MBCM270F338M235A00 PRELIMINARY DATASHEET MBCM270T338M235A00 (Formerly VMB0004MFJ) BCM Bus Converter TM FEATURES DESCRIPTION The MIL-COTS V•I ChipTM bus converter is a high efficiency (>95%) Sine Amplitude Converter™ (SAC™) operating from a 240 to 330 Vdc primary bus to deliver an isolated 30 – 41.25 V nominal, unregulated secondary. The MBCM270F338M235A00 and MBCM270T338M235A00 are provided in a V•I Chip package compatible with standard pick-and-place and surface mount assembly processes. • 270 Vdc – 33.75 Vdc 235 W Bus Converter • MIL-STD-704E/F Compliant • High efficiency (>95%) reduces system power consumption • High power density (>796 W/in3) reduces power system footprint by >40% • Contains built-in protection features: undervoltage, overvoltage lockout, overcurrent protection, short circuit protection, overtemperature protection. VIN = 240 – 330 V POUT = 235 W(NOM) VOUT = 30 – 41.25 V (NO LOAD) K = 1/8 • Provides enable/disable control, internal temperature monitoring PART NUMBER DESCRIPTION • Can be paralleled to create multi-kW arrays MBCM270F338M235A00 -55°C – 125°C TJ operating, J lead TYPICAL APPLICATIONS MBCM270T338M235A00 -55°C – 125°C TJ operating, Through hole • High Voltage 270 V Aircraft Distributed Power • 28 Vdc MIL-COTS PRM™ Interface (MP028F036M21AL) • High Density Power Supplies • Communications Systems • TYPICAL APPLICATION enable / disable switch 240 – 330 Vdc (MIL-STD-704E/F) PC TM IL BCM SW1 +In PC TM PRM VTM 26 – 50 Vdc 30 – 41.25 Vdc F1 VC VC SG OS CD PR PC TM +Out 1 – 50 Vdc +In +Out +In +Out -In -Out -In -Out C1 20 µF VIN -In -Out V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 L O A D Rev. 1.7 12/2010 Page 1 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET ABSOLUTE MAXIMUM RATINGS CONTROL PIN SPECIFICATIONS +IN to –IN . . . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc – +400 Vdc PC to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +20 Vdc TM to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +7 Vdc +IN/-IN to +OUT/-OUT . . . . . . . . . . . . . . . . . . . 4242 V (Hi Pot) +IN/-IN to +OUT/-OUT . . . . . . . . . . . . . . . . . . . 500 V (working) +OUT to –OUT . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc - +60 Vdc Temperature during reflow . . . . . . . . . . . . . . . . 245°C (MSL 6) See section 5.0 for further application details and guidelines. PC (V•I Chip BCM Primary Control) The PC pin can enable and disable the BCM. When held below VPC_DIS the BCM shall be disabled. When allowed to float with an impedance to –IN of greater than 50 kΩ the module will start. When connected to another BCM PC pin, the BCMs will start simultaneously when enabled. The PC pin is capable of being driven high by either an external logic signal or internal pull up to 5 V (operating). PACKAGE ORDERING INFORMATION 4 3 2 +Out B B C C D D +In E E -Out 1 A A F G H TM (V•I Chip BCM Temperature Monitor) The TM pin monitors the internal temperature of the BCM within an accuracy of +5/-5°C. It has a room temperature setpoint of ~3.0 V and an approximate gain of 10 mV/°C. It can source up to 100 µA and may also be used as a “Power Good” flag to verify that the BCM is operating. TM H J RSV J K PC K +Out -Out L L M M N N P P R R -In T T Bottom View Signal Name +In –In TM RSV PC +Out –Out Designation A1-E1, A2-E2 L1-T1, L2-T2 H1, H2 J1, J2 K1, K2 A3-D3, A4-D4, J3-M3, J4-M4 E3-H3, E4-H4, N3-T3, N4-T4 V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 2 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 1.0 ELECTRICAL CHARACTERISTICS Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the temperature range of -55°C < TJ < 125°C (M-Grade); All other specifications are at TJ = 25ºC unless otherwise noted ATTRIBUTE SYMBOL Voltage range dV/dt Quiescent power No load power dissipation VIN dVIN /dt PQ PNL Inrush Current Peak IINR_P DC Input Current IIN_DC K Factor ( ) VOUT CONDITIONS / NOTES MIN TYP MAX UNIT 240 270 330 1 410 10 Vdc V/µs mW W 4 A 0.95 A 235 215 W 352.5 W 41.25 7.3 V A PC connected to -IN VIN = 240 to 330 V VIN = 330 V COUT = 100 µF, POUT = 235 W POUT = 235 W 395 2.5 K VIN 1/8 Efficiency (Ambient) η Efficiency (Hot) Minimum Efficiency (Over Load Range) Output Resistance (Ambient) Output Resistance (Hot) Output Resistance (Cold) Load Capacitance Switching Frequency Ripple Frequency η VIN = 270 VDC; See Figure 14 VIN = 240 – 330 VDC; See Figure 14 VIN = 270 VDC Average POUT < = 235 W, Tpeak < 5 ms Section 3.0 No load Pout < = 235 W VIN = 270 V, POUT = 235 W VIN = 240 V to 330 V, POUT = 235 W VIN = 270 V, TJ = 100° C,POUT = 235 W η 60 W < POUT < 235 W Max 90 ROUT ROUT ROUT COUT FSW FSW_RP TJ = 25° C TJ = 125° C TJ = -55° C 100 130 40 130 180 105 1.56 3.12 Output Voltage Ripple VOUT_PP Output Power (Average) POUT Output Power (Peak) POUT_P Output Voltage Output Current (Average) VOUT IOUT VIN to VOUT (Application of VIN) TON1 PC PC Voltage (Operating) PC Voltage (Enable) PC Voltage (Disable) PC Source Current (Startup) PC Source Current (Operating) PC Internal Resistance PC Capacitance (Internal) PC Capacitance (External) External PC Resistance PC External Toggle Rate VPC VPC_EN VPC_DIS IPC_EN IPC_OP RPC_SNK CPC_INT CPC_EXT RPC FPC_TOG PC to VOUT with PC Released PC to VOUT, Disable PC Ton2 TPC_DIS COUT = 0 µF, POUT = 235 W, VIN = 270 V, Section 8.0 VIN = 270 V, CPC = 0; See Figure 17 Internal pull down resistor Section 5.0 External capacitance delays PC enable time Connected to –VIN VIN = 270 V, Pre-applied CPC = 0, COUT = 0; See Figure 17 VIN = 270 V, Pre-applied CPC = 0, COUT = 0; See Figure 17 30 94.1 94 93.7 95.4 95.2 94.7 % % % 1.64 3.28 170 210 160 100 1.72 3.44 mΩ mΩ mΩ uF MHz MHz 160 400 mV 460 540 620 ms 4.7 2 5 2.5 50 2 50 100 3.5 150 5.3 3 1.95 300 5 400 1000 1000 1 V V V uA mA kΩ pF pF kΩ Hz 100 150 µs 4 10 µs 50 50 V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 3 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 1.0 ELECTRICAL CHARACTERISTICS (CONT.) Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the temperature range of -55°C < TJ < 125°C (M-Grade); All other specifications are at TJ = 25ºC unless otherwise noted ATTRIBUTE SYMBOL TM TM accuracy TM Gain TM Source Current TM Internal Resistance External TM Capacitance TM Voltage Ripple CONDITIONS / NOTES ACTM ATM ITM RTM_SNK CTM VTM_PP PROTECTION Negative going OVLO Positive going OVLO Negative going UVLO Positive going UVLO Output Overcurrent Trip Short Circuit Protection Trip Current Short Circuit Protection Response Time Thermal Shutdown Junction setpoint VIN_OVLOVIN_OVLO+ VIN_UVLOVIN_UVLO+ IOCP GENERAL SPECIFICATION Isolation Voltage (Hi-Pot) Working Voltage (IN – OUT) Isolation Capacitance Isolation Resistance MTBF Agency Approvals/Standards MIN TYP -5 MAX UNIT +5 ºC mV/°C uA kΩ pF mV V V V V A 10 100 25 40 CTM = 0µF, VIN = 330 V, POUT = 235 W 200 400 50 50 500 VIN = 270 V, 25°C 350 355 90 100 9 365 372 115 125 12 380 385 125 135 14 ISCP 14 TSCP 0.8 1 1.2 us TJ_OTP 125 130 135 °C VHIPOT VWORKING CIN_OUT RIN_OUT 4242 660 500 800 Unpowered unit MIL HDBK 217F, 25° C, GB cTUVus CE Mark 500 10 A 4.2 V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 V V pF MΩ Mhrs Rev. 1.7 12/2010 Page 4 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 1.1 APPLICATION CHARACTERISTICS All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data. ATTRIBUTE No Load Power Inrush Current Peak Efficiency (Ambient) Efficiency (Hot – 100°C) Output Resistance (-55°C) Output Resistance (25°C) Output Resistance (120°C) Output Voltage Ripple SYMBOL PNL INR_P η η ROUT ROUT ROUT VOUT_PP VOUT Transient (Positive) VOUT_TRAN+ VOUT Transient (Negative) VOUT_TRAN- Undervoltage Lockout Response Time Output Overcurrent Response Time Overvoltage Lockout Response Time TM Voltage (Ambient) CONDITIONS / NOTES TYP UNIT VIN = 270 V, PC enabled; See Figure 1 COUT = 100 µF, POUT = 235 W VIN = 270 V, POUT = 235 W VIN = 270 V, POUT = 235 W VIN = 270 V VIN = 270 V VIN = 270 V COUT = 0 uF, POUT = 235 W @ VIN = 270, VIN = 270 V IOUT_STEP = 0 TO 7.3 A, ISLEW >10 A/us; See Figure 11 IOUT_STEP = 7.3 A to 0 A, ISLEW > 10 A/us; See Figure 12 5.5 2.5 95.4 94.7 105 130 180 W A % % mΩ mΩ mΩ 160 mV 1.4 V 1.3 V 150 us 5 ms 120 µs 3 V TUVLO TOCP 9 < IOCP < 14 A TOVLO VTM_AMB TJ ≅ 27°C V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 5 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET Full Load Efficiency vs. Case Temperature 96.0 8 95.8 7 95.6 Efficiency (%) 6 5 4 3 2 95.4 95.2 95.0 94.8 94.6 1 94.4 0 230 250 270 290 310 94.2 -100 330 -50 Input Voltage (V) -55°C TCASE: 25°C 100°C VIN : 150 240 V 270 V 330 V 98 PD 11 80 9 75 70 7 65 5 15 96 η 94 Efficiency (%) 13 Power Dissipation (W) 15 η 90 Efficiency (%) 100 Efficiency & Power Dissipation vs. 25°C Case Efficiency & Power Dissipation -55°C Case 85 50 Figure 2 – Full load efficiency vs. temperature; VIN Figure 1 – No load power dissipation vs. VIN; TCASE 95 0 Case Temperature (C) 13 92 11 90 88 9 PD 86 7 84 5 82 0 1 2 3 4 5 6 7 80 8 0 1 2 3 Output Current (A) 240 V VIN: 270 V 330 V 240 V 270 V 330 V 240 V VIN: 6 7 8 3 270 V 330 V 240 V 270 V 330 V Figure 4 – Efficiency and power dissipation at 25°C (case); VIN ROUT vs. Case Temperature Efficiency & Power Disspiation 100°C Case 98 190 16.5 94 14.5 92 12.5 90 10.5 88 PD 86 8.5 6.5 84 4.5 82 80 180 1 2 3 4 5 6 7 270 V 330 V 240 V 150 140 130 120 110 90 8 -80 Output Current (A) 240 V 160 100 2.5 0 170 Rout (mΩ) η Power Dissipation (W) 96 Efficiency (%) 5 Output Current (A) Figure 3 – Efficiency and power dissipation at -55°C (case); VIN VIN: 4 Power Dissipation (W) No Load Power Dissipation (W) No Load Power Dissipation vs Line 9 -60 -40 -20 0 20 40 60 80 100 120 Case Temperature (°C) 270 V Figure 5 – Efficiency and power dissipation at 100°C (case); VIN 330 V I OUT : 0.73 A 7.3 A Figure 6 – ROUT vs. temperature vs. IOUT V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 6 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET Ripple vs. Load 180 Ripple (mV pk-pk) 160 140 120 100 80 60 40 20 0 0 1 2 3 4 5 6 7 8 Load Current (A) Vpk-pk (mV) Figure 7 – Vripple vs. IOUT ; 270 Vin, no external capacitance Figure 8 – PC to VOUT startup waveform Figure 9 – VIN to VOUT startup waveform Figure 10 – Output voltage and input current ripple, 270 Vin, 235 W no COUT Figure 11 – Positive load transient (0 – 7.3 A) Figure 12 – Negative load transient (7.3 A – 0 A) V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 7 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET Safe Operating Area Output Power (W) 400 350 300 250 200 150 100 50 0 29.00 31.00 33.00 Steady State Figure 13 – PC disable waveform, 270 VIN, 100 µF COUT full load 35.00 37.00 39.00 41.00 5 mS 352.5 W Ave Figure 14 – Safe Operating Area vs. VOUT 400 350 50 mS operation full current OVP 330 VDC 300 Normal Operating Range 280 MIL-STD-704F Envelope of normal V transients for 270 Vdc systems 250 200 50% rated current 50 mS full current 1% duty 150 125 UVL 0 20 40 60 80 100 120 mS Figure 15 — Envelope of normal voltage transient for 270 volts DC system. V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 8 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 2.0 PACKAGE/MECHANICAL SPECIFICATIONS All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data. ATTRIBUTE SYMBOL L W H Vol F No heat sink No Heatsink Power Density PD No Heatsink Weight W Operating Temperature Storage Temperature Thermal Capacity Peak Compressive Force Applied to Case (Z-axis) TJ TST TYP MAX UNIT 32.5 / 1.28 22.0 / 0.87 6.73 / 0.265 4.81 / 0.295 7.3 / 1.1 796 49 0.5/14 32.6 / 1.29 22.3 / 0.89 6.98 / 0.275 mm/in mm/in mm/in cm3/in3 cm2/in2 W/in3 W/cm3 oz/g µm -55 -65 125 125 °C °C Ws/°C 6 lbs 9 No J-lead support ESDHBM ESDMM ESD Rating Peak Temperature During Reflow Peak Time Above 183°C Peak Heating Rate During Reflow Peak Cooling Rate Post Reflow Thermal Impedance [b] MIN 32.4 / 1.27 21.7 / 0.85 6.48 / 0.255 Nickel (0.51-2.03 µm) Palladium (0.02-0.15 µm) Gold (0.003-0.05 µm) Lead Finish [a] CONDITIONS / NOTES Length Width Height Volume Footprint ØJC Human Body Model Machine Model[b] MSL 5 MSL 6 5 [a] Min Board Heatsinking 1500 400 VDC 1.5 1.5 1.1 225 245 150 3 6 1.5 °C °C s °C/s °C/s °C/W JEDEC JESD 22-A114C.01 JEDED JESD 22-A115-A V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 9 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 2.1 MECHANICAL DRAWING TOP VIEW ( COMPONENT SIDE ) BOTTOM VIEW RECOMMENDED LAND PATTERN ( COMPONENT SIDE SH OWN ) NOTES: mm 2. DIMENSIONS ARE inch . UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: 3. .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005] 4. PRODUCT MARKING ON TOP SURFACE DXF and PDF files are available on vicorpower.com V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 10 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 2.2 MECHANICAL DRAWING TOP VIEW ( COMPONENT SIDE ) NOTES: BOTTOM VIEW (mm) 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE: X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005] 3. RoHS COMPLIANT PER CST-0001 LATEST REVISION DXF and PDF files are available on vicorpower.com 2.3 RECOMMENDED LAND PATTERN NOTES: (mm) 1. DIMENSIONS ARE inch . 2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE: X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005] RECOMMENDED HOLE PATTERN ( COMPONENT SIDE SHOWN ) 3. RoHS COMPLIANT PER CST-0001 LATEST REVISION DXF and PDF files are available on vicorpower.com V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 11 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 2.4 RECOMMENDED LAND PATTERN FOR PUSH PIN HEAT SINK RECOMMENDED LAND PATTERN (NO GROUNDING CLIPS) TOP SIDE SHOWN NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE FREE OF COPPER, ALL PCB LAYERS. 2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555], THIS PROVIDES 7.00 [0.275] COMPONENT EDGE-TO-EDGE SPACING, AND 0.50 [0.020] CLEARANCE BETWEEN VICOR HEAT SINKS. (B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614], THIS PROVIDES 8.50 [0.334] COMPONENT EDGE-TO-EDGE SPACING, AND 2.00 [0.079] CLEARANCE BETWEEN VICOR HEAT SINKS. RECOMMENDED LAND PATTERN (With GROUNDING CLIPS) 3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY; ACTUAL LAND PATTERN MAY DIFFER. DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN HOLES WILL BE THE SAME FOR ALL FULL SIZE V•ICHIP PRODUCTS. TOP SIDE SHOWN 4. UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE MM [INCH]. TOLERANCES ARE: X.X [X.XX] = ±0.3 [0.01] X.XX [X.XXX] = ±0.13 [0.005] 5. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855) SHOWN FOR REFERENCE. HEATSINK ORIENTATION AND DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION. V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 12 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 3.0 POWER, VOLTAGE, EFFICIENCY RELATIONSHIPS Because of the high frequency, fully resonant SAC topology, power dissipation and overall conversion efficiency of BCM converters can be estimated as shown below. OUTPUT POWER INPUT POWER Key relationships to be considered are the following: 1. Transfer Function P R OUT a. No load condition P NL VOUT = VIN • K Eq. 1 Figure 16 – Power transfer diagram Where K (transformer turns ratio) is constant for each part number b. Loaded condition VOUT = Vin • K – IOUT • ROUT Eq. 2 2. Dissipated Power The two main terms of power losses in the BCM module are: - No load power dissipation (PNL) defined as the power used to power up the module with an enabled power train at no load. - Resistive loss (ROUT) refers to the power loss across the BCM modeled as pure resistive impedance. ~ PNL + PR PDISSIPATED ~ OUT Eq. 3 Therefore, with reference to the diagram shown in Figure 16 POUT = PIN – PDISSIPATED = PIN – PNL – PROUT Eq. 4 Notice that ROUT is temperature and input voltage dependent and PNL is temperature dependent (See Figure 16). The above relations can be combined to calculate the overall module efficiency: η = POUT PIN = PIN – PNL – PROUT PIN = VIN • IIN – PNL – (IOUT)2 • ROUT VIN • IIN =1– ( PNL + (IOUT)2 • ROUT VIN • IIN V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 ) Eq. 5 Rev. 1.7 12/2010 Page 13 of 19 v i c o r p o w e r. c o m v i c o r p o w e r. c o m NL 5V 2.5 V 5V 3V PC VUVLO+ VUVLO– V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 1 A E: TON2 F: TOCP G: TPC–DIS H: TSSP** B D 1: Controller start 2: Controller turn off 3: PC release C *Min value switching off **From detection of error to power train shutdown A: TON1 B: TOVLO* C: Max recovery time D:TUVLO 0.4 V 3 V @ 27°C TM LL • K Vout C 500mS before retrial 3V VIN VOVLO+ VOVLO– 2 F 4: PC pulled low 5: PC released on output SC 6: SC removed IOCP ISSP IOUT E 3 G 4 Notes: H 5 – Timing and voltage is not to scale – Error pulse width is load dependent 6 MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 4.0 OPERATING Figure 17 – Timing diagram Rev. 1.7 12/2010 Page 14 of 19 MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 5.0 USING THE CONTROL SIGNALS TM AND PC The PC control pin can be used to accomplish the following functions: • Delayed start: At start-up, PC pin will source a constant 100 uA current to the internal RC network. Adding an external capacitor will allow further delay in reaching the 2.5 V threshold for module start. • Synchronized start up: In a parallel module array, PC pins shall be connected in order to ensure synchronous start of all the units. While every controller has a calibrated 2.5 V reference on PC comparator, many factors might cause different timing in turning on the 100 uA current source on each module, i.e.: – Different VIN slew rate – Statistical component value distribution By connecting all PC pins, the charging transient will be shared and all the modules will be enabled synchronously. • Auxiliary voltage source: Once enabled in regular operational conditions (no fault), each BCM PC provides a regulated 5 V, 2 mA voltage source. • Output Disable: PC pin can be actively pulled down in order to disable module operations. Pull down impedance shall be lower than 850 Ω and toggle rate lower than 1 Hz. • Fault detection flag: The PC 5 V voltage source is internally turned off as soon as a fault is detected. After a minimum disable time, the module tries to re-start, and PC voltage is re-enabled. For system monitoring purposes (microcontroller interface) faults are detected on falling edges of PC signal. It is important to notice that PC doesn’t have current sink capability (only 150 kΩ typical pull down is present), therefore, in an array, PC line will not be capable of disabling all the modules if a fault occurs on one of them. 6.0 FUSE SELECTION V•I Chips are not internally fused in order to provide flexibility in configuring power systems. Input line fusing of V•I Chips is recommended at system level, in order to provide thermal protection in case of catastrophic failure. The fuse shall be selected by closely matching system requirements with the following characteristics: • Current rating (usually greater than maximum BCM current) • Maximum voltage rating (usually greater than the maximum possible input voltage) • Ambient temperature • Nominal melting I2t • Recommended fuse: ≤2.5 A Bussmann PC-Tron or SOC type 36CFA. The temperature monitor (TM) pin provides a voltage proportional to the absolute temperature of the converter control IC. It can be used to accomplish the following functions: • Monitor the control IC temperature: The temperature in Kelvin is equal to the voltage on the TM pin scaled by x100. (i.e. 3.0 V = 300 K = 27ºC). It is important to remember that V•I chips are multi-chip modules, whose temperature distribution greatly vary for each part number as well with input/output conditions, thermal management and environmental conditions. Therefore, TM cannot be used to thermally protect the system. • Fault detection flag: The TM voltage source is internally turned off as soon as a fault is detected. After a minimum disable time, the module tries to re-start, and TM voltage is re-enabled. V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 15 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 7.0 CURRENT SHARING The SAC topology bases its performance on efficient transfer of energy through a transformer, without the need of closed loop control. For this reason, the transfer characteristic can be approximated by an ideal transformer with some resistive drop and positive temperature coefficient. This type of characteristic is close to the impedance characteristic of a DC power distribution system, both in behavior (AC dynamic) and absolute value (DC dynamic). When connected in an array (with same K factor), the BCM module will inherently share the load current with parallel units, according to the equivalent impedance divider that the system implements from the power source to the point of load. It is important to notice that, when successfully started, BCMs are capable of bidirectional operations (reverse power transfer is enabled if the BCM input falls within its operating range and the BCM is otherwise enabled). In parallel arrays, because of the resistive behavior, circulating currents are never experienced (energy conservation law). General recommendations to achieve matched array impedances are (see also AN016 for further details): • to dedicate common copper planes within the PCB to deliver and return the current to the modules • to make the PCB layout as symmetric as possible • to apply same input/output filters (if present) to each unit Figure 18 – BCM Array V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 16 of 19 v i c o r p o w e r. c o m MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET 8.0 INPUT AND OUTPUT FILTER DESIGN A major advantage of SAC systems versus conventional PWM converters is that the transformers do not require large functional filters. The resonant LC tank, operated at extreme high frequency, is amplitude modulated as a function of input voltage and output current, and efficiently transfers charge through the isolation transformer. A small amount of capacitance, embedded in the input and output stages of the module, is sufficient for full functionality and is key to achieve power density. This paradigm shift requires system design to carefully evaluate external filters in order to: 1.Guarantee low source impedance: To take full advantage of the BCM dynamic response, the impedance presented to its input terminals must be low from DC to approximately 5 MHz. The connection of the V•I Chip to its power source should be implemented with minimal distribution inductance. If the interconnect inductance exceeds 100 nH, the input should be bypassed with a RC damper to retain low source impedance and stable operation. With an interconnect inductance of 200 nH, the RC damper may be as high as 1 µF in series with 0.3 Ω. A single electrolytic or equivalent low-Q capacitor may be used in place of the series RC bypass. Total load capacitance at the output of the BCM shall not exceed the specified maximum. Owing to the wide bandwidth and low output impedance of the BCM, low frequency bypass capacitance and significant energy storage may be more densely and efficiently provided by adding capacitance at the input of the BCM. At frequencies <500 kHz the BCM appears as an impedance of ROUT between the source and load. Within this frequency range capacitance at the input appears as effective capacitance on the output per the relationship defined in Eq. 5. COUT = CIN K2 Eq. 6 This enables a reduction in the size and number of capacitors used in a typical system. 2.Further reduce input and/or output voltage ripple without sacrificing dynamic response: Given the wide bandwidth of the BCM, the source response is generally the limiting factor in the overall system response. Anomalies in the response of the source will appear at the output of the BCM multiplied by its K factor. This is illustrated in Figures 11 and 12. 3.Protect the module from overvoltage transients imposed by the system that would exceed maximum ratings and cause failures: The V•I Chip input/output voltage ranges shall not be exceeded. An internal overvoltage lockout function prevents operation outside of the normal operating input range. Even during this condition, the powertrain is exposed to the applied voltage and power MOSFETs must withstand it. A criterion for protection is the maximum amount of energy that the input or output switches can tolerate if avalanched. V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 17 of 19 v i c o r p o w e r. c o m v i c o r p o w e r. c o m PC -Vin +Vin 1000 pF 2.5 V 100 µA 2.5 V 150 K 1.5 k PC Pull-Up & Source 18.5 V 2 mA 5V 320/540 ms One shot delay Wake-Up Power and Logic Adaptive Soft Start UVLO OVLO VIN Gate Drive Supply Start up & Fault Logic Enable Modulator Primary Current Sensing Primary Gate Drive C4 C3 C2 C1 Cr Cr 2.50 V CS2 Q4 Q3 Q2 Q1 Over Temperature Protection Lr Primary Stage & Resonant Tank Lr Lp2 Vref Over-Current Protection Slow current limit Fast current limit Q6 Q5 Secondary Gate Drive Temperature dependent voltage source Ls2 Ls1 Power Transformer Vref (125ºC) Lp1 Synchronous Rectification Q8 Q7 40 K COUT TM -Vout +Vout MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 18 of 19 MBCM270F338M235A00 - MBCM270T338M235A00 PRELIMINARY DATASHEET Warranty Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper application or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended to the original purchaser only. EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Vicor will repair or replace defective products in accordance with its own best judgement. For service under this warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within the terms of this warranty. Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes all risks of such use and indemnifies Vicor against all damages. Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom power systems. Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are available upon request. Specifications are subject to change without notice. Intellectual Property Notice Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the products described in this data sheet. Interested parties should contact Vicor's Intellectual Property Department. The products described on this data sheet are protected by the following U.S. Patents Numbers: 5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472; and for use under 6,975,098 and 6,984,965 Vicor Corporation 25 Frontage Road Andover, MA, USA 01810 Tel: 800-735-6200 Fax: 978-475-6715 email Customer Service: [email protected] Technical Support: [email protected] V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200 Rev. 1.7 12/2010 Page 19 of 19 v i c o r p o w e r. c o m