Preliminary SF2250E • • • • Low-loss SAW Filter, 1615 MHz, 20 MHz Bandwidth 3.0 x 3.0 x 1.4 mm Surface-mount Case 50 Ω Input/Output Impedance Complies with Directive 2002/95/EC (RoHS) 1615 MHz SAW Filter Pb Absolute Maximum Ratings Rating Incident Power in Passband Value Units +10 dBm 3 VDC Operating Temperature Range -20 to +70 °C Storage Temperature Range in Tape and Reel -40 to +85 °C 265 °C DC Voltage on any Non-ground Terminal Maximum Soldering Profile, 5 cycles/10 seconds maximum SM3030-6 Electrical Characteristics Characteristic Center Frequency Insertion Loss, 1605 to 1625 MHz Amplitude Ripple, p-p, 1605 to 1625 MHz Attenuation Referenced to 0 dB 1100 to 1400 MHz 1400 to 1550 MHz 1700 to 1825 MHz 1825 to 1900 MHz Terminating Source impedance Terminating Load impedance Input/Output Impedance Match Sym Notes Min fC IL 40 33 30 36 Typ Max 1615 3.4 0.3 4.6 2.0 Units MHz 55 52 52 52 50 50 ZS ZL dB dB Ω Ω No matching network required for 50 ohm source/load Case Style Lid Symbolization SM3030-6 991 CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. 2. US and international patents may apply. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. Page 1 of 4 SF2250E - 10/13/10 Matching Circuit 5 0 o h m 2 5 . % SF2250E 5 5 0 o h m 1 , 3 , 4 , 6 Frequency Response Plots www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. Page 2 of 4 SF2250E - 10/13/10 6-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint Case and PCB Footprint Dimensions Dimension A B C D E F G H I J K L M N O K L N K N mm Nom 3.00 3.00 1.25 0.90 2.80 1.60 0.85 1.50 0.60 1.30 3.20 1.70 1.05 0.81 0.38 Min 2.87 2.87 1.12 0.77 2.67 1.47 0.72 1.37 0.47 1.17 Max 3.13 3.13 1.38 1.03 2.93 1.73 0.98 1.63 0.73 1.43 Inches Nom 0.118 0.118 0.049 0.035 0.110 0.063 0.033 0.059 0.024 0.051 0.126 0.067 0.041 0.032 0.015 Min 0.113 0.113 0.044 0.030 0.105 0.058 0.028 0.054 0.019 0.046 Max 0.123 0.123 0.054 0.040 0.115 0.068 0.038 0.064 0.029 0.056 Case Materials O Materials N M M PCB Footprint Top View Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free TOP VIEW BOTTOM VIEW B 1 3 6 991 YWWS A 2 5 E 4 D www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. G C F H 6 1 5 2 4 3 I J Page 3 of 4 SF2250E - 10/13/10 Tape and Reel Specifications "B" REF. 100 REF. “B” Quantity Per Reel Inches millimeters 7 178 500 13 330 3000 See Detail "A" 13. 0 12.0 20 .2 2.0 COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions 2.0 3.35 mm Bo 3.35 mm Ko 1.40 mm Pitch 8.0 mm W 12.0 mm 4.0 PIN #1 A 1.50 1.75 0.3 ± 0.05 Ao Bo B Ao 12.0 5.5 RO.3 (MAX.) B Pitch A Ko R0.5 (MAX.) 1.5 SECTION A-A SECTION B-B www.RFM.com E-mail: [email protected] ©2010 by RF Monolithics, Inc. USER DIRECTION OF FEED Page 4 of 4 SF2250E - 10/13/10