SP8J3 Transistors 4V Drive Pch+Pch MOS FET SP8J3 zStructure Silicon P-channel MOS FET zExternal dimensions (Unit : mm) SOP8 5.0 1.75 0.4 (5) (1) (4) 0.2 1.27 1pin mark 0.4Min. 3.9 6.0 zFeatures 1) Low On-resistance. (100mΩ at 4.5V) 2) High Power Package. (PD=2.0W) 3) High speed switching. 4) Low voltage drive. (4V) (8) Each lead has same dimensions zApplications Power switching, DC-DC converter zPackaging specifications zInner circuit (8) Package Type (7) (6) (5) Taping TB Code Basic ordering unit (pieces) 2500 ∗2 ∗2 SP8J3 ∗1 (1) Continuous Pulsed Continuous Pulsed Drain current Source current (Body diode) Total power dissipation Channel temperature Range of Storage temperature (2) (3) ∗1 ESD PROTECTION DIODE ∗2 BODY DIODE zAbsolute maximum ratings (Ta=25°C) <It is the same ratings for Tr1 and Tr2.> Parameter Drain-source voltage Gate-source voltage ∗1 Symbol VDSS VGSS ID IDP ∗1 IS ISP ∗1 PD ∗2 Tch Tstg Limits −30 ±20 ±3.5 ±14 −1.6 −14 2.0 150 −55 to +150 (4) (1) Tr1 Source (2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate (5) Tr2 Drain (6) Tr2 Drain (7) Tr1 Drain (8) Tr1 Drain Unit V V A A A A W °C °C ∗1 Pw≤10µs, Duty cycle≤1% ∗2 Mounted on a ceramic board zThermal resistance Parameter Channel to ambient Symbol Rth(ch-a) ∗ Limits Unit 62.5 °C / W ∗ Mounted on a ceramic board. Rev.A 1/4 SP8J3 Transistors zElectrical characteristics (Ta=25°C) <It is the same characteristics for Tr1 and Tr2.> Parameter Symbol Min. IGSS Gate-source leakage − Drain-source breakdown voltage V(BR) DSS −30 IDSS Zero gate voltage drain current − VGS (th) −1.0 Gate threshold voltage − ∗ Static drain-source on-state RDS (on) − resistance − Yfs ∗ 1.8 Forward transfer admittance Ciss − Input capacitance Coss Output capacitance − Reverse transfer capacitance − Crss Turn-on delay time − td (on) ∗ Rise time − tr ∗ Turn-off delay time − td (off) ∗ Fall time − tf ∗ Total gate charge − Qg ∗ Gate-source charge − Qgs ∗ Gate-drain charge Qgd ∗ − Typ. Max. − − − − 65 100 120 − 490 110 75 10 15 35 10 5.5 1.5 2.0 ±10 − −1 −2.5 90 140 165 − − − − − − − − − − − Unit µA V µA V mΩ mΩ mΩ S pF pF pF ns ns ns ns nC nC nC Conditions VGS=±20V, VDS=0V ID= −1mA, VGS=0V VDS= −30V, VGS=0V VDS= −10V, ID= −1mA ID= −3.5A, VGS= −10V ID= −1.75A, VGS= −4.5V ID= −1.75A, VGS= −4.0V VDS= −10V, ID= −1.75A VDS= −10V VGS=0V f=1MHz ID= −1.75A VDD −15V VGS= −10V RL=8.6Ω RG=10Ω VDD −15V VGS= −5V ID= −3.5A ∗Pulsed zBody diode characteristics (Source-drain) (Ta=25°C) <It is the same characteristics for Tr1 and Tr2.> Parameter Forward voltage Symbol Min. Typ. Max. Unit VSD − − −1.2 V Conditions IS= −1.6A, VGS=0V Rev.A 2/4 SP8J3 Transistors Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 0.1 0.01 0.001 0.5 1.0 1.5 2.0 2.5 3.0 Ta=25°C Pulsed 100 VGS= −4V VGS= −4.5V VGS= −10V 10 1 0.1 1 GATE-SOURCE VOLTAGE : −VGS (V) VGS= −4.5V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 100 10 0.1 1 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) Fig.1 Typical Transfer Characteristics 1000 1 Ciss 100 Coss Crss 100 10 Fig.3 Static Drain-Source On-State Resistance vs. Drain Current 1000 10 VGS= −4V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 100 10 0.1 1 10 VGS=0V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 1 0.1 0.01 0.0 Ta=25°C VDD= −15V VGS= −10V RG=10Ω Pulsed tf 100 td (off) td (on) 10 tr 1 0.01 0.1 1 0.5 1.0 1.5 SOURCE-DRAIN VOLTAGE : −VSD (V) Fig.6 Reverse Drain Current Source-Drain Current Fig.5 Static Drain-Source On-State vs. Drain Current SWITCHING TIME : t (ns) CAPACITANCE : C (pF) 10 0.1 DRAIN CURRENT : −ID (A) 1000 10 100 10 1000 1 Ta=125°C Ta=75°C Ta=25°C Ta= −25°C Fig.2 Static Drain-Source On-State Resistance vs. Drain Current 10 Ta=25°C f=1MHz VGS=0V 0.1 VGS= −10V Pulsed DRAIN CURRENT : −ID (A) Fig.4 Static Drain-Source On-State vs. Drain Current 10 0.01 1000 DRAIN CURRENT : −ID (A) DRAIN CURRENT : −ID (A) 10000 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) 1 1000 REVERSE DRAIN CURRNT : −IDR (A) VDS= −10V Pulsed 10 8 GATE-SOURCE VOLTAGE : −VGS (V) DRAIN CURRENT : −ID (A) 10 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) zElectrical characteristic curves Ta=25°C VDD= −15V ID= −3.5A RG=10Ω Pulsed 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 DRAIN-SOURCE VOLTAGE : −VDS (V) DRAIN CURRENT : −ID (A) TOTAL GATE CHARGE : Qg (nC) Fig.7 Typical Capacitance vs. Drain-Source Voltage Fig.8 Switching Characteristics Fig.9 Dynamic Input Characteristics Rev.A 3/4 SP8J3 Transistors zMeasurement circuits VGS ID VDS VGS 10% 90% RL D.U.T. 90% 90% RG VDD VDS 10% td(on) 10% td(off) tr ton Fig.10 Switching Time Test Circuit tr toff Fig.11 Switching Time Waveforms VG VGS ID VDS RL IG(Const.) D.U.T. Qg VGS Qgs RG Qgd VDD Charge Fig.12 Gate Charge Test Circuit Fig.13 Gate Charge Waveform Rev.A 4/4 Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. About Export Control Order in Japan Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction. Appendix1-Rev1.1