ROHM BD3021HFP-M

Power Management ICs for Automotive Body Control
Regulator with
Voltage Detector and Watchdog Timer
BD3021HFP-M
No.10039EAT10
●Description
BD3021HFP-M is a regulator IC with integrated WDT (Watch Dog Timer), high output voltage accuracy ±2.0% and 80µA
(Typ.) low circuit current consumption. BD3021HFP-M supports usage of low ESR ceramic capacitor for output stability.
BD3021HFP-M can be a stable power supply for any applications while detecting malfunction of microcontrollers.
●Features
1) WDT Can be Switched ON/OFF by Using INH Pin
2) Low Circuit Current: 80µA(Typ.)
3) Output Circuit: Pch DMOS
4) High Output Voltage Accuracy: 5V±2%
5) Supports Low ESR Ceramic Capacitor
6) Vcc Max Voltage: 50V
7) Integrated Over Current Protection and Thermal Shut Down
8) HRP7 packaging
●Applications
Any application using a microcontroller or a DSP such as automotive (body control), display, server, DVD, phone, etc…
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Vcc
-0.3 ~ +50
V
INH pin voltage
VINH
-0.3 ~ +15
V
Regulator output pin voltage
VOUT
-0.3 ~ +15
V
VRESET
-0.3 ~ +15
V
VCLK
-0.3 ~ +15
V
VCT
-0.3 ~ +15
V
Pd
1.6
W
Operating temperature range
Topr
-40 ~ +125
℃
Storage temperature range
Tstg
-55 ~ +150
℃
Tjmax
150
℃
Supply Voltage
*1
Reset output pin voltage
Watchdog input pin voltage
Reset delay setting pin voltage
Power dissipation
*2
Maximum junction temperature
*1 Not to exceed Pd.
*2 Reduced by 12.8W / °C over Ta = 25°C, when mounted on glass epoxy board: 70mm×70mm×1.6mm.
●Operating conditions (Ta=-40~125°C)
Parameter
Supply Voltage
*3
Output Current
Symbol
Min
Max
Unit
Vcc
5.6
36.0
V
Io
0
500
mA
*3 For the output voltage, consider the voltage drop (dropout voltage) due to the output current.
NOTE: This product is not designed for protection against radioactive rays.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
1/14
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●Electrical characteristics (Unless otherwise specified, Ta=25°C, Vcc=13.5V, CLK=GND)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Bias current 1
Icc1
－
80
130
µA
Io=0mA
Bias current 2
Icc2
－
150
300
µA
Io=50mA(Ta=25℃)
Output voltage
VOUT
4.90
5.00
5.10
V
Io=200mA
Line regulation
Line.Reg
－
5
35
mV
Vcc=5.6 ~ 36V
Load regulation
Load.Reg
－
30
70
mV
Io=5 ~ 200mA
Dropout voltage
ΔVd
－
0.3
0.6
V
Vcc=4.75V, Io=200mA
Ripple rejection
R.R.
45
55
－
dB
f=120Hz, ein=1Vrms,
Io=100mA
Detection voltage
Vdet
4.40
4.50
4.60
V
Hysteresis width
VHS
50
100
150
mV
Output delay time LowHigh
(Power on reset time)
TdLH
1.1
1.9
2.7
ms
Output delay time High→Low
TdHL
－
100
300
µs
IRESET
0.2
－
－
mA
Ict
0.1
－
－
mA
Low output voltage
VRST
－
0.1
0.2
V
Min. operating voltage
VOPL
1.5
－
－
V
CT switching threshold voltage High
VthH
1.08
1.15
1.25
V
WDT ON, INH= Open
CT switching threshold voltage Low
VthL
0.13
0.15
0.17
V
WDT ON, INH= Open
WDT Charge current
Ictc
3.5
6.0
8.5
µA
WDT ON, INH= Open, CT=0V
WDT Discharge current
Ictd
1.2
2.0
2.8
µA
WDT ON, INH= Open, CT=1.3V
WDT ON, INH= Open,
CT=0.01µF(Ceramic Cap)
Overall Device
Regulator
Reset
RESET discharge urrent
CT discharge current
Vcc=Vdet±0.5V(Vcc=VOUT)
INH=Open,CT=0.01µF
Vcc=Vdet±0.5V(Vcc=VOUT)
INH= Open,CT=0.01µF
Vcc=1.5V,RESET=0.5V
(Vcc=VOUT)
Vcc=1.5V,CT=0.5V
(Vcc=VOUT)
VOUT=4.0V
Watchdog timer
Watchdog monitor time Low
TWH
3.0
5.0
7.0
ms
Watchdog reset time
TWL
1.0
1.7
2.4
ms
CLK Input pulse width
TWCLK
500
－
－
ns
WDT OFF threshold Voltage
VHINH
VOUT
×0.8
－
VOUT
V
WDT ON threshold voltage
VLINH
0
－
VOUT
×0.3
V
IINH
－
10
20
µA
※Characteristics of ceramic cap not
considered.
INH
INH Input current
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2/14
INH=5V
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●Electrical characteristics (Unless otherwise specified, Ta=25°C, Vcc=13.5V, CLK=GND )
80
60
Ta=25℃
Ta=-40℃
40
20
OUTPUT VOLTAGE: VOUT [V]
Ta=125℃
100
CIRCUIT CURRENT: Icc2 [μA]
CIRCUIT CURRENT: Icc1 [µA]
6
500
120
400
300
200
100
0
5
10
15
20
SUPPLY VOLTAGE: Vcc [V]
4
3
Ta=-40℃
Ta=25℃
2
Ta=125℃
1
0
0
0
5
25
0
100
200
300
400
OUTPUT CURRENT: IOUT [mA]
Fig.1 Circuit Current
0
500
25
Fig.3 Input Stability
Fig.2 Circuit Current
6
5
10
15
20
SUPPLY VOLTAGE : Vcc [V]
80
1
4
Ta=-40℃
3
2
Ta=125℃
1
0
0.0
0.8
Ta=125℃
0.6
Ta=25℃
0.4
Ta=-40℃
0.2
0.2
0.4
0.6
0.8
1.0
OUTPUT CURRENT: Io[A]
0
1.2
40
100
200
300
400
OUTPUT CURRENT: Io [mA]
Ta=25℃
20
500
5.00
4.75
120
5
4
3
2
1
Fig. 7 Output Voltage
Temperature Characteristics
Ta=-40℃
3
1
-1
4
2
0
3
Fig.10 CT Pin Charge / Discharge
Current (Vcc=5V)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
1
2
3
4
OUTPUT VOLTAGE: VOUT [V]
5
Fig.9 Restion Voltage
(Vcc=VOUT)
6
5
4.6
VHS
4.4
Vdet
4.2
4.0
3.8
-3
0.5
1
1.5
2
2.5
CT PIN VOLTAGE: VCT [V]
6
0
WDT : TWL,H [ms]
DETECTION VOLTAGE: Vdet[V]
Ta=125℃
5
0
8
120
140
160
180
200
AMBIENT TEMPERATURE: Ta [℃]
4.8
Ta=25℃
10000 100000 1000000
Fig. 6 Ripple Rejection
Fig.8 Thermal Shutdown
Circuit Characteristics
7
1000
10
0
100
4.50
100
FREQUENCY : f [Hz]
RESET VOLTAGE: VRESET [V]
OUTPUT VOLTAGE: VOUT [V]
5.25
9
Ta=-40℃
0
10
6
-40
0
40
80
AMBIENT TEMPERATURE: Ta [℃]
Ta=125℃
Fig.5 Dropout Voltage
5.50
CT PIN CURRENT: Ictc,cto [µA]
60
0
Fig. 4 Load Stability
OUTPUT VOLTAGE: VOUT [V]
RIPPLE REJECTION: R.R. [dB]
5
DROPOUT VOLTAGE: ?Vd [V]
OUTPUT VOLTAGE: Vo[V]
Ta=25℃
4
Watch time
3
Reset time
2
1
-40
0
40
80
120
AMBIENT TEMPERATURE: Ta [℃]
Fig.11 Reset Detection
Voltage vs. Temperature
3/14
0
-40
0
40
80
120
AMBIENT TEMPERATURE: Ta [℃]
Fig.12 WDT Time vs. Temperature
(CT=0.01µF)
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●Measurement Circuit for Reference Data
CLK
INH
Vcc
GND
VOUT
RESET
CT
CLK
INH
Vcc
GND
VOUT
RESET
CT
CLK
INH
Vcc
GND
VOUT
RESET
CT
A
V
A
Io
Measurement Circuit of Fig.1
CLK
INH
Vcc
GND
VOUT
RESET
CT
Measurement Circuit of Fig.2
CLK
INH
Vcc
GND
VOUT
RESET
CT
Measurement Circuit of Fig.3
and Fig.7 and Fig.8
CLK
INH
Vcc
GND
VOUT
RESET
CT
V
A
V
～
V
~
V
～
100mA
Io
Measurement Circuit of Fig.4
CLK
INH
Vcc
GND
VOUT
RESET
CT
Measurement Circuit of Fig.5
CLK
INH
Vcc
GND
VOUT
RESET
CT
A
Measurement Circuit of Fig.6
CLK
INH
Vcc
GND
VOUT
RESET
CT
Oscilloscope
V
Measurement Circuit of Fig.9
and Fig11
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
Measurement Circuit of Fig.10
4/14
Measurement Circuit of Fig.12
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●Block diagrams
Vcc
VREF
PREREG
CLK
edge
OCP
TSD
Vcc
INH
ON/OFF
Circuit
VREF_R
Vcc
GND
VOUT
RESET
CT
WDT
VREF_R
VthH
VthL
Fig.13
Pin No.
Pin Name
Function
1
CLK
Clock Input from Microcontroller
2
INH
WDT ON/OFF Function Pin
3
Vcc
Power Supply Pin
4
GND
GND
5
VOUT
Voltage Output Pin
6
RESET
Reset Output Pin
7
CT
Fin
GND
External Capacitance for Reset Output Delay Time,
WDT Monitor Time Setting Connection Pin
GND
●TOP VIEW (Package dimension)
HRP7
1.905±0.1
0.8875
1 2
3 4
0.835±0.2
8.0±0.13
(7.49)
8.82±0.1
(6.5)
5 6 7
1.523±0.15
10.54±0.13
1.017±0.2
9.395±0.125
(MAX 9.745 include BURR)
+5.5°
4.5° −4.5°
0.08±0.05
+0.1
0.27 -0.05
0.73±0.1
1.27
S
0.08 S
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
(Unit : mm)
5/14
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●Input / Output Equivalent Circuit Diagrams (Resistance value is typical value)
CLK(1pin)
INH(2pin)
VOUT
VOUT
INH
CLK
10kΩ
Vcc(3pin)
Vcc
10kΩ
IC
500kΩ
VOUT(5pin)
RESET(6pin)
CT(7pin)
VOUT
Vcc
VOUT
470kΩ
RESET
VOUT
3.7MΩ
CT
1kΩ
1.25MΩ
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
6/14
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●BD3021HFP-M (Power on Reset / Watchdog Timer)
Power ON reset (output delay time) is adjustable by CT pin capacitor.
TdLH(S) ≒(1.15V×CT capacitance(µF) / Ictc(µA)
(Typ.)
・TdLH
:Output delay time( power ON reset)
・1.15V
:Upper switching threshold voltage(Typ.)
・CT capacitance :capacitor connected to CT pin
・Ictc
:WDT charge current
Calculation example) with 0.01µF CT pin capacitor
TdLH(S)=1.15V×0.01µF/6µA
≒1.9msec
※If the CT capacitance is not the same as the condition on the electrical characteristics table, i.e., 0.01µF, choose the capacitance value in ratio referring
to the above equation.
Watch Dog Timer ( WDT watch time, reset time) is adjustable by the CT pin capacitor
TWH(S) ≒(1.00V×CT capacitance (µF))/ Ictd(µA) (Typ.)
TWL(S) ≒(1.00V×CT capacitance (µF))/ Ictc(µA) (Typ.)
・TWH
:WDT watch time (delay time to turn the reset ON)
・TWL
:WDT reset time (time the reset is ON)
・1.00V
:Upper switching threshold voltage － lower switching threshold voltage
・CT capacitance :CT pin capacitor ※Shared with power ON reset
・Ictc
:WDT charge current
・Ictd
:WDT discharge current
Calculation example) with 0.01µF CT pin capacitor
TWH(S)≒1.00V×0.01µF/2µA≒5.0msec (Typ.)
TWL(S)≒1.00V×0.01µF/6µA≒1.7msec (Typ.)
※If the CT capacitance is not the same as the condition on the electrical characteristics table, i.e., 0.01µF, choose the capacitance value in ratio referring
to the above equation.
＜Timing Chart＞
13.5V
Vcc
4.0V
3V
0V
4.60V
5V
4.0V
VOUT
4.50V VHS 100mV
0V
1.25V
1.15V
CT
CT pull up voltage
0.15V
0V
CLK
0V
Power on reset
Reset ON
OUT voltage
RESET
0V
Reset ON
Reset ON
Power on reset
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
7/14
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●WDT timer ON/OFF switch INH (Resistance value is typical value)
BD3021HFP-M has a switch INH to turn the WDT ON/OFF
VREF_R
(TYP≒1.25V)
INH
HIGH
500kΩ
ON/OFF
Circuit
～
～
LOW
WDT
ON
10kΩ
CT
WDT
OFF
External Capacitor
IC Internal Block Diagram
By using INH ON, CT potential can be pulled up to internal voltage VREF_R (invalid with power ON reset))
＜Timing Chart＞
13.5V
Vcc
0V
5V
VOUT
0V
WDT ON
5V
INH
0V
1.25V
CT pull up Voltgge
Upper switching threshold voltage
1.15V
0.15V
lower switching threshold voltage
0V
CT
5V
CLK
0V
OUT voltage
RESET
0V
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
8/14
2010.11 - Rev.A
Technical Note
BD3021HFP-M
＜Timing Chart＞
13.5V
Vcc
5.5V
5V
3V
0V
4.0V
VOUT
4.60V
5V
4.0V
VHS100mV
4.50V
0V
WDT OFF(INH=ON)
INH
5V
0V
Watch time
1.25V
CT 1.15V
0.15V
0V
CLK
CLK width<500ns
0V
Power on reset
OUT voltage
RESET
0V
Power on reset
WDT
Reset time
Minimum reset
Movement voltage
Reset ON
Reset ON
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
9/14
Reset ON
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●Thermal Design
10
Mounted on a Rohm standard board
Board size : 70 ㎜×70 ㎜×1.6 ㎜
θja=78.1(℃/W)
8
POWER DISSIPATON:Pd[ W]
POWER DISSIPATON:Pd[ W]
10
6
4
1.60W
2
0
③7.3W
8
②5.5W
6
Mounted on a Rohm standard board
Board size : 70 ㎜×70 ㎜×1.6 ㎜
(board contains a thermal)
①2-layer board
(back surface copper foil area :15 ㎜×15 ㎜)
②2-layer board
(back surface copper foil area :70 ㎜×70 ㎜)
③4-layer board
(back surface copper foil area :70 ㎜×70 ㎜)
①θja=54.3(℃/W)
②θja=22.7(℃/W)
③θja=17.1(℃/W)
4
①2.3W
2
0
0
25
50
75
100
125
150
0
AMBIENT TEMPERATURE:Ta[℃]
25
50
75
100
125
150
AMBIENT TEMPERATURE:Ta[℃]
Fig.14
Fig.15
Refer to Fig.14 and Fig.15 thermal dissipation characteristics for usage above Ta=25℃. The IC’s characteristics are affected
heavily by the temperature, and if is exceeds its max junction temperature (Tjmax), the chip may degrade or destruct.
Thermal design is critical in terms of avoiding Instantaneous destruction and reliability in long term usage. The IC needs to
be operated below its max junction temperature (Tjmax) to avoid thermal destruction. Refer to Fig.14 and Fig.15 for HRP7
package thermal dissipation characteristics. Operate the IC within power dissipation (Pd) when using this IC.
Power consumption Pc(W) calculation will be as below (for Fig.15③)
Vcc
VOUT
Io
Icc2
Pc=(Vcc－VOUT)×Io+Vcc×Icc2
Power dissipation Pd≧Pc
: Input Voltage
: Output Voltage
: Load Current
: Circuit Current
If load current Io is calculated to operate within power dissipation, it will be as below, where you can find the max load current
IoMax for the applied voltage Vcc of the thermal design.
Io ≦
Pd－Vcc×Icc2
Vcc－VOUT
(Refer to Fig2 for Icc2)
Example) at Ta=125℃,Vcc=12V,VOUT=5V
Io ≦
1.46－12×Icc2
Fig.15③ : θja=17.1℃/W → -58.4mW/℃
25℃=7.3W → 125℃=1.46W
12－5
Io ≦ 208mA (Icc2=150µA)
Refer to above and adjust the thermal design so it will be within power dissipation within the entire operation temperature
range. Below is the power consumption Pc calculation when (VOUT-GND short)
Pc=Vcc×(Icc2+Ishort)
Ishort: short current
(Refer to Fig.4 for I short)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
10/14
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●Pin Settings / Precautions
1. Vcc Pin
Insert a 0.33 ~ 1000µF capacitor between the Vcc and GND pins. The appropriate capacitance value varies by
application. Be sure to allow a sufficient margin for input voltage levels.
2.
Output pins
It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable
capacitance values range from 0.1µF ~ 1000µF. Abrupt fluctuations in input voltage and load conditions may affect the
output voltage. Output capacitance values should be determined only through sufficient testing of the actual application.
Vcc=5.6V～36V
Io=0A～500mA
Ta=-40℃～+125℃
Cin=0.33µF～100µF Cout=0.1µF～100µF
Cout(0.1μF～)
100
Unstable operating region
Cout_ESR( Ω)
10
Vcc
1
Vcc
(5.6~36V)
Stable operating
region
0.1
Cin
(0.33μF～)
Vo
GND
ESR
(0.001Ω～)
Io(ROUT)
0.01
0.001
0
100
200
300
400
500
Cout_Io(mA)
ESR vs Io(reference data)
3.
CT pin
Connecting a capacitance of 0.01µF
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
※Pin Settings / Precautions 2 Measurement circuit
~ 1µF on the CT pin is recommended.
11/14
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●Notes for use
1. Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may
result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode)
when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider
adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external
circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.
3. GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins
are at a voltage below the GND at any time, regardless of transient characteristics.
4. Ground wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused
by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage. The
power supply and ground lines must be as short and thick as possible to reduce line impedance.
5. Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor
soldering or foreign objects) may result in damage to the IC.
6. Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications
where strong electromagnetic fields may be present.
7. Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to
stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8. Thermal consideration
Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions.
Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc)
Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, VOUT : Output Voltage, Io : Load, Icc2 : Bias Current2
Package Power dissipation : Pd (W)=(Tjmax－Ta)/θja
Power dissipation
: Pc (W)=(Vcc－VOUT)×Io+Vcc×Icc2
9. Over current protection circuit (OCP)
The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity.
This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current
(without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These
protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should
not be used in applications characterized by the continuous or transitive operation of the protection circuits.
10. Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of
thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after
this function has activated, or in applications where the operation of this circuit is assumed.
11. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal
state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in
case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent
reverse current flow, or insert bypass diodes between Vcc and each pin.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
12/14
2010.11 - Rev.A
Technical Note
BD3021HFP-M
12. Positive voltage surges on VCC pin
A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 50V on
the VCC pin.
Vcc
GND
13. Negative voltage surges on VCC pin
A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the
VCC pin.
Vcc
GND
14. Output protection diode
Loads with large inductance components may cause reverse current flow during startup or shutdown.
In such cases, a protection diode should be inserted on the output to protect the IC.
15. Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes
and/or transistors.
For example (refer to the figure below):
○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode
○When GND > Pin B, the PN junction operates as a parasitic transistor
Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Transistor (NPN)
Resistor
(Pin A)
B
(Pin B)
C
(Pin B)
E
B
N
P
P+
N
P
P+
P+
N
N
P
N
N
C
E
GND
P+
N
Parasitic elements
or transistors
P substrate
Parasitic elements
(Pin A)
Parasitic elements
or transistors
GND
GND
Parasitic elements
Example of Simple Monolithic IC Architecture
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
13/14
2010.11 - Rev.A
Technical Note
BD3021HFP-M
●Ordering part number
B
D
3
Part No.
0
2
1
Part No.
H
F
P
-
M
Package
HFP:HRP7
T
R
Packaging and forming specification
E2: Embossed tape and reel
HRP7
<Tape and Reel information>
1.905±0.1
0.8875
1 2
3 4
0.835±0.2
8.0±0.13
(7.49)
8.82±0.1
(6.5)
5 6 7
1.523±0.15
10.54±0.13
1.017±0.2
9.395±0.125
(MAX 9.745 include BURR)
Tape
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
+5.5°
4.5° −4.5°
0.08±0.05
+0.1
0.27 -0.05
0.73±0.1
1.27
S
Direction of feed
0.08 S
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
Reel
(Unit : mm)
14/14
∗ Order quantity needs to be multiple of the minimum quantity.
2010.11 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
R1010A