Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3~4 Pinning information........................................................................... 5 Marking........................................................................................... 5 Suggested solder pad layout............................................................. 5 Packing information.......................................................................... 6 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 7 High reliability test capabilities........................................................... 8 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-221927 2009/02/10 2010/03/10 Revision B Page. 8 Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 225mW Surface Mount Switching Diode-75-100V Package outline Features (B) (C) (A) 0.063 (1.60) 0.027 (0.67) 0.013 (0.32) 0.047 (1.20) • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, SOT-23 • Terminals : Solder plated, solderable per 0.012 (0.30) 0.020 (0.50) 0.045 (1.15) .084(2.10) .068(1.70) 0.110 (2.80) 0.120 (3.04) Mechanical data 0.034 (0.85) SOT-23 • Fast speed switching. • For general purpose switching application. • High conductance. • Silicon epitaxial planar chip. • Lead-free parts meet RoHS requirments. • Suffix "-H" indicates Halogen-free part, ex.MMBD2836-H. 0.108 (2.75) 0.051 (1.30) MIL-STD-750, Method 2026 0.003 (0.09) 0.007 (0.18) 0.083 (2.10) 0.035 (0.89) • Mounting Position : Any • Weight : Approximated 0.008 gram Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT PARAMETER Symbol T A=25 oC unless otherwise noted) MMBD2836 MMBD2838 MMBD7000 UNIT Reverse Voltage VR 75 100 V Forward Current IF 100 200 mA Peak Forward Surge Current at t=1s Total Device Dissipation FR-5 I FM Board* 1, T A = 25 OC PD Derate Above 25 OC Total Device Dissipation mA 225 mW mW/ OC 1.8 Thermal Resistance Junction to Ambient R θJA 2 500 Substrate* , T A = 25 C O Derate Above 25 C O 556 O PD C/W mW 300 mW/ OC 2.4 Typical Thermal Resistance Junction to Ambient R θJA 417 Operating Junction Temperature Range TJ -55 ~ +150 o C Storage Temperature Range T STG -55 ~ +150 o C Maximum Reverse Voltage Leakage Current at V R = 50V 0.1 at V R = 100V IR Maximum Diode Capacition(V R = 0V, f = 1.0MHz) Maximum Reverse Recovery Time(I F = I R = 10mA,V R = 5.0Vdc, I R(REC) = 1.0mAdc, R L = 100 OHM) Maximum Forward Voltage at I F = 1.0mA at I F = 10mA 3.0 - 100 CD 4.0 1.5 t rr 4.0 4.0 at I F = 50mA at I F = 100mA Page 2 VF C/W 1.0 - at V R = 50V, T J =125 OC http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 O - 700 1000 820 1000 - 1200 1100 Document ID Issued Date Revised Date DS-221927 2009/02/10 2010/03/10 µA pF ns mV Revision B Page. 8 Rating and characteristic curves for each diode (MMBD2836/MMBD2838/MMBD7000) 820 OHM +10V 2K 100uH 0.1 uF IF tr tp IF t 0.1 uF t t rr 10% DUT 50 OHM OUTPUT PULSE GENERATOR 50 OHM INPUT SAMPLING OSCILLOSCOPE 90% IR(REC)=1 mA IR VR OUTPUT PULSE (IF=IR=10mA;measured at iR(REC)=1mA) Notes : 1. A2.0 Kohm variable resistor adjusted for a forward Current (IF) of 10mA. Notes: Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. 3. tp >> trr. Recovery Time Equivalent Test Circuit FIG.1-TYPICAL FORWARD FIG.2 - TYPICAL LEAKAGE CURRENT CHARACTERISTICS CHARACTERISTICS 10 10 T J = 150 OC IR, REVERSE CURRENT,(uA) IF, FORWARD CURRENT,(mA) 100 TJ = 85OC TJ = 25OC 1.0 TJ = -40OC 1.0 T J= 125 OC 0.1 T J = 85 OC T J = 55 OC 0.01 T J = 25 OC 0.1 .2 0.001 0 .4 .6 .8 1.0 10 20 30 40 50 VR, REVERSE VOLTAGE (V) 1.2 VF, FORWARD VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date DS-221927 2009/02/10 2010/03/10 Revision B Page. 8 Rating and characteristic curves for each diode (MMBD2836/MMBD2838/MMBD7000) FIG.3 - DIODE CAPACITANCE (MMBD2836) FIG.4 - DIODE CAPACITANCE (MMBD2838) 1.0 CD, DIODE CAPACITANCE,(pF) CD, DIODE CAPACITANCE,(pF) 1.75 1.50 1.25 1.00 0.75 0.9 0.8 0.7 0.6 0 2 4 6 8 VR, REVERSE VOLTAGE,(V) 0 2 4 6 8 VR, REVERSE VOLTAGE,(V) FIG.5 - DIODE CAPACITANCE (MMBD7000) CD, DIODE CAPACITANCE,(pF) 0.68 0.64 0.60 0.56 0.52 0 2 4 6 8 VR, REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date DS-221927 2009/02/10 2010/03/10 Revision B Page. 8 Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 Pinning information Type number Marking code Simplified outline Symbol (A) MMBD2836 (B) A A2X (C) (A) MMBD2838 C (B) A (B) A B A6 (C) (A) MMBD7000 B C B M5C C (C) Suggested solder pad layout SOT-23 0.037(0.95) 0.037(0.95) 0.079(2.0) 0.035(0.90) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-221927 2009/02/10 2010/03/10 Revision B Page. 8 Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 55.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 12.0 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date DS-221927 2009/02/10 2010/03/10 Revision B Page. 8 Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 Reel packing PACKAGE SOT-23 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 3000 4.0 30,000 REEL DIA, (m/m) INNER BOX (m/m) 183*183*123 CARTON SIZE (m/m) 178 382*262*387 CARTON (pcs) APPROX. GROSS WEIGHT (kg) 11.6 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date DS-221927 2009/02/10 2010/03/10 Revision B Page. 8 Formosa MS SMD Switching Diode MMBD2836/MMBD2838/MMBD7000 High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker 15P SIG at T A=121 OC for 4 hrs. JESD22-A102 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. MIL-STD-750D METHOD-1051 8. Forward Surge Peak Forward Surge Current MIL-STD-750D METHOD-4066-2 9. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 8 Document ID Issued Date Revised Date DS-221927 2009/02/10 2010/03/10 Revision B Page. 8