Soldering Information Sn-Pb Eutectic Assembly Pb-Free Assembly Ramp-up rate (TL to TP) 3°C/second max. 3°C/second max. Temperature Min (Tsmin) Temperature Max (Tsmax) Time(Ta) from (Tsmin to Tsmax) 100°C 150°C 60-120 seconds 150°C 200°C 60-120 seconds 183°C 60-150second 217°C 60-150seconds 20 second 30 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Parameter Liquidous temperature (TL) Time (tL) maintained above TL Time(TP) with 5°C of the specified Classification temperature(TC) Ramp-down rate(TP to TL) Time 25°C to peak temperature Note1. All temperatures refer to the center or the package, measured on the package body surface that is facing up during assembly reflow Note2. Reflow standard specification reference IPC/JEDEC J-STD-020E Table1-1 SnPb Eutectic Process Classification Temperatures (TC) Package Thickness Volume mm³ <350 Volume mm³ ≧350 < 2.5mm 235°C +0 / -5°C 220°C +0 / -5°C ≧ 2.5mm 220°C +0 / -5°C 220°C +0 / -5°C Table1-2 Pb-Free Process-Classification Temperatures (TC) Package Thickness Volume mm³ <350 Volume mm³ 350~2000 Volume mm³ >2000 < 1.6mm 260°C 260°C 260°C 1.6mm~2.5mm 260°C 250°C 245°C > 2.5mm 250°C 245°C 245°C Suppller TP≥TC User TP≤TC TC TC -5°C User tP Supplier tP Temperature TP tp Max. Ramp Up Rate = 3 + C/S Max. Ramp Down Rate = 6 + C/S TL TC -5ºC t Tsmax Preheat Area Tsmin tS Time 25°C to Peak Time IPC-020e-5-1 Company reserves the right to improve product design , functions and reliability without notice. REV:A QW-1115 Page 1 Comchip Technology CO., LTD.