Formosa MS SMD Switching Diode 1N4448WS-FL List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-221957 2011/09/08 Revised Date - Revision Page. A 7 Formosa MS SMD Switching Diode 1N4448WS-FL 200mW Surface Mount Switching Diode-100V Package Outline SOD-323FL Features • Fast Switching Device (trr<4.0ns) . • General Purpose Diodes . • Flat Lead SOD-323FL Small Outline Plastic Package . • Surface Device Type Mounting . • Lead-free parts for green partner, exceeds environmental • standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free parts, ex. 1N4448WS-FL-H 0.106(2.70) 0.091(2.30) 0.016(0.40) 0.010(0.25) 0.053(1.35) 0.045(1.15) 0.077(1.95) 0.063(1.60) 0.010(0.25) 0.002(0.05) Mechanical data • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-323FL • Terminals :Plated terminals, solderable per MIL-STD-750, 0.039(1.00) 0.028(0.70) Dimensions in inches and (millimeters) Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.004 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) Symbol 1N4448WS-FL UNIT Repetitive Peak Reverse Voltage V RRM 75 V Non-Repetitive Peak Reverse Voltage V RSM 100 V Maximum average forward current at T A = 25 C IO 150 mA Peak forward surge current, 1.0us I FSM 2.0 A o o Power Dissipation derate above 25 C PD 200 mW Maximum forward voltage VF [email protected] [email protected] V Maximum DC reverse current at rated DC blocking voltage T J = 25 oC IR 0.025@20V 5.0@75V Junction capacitance (Notes 1) CJ Maximum reverse recovery (Notes 2) t rr Operating and Storage Temperature Range T J , T STG uA 4.0 pF 4.0 ns o -55 to +150 C Notes : 1. C J at V R = 0V, f = 1MHZ 2. From I F = 10mA to I R = 10mA, I RR = 1mA, R L = 100Ω http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date DS-221957 2011/09/08 Revised Date - Revision Page. A 7 Rating and characteristic curves (1N4448WS-FL) FIG.1-Power Dissipation FIG.2 - Typical Reverse Characteristics 300 200 150 100 50 0 0 25 50 75 100 125 150 Ambient Temperature(°C) FIG.3 - Typical Capacitance FIG.4 - Typical Forward Voltage vs. Ambient Temperature Forward Voltage,(V) Power Dissipation,(mW) 250 Forward Current (mA) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-221957 2011/09/08 Revised Date - Revision Page. A 7 Formosa MS SMD Switching Diode 1N4448WS-FL Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code 1N4448WS-FL S2 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-323FL 0.032 (0.82) 0.022 (0.56) 0.069 (1.75) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-221957 2011/09/08 Revised Date - Revision Page. A 7 Formosa MS SMD Switching Diode 1N4448WS-FL Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-323FL Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 1.46 2.95 1.25 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-221957 2011/09/08 Revised Date - Revision Page. A 7 Formosa MS SMD Switching Diode 1N4448WS-FL Reel packing PACKAGE REEL SIZE SOD-323FL 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 4.0 3,000 30,000 INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) 183*183*123 178 382*262*387 APPROX. CARTON GROSS WEIGHT (pcs) (kg) 240,000 9.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-221957 2011/09/08 Revised Date - Revision Page. A 7 Formosa MS SMD Switching Diode 1N4448WS-FL High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-1056 9. Forward Surge Peak Forward Surge Current at t=1us MIL-STD-750D METHOD-4066-2 10. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 11. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 MIL-STD-750D METHOD-1051 Document ID Issued Date DS-221957 2011/09/08 Revised Date - Revision Page. A 7