RFM products are now Murata products. SF2250E • • • • Low-loss SAW Filter, 1615 MHz, 20 MHz Bandwidth 3.0 x 3.0 x 1.4 mm Surface-mount Case 50 Input/Output Impedance Complies with Directive 2002/95/EC (RoHS) Pb 1615 MHz SAW Filter Absolute Maximum Ratings Rating Incident Power in Passband Value Units +10 dBm 3 VDC Operating Temperature Range -20 to +70 °C Storage Temperature Range in Tape and Reel -40 to +85 °C 265 °C DC Voltage on any Non-ground Terminal Maximum Soldering Profile, 5 cycles/10 seconds maximum SM3030-6 Electrical Characteristics Characteristic Sym Center Frequency Insertion Loss, 1605 to 1625 MHz Amplitude Ripple, p-p, 1605 to 1625 MHz Attenuation Referenced to 0 dB 1100 to 1400 MHz 1400 to 1550 MHz 1700 to 1825 MHz 1825 to 1900 MHz Terminating Source impedance Terminating Load impedance Notes Min fC IL 40 33 30 36 Max 4.6 2.0 Units MHz 55 52 52 52 50 50 ZS ZL Input/Output Impedance Match Typ 1615 3.4 0.3 dB dB No matching network required for 50 ohm source/load Case Style SM3030-6 Lid Symbolization 991 CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. US and international patents may apply. 2. Murata, stylized Murata logo, and Murata N.A., Inc. are registered trademarks of Murata Manufacturing Co., Ltd. ©2010-2015 by Murata Electronics N.A., Inc. SF2250E (R) 8/3/15 Page 1 of 4 www.murata.com Matching Circuit 5 0 o h m 2 SF2250E 5 . % - 5 5 0 o h m 1 , 3 , 4 , 6 Frequency Response Plots ©2010-2015 by Murata Electronics N.A., Inc. SF2250E (R) 8/3/15 Page 2 of 4 www.murata.com 6-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint Case and PCB Footprint Dimensions Dimension A B C D E F G H I J K L M N O K L N K N mm Nom 3.00 3.00 1.25 0.90 2.80 1.60 0.85 1.50 0.60 1.30 3.20 1.70 1.05 0.81 0.38 Min 2.87 2.87 1.12 0.77 2.67 1.47 0.72 1.37 0.47 1.17 Max 3.13 3.13 1.38 1.03 2.93 1.73 0.98 1.63 0.73 1.43 Inches Nom 0.118 0.118 0.049 0.035 0.110 0.063 0.033 0.059 0.024 0.051 0.126 0.067 0.041 0.032 0.015 Min 0.113 0.113 0.044 0.030 0.105 0.058 0.028 0.054 0.019 0.046 Max 0.123 0.123 0.054 0.040 0.115 0.068 0.038 0.064 0.029 0.056 Case Materials O Materials N M M PCB Footprint Top View Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free TOP VIEW BOTTOM VIEW B 6 1 991 YWWS A 2 G C 3 5 E 4 D ©2010-2015 by Murata Electronics N.A., Inc. SF2250E (R) 8/3/15 Page 3 of 4 F H 6 1 5 2 4 3 I J www.murata.com Tape and Reel Specifications “B” "B" REF. 100 REF. Inches Quantity Per Reel millimeters 7 178 500 13 330 3000 See Detail "A" 13. 0 12.0 20 .2 2.0 COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions 2.0 3.35 mm Bo 3.35 mm Ko 1.40 mm Pitch 8.0 mm W 12.0 mm 4.0 PIN #1 A 1.50 1.75 0.3 ± 0.05 Ao Bo B Ao 12.0 5.5 RO.3 (MAX.) B Pitch A Ko R0.5 (MAX.) 1.5 SECTION A-A SECTION B-B ©2010-2015 by Murata Electronics N.A., Inc. SF2250E (R) 8/3/15 Page 4 of 4 USER DIRECTION OF FEED www.murata.com