdown Voltage VDSS Drain Leakage Current IDSS On-Resistance RDS(on) Switching Time tf Thermal Resistance* Rθch-c Test Conditions LC5565LD Pins Min. Typ. Max. Unit 8–1 650 ― ― V 8–1 ― ― 300 μA ― ― 3.95 Ω 8–1 LC5566LD LC5565LD 8–1 LC5566LD LC5565LD ― LC5566LD ― ― 1.9 Ω ― ― 250 ns ― ― 400 ns ― ― 42 °C/W ― ― 35.5 °C/W *The thermal resistance between the channels of the MOSFET and the case. TC measured at the center of the case top surface. Error amplifier reference voltage,VSEN(TH) (V) VREF Pin Voltage versus VSEN(TH) Curve 0.4 0.3 0.2 0.1 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VREF Pin Voltage (V) LC5560LD-DS SANKEN ELECTRIC CO., LTD. 4 November 26, 2012 LC5560LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulator ICs Characteristic Performance LC5565LD MOSFET Safe Operating Area Curve 10 TA = 25°C, single pulse Drain current limited by on-resistance 100 80 Drain Current, ID (A) Safe Operating Area Temperature Derating Coefficient (%) S. O. A. Temperature Derating Coefficient Curve 60 40 20 0 0 25 50 75 100 125 0.1 ms 1 ms 1 0.1 150 To use this graph, apply the S.O.A temperature derating coefficient taken from the graph at the left Channel Temperature, Tch (°C) 0.01 1 10 100 1000 Drain-to-Source Voltage, VDS (V) 100 MOSFET Temperature versus Power Dissipation Curve Allowable Power Dissipation, PD1 (W) EAS Temperature Derating Coefficient (%) MOSFET Avalanche Energy Derating Coefficient Curve 80 60 40 20 0 25 50 75 100 125 150 1.2 1.0 0.8 0.6 0.4 0.2 0 0 Transient Thermal Resistance, Rθch-c (°C/W) Channel Temperature, Tch (°C) 10 25 50 75 100 125 150 Ambient Temperature, TA (°C) Transient Thermal Resistance Curve 1 0.1 0.01 10–6 10–5 10–4 10–3 10–2 10–1 Time (s) LC5560LD-DS SANKEN ELECTRIC CO., LTD. 5 November 26, 2012 LC5560LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulator ICs Characteristic Performance LC5566LD MOSFET Safe Operating Area Curve 10 TA = 25°C, single pulse 0.1 ms 100 1 ms 80 Drain Current, ID (A) Safe Operating Area Temperature Derating Coefficient (%) S. O. A. Temperature Derating Coefficient Curve 60 40 20 0 0 25 50 75 100 125 1 Drain current limited by on-resistance 0.1 150 To use this graph, apply the S.O.A temperature derating coefficient taken from the graph at the left Channel Temperature, Tch (°C) 0.01 1 10 100 1000 Drain-to-Source Voltage, VDS (V) 100 MOSFET Temperature versus Power Dissipation Curve Allowable Power Dissipation, PD1 (W) EAS Temperature Derating Coefficient (%) MOSFET Avalanche Energy Derating Coefficient Curve 80 60 40 20 0 25 50 75 100 125 150 1.2 1.0 0.8 0.6 0.4 0.2 0 0 Transient Thermal Resistance, Rθch-c (°C/W) Channel Temperature, Tch (°C) 10 25 50 75 100 125 150 Ambient Temperature, TA (°C) Transient Thermal Resistance Curve 1 0.1 0.01 10–6 10–5 10–4 10–3 10–2 10–1 Time (s) LC5560LD-DS SANKEN ELECTRIC CO., LTD. 6 November 26, 2012 LC5560LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulator ICs Functional Block Diagram VCC ② Control Part ⑧ D/ST START UP TSD UVLO Reg Drv Bias OVP ① S/GND S RQ OCP ③ Bottom Detection OCP OSC OLP OTA ⑥ ISENSE LEB Feedback Control ④ COMP Reg ⑤ VREF Pin List Table Number Name 1 S/GND 2 VCC Supply voltage input and Overvoltage Protection (OVP) signal input 8 D/ST 3 OCP Overcurrent Protection (OCP), quasi-resonant signal input, and Overvoltage Protection (OVP) signal input 6 ISENSE 4 COMP Feedback phase-compensation input 5 VREF 5 VREF Dimming control signal input 6 ISENSE 7 – 8 D/ST Pin-out Diagram S/GND 1 VCC 2 OCP 3 COMP 4 LC5560LD-DS Function MOSFET source and GND pin for the Control Part Output current detecting voltage input and Overvoltage Protection (OVP) signal input Pin removed MOSFET drain pin and input of the startup current SANKEN ELECTRIC CO., LTD. 7 November 26, 2012 LC5560LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulator ICs Package Diagram DIP8 package 9.4 ±0.3 8 5 LC 6.5 ±0.2 a b c 1.0 +0.3 -0.05 4 1 +0.3 1.52 -0.05 3.3 ±0.2 7.5 ±0.5 4.2 ±0.3 3.4 ±0.1 (7.6 TYP) 0.2 5 + 0. - 0.01 5 ０～１５° ０～１５° 2.54 TYP 0.89 TYP 0.5 ±0.1 a: Part #: 556x b: Lot number 3 digits, plus L st 1 letter: Last digit of year nd 2 letter: Month Jan to September: Numeric October: O November: N December: D rd 3 letter: Week Date 1 to 10: 1 Date 11 to 20: 2 Date 21 to 31: 3 c: Sanken control number Unit: mm Pb-free. Device composition compliant with the RoHS directive. LC5560LD-DS SANKEN ELECTRIC CO., LTD. 8 November 26, 2012 LC5560LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulator ICs Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of the products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the ratings specified by Sanken for the products. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce excess stress. • Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials SC102 Dow Corning Toray Co., Ltd. LC5560LD-DS Soldering • When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10±1 s (Flow, 2 times) 380±10°C 3.5±0.5 s (Soldering iron, 1 time) • Soldering should be at a distance of at least 1.5 mm from the body of the products. Electrostatic Discharge • When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. • Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. • The products should always be stored and transported in Sanken shipping containers or conductive containers, or be wrapped in aluminum foil. SANKEN ELECTRIC CO., LTD. 9 November 26, 2012 LC5560LD Series Single-Stage Power Factor Corrected Off-Line Switching Regulator ICs • The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. • Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. • Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. • Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. • In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly. • When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. • Anti radioactive ray design is not considered for the products listed herein. • Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network. • The contents in this document must not be transcribed or copied without Sanken's written consent. LC5560LD-DS SANKEN ELECTRIC CO., LTD. 10 November 26, 2012