Only One Name Means ProTek’Tion™ SOLDER REFLOW FOR STANDARD AND LEAD-FREE PACKAGES TABLE 1 - STANDARD PACKAGE , LEADED PROCESS, PACKAGE PEAK REFLOW TEMPERATURE Package Thickness Volume mm3 < 350 Volume mm3 >= 350 < 2.5mm 240 +0/-5°C 225 +0/-5°C >= 2.5mm 225 +0/-5°C 225 +0/-5°C NOTES: 1. The package thickness and volume dictates the maximum component temperature. The thermal gradients between packages can be reduced by using convection reflow processes. 2. Volume of the package does not account for the external terminals. 3. Package volume is the equivalent of package size multipled by the height. TABLE 2 - LEAD-FREE PROCESS, PACKAGE PEAK REFLOW TEMPERATURE Package Thickness Volume mm3 < 350 Volume mm3 250 - 2000 Volume mm3 > 2000 < 1.6mm 260 +0°C 260 +0°C 260 +0°C 1.6mm - 2.5mm 260 +0°C 250 +0°C 245 +0°C >= 2.5mm 250 +0°C 245 +0°C 245 +0°C NOTES: 1. 2. 3. 4. 5. 6. The profiling tolerance is +0, -X °C but at no time will it exceed -5°C. Volume of the package does not account for the external terminals. The package thickness and volume dictates the maximum component temperature. The thermal gradients between packages can be reduced by using convection reflow processes. Components used in lead-free assembly shall be evaluated using the lead-free classification temperature and profiles as defined in the above table. Table 3 will help determine if the components are lead-free or not. The device manufacturer/supplier shall ensure process compatibility up to and including the stated classification temperature at the rated MSL level. TABLE 3 - CLASSIFICATION REFLOW PROFILES Profile Feature Sn - Pb Eutetectic Assembly Pb-Free Assembly Average Ramp Up Rate (TSMAX to TP) 3°C/seconds Max. 3°C/seconds Max. Preheat Temperature Min TSMIN Temperature MAX TSMAX Time (TSMIN to TSMAX) (ts) 100°C 150°C 60-120 seonds 150°C 200°C 60-180 seconds Time Maintained Above Temperature (TL) Time(tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak/Classification Temperature (TP) See Table 1 See Table 2 Time Within 5°C of Actual Temperature (tP) 10-30 seconds 20-40 seconds Ramp-Down Rate 6°C/seconds Max. 6°C/seconds Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. NOTES: 1. All temperatures refer to topside of the package, measured on the package body surface. 2. Time within 5°C of the actual peak temperature (TP) specified for the reflow profiles is “supplier” minimum and “user” maximum. Rev 0 Jan. 2014 Page 1 www.protekdevices.com Only One Name Means ProTek’Tion™ SOLDER REFLOW FOR STANDARD AND LEAD-FREE PACKAGES Tp Tp Critical Zone TL to Tp Ramp-Up Temperature TL tL Tsmax Tsmin ts Preheat Ramp-Down t 25°C to Peak Rev 0 Jan. 2014 Time Page 2 www.protekdevices.com Only One Name Means ProTek’Tion™ COMPANY INFORMATION COMPANY PROFILE In business more than 20 years, ProTek Devices™ is a privately held semiconductor company. The company offers a product line of overvoltage protection and overcurrent protection components. These include transient voltage suppressor array (TVS arrays) avalanche breakdown diode, steering diode TVS array and electronics SMD chip fuses. These components deliver circuit protection in electronic systems from numerous overvoltage and overcurrent events. They include lightning; electrostatic discharge (ESD); nuclear electromagnetic pulses (NEMP); inductive switching; and electromagnetic interference (EMI) / radio frequency interference (RFI). ProTek Devices also offers high performance interface and linear products. They include analog switches; multiplexers; LED drivers; LED wafer die for ESD protection; audio control ICs; RF and related high frequency products. CONTACT US Corporate Headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: & Marketing: 602-414-5109 Customer Service: 602-414-5114 Product Technical Support: 602-414-5107 By Fax General: 602-431-2288 By E-mail: Asia Sales: [email protected] Europe Sales: [email protected] U.S. Sales: [email protected] Distributor Sales: [email protected] Customer Service: [email protected] Technical Support: [email protected] ProTek Devices (Asia Pacific) Pte. Ltd. 8 Ubi Road 2, #06-19 Zervex Singapore - 408538 Tel: +65-67488312 Fax: +65-67488313 Web www.protekdevices.com COPYRIGHT © ProTek Devices 2013 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. Rev 0 Jan. 2014 Page 3 www.protekdevices.com