H-bridge Drivers for Brush Motors 18V max. H-bridge Drivers No.10007EDT02 BD622□ Series ●Overview These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow for PWM signal control, while the integrated VREF voltage control function of previous models offers direct replacement of deprecated motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design. ●Features 1) Built-in, selectable one channel or two channels configuration 2) Low standby current 3) Supports PWM control signal input (20kHz to 100kHz) 4) VREF voltage setting pin enables PWM duty control 5) Cross-conduction prevention circuit 6) Four protection circuits provided: OCP, OVP, TSD and UVLO ●Applications VCR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals; car audios; car navigation systems; OA equipments ●Line up matrix Rating voltage Channels Maximum output current 0.5A 1.0A 2.0A 1ch BD6210 HFP / F BD6211 HFP / F BD6212 HFP / FP 2ch BD6215 FP BD6216 FP / FM BD6217 FM 1ch BD6220 HFP / F BD6221 HFP / F BD6222 HFP / FP 2ch BD6225 FP BD6226 FP / FM 1ch BD6230 HFP / F BD6231 HFP / F BD6232 HFP / FP 2ch BD6235 FP BD6236 FP / FM BD6237 FM 7V 18V 36V *Packages; F:SOP8, HFP:HRP7, FP:HSOP25, FM:HSOP-M28 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/15 2010.07 - Rev.D Technical Note BD622□ Series ●Absolute maximum ratings (Ta=25°C, All voltages are with respect to ground) Parameter Symbol Ratings Unit Supply voltage VCC 18 V Output current IOMAX 0.5 *1 / 1.0 *2 / 2.0 *3 A VIN -0.3 ~ VCC V Operating temperature TOPR -40 ~ +85 °C Storage temperature TSTG All other input pins Power dissipation Junction temperature *1 *2 *3 *4 *5 *6 *7 -55 ~ +150 4 5 °C 6 7 Pd 0.687 * / 1.4 * / 1.45 * / 2.2 * W Tjmax 150 °C BD6220 / BD6225. Do not, exceed Pd or ASO. BD6221 / BD6226. Do not, exceed Pd or ASO. BD6222. Do not, exceed Pd or ASO. SOP8 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 5.5mW/°C above 25°C. HRP7 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.2mW/°C above 25°C. HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 11.6mW/°C above 25°C. HSOP-M28 package. Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 17.6mW/°C above 25°C. ●Operating conditions (Ta=25°C) Parameter Symbol Ratings Unit Supply voltage VCC 6 ~ 15 V VREF voltage VREF 3 ~ 15 V ●Electrical characteristics (Unless otherwise specified, Ta=25°C and VCC=VREF=12V) Parameter Symbol Limits Min. Min. Min. Unit Conditions Supply current (1ch) ICC 0.8 1.3 2.5 mA Forward / Reverse / Brake Supply current (2ch) ICC 1.3 2.0 3.5 mA Forward / Reverse / Brake Stand-by current ISTBY - 0 10 µA Stand-by Input high voltage VIH 2.0 - - V Input low voltage VIL - - 0.8 V Input bias current IIH 30 50 100 µA VIN=5.0V Output ON resistance *1 RON 1.0 1.5 2.5 Ω IO=0.25A, vertically total Output ON resistance *2 RON 1.0 1.5 2.5 Ω IO=0.5A, vertically total Output ON resistance *3 RON 0.5 1.0 1.5 Ω IO=1.0A, vertically total VREF bias current IVREF -10 0 10 µA VREF=VCC Carrier frequency FPWM 20 25 35 kHz VREF=9V Input frequency range FMAX 20 - 100 kHz FIN / RIN *1 BD6220 / BD6225 *2 BD6221 / BD6226 *3 BD6222 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/15 2010.07 - Rev.D Technical Note BD622□ Series ●Electrical characteristic curves (Reference data) 2.5 1.5 1.0 0.5 1.5 2.0 85°C 25°C -40°C 1.5 1.0 6 9 12 15 18 9 Fig.1 Supply current (1ch) 15 300 200 100 12 -5 Internal signal: Release [V] _ 10 6 12 9 12 15 6 3 18 0 4.5 5 5.5 6 Junction Temperature: Tj [°C] Fig.10 Thermal shutdown www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1 14 7 24 28 32 Supply Voltage: VCC [V] Fig.9 Over voltage protection 1.5 85°C 25°C -40°C 0.5 0.0 -0.5 200 0.8 21 20 Internal Logic: H/L [-] _ 1.0 Internal Logic: H/L [-] _ 1.0 -0.5 0.6 -40°C 25°C 85°C 28 Fig.8 Under voltage lock out 1.5 0.0 0.4 Fig.6 VREF - DUTY (VCC=12V) Supply Voltage: VCC [V] 0.5 0.2 0 4 1.5 175 0.2 35 Fig.7 VCC - Carrier frequency 150 -40°C 25°C 85°C Input Voltage: VREF / VCC [V] 85°C 25°C -40°C Supply Voltage: VCC [V] 125 0.4 18 0 6 0.6 0.0 0 9 20 2 0.8 Fig.5 VREF input bias current 30 1.8 1.0 Input Voltage: VREF [V] 85°C 25°C -40°C 1.6 Fig.3 Input threshold voltage -40°C 25°C 85°C Input Voltage: VIN [V] 40 1.4 Fig.2 Supply current (2ch) 0 Fig.4 Input bias current 1.2 Input Voltage: VIN [V] 5 18 0.0 1 Internal signal: Release [V] _ 6 -40°C 25°C 85°C Supply Voltage: Vcc [V] -10 0 -40°C 25°C 85°C 0.5 18 Switching Duty: D [Ton/T] _ 85°C 25°C -40°C 0 Oscillation Frequency: FPWM [kHz] 12 10 Input Bias Current: IVREF [ A] Input Bias Current: IIH [µA] _ 400 1.0 -0.5 6 Supply Voltage: Vcc [V] Internal Logic: H/L [-] Internal Logic: H/L [-] _ 85°C 25°C -40°C Circuit Current: Icc [mA] Circuit Current: Icc [mA] 2.0 85°C 25°C -40°C 1.0 0.5 0.0 -0.5 2 2.5 3 3.5 4 1 Load Current / Iomax: Normalized Fig.11 Over current protection (H side) 3/15 1.25 1.5 1.75 2 Load Current / Iomax: Normalized Fig.12 Over current protection (L side) 2010.07 - Rev.D Technical Note BD622□ Series ●Electrical characteristic curves (Reference data) - Continued 0.4 0.8 0.3 0.2 0.1 0 85°C 25°C -40°C 0.6 0.4 0.2 0.1 0.2 0.3 0.4 0.5 0 Output Current: IOUT [A] 0.2 0.4 0.6 0.8 0.5 0 0.4 0.3 0.4 0.5 2 -40°C 25°C 85°C 1.5 1 0.5 0.5 0.2 Fig.15 Output high voltage (2A class) 0 0.3 0.1 Output Current: IOUT [A] Output Voltage:VCC- VOUT [V] Output Voltage:VCC- VOUT [V] 1 0.2 0.1 0 2 -40°C 25°C 85°C 0.1 0.2 1 Fig.14 Output high voltage (1A class) 2 0 0.3 Output Current: IOUT [A] Fig.13 Output high voltage (0.5A class) 1.5 85°C 25°C -40°C 0 0 0 Output Voltage:VCC- VOUT [V] Output Voltage: VCC-VOUT [V] 85°C 25°C -40°C Output Voltage: VCC-VOUT [V] Output Voltage: VCC-VOUT [V] 0.4 -40°C 25°C 85°C 1.5 1 0.5 0 0 Output Current: IOUT [A] 0.2 0.4 0.6 0.8 1 0 Output Current: IOUT [A] 0.4 0.8 1.2 1.6 2 Output Current: IOUT [A] Fig.16 High side body diode (0.5A class) Fig.17 High side body diode (1A class) Fig.18 High side body diode (2A class) 1.2 0.3 0.2 0.1 0 1.2 85°C 25°C -40°C 0.9 0.6 0.3 0 0.1 0.2 0.3 0.4 0.5 Output Current: IOUT [A] 2 0.2 0.4 0.6 0.8 1 0.5 0 0.4 0.5 Output Current: IOUT [A] www.rohm.com 0.8 1.2 1.6 2 Fig.21 Output low voltage (2A class) 2 -40°C 25°C 85°C 1.5 1 0.5 -40°C 25°C 85°C 1.5 1 0.5 0 0 0.2 0.4 0.6 0.8 1 Output Current: IOUT [A] Fig.22 Low side body diode (0.5A class) Fig.23 Low side body diode (1A class) © 2010 ROHM Co., Ltd. All rights reserved. 0.4 Output Current: IOUT [A] 0 0.3 0.3 0 Fig.20 Output low voltage (1A class) Output Voltage: VOUT [V]_ 1.5 0.2 0.6 1 2 -40°C 25°C 85°C 0.1 0.9 Output Current: IOUT [A] Fig.19 Output low voltage (0.5A class) 0 85°C 25°C -40°C 0 0 Output Voltage: VOUT [V]_ 0 Output Voltage: VOUT [V]_ Output Voltage: VOUT [V] 85°C 25°C -40°C Output Voltage: VOUT [V] Output Voltage: VOUT [V] 0.4 4/15 0 0.4 0.8 1.2 1.6 2 Output Current: IOUT [A] Fig.24 Low side body diode (2A class) 2010.07 - Rev.D Technical Note BD622□ Series ●Block diagram and pin configuration BD6220F / BD6221F VREF 6 FIN 4 RIN 5 DUTY Table 1 BD6220F/BD6221F PROTECT 3 VCC 2 VCC CTRL 8 1 7 OUT1 OUT2 GND Fig.25 BD6220F / BD6221F OUT1 GND VCC OUT2 VCC VREF Pin Name Function 1 OUT1 Driver output 2 VCC Power supply 3 VCC Power supply 4 FIN Control input (forward) 5 RIN Control input (reverse) 6 VREF Duty setting pin 7 OUT2 Driver output 8 GND Ground Note: Use all VCC pin by the same voltage. RIN FIN Fig.26 SOP8 BD6220HFP / BD6221HFP / BD6222HFP VREF 1 DUTY PROTECT Table 2 BD6220HFP/BD6221HFP/BD6222HFP 7 FIN 3 RIN 5 VCC Pin Name Function 1 VREF Duty setting pin 2 OUT1 Driver output 3 FIN 4 GND CTRL 4 FIN 2 6 GND OUT1 OUT2 GND Fig.27 BD6220HFP / BD6221HFP / BD6222HFP Control input (forward) Ground 5 RIN 6 OUT2 Driver output Control input (reverse) 7 VCC Power supply FIN GND Ground VCC OUT2 RIN GND FIN OUT1 VREF Fig.28 HRP7 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/15 2010.07 - Rev.D Technical Note BD622□ Series ●Block diagram and pin configuration - Continued BD6222FP VREF 17 DUTY Table 3 BD6222FP PROTECT 21 22 VCC Pin Name VCC 1,2 OUT1 Driver output 6 GND Small signal ground 7,8 RNF Power stage ground 12,13 OUT2 Driver output 17 VREF Duty setting pin 19 RIN Control input (reverse) 20 FIN Control input (forward) 21 VCC Power supply 22,23 VCC Power supply FIN GND Ground 23 FIN 20 CTRL RIN 19 7 8 6 FIN 1 2 12 13 GND GND OUT1 OUT2 RNF Fig.29 BD6222FP NC NC VCC VCC VCC FIN OUT1 OUT1 NC NC NC GND GND GND RNF RNF NC NC NC OUT2 OUT2 Function Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage. RIN NC VREF NC NC NC Fig.30 HSOP25 BD6225FP / BD6226FP Table 4 BD6225FP / BD6226FP VREFA DUTY 9 PROTECT 24 VCC 25 VCC FINA 11 CTRL RINA 10 GND 20 VREFB 21 DUTY 1 OUT1A 6 OUT2A 3 RNFA PROTECT RINB 22 GND 8 3 RNFA 6 OUT2A 8 GND Driver output Power stage ground Driver output Small signal ground 9 VREFA RINA Duty setting pin Control input (reverse) 13 VCC 11 FINA Control input (forward) OUT1B 12 VCC Power supply 14 19 OUT2B 13 VCC Power supply 14 OUT1B Driver output 16 RNFB 16 RNFB 19 OUT2B 20 GND 21 VREFB 22 RINB Control input (reverse) 23 FINB Control input (forward) 24 VCC Power supply 25 VCC Power supply FIN GND Ground Fig.31 BD6225FP / BD6226FP NC GND VREFA RINA FINA VCC VCC OUT1A VCC FIN GND 1 Function 12 GND OUT1A NC RNFA NC NC OUT2A Name 10 FINB 23 CTRL Pin VCC VCC FINB RINB VREFB GND GND OUT2B NC NC RNFB NC OUT1B Power stage ground Driver output Small signal ground Duty setting pin Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage. Fig.32 HSOP25 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/15 2010.07 - Rev.D Technical Note BD622□ Series ●Block diagram and pin configuration - Continued BD6226FM VREFA DUTY 9 Table 5 BD6226FM PROTECT 26 VCC 28 VCC FINA 11 CTRL RINA 10 GND 22 VREFB 23 DUTY 1 OUT1A 6 OUT2A 3 RNFA 12 VCC 14 VCC PROTECT FINB 25 CTRL RINB 24 GND 8 15 OUT1B 20 OUT2B 17 RNFB FIN GND Fig.33 BD6226FM OUT1A NC RNFA NC NC OUT2A NC GND GND VREFA RINA FINA VCC NC VCC VCC NC VCC FINB RINB VREFB GND Pin Name Function 1 OUT1A 3 RNFA 6 OUT2A 8 GND 9 VREFA 10 RINA Control input (reverse) 11 FINA Control input (forward) 12 VCC Power supply 14 VCC Power supply 15 OUT1B Driver output 17 RNFB 20 OUT2B 22 GND 23 VREFB 24 RINB Control input (reverse) 25 FINB Control input (forward) 26 VCC Power supply 28 VCC Power supply FIN GND Ground Driver output Power stage ground Driver output Small signal ground Duty setting pin Power stage ground Driver output Small signal ground Duty setting pin Note: All pins not described above are NC pins. Note: Use all VCC pin by the same voltage. GND NC OUT2B NC NC RNFB NC OUT1B Fig.34 HSOP-M28 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/15 2010.07 - Rev.D Technical Note BD622□ Series ●Functional descriptions 1) Operation modes Table 6 Logic table FIN RIN VREF OUT1 OUT2 a L L X Hi-Z* Hi-Z* b H L VCC H L Forward (OUT1 > OUT2) c L H VCC L H Reverse (OUT1 < OUT2) d H H X L L Brake (stop) e PWM f L L g PWM H h VCC PWM PWM H VCC VCC i H L Option j L H Option Stand-by (idling) __________ H __________ PWM PWM Forward (PWM control mode A) H Reverse (PWM control mode A) L Forward (PWM control mode B) __________ PWM VCC Operation __________ L Reverse (PWM control mode B) PWM __________ H __________ PWM PWM Forward (VREF control) H Reverse (VREF control) * Hi-Z is the off state of all output transistors. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay. X : Don’t care a) Stand-by mode Stand-by operates independently of the VREF pin voltage. In stand-by mode, all internal circuits are turned off, including the output power transistors. Motor output goes to high impedance. If the motor is running at the switch to stand-by mode, the system enters an idling state because of the body diodes. However, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50µs before shutting down all circuits. b) Forward mode This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. For operation in this mode, connect the VREF pin with VCC pin. c) Reverse mode This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. For operation in this mode, connect the VREF pin with VCC pin. d) Brake mode This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because the internal control circuit is operating in the brake mode. Please switch to the stand-by mode (rather than the brake mode) to save power and reduce consumption. OFF OFF ON M OFF OFF OFF M OFF OFF a) Stand-by mode ON OFF M ON b) Forward mode ON c) Reverse mode OFF M OFF ON ON d) Brake mode Fig.35 Four basic operations (output stage) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/15 2010.07 - Rev.D Technical Note BD622□ Series e) f) PWM control mode A The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN pin or the RIN pin. In this mode, the high side output is fixed and the low side output does the switching, corresponding to the input signal. The switching operates by the output state toggling between "L" and "Hi-Z". The PWM frequency can be input in the range between 20kHz and 100kHz. Note that control may not be attained by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. Also, circuit operation may not respond correctly when the input signal is higher than 100kHz. To operate in this mode, connect the VREF pin with VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground. ON OFF ON M OFF OFF M ON OFF Control input : H OFF Control input : L Fig.36 PWM control mode A operation (output stage) FIN RIN OUT1 OUT2 Fig.37 PWM control mode A operation (timing chart) g) h) PWM control mode B The rotational speed of the motor can be controlled by the switching duty when the PWM signal is input to the FIN pin or the RIN pin. In this mode, the low side output is fixed and the high side output does the switching, corresponding to the input signal. The switching operates by the output state toggling between "L" and "H". The PWM frequency can be input in the range between 20kHz and 100kHz. Also, circuit operation may not respond correctly when the input signal is higher than 100kHz. To operate in this mode, connect the VREF pin with VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground. OFF OFF ON M ON OFF M ON OFF Control input : H ON Control input : L Fig.38 PWM control mode B operation (output stage) FIN RIN OUT1 OUT2 Fig.39 PWM control mode B operation (timing chart) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/15 2010.07 - Rev.D Technical Note BD622□ Series i) j) VREF control mode The built-in VREF-switching on duty conversion circuit provides switching duty corresponding to the voltage of the VREF pin and the VCC voltage. The function offers the same level of control as the high voltage output setting function in previous models. The on duty is shown by the following equation. DUTY ≈ VREF [V] / VCC [V] For example, if VCC voltage is 12V and VREF pin voltage is 9V, the switching on duty is about 75 percent. However, please note that the switching on duty might be limited by the range of VREF pin voltage (Refer to the operating conditions, shown on page 2). The PWM carrier frequency in this mode is 25kHz (nominal), and the switching operation is the same as it is the PWM control modes. When operating in this mode, do not input the PWM signal to the FIN and RIN pins. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or more is recommended) between VCC and ground. VCC VREF 0 FIN RIN OUT1 OUT2 Fig.40 VREF control operation (timing chart) 2) Cross-conduction protection circuit In the full bridge output stage, when the upper and lower transistors are turned on at the same time, and this condition exists during the period of transition from high to low, or low to high, a rush current flows from the power supply to ground, resulting in a loss. This circuit protects against the rush current by providing a dead time (about 400ns, nominal) at the transition. 3) Output protection circuits a) Under voltage lock out (UVLO) circuit To secure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 5.0V (nominal) or below, the controller forces all driver outputs to high impedance. When the voltage rises to 5.5V (nominal) or above, the UVLO circuit ends the lockout operation and returns the chip to normal operation. b) Over voltage protection (OVP) circuit When the power supply voltage exceeds 30V (nominal), the controller forces all driver outputs to high impedance. The OVP circuit is released and its operation ends when the voltage drops back to 25V (nominal) or below. This protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. c) Thermal shutdown (TSD) circuit The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175°C nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (150°C nominal). Thus, it is a self-returning type circuit. The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/15 2010.07 - Rev.D Technical Note BD622□ Series d) Over current protection (OCP) circuit To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this circuit works independently for each channel. Threshold Iout 0 CTRL Input ON Internal status OFF mon. ON off timer Monitor / Timer Fig.41 Over current protection (timing chart) ●Interfaces VCC VCC OUT1 OUT2 OUT1 OUT2 GND RNF GND VCC 100k FIN RIN VCC VREF 10k 100k Fig.42 FIN / RIN www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Fig.43 VREF Fig.44 OUT1 / OUT2 Fig.45 OUT1 / OUT2 (SOP8/HRP7) (HSOP25/HSOPM28) 11/15 2010.07 - Rev.D Technical Note BD622□ Series ●Notes for use 1) Absolute maximum ratings Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is to be implemented. 2) Connecting the power supply connector backward Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply lines, such as adding an external direction diode. 3) Power supply lines Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path by inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors – including a capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the power supply and GND. 4) Electrical potential at GND Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena. When both a small signal GND and high current GND are present, single-point grounding (at the set’s reference point) is recommended, in order to separate the small signal and high current GND, and to ensure that voltage changes due to the wiring resistance and high current do not affect the voltage at the small signal GND. In the same way, care must be taken to avoid changes in the GND wire pattern in any external connected component. 5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) under actual operating conditions. 6) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error, or if pins are shorted together. 7) Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic fields. 8) ASO - Area of Safety Operation When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO. 9) Built-in thermal shutdown (TSD) circuit The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. 10) Capacitor between output and GND In the event a large capacitor is connected between the output and GND, if VCC and VIN are short-circuited with 0V or GND for any reason, the current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1μF between output and GND. 11) Testing on application boards When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress. Therefore, always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from the test setup during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 12) Switching noise When the operation mode is in PWM control or VREF control, PWM switching noise may effects to the control input pins and cause IC malfunctions. In this case, insert a pulled down resistor (10kΩ is recommended) between each control input pin and ground. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/15 2010.07 - Rev.D Technical Note BD622□ Series 13) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements, in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, as well as operating malfunctions and physical damage. Therefore, do not use methods by which parasitic diodes operate, such as applying a voltage lower than the GND (P substrate) voltage to an input pin. Resistor Transistor (NPN) Pin A Pin B C Pin B B E Pin A + N P N P+ P N N Parasitic element N P+ Parasitic element B C N E P substrate P substrate GND P+ P Parasitic element GND GND Parasitic GND element Other adjacent elements Appendix: Example of monolithic IC structure www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/15 2010.07 - Rev.D Technical Note BD622□ Series ●Ordering part number B D 6 ROHM part number 2 2 0 Type 1X: 7V max. 2X: 18V max. 3X: 36V max. X0: 1ch/0.5A X5: 2ch/0.5A X1: 1ch/1A X6: 2ch/1A X2: 1ch/2A F - E Package F: SOP8 FP: HSOP25 FM: HSOP-M28 HFP: HRP7 2 Packaging spec. E2: Embossed taping (SOP8/HSOP25/HSOP-M28) TR: Embossed taping (HRP7) SOP8 <Tape and Reel information> 7 6 5 +6° 4° −4° 6.2±0.3 4.4±0.2 0.3MIN 8 1 2 3 0.9±0.15 5.0±0.2 (MAX 5.35 include BURR) Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.5±0.1 +0.1 0.17 -0.05 S S 0.11 0.1 1.27 1pin 0.42±0.1 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. HSOP25 <Tape and Reel information> 13.6 ± 0.2 (MAX 13.95 include BURR) 2.75 ± 0.1 0.3Min. 1 13 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.25 ± 0.1 1.95 ± 0.1 S 0.11 1.9 ± 0.1 Embossed carrier tape Quantity 14 5.4 ± 0.2 7.8 ± 0.3 25 Tape 0.1 S 0.8 0.36 ± 0.1 12.0 ± 0.2 1pin Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/15 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.07 - Rev.D Technical Note BD622□ Series HSOP-M28 <Tape and Reel information> 18.5 ± 0.2 (MAX 18.85 include BURR) +6° 4°−4° 1.2±0.15 0.5±0.2 5.15 ± 0.1 Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) +0.1 0.27 −0.05 S 0.11 2.2±0.1 1500pcs 14 1 1.25 Embossed carrier tape Quantity 15 7.5±0.2 9.9±0.3 28 Tape 0.37 ± 0.1 0.8 0.1 S Direction of feed 1pin Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. HRP7 <Tape and Reel information> 1.905±0.1 0.8875 1 2 3 4 0.835±0.2 8.0±0.13 (7.49) 8.82±0.1 (6.5) 5 6 7 1.523±0.15 10.54±0.13 1.017±0.2 9.395±0.125 (MAX 9.745 include BURR) Tape Embossed carrier tape Quantity 2000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin +5.5° 4.5° −4.5° 0.08±0.05 +0.1 0.27 -0.05 0.73±0.1 1.27 S Direction of feed 0.08 S www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Reel (Unit : mm) 15/15 ∗ Order quantity needs to be multiple of the minimum quantity. 2010.07 - Rev.D Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A