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Soldering Information
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Ramp-up rate (TL to TP)
3°C/second max.
3°C/second max.
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time(Ta) from (Tsmin to Tsmax)
100°C
150°C
60-120 seconds
150°C
200°C
60-120 seconds
183°C
60-150second
217°C
60-150seconds
20 second
30 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Parameter
Liquidous temperature (TL)
Time (tL) maintained above TL
Time(TP) with 5°C of the specified
Classification temperature(TC)
Ramp-down rate(TP to TL)
Time 25°C to peak temperature
Note1. All temperatures refer to the center or the package, measured on the package body surface that is facing up during assembly reflow
Note2. Reflow standard specification reference IPC/JEDEC J-STD-020E
Table1-1
SnPb Eutectic Process Classification Temperatures (TC)
Package Thickness
Volume mm³ <350
Volume mm³ ≧350
< 2.5mm
235°C +0 / -5°C
220°C +0 / -5°C
≧ 2.5mm
220°C +0 / -5°C
220°C +0 / -5°C
Table1-2
Pb-Free Process-Classification Temperatures (TC)
Package Thickness
Volume mm³ <350
Volume mm³ 350~2000
Volume mm³ >2000
< 1.6mm
260°C
260°C
260°C
1.6mm~2.5mm
260°C
250°C
245°C
> 2.5mm
250°C
245°C
245°C
Suppller TP≥TC
User TP≤TC
TC
TC -5°C
User tP
Supplier tP
Temperature
TP
tp
Max. Ramp Up Rate = 3 + C/S
Max. Ramp Down Rate = 6 + C/S
TL
TC -5ºC
t
Tsmax
Preheat Area
Tsmin
tS
Time 25°C to Peak
Time
IPC-020e-5-1
Company reserves the right to improve product design , functions and reliability without notice.
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Comchip Technology CO., LTD.