Revision 3 - Preliminary Datasheet ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Features Ordering Information • Ultralow Power – Typical TX Current (at 50-Ω match): < 2 mA at −13 dBm;< 5 mA at −2 dBm – Typical RX Current: < 1.9 mA – Sleep Current: < 500 nA – Supply: 1.2 V to 1.8 V • Radio Operating Frequency Range: 795 to 965 MHz – North American ISM Band: 902 to 928 MHz – European SRD Bands: 863 to 870 MHz • Radio Performance – Raw Data Rate: 186 kbit/s – TX Power: up to 0 dBm – RX Sensitivity: −90 dBm Typical at 186 kbit/s • Very Few External Components – Only Crystal and Bias Resistor • Standard Interfaces – SPIbus Master for Packet Data – Two-Wire for Status and Control • MAC – Clear Channel Assessment – Sniff with Automatic Receive or Sleep – Automatic Clear-to-Send, Turn-Around, and Sleep – Receiver AGC – Packetization – Preamble and Frame Sync – Whitening 36-Pin CSP in Tray – ZL70250UEJ2 36-Pin CSP in T&R – ZL70250UEB2 Applications • • • • • • • • Body-Area Network Energy Harvesting Wireless Sensor Network Remote Control Voice/Compressed Audio Communication RF Switch Active RFID Inventory Management Description The ZL70250 ultra-low-power RF transceiver provides a wireless link in applications where power consumption is of primary importance. The transceiver’s ultralow power requirements allow the use of a coin-cell battery or energy-harvesting methods, enabling devices with extremely small form factors. The ultra-low-power device operates in unlicensed frequency bands between 795 and 965 MHz with a data rate of 186 kbit/s to support voice/compressed audio communication. Duty cycling can be employed for applications that require lower average payload to further reduce power consumption. 24.572675-MHz Crystal XTAL2 VDDA VSSA2 XTAL1 Note: Oscillator frequency = 24.576-MHz without load capacitors VSSA CLKSEL CLK_OUT MAC 1.117091 MHz (24.576/22) V Reference RBIAS XTAL OSC Clock Generator VDDD VSSD 303 kHz RESET_B I Reference 16/17 prescaler A&M Counter Phase Detector Charge Pump Range Compare Loop LP Filter SCL SDA IRQ RX+ TXRX_STAT VCO 795/965 MHz PLL Tuning TX+ PA TXRX_CMD Gaussian Filter Modulation Tuning TX- DAC TX data RX- SPI_CLK Coarse Tuning VSSH SPI_SEL_B SPI_DATA_OUT IF Filter Mixer LNA Antenna Tune SPI_DATA_IN FM Detector Limiter RSSI Blocker Detector Digital PostDetection Filter RX data RSSI DOUT0 Blocker Detector Fivebit ADC Test Buffers DOUT1 AMX2 ZL70250 0003v1207.0 Figure 1 • Analog Test Mux AMX0 AMX1 AMX2 AMX3 VDDTST ZL70250 Block Diagram August 2012 © 2012 Microsemi Corporation I ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Table of Contents ZL70250 Ultra-Low-Power RF Transceiver (Datasheet) 1 – Overview 2 – Application Interface Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 3 – Electrical Specifications Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital I/O DC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Programmable Transmit Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Crystal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3-1 3-1 3-2 3-4 3-6 4 – Mechanical Specifications 36-Pin Chip Scale Package (CSP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 5 – Typical Application Circuit 6 – Glossary 7 – Datasheet Information List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2 Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2 Re v ision 3 - P reliminary D atasheet II ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver List of Figures Figure 1 • ZL70250 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I Figure 2-1 • Bit-Level Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Figure 2-2 • SPI Receive Timing, ZL70250 to External Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Figure 2-3 • SPI Transmit Timing, External Microcontroller to ZL70250 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 Figure 2-4 • SPI Data Packet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 Figure 2-5 • PCM Data Packet with 32-Bit Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5 Figure 2-6 • PCM Start of Packet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5 Figure 2-7 • PCM End of Packet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6 Figure 3-1 • TX Power vs. PA Trim Value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 Figure 3-2 • Current Consumption vs. TX Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Figure 3-3 • Crystal Oscillator with Additional External Load Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 Figure 4-1 • ZL70250 CSP Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 Figure 5-1 • 50-Ω Single-Ended Implementation Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 Re v ision 3 - P reliminary D atasheet III ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver List of Tables Table 2-1 • Write Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Table 2-2 • Read Setup Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Table 2-3 • Read Operation Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Table 2-4 • Data Interface, SPI Timing Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Table 3-1 • Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Table 3-2 • Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Table 3-3 • Digital I/O DC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Table 3-4 • Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Table 3-5 • Crystal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 Table 4-1 • CSP Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Re v ision 3 - P reliminary D atasheet IV 1 – Overview The ultra-low-power ZL70250 RF transceiver enables RF telemetry in applications powered by coin-cell batteries or energy harvesting, where wireless telemetry was previously unfeasible. End applications may include wireless sensors, body-area networks (principally on-body sensors), or voice communication. With a typical peak/average current consumption below 2 mA in both transmit and receive, and with a data rate of 186 kbit/s, the ZL70250 enables bidirectional RF links with an impressive efficiency of 13 nJ/bit over a range of up to 100 meters. The output power is programmable and can be reduced to −25 dBm to save power in cases where the link budget allows it, or can be increased up to 0 dBm for more range or to allow for system losses such as a very small antenna or body tissue absorption. To achieve the minimum possible power consumption, the ZL70250 offers many optimization parameters, all available to the user via the control interface. To streamline the setup and optimization process, most parameters have an onchip automatic trim capability. The frequency tuning is also highly automated. In addition to its very low power consumption, the ZL70250 also includes a highly flexible Media Access Controller (MAC) that offers all the basic functions needed to implement a link layer with the minimum amount of data transfer between the ZL70250 and its controller. Some of the capabilities are: • Digital RSSI and blocker indicator • Clear channel assessment • Transmit with automatic clear-to-send • Sniff with automatic receive or sleep • Receiver AGC (programmable) • Preamble and frame sync generation and detection • Whitening • Packetization with programmable size for both transmit and receive • Automatic sleep after receive • Automatic turnaround for bidirectional data transfer The ZL70250 is also highly integrated. Besides the antenna and, in some cases, its matching network, only a crystal and a bias resistor are required. The ZL70250 is an ultra-low-power RF transceiver operating in unlicensed frequency bands between 795 and 965 MHz. It offers a data rate of 186 kbit/s in 300-kHz-wide channels. The ZL70250 includes a frequency synthesizer, transmit and receive RF circuitry (shown in Figure 1 on page I), and a MAC for performing bit and frame synchronization, transmit and receive control, and other digital functions. The ZL70250 transceiver transmits and receives GFSK-modulated digital data over one 300-kHz-wide channel using time-division multiplexing. The channel frequency and other features are configurable via registers that must be programmed over the control interface. Registers control selective shutdown of the device in order to conserve power. The device does not contain any timing circuits necessary for periodic wake-up and channel sniffing; this is left to the system host. The system host initiates and controls Clear Channel Assessment (CCA) at a high level. CCA consists of the RSSI level and mixer peak detector output (blockers) for the currently programmed receiver channel. CCA of other channels requires the host to set the receiver for those channels one at a time and to request and read the RSSI and blocker registers. Although many different channel frequencies can be selected by programming the synthesizer dividers, the IF has been chosen such that six adjacent channels can operate within the same range without interference in both the US and Europe, assuming there are vacant bands that are four channels wide both above and below the six used channels. The vacant bands are necessary because — due to limitations on power, size, and external components — the architecture does not include image cancellation or image filtering. The polarity of the receiver data output is programmable to allow for a high-side LO or a low-side LO. Re v ision 3 - P reliminary D atasheet 1-1 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver The ZL70250 is configurable for operation with minimal external components. In some applications the only necessary external components are an antenna, a crystal, and a resistor (49.9 kΩ ± 1%) to set the nominal bias current. The capacitors for antenna tuning and crystal oscillator trimming reside on the chip. The transmit power amplifier has a separate ground pin and is able to drive the antenna such that the voltage at its end points swings above the VDD supply. The MAC handles the received and transmitted data. The MAC also includes the programming interface, trim and test modes, transmit and receive switching, and any other controllable functions on the chip. The transmitted and received data is exchanged with the system host or other devices via dedicated pins. No conversion to or from encoded audio data formats is done on the chip. Transmit and receive timing is controlled by the system host via a single pin. The TX-RX turnaround timing is programmable and resides in the ZL70250. Re v ision 3 - P reliminary D atasheet 1-2 2 – Application Interface Control Interface Functional Description The control interface in the MAC is used to program the ZL70250 RF transceiver. At the bit level the ZL70250 interface is a standard two-wire control interface with a maximum speed of 400 kHz. The bit-level protocol is shown in "Bit-Level Protocol" below. The ZL70250 control interface differs slightly from the standard two-wire protocol at the byte sequencing level due to the addition of some extra functionality as shown in "Byte Sequencing" on page 2-2. Bit-Level Protocol Figure 2-1 shows the basic bit protocol for a transfer on the two-wire bus. The first byte provides a seven-bit device ID and one bit for read/write indication. All byte transfers are nine bits, with the ninth bit being the acknowledge bit. At the bit level, the ZL70250 two-wire protocol is identical to a standard two-wire protocol. Figure 2-1 • Bit-Level Protocol Re v ision 3 - P reliminary D atasheet 2-1 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Byte Sequencing The byte sequence required to control the ZL70250 is specific to the ZL70250, and is defined below. All byte definitions are shown with the MSB ([D7]) first. Write operations are performed in one sequence of bytes (see Table 2-1). One or more bytes can be written in a write command: first (in byte 5) to the address that was specified in byte 4, then continuing to autoincrement to the next address for each of the remaining bytes. Table 2-1 • Write Command Sequence Bits Description Byte 1, bits [D7:D1] Device ID for ZL70250 = 7’b1000101 Byte 1, bit [D0] R/W bit; 0 = Write Byte 2, bits [D7:D0] Write command byte = 8’b00000010 Byte 3, bits [D7:D0] Upper address bits [15:8] = 8’b00000000 Byte 4, bits [D7:D0] Lower address bits [7:0] = Register address Byte 5, bits [D7:D0] First data byte to be written Byte 5+N, bits [D7:D0] Nth data byte to be written Read operations are performed in two sequences of bytes. The first sequence is the read setup operation (see Table 2-2), which provides the first address to be read. The second sequence is the actual read operation (see Table 2-3). One or more bytes can be read in a read operation: first (in byte 2) from the address that was specified during the setup operation, then continuing to autoincrement to the next address for each of the remaining bytes. Table 2-2 • Read Setup Command Sequence Bits Description Byte 1, bits [D7:D1] Device ID for ZL70250 = 7’b1000101 Byte 1, bit [D0] R/W bit, 0 = Write Byte 2, bits [D7:D0] Read setup command byte = 8’b00000001 Byte 3, bits [D7:D0] Upper address bits [15:8] = 8’b00000000 Byte 4, bits [D7:D0] Lower address bits [7:0] = Register address Table 2-3 • Read Operation Sequence Bits Byte 1, bits [D7:D1] Description Device ID for ZL70250 = 7’b1000101 Byte 1, bit [D0] R/W bit, 1 = Read Byte 2, bits [D7:D0] First data byte read Byte 2+N, bits [D7:D0] Nth data byte read Re v ision 3 - P reliminary D atasheet 2-2 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Data Interface Functional Description The data interface in the MAC controls the transfer of data between the ZL70250 RF transceiver and the external microcontroller. The data interface can be configured in either SPI or PCM mode. For PCM, both wide and narrow frame sync are supported. In PCM mode, the clock and frame sync can be any polarity. In both SPI and PCM modes, the ZL70250 is the master, and data is clocked in and out at the fixed bit rate of the RF interface. The data interface supports five basic modes of operation: • bidirectional transmit/receive multiple packets • transmit one packet • transmit multiple packets • receive one packet • receive multiple packets In both SPI and PCM mode, SPI_DATA_OUT is not tristated. This implies that outgoing and incoming traffic needs to happen on separate lines. Table 2-4 • Data Interface, SPI Timing Specifications Parameter Sym. Conditions Rise time (20% to 80%) TR Fall time (80% to 20%) Min. Nom Max. Unit CLOAD = 200 pF RPULLUP = 8 kΩ 50 ns TF CLOAD = 200 pF ILOAD = 1 mA 50 ns Clock period TCP Receive mode 4.45 5.37 6.30 μs Clock low TCL Receive mode 2.63 2.68 2.73 μs Clock high TCH Receive mode 1.73 2.68 3.63 μs RX data setup TRSU Receive mode 1.50 2.68 RX data hold TRH Receive mode −100 RX data out TRCO Receive mode TX data setup TTSU Transmit mode TX data out TTCO Transmit mode TX data hold TTH Transmit mode μs ns 200 200 ns 1000 −1000 ns ns ns Figure 2-2 • SPI Receive Timing, ZL70250 to External Microcontroller Re v ision 3 - P reliminary D atasheet 2-3 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Figure 2-3 • SPI Transmit Timing, External Microcontroller to ZL70250 SPI Data Packet Figure 2-4 • SPI Data Packet Re v ision 3 - P reliminary D atasheet 2-4 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver PCM Data Packet Figure 2-5 • PCM Data Packet with 32-Bit Frame Figure 2-6 • PCM Start of Packet Re v ision 3 - P reliminary D atasheet 2-5 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Figure 2-7 • PCM End of Packet Re v ision 3 - P reliminary D atasheet 2-6 3 – Electrical Specifications Absolute Maximum Ratings Table 3-1 • Absolute Maximum Ratings Characteristics Symbol Supply voltage Minimum Rating Maximum Rating Unit 1.98 V Note 1 0.3 V At least 20 mA at −1.5 V VDD Reverse supply voltage Input voltage (digital and analog) Vin VSS − 0.3 VDD + 0.3 V RF I/O voltage Vio VSS − 0.3 2 × VDD V Storage temperature Tstg −40 +85 °C Electrostatic discharge ESD RF pads: 500 All others: 1.5k V Notes Note 2 Notes: 1. A DC voltage above 1.98 will begin to degrade the life of the part. 2. Applied one at a time. Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied. Human body model. Recommended Operating Conditions Table 3-2 • Recommended Operating Conditions Characteristics Symbol Min. Max. Unit Supply voltage VDD_op 1.1 1.9 V Top −10 70 °C Operating temperature Notes Digital I/O DC Specifications Table 3-3 • Digital I/O DC Specifications Parameter Sym. Conditions Min. Output high VOH DOUTB = VSS RPULLUP = 8 kΩ VDD − 0.01 Output low VOL DOUTB = VDD ILOAD = 1 mA Input high VIH Input low VIL Nom Max. Unit V VSS + 0.1 (VDD − VSS) × 0.8 V (VDD − VSS) × 0.2 Re v ision 3 - P reliminary D atasheet V 3-1 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Dynamic Characteristics The specified performance of the ZL70250 is valid over a supply range of 1.1 to 1.9 V. The ZL70250 continues to operate such that it can receive and transmit at some range over a supply range of 1.0 to 1.9 V. Additionally, all other functions operate correctly over the same supply voltage range. See Table 3-4. Table 3-4 • Dynamic Characteristics Parameter Min. Operating frequency range 795 Sleep state Typ. Max. 965 0.5 Units and Notes MHz μA All circuits disabled Reference frequency 24.576 MHz See Note 1 Symbol rate 186.182 ksps (24.576 MHz / 22 / 6) Channel separation 303.407 kHz (24.576 MHz / 81) Power up 3 5 ms From RESET_B release, assuming VDD is settled External clock output 0.8192 6.144 MHz (24.576 MHz / N, where 4 ≤ N ≤ 30) Receiver Parameters Sensitivity at 25°C −90 dBm Input level resulting in BER of 10−3; minimum depends on load conditions 1-dB compression point 4 mVrms Input at LNA/mixer gain of 30 dB Cascaded voltage gain 30 dB LNA and mixer; programmable, with five settings in 4-dB steps Current consumption 1.9 mA Continuous RX mode IF RSSI range 606.814 40 kHz (303.407 kHz × 2) dB Digital, 32 levels of 2 dB Adjacent channel rejection 11 dB Desired channel 3 dB above the sensitivity limit; 303.407-kHz channel spacing Alternate channel rejection 25 dB Desired channel 3 dB above the sensitivity limit; 606.814-kHz channel spacing 1. In order to save power, the crystal oscillator has a 3-pF load instead of a typical 8-pF or 10-pF load. 2. The achievable output voltage swing depends on the supply voltage: Vswing = ±Min[VDD-0.4, 1.5]. For VDD = 1.8 V, the single-ended voltage swing can be up to ±1.4 V centered around VDD. For VDD = 1.2 V, it is reduced to ±0.8 V. 3. The PA has been optimized for a 1-kΩ load. However, for efficiency, the higher the load impedance the better. 4. Test performed was with specified load of 50 Ω with the transmitter operating. See section 8.8.2 of ETSI EN 300 220. Re v ision 3 - P reliminary D atasheet 3-2 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Table 3-4 • Dynamic Characteristics (continued) Parameter Min. Typ. Max. Units and Notes Transmitter Parameters Current consumption 2.0 mA Continuous TX mode; with PA trim code of 8’h08, 1 kΩ load Maximum output power Output voltage range of PA −2 0.4 dBm, 1 kΩ load 2 × VDD V Each single-ended output; DC bias to VDD required (see Note 2) Output current range of PA 100 320 1500 μArms Nominal 100-μA steps Matching impedance 500 1000 2000 ohms See Note 3 Spurious emissions −68 −36 dBm See Note 4 862 MHz to 1 GHz (Maximum figure is the limit per ETSI EN 300 220 section 8.8.5) −33 −30 dBm See Note 4 Above 1 GHz (Maximum figure is the limit per ETSI EN 300 220 section 8.8.5) Modulation index 0.45 0.5 0.55 (±10%) A transmitted 1 is a shift to a higher frequency, 0 a shift to a lower TX-RX or RX-TX turnaround time 1.8 ms Programmable 1. In order to save power, the crystal oscillator has a 3-pF load instead of a typical 8-pF or 10-pF load. 2. The achievable output voltage swing depends on the supply voltage: Vswing = ±Min[VDD-0.4, 1.5]. For VDD = 1.8 V, the single-ended voltage swing can be up to ±1.4 V centered around VDD. For VDD = 1.2 V, it is reduced to ±0.8 V. 3. The PA has been optimized for a 1-kΩ load. However, for efficiency, the higher the load impedance the better. 4. Test performed was with specified load of 50 Ω with the transmitter operating. See section 8.8.2 of ETSI EN 300 220. Re v ision 3 - P reliminary D atasheet 3-3 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Programmable Transmit Power Characteristics Measurement results for characterizing the transmitter power were taken from a typical device, at room temperature and VDD = 1.8 V. Measurements were made using the ZL70250 Application Development Kit (ADK) at the 50-Ω SMA connector (after matching network); refer to Figure 5-1 on page 5-1. IC transmit power results were extrapolated assuming a 3-dB loss in the matching network. Transmit Power vs. PA trim Value Figure 3-1 • TX Power vs. PA Trim Value Re v ision 3 - P reliminary D atasheet 3-4 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Current Consumption vs. Transmit Power Figure 3-2 • Current Consumption vs. TX Power Re v ision 3 - P reliminary D atasheet 3-5 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Crystal Specifications All frequency-related specifications are based on the crystal oscillator performance, which, in turn, is dependent on the crystal specifications. The ZL70250 specifications assume that the crystal specifications listed in Table 3-5 are met or exceeded. Table 3-5 • Crystal Specifications Parameter Min. Frequency Typ. Max. 24.576 Units and Notes MHz Frequency tolerance ±25 ppm Stability with temperature ±20 ppm (over operating temp) 70 °C 110 ohms Operating temperature range −10 Equivalent series resistance 50 Shunt capacitance Motional capacitance Load capacitance 63 2 pF (Note 1) 1.5 fF (Note 1) 3 pF (Note 2) Drive level 50 μW 1. A low shunt capacitance and high motional capacitance is best as it result in a larger trim range. It is particularly important when external capacitors are used, as those reduce the trim range. 2. In order to save power, the crystal oscillator presents a 3-pF load instead of the typical 8-pF or 10-pF load. A slight frequency pull, on the order of 100 to 150 ppm, would result if using a standard crystal without additional external load capacitors. Such a deviation has no effect on the operation of the device and is generally not a problem for most applications, providing all ZL70250s have the same frequency pull (within trimmable range). If the deviation is not acceptable and power is critical, a special cut crystal would need to be ordered (that is, slightly slower to compensate for the pull). Alternatively, if power is not as critical, external capacitors can be added, as shown in Figure 3-3 below, to bring the total load capacitance to the crystal load specification. For instance, for a crystal with an 8-pF load specification (CL), CLext = 8 pF − 3 pF = 5 pF, so two 10-pF capacitors need to be added, one on each end of the crystal. It must be noted, however, that this results in a reduced trim range. The frequency tolerance should therefore be tighter to compensate. Figure 3-3 • Crystal Oscillator with Additional External Load Capacitors Re v ision 3 - P reliminary D atasheet 3-6 4 – Mechanical Specifications 36-Pin Chip Scale Package (CSP) Pinout Table 4-1 • CSP Pin # CSP Pinout Pin Name I/O A/D A1 XTAL1 I A Crystal connection or external Connect to crystal. clock input when CLKSEL is high A2 XTAL2 I A Crystal connection, leave open Connect to crystal. when using external clock source A3 RESET_B I D Reset when low, all circuits off (including the CLK_OUT, so do not use CLK_OUT for microprocessor and then control the RESET_B with the microprocessor). When the chip comes out of reset, the programmable registers are at default conditions— crystal oscillator and CLK_OUT on, everything else off. Connect to microprocessor or other reset network. Programmable clock output for normal operation is crystal frequency / N, where 4 ≤ N ≤ 30 Can be used to clock microprocessor (minimize load capacitance) or leave open and disable through SSI port. O D Function Connection Internal 1-MΩ pull-down when driven high, 100-kΩ pull-down when low. A4 CLK_OUT A5 NC B1 VDDTEST B2 NC B3 TXRX_STAT O D Transmit/receive mode indicator for controlling a TX-RX switch during normal operation Connect to TX-RX switch or leave open. B4 SCL I D Serial clock (similar to two-wire); ZL70250 is slave External pull-up resistor required, value depends on load capacitance. B5 SDA I/O D Data input or open drain output External pull-up resistor required, for serial port data (similar to two- value depends on load capacitance. wire); ZL70250 is slave C1 AMX2 O A Analog test bus output Leave open for normal operation. C2 AMX3 O A Analog test bus output Leave open for normal operation. Reserved: do not use; do not connect PWR A Supply voltage for test buffers Supply, connect to VDDA or VDDD. Reserved: do not use; do not connect Re v ision 3 - P reliminary D atasheet 4-1 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Table 4-1 • CSP Pinout (continued) CSP Pin # Pin Name I/O A/D C4 SPI_CLK O D SPI master clock. Can be configured for PCM clock. See programmer's manual. Connects to SPI or PCM interface. C5 SPI_DATA_IN I D SPI data input. Can be configured for PCM data input. See programmer's manual. Connects to SPI or PCM interface. D1 AMX0 I A Analog test bus input Leave open for normal operation. D2 AMX1 I A Analog test bus input Leave open for normal operation. D3 TXRX_CMD I D Transmit/receive control (see programmer's manual) Output from microprocessor. D4 SPI_DATA_OUT O D SPI data output. Can be configured for PCM data output (see programmer's manual) Connects to SPI or PCM interface. D5 SPI_SEL_B O D SPI frame output. Can be Connects to SPI or PCM interface. configured for PCM frame output (see programmer's manual) E1 VDDA PWR A Analog supply voltage Supply, 1.2 V to 1.9 V. E2 RBIAS I A Bias resistor used in trim Connect external 50 kΩ to ground. E3 DOUT0 O D Digital test output Leave open or connect to test point. E4 VDDD PWR A Digital supply voltage Supply, 1.2 V to 1.9 V. E5 IRQ O D Interrupt to microprocessor F1 VSSA PWR A Analog ground F3 NC F5 VSSD PWR A Ground for digital section Ground. G1 VSSH PWR A Ground for power amplifier Ground. G2 TX− O A RF transmitter PA minus output G3 VSSA2 PWR A Analog ground Ground. G5 DOUT1 O D Digital test output Leave open or connect to test point. Function Connection Ground. Reserved: do not use; do not connect Re v ision 3 - P reliminary D atasheet 4-2 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Table 4-1 • CSP Pin # CSP Pinout (continued) Pin Name I/O A/D Function H1 RX− I A RF receiver amplifier minus input (differential high impedance, internal AC coupled); internally connected to antenna tuning capacitor bank H2 RX+ I A RF receiver amplifier plus input (differential high impedance, internal AC coupled); internally connected to antenna tuning capacitor bank H3 TX+ O A RF transmitter PA plus output H4 NC H5 CLKSEL Connection Reserved: do not use; do not connect I D Selects crystal oscillator when low and external clock signal when high (bypasses internal oscillator) Internal 1-MΩ pull-down when driven high, 100-kΩ pull-down when low, leave open or tie to ground for normal operation. Note: Regarding pull-downs: Most of the digital input pads have built-in pull-down resistors so that, if the pin is not used for normal operation, then no connection to the pin is required, thus reducing the traces on small hybrid assemblies. If the input is used, then the pull-down resistor value is switched depending on the input state. If the pin is driven high, the resistor is switched to 1 MΩ to reduce the amount of pull-down current. If the input is driven low or left unconnected, the pull-down resistor value is 100 kΩ. Re v ision 3 - P reliminary D atasheet 4-3 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Package Mechanical Specifications Figure 4-1 • ZL70250 CSP Bottom View Re v ision 3 - P reliminary D atasheet 4-4 5 – Typical Application Circuit Figure 5-1 is representative of a 50-Ω single-ended implementation. The matching network might be different, or even unnecessary, for other types of antennas. In addition, the matching component values assume a particular FR4 substrate. Those values might be different with another substrate type or with FR4 with different characteristics. Figure 5-1 • 50-Ω Single-Ended Implementation Schematic Re v ision 3 - P reliminary D atasheet 5-1 6 – Glossary Term Explanation A Analog A/D Analog/digital AC Alternating current ACK Acknowledgement ADC Analog-to-digital converter addr Address ADK Application development kit AGC Automatic gain control ANT Antenna BER Bit error ratio CCA Clear channel assessment Clk Clock cmd Command CODEC Coder/decoder CSP Chip Scale Package Ctrl Control D Digital DAC Digital-to-analog converter DC Direct current EEPROM Electrically erasable and programmable read-only memory EMC Electromagnetic compatibility EN European Standard (French: Norme) ESD Electrostatic discharge ETS European Telecommunications Standard ETSI European Telecommunications Standards Institute Ext External FCC Federal Communications Commission (US) FM Frequency modulation FR4 Flame retardant 4 (printed circuit board) Freq Frequency Gen Generator GMFK Gaussian frequency shift keying GPIO General-purpose input/output Re v ision 3 - P reliminary D atasheet 6-1 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Term Explanation I Current; Input I/O Input/output IC Integrated circuit ID Identification IF Intermediate frequency ISM Industrial, Scientific, and Medical ksps Thousand (or kilo) symbols per second LO Local oscillator LNA Low-noise amplifier LP Low pass MAC Media access controller Max Maximum MSB Most significant bit Min Minimum mux Multiplexer OSC Oscillator NC No connect Nom Nominal P Stop PA Power amplifier PCM Pulse code modulation PLL Phase-locked loop ppm Parts per million pwr Power R/W Read/write ref Reference RF Radio frequency rms Root mean square RSSI Received signal strength indicator RX Receive S Start SMA Subminiature A SPI Serial peripheral interface SRD Short-range device SSI Synchronous serial interface Sym Symbol Re v ision 3 - P reliminary D atasheet 6-2 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Term Explanation sync Synchronization synth Synthesizer T&R Tape and reel TX Transmit Typ Typical US United States USB Universal serial bus V Voltage; Volt(s) VCO Voltage-controlled oscillator VDD Supply voltage VDDA Supply voltage, analog VDDD Supply voltage, digital vs Versus VSS Ground Wr Write XTAL Crystal Re v ision 3 - P reliminary D atasheet 6-3 7 – Datasheet Information List of Changes The following table lists substantive changes that were made in the ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver datasheet. Revision Preliminary Revision 3 (August 2012) Changes Removed -ENG suffix from part numbers in "Ordering Information". I In Table 3-1, corrected supply voltage and RF I/O voltage, and added a relevant footnote to the table. 3-1 In Table 3-3, removed input current row. 3-1 Corrected recommended supply range in paragraph introducing table. 3-2 In Table 3-4: (1) replaced standby current row with sleep state, including changes to specs and note. (2) clarified temperature for sensitivity parameter, and moved value to "Typ" column. (3) changed note for current consumption row. (4) corrected output voltage range of PA. (5) replaced output power row with maximum output power, including changes to specs and note. 3-2 In Table 3-5, corrected operating temperature range. 3-6 Replaced Figure 5-1. 5-1 Changed terminology to be consistent with other documents: (1) changed "standby" to "sleep" state in tables and text. (2) changed WCLK to CLK_OUT in Figure 1 and in text. Corrected link range Advance Revision 2 (April 2012) Page I, 1-1, 3-2, 4-1, 5-1 1-1 Changed part number in "Ordering Information" from -ENG1 suffix to -ENG2 suffix, plus related changes to specifications throughout document (e.g., removed all references to 24.000-MHz crystal, and changed the recommended operating voltage to 1.1 to 1.9 V). I, various Name change from Zarlink to Microsemi. Included changing document format and chapter structure. Spelling and grammar were also corrected throughout the document. All Re v ision 3 - P reliminary D atasheet 7-1 ZL70250 Ultra-Low-Power Sub-GHz RF Transceiver Datasheet Categories Categories In order to provide the latest information to designers, some datasheet parameters are published before data has been fully characterized from silicon devices. The data provided for a given device is designated as either "Product Brief," "Advance," "Preliminary," or "Production." The definitions of these categories are as follows: Product Brief The product brief is a summarized version of a datasheet (advance or production) and contains general product information. This document gives an overview of specific device and family information. Advance This version contains initial estimated information based on simulation, other products, devices, or speed grades. This information can be used as estimates, but not for production. This label will only be used when the data has not been fully characterized. Preliminary The datasheet contains information based on simulation and/or initial characterization. The information is believed to be correct, but changes are possible. Production This version contains information that is considered to be final. Safety Critical, Life Support, and High-Reliability Applications Policy The products described in an advance status document may not have completed the Microsemi qualification process. Products may be amended or enhanced during the product introduction and qualification process, resulting in changes in device functionality or performance. It is the responsibility of each customer to ensure the fitness of any product (but especially a new product) for a particular purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications. Consult the Microsemi CMPG Products Group Terms and Conditions for specific liability exclusions relating to life-support applications. A reliability report covering all of the CMPG Products Group’s products is available from Microsemi upon request. Microsemi also offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for additional reliability information. Re v ision 3 - P reliminary D atasheet 7-2 Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo CA 92656 USA Within the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 © 2012 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. ZL70250CSP-PreliminaryDS/142423-3/8.12