Formosa MS SMD Schottky Barrier Diode SD103AW / BW / CW List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities...........................................................7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-22163N 2009/08/10 Revised Date - Revision Page. A 7 Formosa MS SMD Schottky Barrier Diode SD103AW / BW / CW 350mA Surface Mount Small Signal Schottky Diode Type-20V-40V Package outline Features 0.071(1.80) 0.063(1.60) 0.016(0.40) 0.010(0.25) • Low current rectification and high speed switching. • Extremely small surface mount type. • Low forward voltage drop. • Suffix "-H" indicates Halogen-free part, ex.SD103AW-H. • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts for green partner, exceeds environmental 0.053(1.35) 0.045(1.15) SOD-123F standards of MIL-STD-19500 /228 0.039(1.00) 0.031(0.80) 0.003(0.08) 0.016(0.40) Mechanical data • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-123F • Terminals :Plated terminals, solderable per MIL-STD-750, 0.106(2.70) 0.091(2.30) Method 2026 Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.010 gram Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER CONDITIONS Symbol SD103AW SD103BW SD103CW UNIT Peak repetitive reverse voltage Working peak reverse voltage DC blocking voltage V RRM V RWM VR 40 RMS reverse voltaget V R(RMS) 28 Average rectified output current I FAV Non-repetitive peak forward surge current @ t < 1.0 s Total device dissipation Thermal resistance junction to ambient junction to ambientrse Storage temperature Reverse breakdown voltage 20 21 14 1.5 A PD 400 mW R èJA 300 K/W TJ -55 ~ +125 o C -65 ~ +175 o C V (BR)R 40 30 I F = 20mA I F = 200mA VF 0.37 0.60 Reverse current V R = 30 V, SD103AW V R = 20 V, SD103BW V R = 10 V, SD103CW IR 5.0 Junction capacitance V R = 0 V, f = 1.0 MHz CJ Reverse recover time I F = IR = 200mA, Irr = 0.1 X I R, R L = 100 OHM t rr Page 2 V mA I FSM Forward voltage http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 V 350 T STG Operating temperature 30 2.0 20 V V uA 2.1 2.2 pF ns 10 Document ID Issued Date DS-22163N 2009/08/10 Revised Date - Revision Page. A 7 Rating and characteristic curves (SD103AW / BW / CW) Fig. 1 POWER DERATING CURVE Fig. 2 TYPICAL FORWARD CHARACTERISTIC I F, FORWARD CURRENT (A) 500 400 300 200 100 0 0 25 50 75 100 125 100 10 1.0 .1 .01 150 O 0 0.5 1.0 V F, FORWARD VOLTAGE (V) T A, AMBIENT TEMPERATURE ( C) Fig. 3 TYPICAL JUNCTION CAPACITANCE VS REVERSE VOLTAGE 100 C J, JUNCTION CAPACITANCE (pF) Pd, POWER DISSIPATION (mW) 1000 10 1.0 0.1 0 10 20 30 40 V R, REVERSE VOLTAGE (V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date DS-22163N 2009/08/10 Revised Date - Revision Page. A 7 Formosa MS SMD Schottky Barrier Diode SD103AW / BW / CW Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code SD103AW SD103BW SD103CW S4 S5 S6 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-123F 0.075 (1.90) 0.055 (1.40) 0.075 (1.90) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date DS-22163N 2009/08/10 Revised Date - Revision Page. A 7 Formosa MS SMD Schottky Barrier Diode SD103AW / BW / CW Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123F Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.00 3.85 1.10 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date DS-22163N 2009/08/10 Revised Date - Revision Page. A 7 Formosa MS SMD Schottky Barrier Diode SD103AW / BW / CW Reel packing PACKAGE REEL SIZE 7" SOD-123F REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 9.5 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tP TP Ramp-up TL tL Temperature T smax T smin TS ts Preheat 25 Ramp-down t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP ) <3oC/sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 100oC 150oC 60~120sec Tsmax to TL -Ramp-upRate <3oC/sec Time maintained above: -Temperature(TL ) -Time(tL ) 183oC 60~150sec 255oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(tP ) 10~30sec Ramp-down Rate <6 oC/sec Time 25oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date DS-22163N 2009/08/10 Revised Date - Revision Page. A 7 Formosa MS SMD Schottky Barrier Diode SD103AW / BW / CW High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260±5 C for 10±2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T A=125 OC for 168 hrs. MIL-STD-750D METHOD-1026 4. Forward Operation Life Rated average rectifier current at T=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 15P SIG at TA=121 OC for 4 hrs. 7. Temperature Cycling -55 OC to +125OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life 12. Solvent Resistance http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 0 OC for 5 min. rise to 100 OC for 5 min. total 10 cycles. MIL-STD-750D METHOD-4066-2 8.3ms single half sine-wave superimposed on rated load, one surge. at TA=65 OC, RH=98% for 1000hrs. MIL-STD-750D METHOD-1038 at 175OC for 1000 hrs. MIL-STD-750D METHOD-1031 Dip into Freon at 25OC for 1 min. MIL-STD-202F METHOD-215 Page 7 Document ID Issued Date DS-22163N 2009/08/10 Revised Date - Revision Page. A 7