Application Note Rev. 1.01 / May 2012 ZSSC3026 Application Circuits ZSSC3026 – Application Circuits Low Power 16 Bit Sensor Signal Conditioner IC Table of Contents 1 2 Application Circuits........................................................................................................................................ 3 1.1. Application Circuit for Custom-Sensor-Module’s Typical Operation ...................................................... 3 1.2. Application Circuit for Custom-Sensor-Module’s MTP / Memory Programming .................................... 4 1.3. Application Circuit for ZSSC3026 in PQFN24 (I C) ............................................................................... 5 1.4. Application Circuit for ZSSC3026 in PQFN24 (SPI)............................................................................... 6 2 Die Dimensions and Pin Assignments .......................................................................................................... 7 2.1. Die Properties......................................................................................................................................... 7 2.2. Package (PQFN24) Properties............................................................................................................... 9 3 Related Documents..................................................................................................................................... 11 4 Document Revision History......................................................................................................................... 11 Table of Figures Figure 1.1 ZSSC3026-Module: Typical Sensor Application. ............................................................................ 3 Figure 1.2 ZSSC3026-Module: Increased Requirements for Programming..................................................... 4 Figure 1.3 ZSSC3026-PQFN24: Typical Operation and/or Programming in I²C-Setup. .................................. 5 Figure 1.4 ZSSC3026-PQFN24: Typical Operation and/or Programming in SPI-Setup. ................................. 6 Figure 2.1 ZSSC3026 Pad Placement for Die-Bond. ....................................................................................... 7 Figure 2.3 General PQFN24 Package Dimensions. ......................................................................................... 9 List of Tables Table 2.1 Die Size & Geometry. ...................................................................................................................... 8 Table 2.2 Pad Assignments............................................................................................................................. 8 Table 2.4 Physical Package Dimensions’ Extrema. ........................................................................................ 9 Table 2.5 Pin Assignments PQFN24............................................................................................................. 10 Preliminary May 18, 2012 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 2 of 11 ZSSC3026 – Application Circuits Low Power 16 Bit Sensor Signal Conditioner IC 1 Application Circuits This document shall support the application of the ZSSC3026 in standard or custom sensor configuration. General application circuits for typical operation and programming are provided. 1.1. Application Circuit for Custom-Sensor-Module’s Typical Operation In the following, the typical operating configuration for ZSSC3026 die together with an arbitrary resistive bridgetyped sensor is shown being interfaced via I²C/SPI. A DC-supply (VDD = 1.8V … 3.6V with capabilities for IDD > 1.1mA) is required and the respective pull-up functionality on the I²C interface line, SDA (not required if SPI interface communication is intended). The connection to EOC is optional. IC supply voltage and the high level of the communication lines need to be the same (VDD). Figure 1.1 ZSSC3026-Module: Typical Sensor Application. Preliminary May 18, 2012 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 3 of 11 ZSSC3026 – Application Circuits Low Power 16 Bit Sensor Signal Conditioner IC 1.2. Application Circuit for Custom-Sensor-Module’s MTP / Memory Programming For programming the MTP, the internal charge pump of the ZSSC3026 will be used. During switch-on of the charge pump, a short peak current up to 20mA at VDD is possible. Therefore a buffer capacitor C1 > 1nF or a fast regulator or just a battery needs to supply the IC at a voltage of VDD > 2.9V. The mean current draw during programming will be IDD = 5mA…6mA typically. However, this is exactly only needed during programming the memory. Figure 1.2 ZSSC3026-Module: Increased Requirements for Programming. Preliminary May 18, 2012 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 4 of 11 ZSSC3026 – Application Circuits Low Power 16 Bit Sensor Signal Conditioner IC 1.3. Application Circuit for ZSSC3026 in PQFN24 (I2C) The configuration for ZSSC3026 in PQFN24 interfaced via I²C is also simple. For typical operations just a poor DC-supply (VDD = 1.8V … 3.6V) is required and the respective pull-up functionality on the I²C interface line, SDA. The connection to EOC is optional. IC supply voltage and the high level of the communication lines need to be the same (VDD). For programming the MTP, the internal charge pump of the ZSSC3026 will be used. During switch-on of the charge pump, a short peak current up to 20mA at VDD is possible. Therefore a buffer capacitor C1 > 1nF or a fast regulator or just a battery needs to supply the IC at a voltage of VDD > 2.9V. The mean current draw during programming will be IDD = 5mA…6mA typically. However, this is exactly only needed during programming the memory. Figure 1.3 ZSSC3026-PQFN24: Typical Operation and/or Programming in I²C-Setup. Preliminary May 18, 2012 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 5 of 11 ZSSC3026 – Application Circuits Low Power 16 Bit Sensor Signal Conditioner IC 1.4. Application Circuit for ZSSC3026 in PQFN24 (SPI) Here, the configuration for ZSSC3026 in PQFN24 interfaced via SPI is shown. For typical operations just a poor DC-supply (VDD = 1.8V … 3.6V) is required. The connection to EOC is optional. IC supply voltage and the high level of the communication lines need to be the same (VDD). For programming the MTP, the internal charge pump of the ZSSC3026 will be used. During switch-on of the charge pump, a short peak current up to 20mA at VDD is possible. Therefore a buffer capacitor C1 > 1nF or a fast regulator or just a battery needs to supply the IC at a voltage of VDD > 2.9V. The mean current draw during programming will be IDD = 5mA…6mA typically. However, this is exactly only needed during programming the memory. Figure 1.4 ZSSC3026-PQFN24: Typical Operation and/or Programming in SPI-Setup. Preliminary May 18, 2012 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 6 of 11 ZSSC3026 – Application Circuits Low Power 16 Bit Sensor Signal Conditioner IC 2 Die Dimensions and Pin Assignments The ZSSC3026 is available in the forms: 2 • die (chip size with scribe line: 1.5mm ), • bumped, sawn die on foil and • PQFN24 package. See the following figures for additional dimensions and geometry details. The shown outer silicon dimensions are estimations for a die after sawing with remaining scribe-line silicon of ca. 20um around the core die. Thus, the effective outer dimensions may differ slightly. ZMDI-test pads must not be bonded or contacted to ensure correct IC-operation. 2.1. Die Properties Figure 2.1 ZSSC3026 Pad Placement for Die-Bond. Preliminary May 18, 2012 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 7 of 11 ZSSC3026 – Application Circuits Low Power 16 Bit Sensor Signal Conditioner IC Table 2.1 Die Size & Geometry. Parameter MIN [um] TYP [um] Description / Remarks X-dimension 900 925 Y-dimension 1560 1585 79.5 80 including seal ring and remaining “empty” silicon after sawing; maximum dimensions may be larger for engineering samples due to wider scribe lines passivation window’s opening … effective area for bond connection 200 - BondPad Size (X & Y) Minimum pitch for application relevant pads Table 2.2 Pad Assignments. Name Direction Type VDD1 VDD2 VSS VSSB VDDB INP INN EOC1 EOC2 SEL SCLK/SCL MOSI/SDA MISO SS ZMDI-test Preliminary May 18, 2012 Center-to-center distance; there are further pads, which are only for ZMDI’s test purposes IN Supply IN OUT OUT IN IN Supply Analog Analog Analog Analog OUT Digital IN IN IN/Out OUT IN - Digital Digital Digital Digital Digital - Description IC positive supply voltage for the IC, regular bond pad IC positive supply voltage for the IC, bump pad (electrically connected to VDD1, also bondable) Ground reference voltage signal Negative bridge supply Positive bridge supply Positive bridge signal Negative bridge signal End of conversion, regular bond pad End of conversion, bump pad (electrically connected to EOC1, also bondable) I²C or SPI interface select Clock input for I²C/SPI Data input for SPI; data in/out for I²C Data output for SPI Slave select for SPI do not connect to these pads © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 8 of 11 ZSSC3026 – Application Circuits Low Power 16 Bit Sensor Signal Conditioner IC 2.2. Package (PQFN24) Properties Figure 2.2 General PQFN24 Package Dimensions. Table 2.3 Physical Package Dimensions’ Extrema. Parameter / Dimension Min [mm] Max [mm] A 0.80 0.90 A1 0.00 0.05 B 0.18 0.30 e Preliminary May 18, 2012 0.5nom HD 3.90 4.10 HE 3.90 4.10 L 0.35 0.45 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 9 of 11 ZSSC3026 – Application Circuits Low Power 16 Bit Sensor Signal Conditioner IC Table 2.4 Pin No. Pin Assignments PQFN24. Name *) Direction Type 1 2 3 4 5 6 VSS VSSB ZMDI-test INN ZMDI-test IN OUT IN - Supply Supply Analog - VDDB OUT Supply 7 8 9 10 11 12 13 14 15 16 17 18 INP ZMDI-test n.c. n.c. SCLK/SCL MOSI/SDA ZMDI-test MISO ZMDI-test SS ZMDI-test IN IN IN / OUT IN IN - Analog Digital Digital Digital Digital - SEL IN Digital EOC OUT Digital n.c. n.c. n.c. n.c. IN Supply 19 20 21 22 23 24 VDD Description ground reference voltage signal sensor bridge's ground do not connect negative bridge signal do not connect sensor bridge’s supply (driven from the IC), Remark: Do not short with VDD! positive bridge signal do not connect clock input for I²C / SPI data input for SPI, data in/out-line for I²C do not connect data output for SPI do not connect slave select for SPI do not connect I²C or SPI Interface select (internal pull up, 0…SPI, 1…I2C) end of conversion … can be used as “measurement completed” trigger IC’s supply voltage *) n.c. stands for not connected / no connection required / not bonded Preliminary May 18, 2012 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 10 of 11 ZSSC3026 – Application Circuits Low Power 16 Bit Sensor Signal Conditioner IC 3 Related Documents Document File Name ZSSC3026 Feature Sheet ZSSC3026_Feature_Sheet_v*.pdf ZSSC3026 Data Sheet ZSSC3026_DataSheet_v*.pdf ZSSC3026 Application Note: Assembly ZSSC3026_AssemblyInformation_v*.pdf ZSSC30x6 Evaluation Kit Documentation ZSSC30x6_EvaluationKit_v*.pdf ZSSC30x6 Application Note: Calibration ZSSC30x6_Calibration_v*.pdf Visit ZMDI’s website www.zmdi.com or contact your nearest sales office for ordering information or the latest version of these documents. 4 Document Revision History Revision Date Description th 1.00 March 28 , 2012 1.01 th May 18 , 2012 First release of Application Circuits’ Notes, ZSSC3026 Minor Corrections Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG (ZMD AG) ZMD America, Inc. ZMD AG, Japan Office ZMD Far East, Ltd. Grenzstrasse 28 01109 Dresden Germany 8413 Excelsior Drive Suite 200 Madison, WI 53717 USA 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone Fax Phone Fax Phone Fax Phone Fax +49 (0)351.8822.7.772 +49(0)351.8822.87.772 +01 (608) 829-1987 +01 (631) 549-2882 +81.3.6895.7410 +81.3.6895.7301 +886.2.2377.8189 +886.2.2377.8199 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are PRELIMINARY and subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. Preliminary May 18, 2012 © 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 11 of 11