Multilayer Chip Bead CBM0805 RC0201 RC0201 RC0201 Multilayer Chip Bead Features Effective EMI protection Low DC resistance High soldering heat resistance Multiple size availability RoHS compliant Applications Computers and Peripheral Equipment VCRS, Television Cellular Phones Digital Communication Equipment Various Electronics Equipments Circuit Where a Stable Ground is Unavailable Constructions Item Material ① Ferrite Substance (NiO-CuO-ZnO-Ferrite) ② Silver Electrode ③ Electrode (Ag/Cu/Ni/Sn) TAITRON COMPONENTS INCORPORATED www.taitroncomponents.com Tel: (800)-TAITRON Fax: (800)-TAITFAX (800)-824-8766 (800)-824-8329 (661)-257-6060 (661)-257-6415 Rev. A/CW Page 1 of 8 Multilayer Chip Bead CBM0805 Dimensions Unit: mm Type Size Inch (mm) A B C D Weight (g) (1,000pcs) CBM0805 0805(2012) 2.0±0.20 1.25±0.20 0.9±0.20 0.2~0.8 10 Electrical Specifications CBM0805 Type: Impedance (Ω) Tolerance Test Freq. (MHz) DCR (Ω) max. Rated Current (mA) max. 5 7 9 10 11 12 15 17 19 22 26 28 30 31 32 33 39 40 42 ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 500 500 500 500 Rev. A/CW www.taitroncomponents.com Page 2 of 8 Multilayer Chip Bead CBM0805 Impedance (Ω) Tolerance Test Freq. (MHz) DCR (Ω) max. Rated Current (mA) max. 47 50 52 56 60 70 75 80 90 95 100 120 150 180 200 220 240 300 330 400 420 430 450 470 500 600 680 750 1000 1200 1500 2000 2200 2500 2700 ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% ±25% 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 0.1 0.1 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.15 0.25 0.25 0.25 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.4 0.4 0.4 0.4 0.4 0.4 0.5 0.5 0.6 0.6 0.7 0.7 0.7 0.7 500 500 500 500 500 500 500 500 500 500 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 200 200 200 200 200 200 200 200 Rev. A/CW www.taitroncomponents.com Page 3 of 8 Multilayer Chip Bead CBM0805 Environment Characteristics Electrical Characteristic Test Test Item Test Condition Impedance HP4291B DCR Agilent 34401A Requirement Refer to standard electrical spec. Mechanical Characteristic Test Test Item Test Condition Requirement Test device shall be soldered on the substrate Substrate Dimension:100x40x1.6mm Deflection: 2.0mm Keeping Time: 30sec Flexure Strength The forces applied on the right conditions must not damage the terminal electrode and the ferrite Vibration Test device shall be soldered on the substrate Oscillation Frequency : 10 to 55 to 10Hz for 1min Amplitude : 1.5mm Time : 2hrs for each axis (X,Y&Z), total 6hrs Resistance to Soldering Heat Pre-heating: 150°C, 1min Solder Temperature: 260±5°C Immersion Time: 10±1sec Solderability Pre-heating: 150°C, 1min Solder Temperature: 245±5°C Immersion Time: 4±1sec Test device shall be soldered on the substrate The electrodes shall be at least 90% covered with new solder coating ≥1.0kg Terminal Strength Test Temperature Cycle Appearance: No damage More than 75% of the terminal electrode should be covered with solder Impedance: within ±30% of initial value One cycle: One cycle/step1: -55±3°C for 30min step2: 25±2°C for 3.0min step3:125±3°C for 30min step4:25±2°C for 3.0min Total: 100cycles Measured after exposure in the room condition for 24hrs Appearance: No damage Impedance: within±30% of initial value Rev. A/CW www.taitroncomponents.com Page 4 of 8 Multilayer Chip Bead CBM0805 Test Item Test Condition Requirement Temperature: 40±2°C Relative Humidity: 90 ~ 95% time: 1000hrs Measured after exposure in the room condition for 24hrs Temperature: 125±3°C Relative Humidity : 0% Applied Current: Rated Current time: 1000hrs Measured after exposure in the room condition for 24hrs Temperature: -55±3°C TR elative Humidity : 0% time: 1000hrs Measured after exposure in the room condition for 24hrs Humidity Resistance High Temperature Resistance Low Temperature Resistance Appearance: No damage Impedance: within±30% of initial value ■ Operating Temperature: -55°C ~ 125°C ■ Storage Temperature: 25±3°C; Humidity < 80%RH Packing Information: Carrier Tape Dimensions Unit: mm Type A B T W P F K CBM0805 1.42 2.25 1.04 8.0 4.0 3.5 0.22 Rev. A/CW www.taitroncomponents.com Page 5 of 8 Multilayer Chip Bead CBM0805 Reel Dimensions Unit: mm Type A B C D Quantity (EA) CBM0805 178 60 10 2 4,000 Recommended Pattern Unit: mm Type A B C CBM0805 1.2 3.0~4.0 1.0 Rev. A/CW www.taitroncomponents.com Page 6 of 8 Multilayer Chip Bead CBM0805 How to Order CBM 0805 J 150 - xx -TR70 Packing Code TR70:7” Reel, RoHS Factory Location Code Impedance Code: 150: 15Ω; J: Material Code Size Code in inch(mm) 0805(2012) Taitron Multilayer Chip Bead Rev. A/CW www.taitroncomponents.com Page 7 of 8 Multilayer Chip Bead CBM0805 How to contact us US HEADQUARTERS 28040 WEST HARRISON PARKWAY, VALENCIA, CA 91355-4162 Tel: (800)-TAITRON (800)-824-8766 (661)-257-6060 Fax: (800)-TAITFAX (800)-824-8329 (661)-257-6415 Email: [email protected] Http://www.taitroncomponents.com TAITRON COMPONENTS MEXICO, S.A .DE C.V. BOULEVARD CENTRAL 5000 INTERIOR 5 PARQUE INDUSTRIAL ATITALAQUIA, HIDALGO C.P. 42970 MEXICO Tel: +52-55-5560-1519 Fax: +52-55-5560-2190 TAITRON COMPONENTS INCORPORATED TAIWAN, TAIPEI 6F., No.190, Sec. 2, Zhongxing Rd., Xindian Dist., New Taipei City 23146, Taiwan R.O.C. Tel: 886-2-2913-6238 Fax: 886-2-2913-6239 TAITRON COMPONETS INCORPORATED, SHANGHAI REPRESENTATIVE OFFICE METROBANK PLAZA,1160 WEST YAN’AN ROAD, SUITE 1503, SHANGHAI,200052, CHINA Tel: +86-21-5424-9942 Fax: +86-21-5424-9931 CROSS REGION PLAZA, 899 LINGLING ROAD, SUITE 18C, SHANGHAI, 200030, CHINA Tel: +86-21-5424-9942 Fax: +86-21-5424-9931 Rev. A/CW www.taitroncomponents.com Page 8 of 8