LCD Segment Driver series Standard function Segment Drivers No.09044EBT01 BU9795AKV, BU9795AFV, BU9795AGUW ●Description This is LCD segment driver for 140 segment type display. There is a lineup which is suitable for multi function display and is integrated display RAM and power supply circuit for LCD driving with 4 common output type: BU9795AKV/FV/GUW. ●Features 1) 3wire serial interface (CSB, SD, SCL) 2) Integrated RAM for display data (DDRAM) : 35 × 4bit (Max 140 Segment) 3) LCD driving port: 4 Common output, Segment: 35output (BU9795AKV), 31output (BU9795AGUW), 27output (BU9795AFV) 4) Display duty: 1/4 duty 5) Integrated Buffer AMP for LCD driving power supply 6) 1/2bias, 1/3bias selectable 7) No external components 8) Low power/ Ultra low power consumption design: +2.5～5.5V ●Applications Telephone, FAX, Portable equipment (POS, ECR, PDA etc.), DSC, DVC, Car audio, Home electrical appliance, Meter equipment etc. ●Line up matrix Parameter Segment output Common output Package www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. BU9795AKV 35 4 VQFP48C BU9795AFV 27 4 SSOP-B40 1/15 BU9795AGUW 31 4 VBGA048W040 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW ●Absolute maximum ratings (Ta=25degree, VSS=0V) Parameter Power supply voltage1 Power supply voltage2 Allowable loss Input voltage range Operational temperature range Storage temperature range Symbol Limits Unit Remark VDD VLCD -0.5 ～ +7.0 -0.5 ～ VDD V V 0.6 W 0.7 W 0.27 W Power supply LCD drive voltage When use more than Ta=25C, subtract 6mW per degree.(BU9795AKV) When use more than Ta=25C, subtract 7mW per degree (BU9795AFV) When use more than Ta=25C, subtract 2.7mW per degree (BU9795AGUW) Pd VIN -0.5 ～ VDD+0.5 V Topr -40 ～ +85 degree Tstg -55 ～ +125 degree *This product is not designed against radioactive ray. ●Operating conditions (Ta=25degree,VSS=0V) Parameter Symbol Min. Power Supply voltage1 VDD 2.5 Power Supply voltage2 VLCD 0 * Please use VDD-VLCD≧2.4V condition. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Typ. - Max. 5.5 VDD-2.4 2/15 Unit V V Remark Power supply LCD drive voltage 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW ●Electrical characteristics DC Characteristics (VDD=2.5～5.5V, VSS=0V, Ta=-40～85degree, unless otherwise specified) Limit Symbol Unit Condition Parameter MIN TYP MAX VIH 0.7VDD VDD V “H” level input voltage VIL VSS 0.3VDD V “L” level input voltage IIH 1 uA “H” level input current IIL -1 uA “L” level input current SEG RON 3.5 kΩ Iload=±10uA LCD Driver on resistance COM RON 3.5 kΩ VDD -2.4 VLCD supply voltage VLCD 0 V VDD-VLCD≧2.5V Display off, Oscillator off Ist 5 uA Standby current Power consumption 1 IDD1 - 12.5 30 uA VDD=3.3[V], Ta=25, Power save mode1, FR=70Hz 1/3 bias, Frame inverse Power consumption 2 IDD2 - 20 40 uA VDD=3.3[V], Ta=25, Normal mode, FR=80Hz 1/3 bias, Line inverse Limit TYP 80 80 MAX 104 90 Limit TYP - MAX 80 80 - ● Oscillation Characteristics (VDD=2.5～5.5V,VSS=0V, Ta=-40～85degree) Parameter Symbol Frame frequency Frame frequency1 MIN 56 70 fCLK fCLK1 Unit Hz Hz Condition FR = 80Hz setting VDD=3.5V, 25degree ● MPU interface Characteristics (VDD=2.5V～5.5V,VSS=0V, Ta=-40～85degree) Parameter Symbol Input rise time MIN 400 100 100 20 50 50 50 50 tr tf tSCYC tSHW tSLW tSDS tSDH tCSS tCSH tCHW Input fall time SCL cycle time “H” SCL pulse width “L” SCL pulse width SD setup time SD hold time CSB setup time CSB hold time “H” CSB pulse width Unit Condition ns ns ns ns ns ns ns ns ns ns tCHW CSB tCSS tf SCL tSCYC tr tCSH tSLW tSHW SD tSDS tSDH Fig.1 3wire Serial timing waveform www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW * BU9795AKV ● Block Diagram ● Pin Arrangement COM1 ＋ LCD BIAS SELECTOR common counter ＋ － blink timing generator DDRAM VLCD INHb Command Data Decoder Command register OSCIN SEG24 25 SEG25 SEG26 SEG27 SEG28 SEG29 24 SEG23 SEG22 COM3 SEG21 VLCD SEG20 VDD SEG19 VSS SEG18 OSCIO SEG17 CSB SEG16 SCL SEG15 SD SEG14 TEST SEG13 SEG12 13 48 CSB SD SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG0 TEST SEG4 1 IF FILTER VSS SEG11 12 INHb serial inter face SEG3 Power On Reset SEG2 OSCILLATOR 37 COM2 SEG1 － SEG30 Segment driver SEG31 common driver SEG32 LCD voltage generator SEG33 VDD SEG34 SEG0……SEG34 36 COM0 COM0……COM3 SCL Fig. 2A BU9795AKV Block diagram Fig. 3A BU9795AKV Pin arrangement ● Terminal description Terminal No. I/O INHb 48 I Input terminal for turn off display H: turn on display L: turn off display TEST 47 I Test input (ROHM use only) Must be connect to VSS OSCIO 43 I External clock input Ex clock and Int clock can be changed by command. Must be connect to VSS when use internal oscillation circuit. SD 46 I serial data input SCL 45 I serial data transfer clock CSB 44 I Chip select VSS 42 GND VDD 41 Power supply VLCD 40 Power supply for LCD driving Terminal Function : “L” active SEG0-34 1-35 O SEGMENT output for LCD driving COM0-3 36-39 O COMMON output for LCD driving www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW * BU9795AFV ● Block Diagram ● SEG28 SEG29 COM0 SEG30 COM1 COM2 VLCD COM3 VDD VSS CSB OSCIO SD SCL INHb Segment driver TEST common driver SEG4 LCD voltage generator SEG7 VDD SEG5 SEG4……SEG30 SEG6 COM0……COM3 Pin Arrangement 40 21 1 20 ＋ LCD BIAS SELECTOR － common counter ＋ － blink timing generator DDRAM Pow er On Reset SEG27 SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG11 Command Data Decoder Command register OSCILLATOR SEG10 INHb OSCIN SEG9 SEG8 VLCD serial inter face IF FILTER VSS TEST CSB SD SCL Fig. 2B BU9795AFV Block diagram Fig. 3B BU9795AFV Pin arrangement ● Terminal description Terminal No. I/O INHb 36 I Input terminal for turn off display H: turn on display L: turn off display TEST 35 I Test input (ROHM use only) Must be connect to VSS OSCIO 31 I External clock input Ex clock and Int clock can be changed by command. Must be connect to VSS when use internal oscillation circuit. SD 34 I serial data input SCL 33 I serial data transfer clock CSB 32 I Chip select VSS 30 GND VDD 29 Power supply VLCD 28 I Power supply for LCD driving SEG4-30 1-23, 37-40 O SEGMENT output for LCD driving COM0-3 24-27 O COMMON output for LCD driving Terminal www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Function : “L” active 5/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW * BU9795AGUW ● Block Diagram ● COM0……COM3 Pin Arrangement SEG2……SEG32 1 2 3 4 5 6 7 G (NC) SEG13 SEG15 SEG18 SEG20 SEG22 (NC) F SEG11 SEG12 SEG16 SEG17 SEG21 SEG23 SEG24 E SEG9 SEG10 SEG14 SEG19 SEG25 SEG27 SEG26 D SEG7 SEG6 SEG8 SEG5 SEG30 SEG28 SEG29 C SEG4 SEG3 SEG2 CSB COM3 SEG32 SEG31 INHb SD VSS VDD COM1 COM0 TEST2 SCL OSCIO VLCD COM2 (NC) VDD LCD voltage generator common driver Segment driver ＋ LCD BIAS SELECTOR － common counter ＋ － blink timing generator DDRAM VLCD INHb Command Data Decoder Command register OSCIN OSCILLATOR Pow er On Reset B serial inter face A (NC) IF FILTER VSS TEST CSB SD SCL Fig. 2C BU9795AGUW Block diagram Fig. 3C BU9795AGUW Pin arrangement ● Terminal description Terminal I/O Function INHb I Input terminal for turn off display H: turn on display L: turn off display TEST I Test input (ROHM use only) Must be connect to VSS OSCIO I External clock input Ex clock and Int clock can be changed by command. Must be connect to VSS when use internal oscillation circuit. SD I serial data input SCL I serial data transfer clock CSB I Chip select : VSS GND VDD Power supply “L” active VLCD I Power supply for LCD driving SEG2-32 O SEGMENT output for LCD driving COM0-3 O COMMON output for LCD driving (Caution) About terminal number, please refer to above pin arrangement www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW ●Command Description D7 (MSB) is bit for command or data judgment. Refer to Command and data transfer method. C: 0: Next byte is RAM write data. 1: Next byte is command. ○ Mode Set (MODE SET) MSB D7 C D6 1 D5 0 D4 * D3 P3 D2 P2 D1 * LSB D0 * (*:Don’t care) Set display ON and OFF Setting Display OFF (DISPOFF) Display ON (DISPON) P3 0 1 Reset initialize condition ○ Set bias level Setting P2 1/3 Bias 1/2 Bias Reset initialize condition ○ 0 1 ○ Address set (ADSET) MSB D7 C D6 0 D5 0 D4 P4 D3 P3 D2 P2 D1 P1 LSB D0 P0 Address data is specified in P[4:0] and P2 (ICSET command) as follows. Internal register Bit of each command www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. MSB Address [5] ICSET [P2] 7/15 Address [4] ADSET [P4] ・・・ ・・・ LSB Address [0] ADSET [P0] 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW ○ Display control (DISCTL) MSB D7 C D6 0 D5 1 D4 P4 D3 P3 D2 P2 LSB D0 P0 D1 P1 Set Frame frequency Setting P4 P3 Reset initialize condition 80Hz 0 0 ○ 71Hz 0 1 64Hz 1 0 53Hz 1 1 Set LCD drive waveform Setting P2 Reset initialize condition Line inversion 0 ○ Frame inversion 1 Set Power save mode ＊ Setting P1 P0 Power save mode 1 0 0 Power save mode 2 0 1 Normal mode 1 0 High power mode 1 1 Reset initialize condition ○ VDD-VLCD>=3.0V is required for High power mode. ○ Set IC Operation (ICSET) MSB LSB D7 D6 D5 D4 D3 D2 D1 D0 C 1 1 0 1 P2 P1 P0 P2: MSB data of DDRAM address. Please refer to “ADSET” command. Setting P2 Reset initialize condition Address MSB‘0’ 0 ○ Address MSB‘1’ 1 Set Software Reset condition Setting P1 No operation 0 Software Reset 1 Switch between internal clock and external clock. Setting P0 Reset initialize condition Internal clock 0 ○ External clock input 1 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW ○ Blink control (BLKCTL) MSB LSB D7 D6 D5 D4 D3 D2 D1 D0 C 1 1 1 0 * P1 P0 Set blink condition Setting P1 P0 Reset initialize condition OFF 0 0 ○ 0.5 Hz 0 1 1 Hz 1 0 2 Hz 1 1 ○ All pixel control (APCTL) MSB LSB D7 D6 D5 D4 D3 D2 D1 D0 C 1 1 1 1 1 P1 P0 All display set ON. OFF Setting P1 Reset initialize condition Normal 0 ○ All pixel ON 1 P0 Reset initialize condition Normal Setting 0 ○ All pixel OFF 1 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW ●Function description ○ Command and data transfer method ○ 3-SPI (3wire Serial interface) This device is controlled by 3-wire signal (CSB, SCL, and SD). First, Interface counter is initialized with CSB=“H", and CSB=”L” makes SD and SCL input enable. The protocol of 3-SPI transfer is as follows. Each command starts with Command or Data judgment bit (D/C) as MSB data, and continuously in order of D6 to D0 are followed after CSB =”L”. (Internal data is latched at the rising edge of SCL, it converted to 8bits parallel data at the falling edge of 8th CLK.) Command/Data Command CSB SCL SD D/C D6 D5 D4 D3 D2 D1 D0 D/C D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D/C = “H” : Command D/C = “L” : Data Fig. 4 3-SPI Command/Data transfer format ○Write display data and transfer method * BU9795AKV This LSI have Display Data RAM (DDRAM) of 35×4=140bit. The relationship between data input and display data, DDRAM data and address are as follows. Command 0000000 a b c d e f g h i j k l m n o p … Display Data 8 bit data will be stored in DDRAM. The address to be written is the address specified by Address set command, and the address is automatically incremented in every 4bit data. Data can be continuously written in DDRAM by transmitting Data continuously. (When RAM data is written successively after writing RAM data to 22h (SEG34), the address is returned to 00h (SEG0) by the auto-increment function. DDRAM address BIT 1Fh 20h 21h 22h 02h 03h 04h 05h 0 a e i m q u COM0 1 b f j n r v COM1 2 c g k o s x COM2 COM3 d h l p t y SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 07h 1Eh 01h 3 06h ・・・・・・・・ 00h SEG7 ・・・・・・・・ SEG30 SEG31 SEG32 SEG33 SEG34 As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes CSB=”L”→”H” before 4bits data transfer. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 10/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW * BU9795AFV As SEG0, SEG1, SEG2, SEG3, SEG31, SEG32, SEG33, SEG34 are not output, these address will be dummy address. Dummy data BIT Dummy data DDRAM address 06h 1Eh 1Fh 20h 21h 22h 01h 02h 03h 04h 05h 0 a e i m q u COM0 1 b f j n r v COM1 2 c g k o s x 3 d h l p t y COM2 COM3 SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 07h ・・・・・・・・ 00h SEG7 ・・・・・・・・ SEG30 SEG31 SEG32 SEG33 SEG34 As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes CSB=”L”→”H” before 4bits data transfer. * BU9795AGUW As SEG0, SEG1, SEG33, SEG34 are not output, these address will be dummy address. Dummy data BIT Dummy data DDRAM address 06h 1Eh 1Fh 20h 21h 22h 01h 02h 03h 04h 05h 0 a e i m q u COM0 1 b f j n r v COM1 2 c g k o s x 3 d h l p t y COM2 COM3 SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 07h ・・・・・・・・ 00h SEG7 ・・・・・・・・ SEG30 SEG31 SEG32 SEG33 SEG34 As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes CSB=”L”→”H” before 4bits data transfer. ○ Reset (initial) condition Initial condition after execute Software Reset is as follows. ・ Display is OFF. ・ DDRAM address is initialized (DDRAM Data is not initialized). ・ Refer to Command Description about initialize value of register. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 11/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW ● Cautions of Power-On condition This LSI has “P.O.R” (Power-On Reset) circuit and Software Reset function. Please keep the following recommended Power-On conditions in order to power up properly. 1. Please set power up conditions to meet the recommended tR, tF, tOFF, and Vbot spec below in order to ensure P.O.R operation. tF VDD Recommendation condition of tR,tF,tOFF,Vbot tR tOFF Power tR tF tOFF Vbot Less than 1ms Less than 1ms More than Less than 0.1V 150ms Vbot ON/OFF Fig. 5 Power on-off waveform 2. If it is difficult to meet above conditions, execute the following sequence after Power-On. Because it doesn’t accept the command in power off, it is necessary to care that correspondence by software reset doesn’t become alternative to POR function completely. (1) CSB=”L”→”H” condition VDD CS B Fig. 6 CSB Timing (2) After CSB”H”→“L”, execute Software Reset (ICSET command). ● IO Circuit (BU9795AKV /AFV /AGUW) VDD VDD VLCD TEST VSS VSS VDD VDD CSB, SD, SCL OSCIN VSS VSS VDD VDD INHb VSS VSS Fig. 7 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. IO circuit 12/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW ● Notes for Application (BU9795AKV /BU9795AFV / BU9795AGUW) In case, BU9795AKV/ BU9795AFV/ BU9795AGUW used at VLCD≠VSS, voltage gap occur between SEG line to COM1 – 3 line at Display off state. Because of this voltage gap, there is possibility to display LCD for a moment. To avoid this phenomenon, please decide VDD and VLCD level to satisfy Voff voltage lower than OFF level (OFF level = 1V at the example explained below). condition ： VDD=5.0V VLCD=2.0V 1/3bias DDRAM data ALL "H" Frame inversion In case, VLCD voltage different from VSS level（VLCD≠VSS) In this case, volatage gap occur, between SEG line to COM 1-3 line. Because of this gap, there is possibility to display LCD for a moment. 1Frame Send "Display off" command VDD (5V) Output VLCD level at display off （All SEG terminal） SEG0 Output VLCD (2V) VLCD-VSS=2V VSS COM0 Output VDD (5V) Output VLCD level at display off （Only COM0 terminal） VLCD (2V) VLCD-VSS=2V VSS COM1 Output VDD (5V) VLCD (2V) Output VSS level at display off (at COM 1-3 terminal) VLCD-VSS=2V VSS Display on Voltage gap of COM0-SEG0 Display off 3V 2V the volatage between COM0 to SEG0 is 0V at display off. 1V 0V -1V -2V -3V Display off Display on Voltage gap of COM1-SEG0 3V 2V ON level the volatage between COM1 to SEG0 is -2V at display off. 1V OFF level 0V -1V Voff -2V -3V Voltage gap occur between COM1 to SEG0 at display off. So, there is possibility to display LCD. （Only at COM 1-3 line） www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 13/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, or the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) No Connecting input terminals In terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. And unstable state brings the inside gate voltage of p-channel or n-channel transistor into active. As a result, battery current may increase. And unstable state can also causes unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the power supply or GND line. (13) Rush current When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may flow instantaneously. Therefore, give special condition to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 14/15 2009.07 - Rev.B Technical Note BU9795AKV, BU9795AFV, BU9795AGUW ●Ordering part number B D 9 Part No. 7 9 5 A K Part No. V - Package KV: VQFP48C FV: SSOP-B40 GUW: VBGA048W040 E 2 Packaging and forming specification E2: Embossed tape and reel VQFP48C <Tape and Reel information> 9.0±0.2 7.0±0.1 25 36 Embossed carrier tape Quantity 1500pcs 0.5±0.15 0.75 48 13 1 12 0.75 1.0±0.2 24 7.0 ± 0.1 9.0 ± 0.2 37 Tape E2 Direction of feed direction is the 1pin of product is at the upper left when you hold ( The ) reel on the left hand and you pull out the tape on the right hand +0.05 0.145 -0.03 1.6MAX 1PIN MARK 0.1 ± 0.05 1.4 ± 0.05 4 +6 –4 0.5±0.1 0.08 S +0.05 0.22 -0.04 0.08 Direction of feed 1pin M Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. SSOP-B40 <Tape and Reel information> 13.6 ± 0.2 (MAX 13.95 include BURR) 0.5 ± 0.2 1 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 20 0.15 ± 0.1 0.1 1.8 ± 0.1 Embossed carrier tape Quantity 21 5.4 ± 0.2 7.8 ± 0.3 40 Tape 0.1 S 0.65 0.22 ± 0.1 0.08 M 1pin Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. VBGA048W040 <Tape and Reel information> 4.0 ± 0.1 4.0±0.1 P=0.5×6 A 0.5 G F E D C B A B 12 3 4 5 6 7 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) S 0.5 P=0.5 × 6 0.08 S 0.5±0.1 48- φ 0.295±0.05 φ 0.05 M S AB Embossed carrier tape (with dry pack) Quantity 0.5 ± 0.1 0.10 0.9MAX 1PIN MARK Tape 1pin (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Reel 15/15 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2009.07 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A