Formosa MS SD103AW / BW / CW

Formosa MS
SMD Schottky Barrier Diode
SD103AW / BW / CW
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities...........................................................7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-22163N
2009/08/10
Revised Date
-
Revision
Page.
A
7
Formosa MS
SMD Schottky Barrier Diode
SD103AW / BW / CW
350mA Surface Mount Small Signal
Schottky Diode Type-20V-40V
Package outline
Features
0.071(1.80)
0.063(1.60)
0.016(0.40)
0.010(0.25)
• Low current rectification and high speed switching.
• Extremely small surface mount type.
• Low forward voltage drop.
• Suffix "-H" indicates Halogen-free part, ex.SD103AW-H.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts for green partner, exceeds environmental
0.053(1.35)
0.045(1.15)
SOD-123F
standards of MIL-STD-19500 /228
0.039(1.00)
0.031(0.80)
0.003(0.08)
0.016(0.40)
Mechanical data
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123F
• Terminals :Plated terminals, solderable per MIL-STD-750,
0.106(2.70)
0.091(2.30)
Method 2026
Dimensions in inches and (millimeters)
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.010 gram
Maximum ratings (AT T =25 C unless otherwise noted)
o
A
PARAMETER
CONDITIONS
Symbol SD103AW SD103BW SD103CW UNIT
Peak repetitive reverse voltage
Working peak reverse voltage
DC blocking voltage
V RRM
V RWM
VR
40
RMS reverse voltaget
V R(RMS)
28
Average rectified output current
I FAV
Non-repetitive peak forward surge current
@ t < 1.0 s
Total device dissipation
Thermal resistance junction to ambient
junction to ambientrse
Storage temperature
Reverse breakdown voltage
20
21
14
1.5
A
PD
400
mW
R èJA
300
K/W
TJ
-55 ~ +125
o
C
-65 ~ +175
o
C
V (BR)R
40
30
I F = 20mA
I F = 200mA
VF
0.37
0.60
Reverse current
V R = 30 V, SD103AW
V R = 20 V, SD103BW
V R = 10 V, SD103CW
IR
5.0
Junction capacitance
V R = 0 V, f = 1.0 MHz
CJ
Reverse recover time
I F = IR = 200mA, Irr = 0.1 X I R,
R L = 100 OHM
t rr
Page 2
V
mA
I FSM
Forward voltage
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
V
350
T STG
Operating temperature
30
2.0
20
V
V
uA
2.1
2.2
pF
ns
10
Document ID
Issued Date
DS-22163N
2009/08/10
Revised Date
-
Revision
Page.
A
7
Rating and characteristic curves (SD103AW / BW / CW)
Fig. 1 POWER DERATING CURVE
Fig. 2 TYPICAL FORWARD CHARACTERISTIC
I F, FORWARD CURRENT (A)
500
400
300
200
100
0
0
25
50
75
100
125
100
10
1.0
.1
.01
150
O
0
0.5
1.0
V F, FORWARD VOLTAGE (V)
T A, AMBIENT TEMPERATURE ( C)
Fig. 3 TYPICAL JUNCTION CAPACITANCE VS
REVERSE VOLTAGE
100
C J, JUNCTION CAPACITANCE (pF)
Pd, POWER DISSIPATION (mW)
1000
10
1.0
0.1
0
10
20
30
40
V R, REVERSE VOLTAGE (V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 3
Document ID
Issued Date
DS-22163N
2009/08/10
Revised Date
-
Revision
Page.
A
7
Formosa MS
SMD Schottky Barrier Diode
SD103AW / BW / CW
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
SD103AW
SD103BW
SD103CW
S4
S5
S6
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD-123F
0.075 (1.90)
0.055 (1.40)
0.075 (1.90)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
DS-22163N
2009/08/10
Revised Date
-
Revision
Page.
A
7
Formosa MS
SMD Schottky Barrier Diode
SD103AW / BW / CW
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOD-123F
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.00
3.85
1.10
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
DS-22163N
2009/08/10
Revised Date
-
Revision
Page.
A
7
Formosa MS
SMD Schottky Barrier Diode
SD103AW / BW / CW
Reel packing
PACKAGE
REEL SIZE
7"
SOD-123F
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
CARTON
SIZE
(m/m)
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
3,000
4.0
30,000
183*183*123
178
382*262*387
240,000
9.5
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15%
2.Reflow soldering of surface-mount devices
Critical Zone
T L to T P
tP
TP
Ramp-up
TL
tL
Temperature
T smax
T smin
TS
ts
Preheat
25
Ramp-down
t25 oC to Peak
Wave Soldering
IR Reflow
Time
3.Flow (wave)soldering (solder dipping)
Profile Feature
Soldering Condition
Average ramp-up rate(T L to TP )
<3oC/sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
100oC
150oC
60~120sec
Tsmax to TL
-Ramp-upRate
<3oC/sec
Time maintained above:
-Temperature(TL )
-Time(tL )
183oC
60~150sec
255oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(tP )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 6
Document ID
Issued Date
DS-22163N
2009/08/10
Revised Date
-
Revision
Page.
A
7
Formosa MS
SMD Schottky Barrier Diode
SD103AW / BW / CW
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260±5 C for 10±2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T A=125 OC for 168 hrs.
MIL-STD-750D
METHOD-1026
4. Forward Operation Life
Rated average rectifier current at T=25 OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
15P SIG at TA=121 OC for 4 hrs.
7. Temperature Cycling
-55 OC to +125OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Thermal Shock
9. Forward Surge
10. Humidity
11. High Temperature Storage Life
12. Solvent Resistance
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
MIL-STD-750D
METHOD-1051
MIL-STD-750D
METHOD-1056
0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-4066-2
8.3ms single half sine-wave superimposed
on rated load, one surge.
at TA=65 OC, RH=98% for 1000hrs.
MIL-STD-750D
METHOD-1038
at 175OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
Dip into Freon at 25OC for 1 min.
MIL-STD-202F
METHOD-215
Page 7
Document ID
Issued Date
DS-22163N
2009/08/10
Revised Date
-
Revision
Page.
A
7