DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS Product Specification – December 4, 2014 V.19 General data Product specification Surface-Mount Ceramic Multilayer Capacitors 2 18 General data PACKING TAPE AND REEL SPECIFICATIONS Packing conforms fully with “IEC 60286-3”, “EIA 481-1” and “JIS C0806” industrial standards. Multilayer Chip Capacitors (MLCCs) are supplied on tape on reel or in bulk case. For MLCCs with a product thickness of <1 mm, paper/PE tape is preferred. MLCCs with a product thickness of ≥ 1 mm, are supplied in embossed blister tape. For the combination carrier/cover tape no electrostatic behaviour is observed (relative humidity ≥ 30%). The products do not stick to the cover tape. The technical and thermal properties of polycarbonate tapes are excellent, so there is no change in dimensions as a function of time. The peel off force is very stable as a function of time and temperature, and it is defined as 0.1 to 0.7 N at a peel-off speed of 300 mm/minute. Table 1 Properties of carrier tape - polycarbonate 8.1/12 MM TAPE WIDTH, 0.2 MM TOLERANCE Thickness 130 to 360µm Tensile strength at break > 60 MPa Elongation at break 100 to 150% Surface resistance < 1012 Ω/sq. Table 2 Properties of cover tape - polyester (antistatic) 5.5/9.5 MM TAPE WIDTH, 0.1 MM TOLERANCE Thickness 62 µm Breaking force > 20 N / ≥ 17.6 N Elongation at break 105 ± 60% < 1011 Ω/sq. Surface resistance BULK-CASE SPECIFICATION In accordance with “IEC 60286-6”. Reduced costs - Storage - Transport - Machine handling - Packing Customized labelling (bar codes) Available component size please see table 3 Fig. 1 Bulk-case outline OUTLINES Table 3 Packing quantities for component size; see note 1 and Fig.1 For dimension see Table 3 Fig. 2 Surface mounted multilayer ceramic capacitor dimension L1 (mm) W (mm) T (mm) QUANTITY PER BULK CASE 0402 1.0 0.5 0.5 50,000 0603 1.6 0.8 0.8 15,000 0805 2.0 1.25 0.6 10,000 0805 2.0 1.25 0.85 8,000 0805 2.0 1.25 1.25 5,000 SIZE CODE NOTE 1. Refer to the selection charts in product data for specific values www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors 3 18 General data PAPER/PE TAPE SPECIFICATION Fig. 3 Paper/PE tape Table 4 Dimensions of paper/PE tape for relevant chip size; see Fig.3 SIZE SYMBOL Unit: mm (1) CODE A0 0201 0.37 ± 0.03 0.69 ± 0.05 8.0 ± 0.20 1.75 ± 0.1 3.50 ± 0.05 4.0 ± 0.10 2.0 ± 0.05 2.0 ± 0.05 1.55 ± 0.03 0402 0.65 ± 0.15 1.10 ± 0.15 8.0 ± 0.20 1.75 ± 0.1 3.50 ± 0.05 4.0 ± 0.05 2.0 ± 0.05 2.0 ± 0.05 1.50 +0.1 /-0 0.60 ± 0.10 0603 0.95 ± 0.15 1.78 ± 0.15 8.0 ± 0.20 1.75 ± 0.1 3.50 ± 0.05 4.0 ± 0.05 4.0 ± 0.05 2.0 ± 0.05 1.50 +0.1 /-0 0.95 ± 0.15 0805 1.50 ± 0.15 2.26 ± 0.20 8.0 ± 0.20 1.75 ± 0.1 1206 1.90 ± 0.15 3.50 ± 0.20 8.0 ± 0.20 1.75 ± 0.1 (0.95 / 0.75)± 3.50 ± 0.05 4.0 ± 0.05 4.0 ± 0.05 2.0 ± 0.05 1.50 +0.1 /-0 0.10 (0.95 / 0.75)± 3.50 ± 0.05 4.0 ± 0.05 4.0 ± 0.05 2.0 ± 0.05 1.50 +0.1 /-0 0.10 (0.95 / 0.75)± 3.50 ± 0.05 4.0 ± 0.05 4.0 ± 0.05 2.0 ± 0.05 1.50 +0.1 /-0 0.10 B0 W E 4 × 0402 1.50 ± 0.15 2.26 ± 0.20 8.0 ± 0.20 1.75 ± 0.1 4 × 0603 1.90 ± 0.15 3.50 ± 0.20 8.0 ± 0.20 1.75 ± 0.1 0508 1.50 ± 0.15 2.26 ± 0.20 8.0 ± 0.20 1.75 ± 0.1 0612 1.90 ± 0.15 3.50 ± 0.20 8.0 ± 0.20 1.75 ± 0.1 F P0 P1 P2 Ø D0 T 0.42 ± 0.05 (0.95 / 0.75)± 3.50 ± 0.05 4.0 ± 0.05 4.0 ± 0.05 2.0 ± 0.05 1.50 +0.1 /-0 0.10 (0.95 / 0.75)± 3.50 ± 0.05 4.0 ± 0.05 4.0 ± 0.05 2.0 ± 0.05 1.50 +0.1 /-0 0.10 3.50 ± 0.05 4.0 ± 0.05 4.0 ± 0.05 2.0 ± 0.05 1.50 +0.1 /-0 (0.95 / 0.75)± 0.10 NOTE 1. P0 pitch tolerance over any 10 pitches is 0.2 mm 2. 4 x 0402 stands for 0508 array 3. 4 x 0603 stands for 0612 array www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors 4 18 General data BLISTER TAPE SPECIFICATION For dimension see Table 4 K0: so chosen that the orientation of the component cannot change For W = 8 mm: T2 = 3.5 mm max. For W = 12 mm: T2 = 6.5 mm max. Fig. 4 Blister tape Table 5 Dimensions of blister tape for relevant chip size; see Fig.4 SYMBOL SIZE B0 CODE A0 Unit: mm K0 W Min. Max. Min. Max. Min. Max. E F Ø D0 Ø D1 P0 (2) P1 P2 Min. 0805 1.29 1.57 2.08 2.39 1.27 1.55 8.1 ± 0.20 1.70 ± 0.1 3.5 ± 0.05 1.5 +0.1/-0.0 1 +0.1/-0.0 4.0 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 1206 1.65 2.01 3.30 3.63 1.22 2.03 8.1 ± 0.20 1.70 ± 0.1 3.5 ± 0.05 1.5 +0.1/-0.0 1 +0.1/-0.0 4.0 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 1210 2.55 3.02 3.28 3.76 0.78 2.75 8.1 ± 0.20 1.70 ± 0.1 3.5 ± 0.05 1.5 +0.1/-0.0 1 +0.1/-0.0 4.0 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 1808 2.10 2.45 4.80 5.45 1.30 2.45 12.1 ± 0.20 1.70 ± 0.1 5.5 ± 0.05 1.5 +0.1/-0.0 1.5 +0.1/-0.0 4.0 ± 0.10 8.0 ± 0.10 2.0 ± 0.05 1812 3.24 3.75 4.60 5.20 0.80 2.40 12.1 ± 0.20 1.70 ± 0.1 5.5 ± 0.05 1.5 +0.1/-0.0 1.5 +0.1/-0.0 4.0 ± 0.10 8.0 ± 0.10 2.0 ± 0.05 2220 5.12 5.32 5.84 6.04 1.28 1.48 12.0 ± 0.20 1.70 ± 0.1 5.5 ± 0.05 1.5 +0.1/-0.0 1.5 +0.1/-0.0 4.0 ± 0.10 8.0 ± 0.10 2.0 ± 0.05 NOTE 1. Typical capacitor displacement in pocket 2. P0 pitch tolerance over any 10 pitches is ±0.2 mm www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors 5 18 General data REEL SPECIFICATION Fig. 5 Reel Table 6 Reel dimensions; see Fig.5 SYMBOL TAPE WIDTH A N C W1 8 (Ø 178 mm/7") 178 ± 1.0 60 ± 1.0 13 +0.50/-0.20 9.0 ± 0.2 14.4 8 (Ø 330 mm/13") 330 ± 1.0 100 ± 1.0 13 +0.50/-0.20 9.0 ± 0.2 14.4 12 (Ø 178 mm/7") 178 ± 1.0 60 ± 1.0 13 +0.50/-0.20 13.4 ± 1.5 18.4 Unit: mm W2max. P ROPERTIES OF REEL Material: polystyrene Surface resistance: <10 10 /sq. www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors 6 18 General data THICKNESS CLASSES AND PACKING QUANTITY Table 7 SIZE CODE Ø 180 MM / 7 INCH Ø 330 MM / 13 INCH THICKNESS CLASSIFICATION TAPE WIDTH QUANTITY PER REEL Paper/PE Blister Paper/PE Blister QUANTITY PER BULK CASE 0201 0.3 ± 0.03 mm 8 mm 15,000 --- 50,000 --- --- 0402 0.5 ± 0.05 mm 8 mm 10,000 --- 50,000 --- 50,000 0603 0.8 ± 0.1 mm 8 mm 4,000 --- 15,000 --- 15,000 0.6 ± 0.1 mm 8 mm 4,000 --- 20,000 --- 10,000 0805 0.85 ± 0.1 mm 8 mm 4,000 --- 15,000 --- 8,000 1.25 ± 0.2 mm 8 mm --- 3,000 --- 10,000 5,000 0.6 ± 0.1 mm 8 mm 4,000 --- 20,000 --- --- 0.85 ± 0.1 mm 8 mm 4,000 --- 15,000 --- --- 1.00 / 1.15 ± 0.1 mm 8 mm --- 3,000 --- 10,000 --- 1.25 ± 0.2 mm 8 mm --- 3,000 --- 10,000 --- 1.6 ± 0.15 mm 8 mm --- 2,500 --- 10,000 --- 1.6 ± 0.2 mm 8 mm --- 2,000 --- 8,000 --- 0.6 / 0.7 ± 0.1 mm 8 mm --- 4,000 --- 15,000 --- 0.85 ± 0.1 mm 8 mm --- 4,000 --- 10,000 --- 1206 1.15 ± 0.1 mm 8 mm --- 3,000 --- 10,000 --- 1.15 ± 0.15 mm 8 mm --- 3,000 --- 10,000 --- 1.25 ± 0.2 mm 8 mm --- 3,000 --- --- --- 1.5 ± 0.1 mm 8 mm --- 2,000 --- --- --- 1.6 / 1.9 ± 0.2 mm 8 mm --- 2,000 --- --- --- 2.0 ± 0.2 mm 8 mm --- 2,000 1,000 --- --- --- 2.5 ± 0.2 mm 8 mm --- 1,000 500 --- --- --- 1.15 ± 0.15 mm 12 mm --- 3,000 --- --- --- 1.25 ± 0.2 mm 12 mm --- 3,000 --- --- --- 1.35 ± 0.15 mm 12 mm --- 2,000 --- --- --- 1.5 ± 0.1 mm 12 mm --- 2,000 --- --- --- 1.6 ± 0.2 mm 12 mm --- 2,000 --- --- --- 2.0 ± 0.2 mm 12 mm --- 2,000 --- --- --- 0.6 / 0.85 ± 0.1 mm 12 mm --- 2,000 --- --- --- 1.15 ± 0.1 mm 12 mm --- 1,000 --- --- --- 1.25 ± 0.2 mm 12 mm --- 1,000 --- --- --- 1.5 ± 0.1 mm 12 mm --- 1,000 --- --- --- 1.6 ± 0.2 mm 12 mm --- 1,000 --- --- --- 2.0 ± 0.2 mm 12 mm --- 1,000 --- --- --- 2.5 ± 0.2 mm 12 mm --- 500 --- --- --- 1210 1808 1812 www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors General data 7 18 LEADER/TRAILER TAPE SPECIFICATION Fig. 6 Leader/trailer tape Table 8 Leader/trailer tape data DESCRIPTION VALUE Minimum length of empty compartments at leader end ≥ 400 mm of which a minimum 260 mm of empty compartments are covered with cover tape and ≥ 180 mm cover tape only Minimum length of empty compartments at trailer end ≥ 180 mm www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors 8 18 General data LABELLING Label examples are shown in Fig. 7 LINE MARKING EXPLANATION 1 Quantity 2 Bar code of batch no (1D) 3 Unique batch number 4 Bar code of CTC (2D) 5 Taping week code 6 Series code of reel Fig. 7 Packing label www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors 9 18 General data MOUNTING SOLDERING CONDITIONS For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering or conductive adhesive in accordance with IEC 61760-1 (Standard method for the specification of surface mounting components). For advised soldering profiles see Figs 8, 9, 10. An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with the chip size and with temperature fluctuations (>100 °C). Therefore, it is advised to use the smallest possible size and follow the dimensional recommendations given in Tables 8, 9 and 10 for reflow and wave soldering. More detailed information is available on request. Solid line: Typical process (terminal temperature) Dotted lines: Process limits - bottom process limit (terminal temperature) & upper process limit (top surface temperature). Fig. 8 Infrared soldering, forced gas convection reflow soldering - Temperature/time profile for SnPb solders www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors General data 10 18 Solid line: Typical process (terminal temperature) Dotted lines: Process limits - bottom process limit (terminal temperature) & upper process limit (top surface temperature). Fig. 9 Infrared soldering, forced gas convection reflow soldering - Temperature/time profile for lead-free SnAgCu solders Solid line: Typical process Dotted lines: Process limits Fig. 10 Double wave soldering for SnPb and lead-free SnAgCu solder - Temperature/time profile (terminal temperature) www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors 11 18 General data FOOTPRINT DIMENSIONS Fig. 11 Discrete capacitors recommended dimensions of footprint Table 9 Reflow soldering; for footprint dimensions see Fig.11 SIZE Unit: mm FOOTPRINT DIMENSIONS CODE A B C D E F G 0201 0.8 ± 0.20 0.25 ± 0.05 0.28 ± 0.07 0.3 ± 0.10 --- --- --- 0402 1.5 ± 0.15 0.5 ± 0.15 0.5 ± 0.15 0.5 ± 0.15 0.10 ± 0.15 1.75 ± 0.15 0.95 ± 0.15 0603 2.3 ± 0.15 0.7 ± 0.15 0.8 ± 0.15 0.9 ± 0.15 0.26 ± 0.15 2.7 ± 0.15 1.5 ± 0.15 0603 2.3 ± 0.25 0.5 ± 0.25 0.9 ± 0.25 0.9 ± 0.25 0.0 ± 0.25 2.7 ± 0.25 1.5 ± 0.25 0805 2.8 ± 0.25 0.9 ± 0.25 0.95 ± 0.25 1.4 ± 0.25 0.45 ± 0.25 3.2 ± 0.25 2.1 ± 0.25 1206 4.0 ± 0.25 2.0 ± 0.25 1.0 ± 0.25 1.8 ± 0.25 1.4 ± 0.25 4.4 ± 0.25 2.5 ± 0.25 1210 4.0 ± 0.25 2.0 ± 0.25 1.0 ± 0.25 2.7 ± 0.25 1.4 ± 0.25 4.4 ± 0.25 3.4 ± 0.25 1808 5.4 ± 0.25 3.3 ± 0.25 1.05 ± 0.25 2.3 ± 0.25 2.7 ± 0.25 5.8 ± 0.25 2.9 ± 0.25 1812 5.4 ± 0.25 3.3 ± 0.25 1.05 ± 0.25 3.5 ± 0.25 2.7 ± 0.25 5.8 ± 0.25 4.1 ± 0.25 2220 6.6 ± 0.25 4.5 ± 0.25 1.05 ± 0.25 5.3 ± 0.25 3.9 ± 0.25 7.0 ± 0.25 5.9 ± 0.25 Processing remarks IR or hot plate soldering Ceramic substrate only Table 10 Wave soldering (no dummy tracks allowed for ≥ 500 V); for footprint dimensions see Fig.11 SIZE Unit: mm FOOTPRINT DIMENSIONS CODE A B C D E F G 0603 2.4 ± 0.10 1.0 ± 0.10 0.7 ± 0.10 0.8 ± 0.10 0.2 ± 0.10 3.0 ± 0.10 1.9 ± 0.10 1 x (0.2 x 0.8) 0603 2.7 ± 0.25 0.9 ± 0.25 0.9 ± 0.25 0.8 ± 0.25 0.0 ± 0.25 3.2 ± 0.25 2.1 ± 0.25 1 x (0.3 x 0.8) 0805 3.2 ± 0.15 1.4 ± 0.15 0.9 ± 0.15 1.3 ± 0.15 0.36 ± 0.15 4.1 ± 0.15 2.5 ± 0.15 1 x (0.3 x 1.3) 0805 3.4 ± 0.25 1.3 ± 0.25 1.05 ± 0.25 1.3 ± 0.25 0.2 ± 0.25 4.3 ± 0.25 2.7 ± 0.25 1 x (0.2 x 1.3) 1206 4.8 ± 0.25 2.3 ± 0.25 1.25 ± 0.25 1.7 ± 0.25 1.25 ± 0.25 5.9 ± 0.25 3.2 ± 0.25 3 x (0.25 x 1.7) Number & dimensions to dummy tracks www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors 12 18 General data Fig. 12 Recommended footprint dimensions for C-Array Table 11 C-Array footprint dimensions; see Fig.12 FOOTPRINT DIMENSIONS SIZE Unit: mm CODE A B C D E 0405 (2 x 0402) 1.4 ± 0.15 0.4 ± 0.05 0.6 ± 0.05 0.64 0.35 ± 0.05 0508 (4 x 0402) 1.65 ± 0.15 0.55 ± 0.05 0.55 ± 0.05 0.5 0.25 ± 0.05 0612 (4 x 0603) 2.54 ± 0.15 0.89 ± 0.10 0.76 ± 0.10 0.80 ± 0.10 0.45 ± 0.10 www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors 13 18 General data TESTS AND REQUIREMENTS Table 12 Test procedures and requirements TEST TEST METHOD PROCEDURE REQUIREMENTS Mounting IEC 6038421/22 4.3 The capacitors may be mounted on printed-circuit boards or ceramic substrates No visible damage Visual inspection and dimension check 4.4 Any applicable method using × 10 magnification In accordance with specification Capacitance 4.5.1 Class 1: f = 1 MHz for C ≤ 1 nF, measuring at voltage 1 Vrms at 20 °C Within specified tolerance f = 1 KHz for C > 1 nF, measuring at voltage 1 Vrms at 20 °C Class 2: f = 1 KHz for C ≤ 10 µF, measuring at voltage 1 Vrms at 20 °C f = 120 Hz for C >10 µF, measuring at voltage 0.5 Vrms at 20 °C Dissipation factor (D.F.) 4.5.2 Class 1: f = 1 MHz for C ≤ 1 nF , measuring at voltage 1 V rms at 20 °C In accordance with specification f = 1 KHz for C > 1 nF, measuring at voltage 1 Vrms at 20 °C Class 2: f = 1 KHz for C ≤ 10 µF, measuring at voltage 1 Vrms at 20 °C f = 120 Hz for C > 10 µF, measuring at voltage 0.5 Vrms at 20 °C Insulation resistance 4.5.3 At Ur (DC) for 1 minute In accordance with specification www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors TEST TEST METHOD Temperature coefficient 4.6 18 General data PROCEDURE REQUIREMENTS Capacitance shall be measured by the steps shown in the following table. <General purpose series> Class1: ∆ C/C: ± 30ppm The capacitance change should be measured after 5 min at each specified temperature stage. Step Temperature(℃) a 25± 2 b Lower temperature± 3℃ c 25± 2 d Upper Temperature± 2℃ e 25± 2 14 Class2: X7R: ∆ C/C: ±15% Y5V: ∆ C/C: 22~-82% <High Capacitance series> Class2: X7R/X5R: ∆ C/C: ±15% Y5V: ∆ C/C: 22~-82% (1) Class I Temperature Coefficient shall be calculated from the formula as below Temp, Coefficient = C2 - C1 106 [ppm/℃] C1 xΔT C1: Capacitance at step c C2: Capacitance at 125℃ ∆T: 100℃(=125℃-25℃) (2) Class II Capacitance Change shall be calculated from the formula as below C2 - C1 ∆C = x 100% C1 C1: Capacitance at step c C2: Capacitance at step b or d Adhesion 4.7 A force applied for 10 seconds to the line joining the terminations and in a plane parallel to the substrate Force size ≥ 0603: 5N size = 0402: 2.5N size = 0201: 1N IEC 60384Bond 21/22 strength of plating on end face 4.8 Mounting in accordance with IEC 60384-22 paragraph 4.3 No visible damage Conditions: bending 1 mm at a rate of 1 mm/s, radius jig 340 mm <General purpose series> ∆C/C Class 1: NP0: within ± 1% or 0.5 pF, whichever is greater Class2: X5R/X7R/Y5V: ± 10% <High Capacitance series> ∆C/C Class2: X5R/X7R/Y5V: ± 10% www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors TEST Resistance to soldering heat TEST METHOD 4.9 18 General data PROCEDURE REQUIREMENTS Precondition: 150 +0/–10 °C for 1 hour, then keep for 24 ± 1 hours at room temperature Dissolution of the end face plating shall not exceed 25% of the length of the edge concerned Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute Preheating: for size >1206: 100 °C to 120 °C for 1 minute and 170 °C to 200 °C for 1 minute Solder bath temperature: 260 ± 5 °C Dipping time: 10 ± 0.5 seconds Recovery time: 24 ± 2 hours 15 <General purpose series> ∆C/C Class 1: NP0: within ± 0.5% or 0.5 pF, whichever is greater Class2: X5R/X7R: ± 10% Y5V: ± 20% <High Capacitance series> ∆C/C Class2: X5R/X7R: ± 10% Y5V: ± 20% D.F. within initial specified value Rins within initial specified value Solderability 4.10 Preheated the temperature of 80 °C to 140 °C and maintained for 30 seconds to 60 seconds. The solder should cover over 95% of the critical area of each termination Test conditions for lead containing solder alloy Temperature: 235 ± 5 °C Dipping time: 2 ± 0.2 seconds Depth of immersion: 10 mm Alloy Composition: 60/40 Sn/Pb Number of immersions: 1 Test conditions for leadfree containing solder alloy Temperature: 245 ± 5 °C Dipping time: 3 ± 0.3 seconds Depth of immersion: 10 mm Alloy Composition: SAC305 Number of immersions: 1 www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors TEST METHOD PROCEDURE REQUIREMENTS Rapid change of temperature IEC 6038421/22 Preconditioning; 150 +0/–10 °C for 1 hour, then keep for 24 ± 1 hours at room temperature No visual damage 4.11 18 General data TEST 16 <General purpose series> ∆C/C 5 cycles with following detail: 30 minutes at lower category temperature 30 minutes at upper category temperature Recovery time 24 ± 2 hours Class 1: NP0: within ± 1% or 1 pF, whichever is greater Class2: X5R/X7R: ± 15% Y5V: ± 20% <High Capacitance series> ∆C/C Class2: X5R/X7R: ± 15% Y5V: ± 20% D.F. meet initial specified value Rins meet initial specified value Damp heat with Ur load 4.13 1. Preconditioning, class 2 only: 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room temp 2. Initial measure: Spec: refer initial spec C, D, IR 3. Damp heat test: 500 ± 12 hours at 40 ± 2 °C; 90 to 95% R.H. 1.0 Ur applied 4. Recovery: Class 1: 6 to 24 hours Class 2: 24 ± 2 hours 5. Final measure: C, D, IR P.S. If the capacitance value is less than the minimum value permitted, then after the other measurements have been made the capacitor shall be precondition according to “IEC 60384 4.1” and then the requirement shall be met. No visual damage after recovery <General purpose series> ∆C/C Class 1: NP0: within ± 2% or 1 pF, whichever is greater Class2: X5R/X7R: ± 15%; Y5V: ± 30% D.F. Class 1: NP0: ≤ 2 x specified value Class2: X5R/X7R: ≤ 16V: ≤ 7% ≥ 25V: ≤ 5% Y5V: ≤ 15% Rins Class 1: NP0: ≥ 2,500 MΩ or Rins x Cr ≥ 25s whichever is less Class2: X5R/X7R/Y5V: ≥ 500 MΩ or Rins x Cr ≥ 25s whichever is less <High Capacitance series> ∆C/C Class2: X5R/X7R: ± 20%; Y5V: ± 30% D.F. Class2: 2 x initial value max Rins Class2: 500 MΩ or Rins x Cr ≥ 25s, whichever is less www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors TEST TEST METHOD Endurance IEC 6038421/22 General data PROCEDURE 4.14 1. Preconditioning, class 2 only: 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room temp 2. Initial measure: Spec: refer initial spec C, D, IR 3. Endurance test: Temperature: NP0/X7R: 125 °C X5R/Y5V: 85 °C Specified stress voltage applied for 1,000 hours: Applied 2.0 x Ur for general product Applied 1.5 x Ur for high cap. product High voltage series follows with below stress condition: Applied 1.3 x Ur for 500V series Applied 1.2 x Ur for 1KV, 2KV, 3KV series 18 REQUIREMENTS No visual damage <General purpose series> ∆C/C Class1: NP0: within ± 2% or 1 pF, whichever is greater Class2: X5R/X7R: ± 15%; Y5V: ± 30% D.F. Class1: NP0: ≤ 2 x specified value Class2: X5R/X7R: ≤ 16V: ≤ 7% ≥ 25V: ≤ 5% 4. Recovery time: 24 ± 2 hours Y5V: ≤ 15% 5. Final measure: C, D, IR Rins P.S. If the capacitance value is less than the minimum value permitted, then after the other measurements have been made the capacitor shall be precondition according to “IEC 60384 4.1” and then the requirement shall be met. 17 Class1: NP0: ≥ 4,000 MΩ or Rins x Cr ≥ 40s whichever is less Class2: X5R/X7R/Y5V: ≥ 1,000 MΩ or Rins x Cr ≥ 50s whichever is less <High Capacitance series> ∆C/C Class 2: X5R/X7R: ± 20%; Y5V: ± 30% D.F. Class 2: 2 x initial value max Rins Class 2: 1,000 MΩ or Rins x Cr ≥ 50s, whichever is less Voltage proof IEC 60384-1 4.6 Specified stress voltage applied for 1 minute No breakdown or flashover Ur ≤ 100 V: series applied 2.5 Ur 100 V < Ur ≤ 200 V series applied (1.5 Ur + 100) 200 V < Ur ≤ 500 V series applied (1.3 Ur + 100) Ur > 500 V: 1.3 Ur I: 7.5 mA www.yageo.com Dec. 4, 2014 V.18 Product specification Surface-Mount Ceramic Multilayer Capacitors General data 18 18 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION Version 19 Dec. 04, 2014 - Dimensions of paper Version 18 Jun. 10, 2014 - Dimensions of paper Version 17 Jun. 17, 2013 - Thickness classes and Packing quantity updated Version 16 Oct 05, 2012 - Thickness classes and Packing quantity updated Version 15 Mar 09, 2011 - Packing quantity added Version 14 Feb 18, 2011 - 0201 PE tape specifications added Version 13 Sep 15, 2010 - Dimensions of blister tape updated Version 12 Sep 18, 2009 - PE tape specifications updated Version 11 Sep 07, 2009 - PE tape specifications added Version 10 Jun 12, 2009 - Paper tape specifications updated Version 9 Apr 03, 2009 - Change to dual brand datasheet - Label definition updated - Reflow soldering for Sn/Pb chart updated - Reflow soldering for lead free (Pb-free) chart added - Double wave soldering chart updated - Tests and requirements updated Version 8 Apr 11, 2006 - Taping quality improved Version 7 Jul 10, 2003 - Company logo updated - Taping specification updated - Label definition updated www.yageo.com Dec. 4, 2014 V.18