Data Sheet Rev. 1.24 / April 2015 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications Multi-Market Sensing Platforms Precise and Deliberate ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications Brief Description Benefits The ZSSC3138 is a member of the ZSSC313x product family of CMOS integrated circuits designed for automotive/ industrial sensor applications. All family members are well suited for highly accurate amplification and sensor-specific correction of resistive bridge sensor signals. An internal 16-bit RISC microcontroller running a correction algorithm compensates sensor offset, sensitivity, temperature drift, and non-linearity of the connected sensor element. The required calibration coefficients are stored by the one-pass calibration procedure on chip (EEPROM). Family approach offers the best fitting IC selection to build cost-optimized applications No external trimming components required Low number of external components needed PC-controlled configuration and one-pass/ end-of-line calibration via I²C™* or ZACwire™ interface: simple, cost efficient, quick, and precise High accuracy (0.25% FSO** @ -25 to +85°C; 0.5% FSO @ -40 to +125°C) Optimized for automotive/industrial environments due to robust protection circuitries, excellent electromagnetic compatibility and AEC-Q100 qualification The ZSSC3138 offers a maximum analog gain of 420 and two offset compensation features. These fit perfectly with the requirements of ceramic thick-filmbased sensor elements as well as strain gauges. The high amplification in combination with the offset compensation offers the capability to set up ceramic thick-film-based sensor applications without laser trimming, which leads to better long-term stability. Available Support Features Physical Characteristics Adjustable to nearly all resistive bridge sensor types, analog gain of 420, maximum overall gain of 1680 Enhanced sample rate: 7.8 kHz maximum High ADC resolution 15/16 bit Safety functionality sensor connection Internal temperature compensation Digital compensation of sensor offset, sensitivity, temperature drift, and non-linearity Output options: ratiometric analog voltage output (5 - 95% maximum, 12.4 bit resolution) or TM ZACwire (digital One-Wire Interface (OWI)) Sensor biasing by voltage High voltage protection up to 33 V Supply current: 5.5mA maximum Reverse polarity and short circuit protection Wide operation temperature range between -40 to +150°C Traceability by user-defined EEPROM entries * Note: I2C™ is a trademark of NXP. ** FSO = Full Scale Output. Evaluation Kits Application Notes Mass Calibration System Supply voltage 4.5 to 5.5 V Operation temperature: -40°C to +125°C (-40°C to +150°C extended temperature range depending on product version) Available in RoHS-compliant JEDEC-SSOP14 package or delivery as die ZSSC3138 Minimum Application Requirements VCC Sensor Module OUT ZSSC3138 GND For more information, contact ZMDI via [email protected]. © 2015 Zentrum Mikroelektronik Dresden AG — Rev.1.24 — April 10, 2015. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications ZSSC3138 Application Example Out / OWI GND C2 100nF 8 VSSE VDDE 7 10 VBN 11 VBR_B 12 VBP C5 VDD 6 ZSSC3138 9 AOUT Sensor Bridge C4 VSUPP +4.5V to +5.5V C3 47nF n.c. 5 SCL 4 SCL SDA 3 SDA Serial Interface 13 VBR_T VSSA 2 14 N.C. VDDA 1 C1 100nF Ordering Information (See data sheet section 8 for complete delivery options.) Product Sales Code Description Package ZSSC3138BE1 ZSSC3138 die – tested; temperature range -40 to +150°C Unsawn wafer: add “B” to sales code Die on frame: add “C” to sales code ZSSC3138BA1 ZSSC3138 die – tested; temperature range -40 to +125°C Unsawn wafer: add “B” to sales code Die on frame: add “C” to sales code ZSSC3138BE2 ZSSC3138 SSOP14 – temperature range -40 to +150°C Tube: add “T” to sales code Tape & Reel: add “R” ZSSC3138BA2 ZSSC3138 SSOP14 – temperature range -40 to +125°C Tube: add “T” to sales code Tape & Reel: add “R” ZSSC313xKITV1.1 ZSSC313x Evaluation Kit, version 1.1, including Evaluation Board, ZSSC3138 IC samples, USB cable Kit ZSSC313x Mass Calibration System V1.1 Modular Mass Calibration System (MSC) for ZSSC313x including MCS boards, cable, connectors Kit Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.306 Fax +49.351.8822.337 USA Phone 1.855.275.9634 Phone +1.408.883.6310 Fax +1.408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building Unit B, 906-1 660, Daewangpangyo-ro Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2015 Zentrum Mikroelektronik Dresden AG — Rev.1.24 — April 10, 2015. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications Contents 1 Electrical Characteristics ............................................................................................................................... 6 1.1. Absolute Maximum Ratings .................................................................................................................... 6 1.2. Operating Conditions .............................................................................................................................. 6 1.3. Electrical Parameters ............................................................................................................................. 7 1.3.1. Supply Current and System Operation Conditions .......................................................................... 7 1.3.2. Analog Front-End (AFE) Characteristics ......................................................................................... 7 1.3.3. Temperature Measurement ............................................................................................................. 7 1.3.4. A/D Conversion ................................................................................................................................ 7 1.3.5. Sensor Check................................................................................................................................... 8 1.3.6. DAC and Analog Output .................................................................................................................. 8 1.3.7. System Response ............................................................................................................................ 9 1.4. Interface Characteristics and EEPROM ............................................................................................... 10 TM 1.4.1. I²C Interface ................................................................................................................................ 10 1.4.2. ZACwire™ One-Wire Interface (OWI) ........................................................................................... 10 1.4.3. EEPROM ........................................................................................................................................ 10 2 Circuit Description ....................................................................................................................................... 11 2.1. Signal Flow ........................................................................................................................................... 11 2.2. Application Modes ................................................................................................................................ 12 2.3. Analog Front-End (AFE) ....................................................................................................................... 12 2.3.1. Programmable Gain Amplifier (PGA) ............................................................................................. 13 2.3.2. Offset Compensation ..................................................................................................................... 13 2.3.3. Measurement Cycle ....................................................................................................................... 14 2.3.4. Analog-to-Digital Converter ............................................................................................................ 15 2.4. Temperature Measurement .................................................................................................................. 17 2.5. System Control and Conditioning Calculation ...................................................................................... 17 2.5.1. General Working Modes ................................................................................................................ 17 2.5.2. Startup Phase ............................................................................................................................... 18 2.5.3. Conditioning Calculation ................................................................................................................ 18 2.6. Analog or Digital Output ....................................................................................................................... 19 2.7. Serial Digital Interface .......................................................................................................................... 19 2.8. Failsafe Features .................................................................................................................................. 19 2.9. High Voltage, Reverse Polarity, and Short Circuit Protection .............................................................. 20 3 Application Circuit Examples ....................................................................................................................... 21 4 Pin Configuration and Package ................................................................................................................... 22 5 ESD Protection ............................................................................................................................................ 23 6 Quality and Reliability .................................................................................................................................. 23 7 Customization .............................................................................................................................................. 23 8 Ordering Information ................................................................................................................................... 23 9 Related Documents ..................................................................................................................................... 24 10 Glossary ...................................................................................................................................................... 25 11 Document Revision History ......................................................................................................................... 26 Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 4 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications List of Figures Figure 2.1 Figure 2.2 Figure 3.1 Figure 4.1 Block Diagram of the ZSSC3138 ................................................................................................... 11 Measurement Cycle with 1 Bridge Sensor Signal Measurement per Special Measurement ........ 15 Application with On-Chip Diode Temperature Sensor ................................................................... 21 ZSSC3138 SSOP14 Pin Diagram ................................................................................................. 22 List of Tables Table 1.1 Table 1.2 Table 1.3 Table 1.4 Table 2.1 Table 2.2 Table 2.3 Table 3.1 Table 4.1 Data Sheet April 10, 2015 Absolute Maximum Ratings ............................................................................................................. 6 Operating Conditions ....................................................................................................................... 6 Electrical Parameters ....................................................................................................................... 7 Interface Characteristics and EEPROM ........................................................................................ 10 Adjustable Gains, Resulting Sensor Signal Spans and Common Mode Ranges ......................... 13 Extended Analog Zero Compensation Ranges (XZC) .................................................................. 14 ADC Resolution versus Output Resolution and Sample Rate ....................................................... 17 External Components for Application Circuit Examples ................................................................ 21 Pin Configuration and Definition .................................................................................................... 22 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 5 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 1 Electrical Characteristics 1.1. Absolute Maximum Ratings Parameters apply in operation temperature range and without time limitations. Table 1.1 Absolute Maximum Ratings No. Parameter Symbol 1) 1.1.1 Supply voltage 1.1.2 Potential at AOUT pin 1) VOUT 1.1.3 Analog supply voltage 1) VDDAAMR 1.1.4 Voltage at all analog and digital IO pins VA_IO VD_IO 1.1.5 Storage temperature TSTG 1) 1.2. VDDEAMR Conditions Min Max Unit To VSSE, refer to section 3 for application circuits -33 33 VDC Referenced to VSSE -33 33 VDC Referenced to VSSA, VDDE - VDDA < 0.35V -0.3 6.5 VDC Referenced to VSSA -0.3 VDDA + 0.3 VDC -55 150 C Refer to the ZSSC313x High Voltage Protection Description for specification and detailed conditions. Operating Conditions All voltages are referenced to VSSA. Table 1.2 Operating Conditions No. Parameter 1.2.1 Ambient temperature 1.2.2 Supply voltage 1.2.3 Bridge resistance 3) 4) Symbol 1) 2) Conditions Min Typ Max Unit TAMB_TQE Extended Temperature Range (TQE) -40 150 C TAMB_TQA Advanced-Performance Temperature Range (TQA) -40 125 C TAMB_TQI Best-Performance Temperature Range (TQI) -25 85 C 5.5 VDC 25 k VDDE 4.5 RBR 2 5.0 1) Maximum operation temperature range depends on product version (refer to section 8). 2) See the temperature profile description in the ZSSC313x Dice Package Document. 3) No measurement in mass production, parameter is guaranteed by design and/or quality observation. 4) Symmetric behavior and identical electrical properties (especially the low pass characteristic) of both sensor inputs of the ZSSC3138 are required. Unsymmetrical conditions of the sensor and/or external components connected to the sensor input pins of the ZSSC3138 can generate a failure in signal operation. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 6 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 1.3. Electrical Parameters All parameter values are valid under the operating conditions specified in section 1.2 (special definitions excluded). All voltages referenced to VSSA. Note: See important notes at the end of Table 1.3. Table 1.3 Electrical Parameters No. Parameter Symbol Conditions Min Typ Max Unit 5.5 mA 4 MHz 1.3.1. Supply Current and System Operation Conditions 1.3.1.1 Supply current IS 1.3.1.2 Oscillator frequency 1) fOSC Without bridge and load current, fOSC 3 MHz Adjustment guaranteed for whole temperature range (TAMB_TQE) 2 3 Analog gain: 105 to 2.8 8 275 mV/V Analog gain: 420 to 2.8 1 275 mV/V Temperature range TAMB_TQE -10 10 nA Temperature range TAMB_TQI -2 2 nA Depends on gain adjust; XZC off (refer to section 2.3.1) 0.29 0.65 VDDA Depends on gain adjustment; refer to section 2.3.2 -300 300 % VIN_SP Raw values, without conditioning 700 2700 ppm FS /K 13 16 Bit 0.95 LSB 1.3.2. Analog Front-End (AFE) Characteristics 1.3.2.1 Input span 1.3.2.2 VIN_SP Parasitic differential input 1) offset current 1.3.2.3 Common mode input range 1.3.2.4 Analog offset compensation range IIN_OFF VIN_CM 1.3.3. Temperature Measurement (Refer to section 2.4.) 1.3.3.1 Internal temperature diode sensitivity STTSI 1.3.4. A/D Conversion 1.3.4.1 1.3.4.2 A/D resolution DNL Data Sheet April 10, 2015 1) 1) rADC DNLADC rADC=13bit, fOSC=3MHz, best fit, complete AFE, range according to 1.3.4.5 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 7 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications No. Parameter Symbol Conditions Min Typ Max Unit 1.3.4.3 INL TQA INLADC rADC=13bit, fOSC=3MHz, best fit, complete AFE, range according to 1.3.4.5 4 LSB 1.3.4.4 INL TQE INLADC_TQE rADC=13bit, fOSC=3MHz, best fit, complete AFE, range according to 1.3.4.5, temperature range TAMB_TQE 5 LSB 1.3.4.5 ADC input range 0.9 VDDA VADC_IN 0.1 1.3.5. Sensor Check 1.3.5.1 Sensor connection loss RSCC_min Detection threshold 1.3.5.2 Sensor input short RSSC_short Short detection guaranteed 1.3.5.3 Sensor input no short RSSC_pass Corresponds with minimum sensor output resistance rDAC Analog output, 10-90% 100 k 0 50 1000 1.3.6. DAC and Analog Output 1.3.6.1 D/A resolution 1.3.6.2 Output current sink and source for VDDE=5V IOUT_SRC/SINK 12 Bit VOUT: 5-95%, RLOAD ≥ 2kΩ 2.5 mA VOUT: 10-90%, RLOAD ≥1kΩ 5 mA -25 25 mA 2) 1.3.6.3 Short circuit current IOUT_max To VDDE/VSSE 1.3.6.4 Output signal range VOUT_RANGE With RLOAD ≥ 2k 0.05 0.95 VDDE With RLOAD ≥ 1k 0.1 0.90 VDDE CLOAD < 50nF 0.1 1) 1.3.6.5 Output slew rate 1.3.6.6 Output resistance in diagnostic mode 1.3.6.7 Load capacitance 1.3.6.8 DNL DNLOUT 1.3.6.9 INL TQA INLOUT 1) 1.3.6.10 INL TQE 1.3.6.11 Output leakage current at 150°C Data Sheet April 10, 2015 SROUT ROUT_DM CLOAD INLOUT_TQE IOUT_LEAK V/µs Diagnostic range: <4 to 96>%, RLOAD ≥ 2k <8 to 92>%, RLOAD ≥ 1k 82 C3 + CLOAD (refer to section 3) 150 nF -1.5 1.5 LSB Best fit, rDAC=12bit -5 5 LSB Best fit, rDAC=12bit, temperature range TAMB_TQE -8 8 LSB In case of power or ground loss -25 25 µA © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 8 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications No. Parameter Symbol Conditions Min Typ Max Unit 1-step ADC, fOSC=3MHz rADC=14bit) 35 ms 2-step ADC, fOSC=3MHz, rADC=14bit) 5 ms 1.3.7. System Response 1) 3) 1.3.7.1 Startup time st (To 1 output, ROM check disabled) 1) 1.3.7.2 Response time (100% input step; refer to Table 2.3) 1) 1.3.7.3 Bandwidth (In comparison to an equivalent analog SSC. Refer to Table 2.3) 1.3.7.4 tSTARTUP tRESPONSE BW Analog output noise 1) peak-to-peak VNOISE_PP Analog output noise 1) RMS VNOISE_RMS 1.3.7.6 Ratiometricity error RE 1.3.7.7 Overall failure Deviation from ideal line including INL, gain, offset and temperature errors. No sensor-caused effects. Failure for digital readout shown in parenthesis. 1.3.7.5 4) 1-step ADC, fOSC=4MHz, rADC=13bit 8.7 13.1 17.4 ms 2-step ADC, fOSC=4MHz, rADC=13bit 256 384 512 µs 1-step ADC 200 Hz 2-step ADC 7.8 kHz Shorted inputs 10 mV 3 mV 1000 ppm bandwidth 10kHz Shorted inputs bandwidth 10kHz Maximum error for VDDE=5V to 4.5/5.5V fOSC≤3MHz, rADC=13bit, temperature range TAMB_TQI 0.25 (0.1) % FS FOVERALL_TQA fOSC≤3MHz, rADC=13bit, temperature range TAMB_TQA 0.5 (0.25) % FS FOVERALL_TQE fOSC≤3MHz, rADC=13bit, temperature range TAMB_TQE 1.0 (0.5) % FS FOVERALL_TQI 1) No measurement in mass production, parameter is guaranteed by design and/or quality observation. 2) Minimum output voltage to VDDE or maximum output voltage to VSSE. 3) Depends on resolution and configuration. Start routine begins approximately 0.8ms after power on. 4) If XZC is active, additional overall failure of 25ppm/K for XZC=31 maximum. Failure decreases linearly for XZC<31. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 9 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 1.4. Interface Characteristics and EEPROM Table 1.4 Interface Characteristics and EEPROM No. Parameter TM 1.4.1. I²C Symbol Conditions Min Typ Max Unit Interface (Refer to the ZSSC313x Functional Description for timing details) 1.4.1.1 I²C voltage level HIGH 1.4.1.2 I²C voltage level LOW VI²C,HIGH 1) Slave output level LOW 1.4.1.4 SDA load capacitance 1) 1.4.1.5 1) 1.4.1.6 Internal pull-up resistor VDDA VI²C,LOW 1) 1.4.1.3 SCL clock frequency 0.8 VI²C,LOW_OUT Open drain, IOL<2mA CSDA fI²C 1) fOSC≥2MHz RI²C,PULLUPI 25 0.2 VDDA 0.15 VDDA 400 pF 400 kHz 100 k 1.4.2. ZACwire™ One-Wire Interface (OWI) (Refer to the ZSSC313x Functional Description for timing details) 1.4.2.1 OWI voltage level HIGH 1.4.2.2 1.4.2.3 1.4.2.4 1) OWI voltage level LOW 1) Slave output level LOW 1) Start window 1) VOWI,HIGH 0.75 VDDA VOWI,LOW VOWI,LOW_OUT Open drain, IOL<2mA tOWI,STARTWIN At fOSC=3MHz 96 175 0.2 VDDA 0.15 VDDA 455 ms 150 C 1.4.3. EEPROM 1.4.3.1 Ambient temperature for 1) EEPROM programming 1.4.3.2 Write cycles 1) TAMB_EEP nEEP_WRI -40 Write <= 85°C 100 000 Write up to 150°C 1) 2) 1.4.3.3 Read cycles 1.4.3.4 Data retention 1.4.3.5 Programming time ≤175°C 8 * 10 tEEP_RETENTION 1300h at 175°C ( = 3000h at 150°C + 27000h at 125°C + 100000h at 55°C ) 15 nEEP_READ 1) 3) 1) 100 tEEP_WRI Per written word 12 8 a ms 1) No measurement in mass production, parameter is guaranteed by design and/or quality observation. 2) Valid for the dice. Note that the package and the temperature version causes additional restrictions. 3) Over lifetime and valid for the dice. Use the calculation sheet ZMDI Temperature Profile Calculation Sheet for temperature stress calculation. Note that the package and the temperature version causes additional restrictions. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 10 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 2 2.1. Circuit Description Signal Flow The ZSSC3138’s signal path is partly analog and partly digital. The analog section is differential – this means the differential bridge sensor signal is internally handled via two signal lines that are rejected symmetrically around an internal common mode potential (analog ground = VDDA/2). As a result of the differential design, it is possible to amplify positive and negative input signals that are within the common mode range of the signal input. Figure 2.1 Block Diagram of the ZSSC3138 PGA MUX EEPROM TS ADC Analog Domain CMC ZACwire™ RAM DAC I2C™ * Digital Data I/O BAMP Analog Output ROM ZSSC3138 Digital Domain * Note: I2C™ is a trademark of NXP. PGA Programmable Gain Amplifier TS On-chip Temperature Sensor (pn-junction) MUX Multiplexer ADC Analog-to-Digital Converter CMC Calibration Microcontroller ROM Read-Only Memory for Correction Formula and Algorithm RAM Volatile Memory for Calibration Parameters and Configuration EEPROM Non-volatile Memory for Calibration Parameters and Configuration DAC Digital-to-Analog Converter BAMP Output Buffer Amplifier The differential signal from the bridge sensor is pre-amplified by the programmable gain amplifier (PGA). The multiplexer (MUX) transmits the signals from either the bridge sensor or the internal temperature sensor to the analog-to-digital converter (ADC) in a specific sequence. The ADC converts these signals into digital values. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 11 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications The digital signal conditioning is processed by the calibration microcontroller (CMC). It is based on a correction formula that uses sensor-specific coefficients determined during calibration. The formula is located in ROM, and the sensor-specific coefficients are stored in EEPROM. Depending on the programmed output configuration, the conditioned sensor signal is output as an analog signal, or alternatively can be readout via a digital serial interface (I²C™ or ZACwire™). The configuration data and the correction parameters must also be programmed into the EEPROM via the digital interfaces. 2.2. Application Modes For each application, a configuration set must be established by programming the on-chip EEPROM for the following modes: Sensor channel Input range: The gain adjustment of the analog front-end (AFE) with respect to the maximum sensor signal span and the zero point of the A/D conversion must be selected. Extended analog offset compensation (XZC): If required, this compensates large sensor offsets; e.g., if the sensor offset voltage is near to or larger than the sensor span. Resolution/response time: The A/D converter must be configured for resolution. The ADC order (first or second order) must also be configured. These settings influence the sampling rate and the signal integration time, and thus, the noise immunity. Temperature Temperature measurement 2.3. Analog Front-End (AFE) The analog front-end (AFE) consists of the three-stage programmable gain amplifier (PGA), the multiplexer (MUX), and the analog-to-digital converter (ADC). Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 12 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 2.3.1. Programmable Gain Amplifier (PGA) Table 2.1 shows the adjustable gains, the sensor signal spans, and the valid common mode range. Table 2.1 Adjustable Gains, Resulting Sensor Signal Spans and Common Mode Ranges PGA Gain aIN Maximum Span 1) VIN_SP [mV/V] 420 Input Common Mode Range 2) VIN_CM [% VDDA] XZC = Off XZC = On 1.8 29 to 65 45 to 55 280 2.7 29 to 65 45 to 55 210 3.6 29 to 65 45 to 55 140 5.4 29 to 65 45 to 55 105 7.1 29 to 65 45 to 55 70 10.7 29 to 65 45 to 55 52.5 14.3 29 to 65 45 to 55 35 21.4 29 to 65 45 to 55 26.3 28.5 29 to 65 45 to 55 14 53.75 29 to 65 45 to 55 9.3 80 29 to 65 45 to 55 7 107 29 to 65 45 to 55 2.8 267 32 to 57 Not applicable 1) Recommended maximum internal signal range is 75% of supply voltage. Span is calculated by the following formula: Span = 0.75 (VBR_T – VBR_B) / Gain. 2) Refer to section 2.3.2 for an explanation of the extended analog zero compensation (XZC). 2.3.2. Offset Compensation The ZSSC3138 processes a sensor-offset correction during the digital signal conditioning by the calibration microcontroller (CMC). The ZSSC3138 also supports an extended analog zero compensation (XZC) for large offsets up to a maximum of approximately 300% of signal span, depending on the gain adjustment (Table 2.2). This prevents overdriving the analog signal path in the case of a large sensor offset by adding a compensation voltage to the second amplification stage. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 13 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications Table 2.2 Extended Analog Zero Compensation Ranges (XZC) PGA Gain aIN Maximum Span VIN_SP [mV/V] Offset Shift / XZC Step [% VIN_SP] Maximum Offset Shift [mV/V] Maximum Shift (XZC = ±31) [% VIN_SP] 420 1.8 12.5 % 7.8 388% 280 2.7 7.6 % 7.1 237% 210 3.6 12.5 % 15.5 388% 140 5.4 7.6 % 14.2 237% 105 7.1 12.5 % 31 388% 70 10.7 7.6 % 28 237% 52.5 14.3 12.5 % 32 388% 35 21.4 7.6 % 57 237% 26.3 28.5 5.2 % 52 161% 14 53.75 12.5 % 194 388% 9.3 80 7.6 % 189 237% 7 107 5.2 % 161 161% 2.8 267 0.83 % 72 26% 2.3.3. Measurement Cycle The measurement cycle is controlled by the CMC. Depending on EEPROM settings, the multiplexer (MUX) selects the following input signals in a defined sequence: Pre-amplified bridge sensor signal Temperature sensor signal Internal offset of the input channel (VOFF) The cycle diagram in Figure 2.2 shows the basic structure of the measurement cycle. After power-on, the startup routine is processed, which performs all required measurements to expedite acquiring an initial valid conditioned sensor output. After the startup routine, the normal measurement cycle runs. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 14 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications Figure 2.2 Measurement Cycle with 1 Bridge Sensor Signal Measurement per Special Measurement CTAZ CT Measurement Cycle with Bridge Signal Output BRAZ CFGAPP:BRCNT = 0 Startup BR (1 bridge sensor signal measurement per special measurement) CTAZ BR CT BR CMV BR SSCP BR SSCN BR BRAZ 12 Measurements per Cycle Measurement Cycle Measurement Cycle Phases Main Signals Measurement Safety Functions Measurement * Bridge Sensor Measurement BR BRAZ Bridge Sensor Auto-Zero Measurement 2.3.4. Calibration Temperature Measurement SSCP Sensor Short Check CTAZ Calibration Temperature SSCN Sensor Short Check CT Auto-Zero Measurement Positive-Biased Measurement Negative-Biased Measurement Analog Output Updated CMV Sensor Common Mode Voltage Measurement Bridge Sensor Signal * Not available for all ZSSC313x products. See Table 1.1 in the ZSSC313x Functional Description. Analog-to-Digital Converter The A/D converter is implemented using full-differential switched-capacitor technique. Programmable ADC resolutions are rADC=<13, 14>bit. The ZSSC3138 supports <15, 16>bit resolution with range zooming. The A/D conversion is integrating, inherently monotone, and insensitive to short and long term instability of the clock frequency. The conversion time tADC depends on the desired resolution and can be roughly calculated by equation (1): t ADC 2rADC fOSC 2 (1) Where rADC Resolution of A/D conversion fOSC Frequency of internal oscillator (refer to 1.3.1) Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 15 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications The ZSSC3138 supports a high sample rate ADC mode (2-step conversion) with the advantage of a much shorter conversion time but with the drawback of a lower noise immunity caused by the shorter signal integration time. The conversion time tADC,2step in this mode is roughly calculated by equation (2): t ADC,2-step 2 rADC 3 2 fOSC 2 (2) Refer to the ZSSC313x Bandwidth Calculation Sheet for a detailed calculation of sampling time and bandwidth. The result of the A/D conversion is a relative counter result Z corresponding to the following equation: Z 2rADC ( VADC_DIFF VADC_REF RS) (3) Where rADC Resolution of A/D conversion VADC_DIFF Differential ADC input voltage VADC_REF ADC reference voltage (VVBR_T-VVBR_B or VVDDA-VVSSA, if BRREF=1) RS Digital ADC Range Shift (RS = 1/16, 1/8, 1/4, 1/2; controlled by the EEPROM contents) With the RS value, a sensor input signal can be shifted in the optimal input range of the ADC. The condition required for ensuring the specified accuracy, stability, and non-linearity parameters of the analog front-end is that the differential ADC input voltage VADC_DIFF does not exceed the range of 10% to 90% of the ADC reference voltage VADC_REF. This requirement must be met for the whole temperature range and for all sensor tolerances. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 16 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications Table 2.3 ADC Resolution versus Output Resolution and Sample Rate ADC Adjustment ADC Sample Rate Mode Normal High Output Resolution 1) Sample Rate 2) Averaged Bandwidth 2) rADC [bit] Digital [bit] Analog [bit] fOSC=3MHz [Hz] fOSC=4MHz [Hz] fOSC=3MHz [Hz] fOSC=4MHz [Hz] 13 13 12 345 460 130 172 14 14 12 178 237 67 89 15 14 12 90 120 34 45 16 14 12 45 61 17 23 13 13 12 5859 7813 2203 2937 14 14 12 3906 5208 1469 1958 15 14 12 2930 3906 1101 1468 16 14 12 1953 2604 734 979 1) Output resolution does not exceed ADC resolution. PGA gain should be such that the differential ADC input signal uses at least 50% of ADC input range to ensure maximum achievable output resolution. 2) Refer to the ZSSC313x Bandwidth Calculation Sheet for a detailed calculation of sampling time and bandwidth. 2.4. Temperature Measurement The ZSSC3138 supports acquiring temperature data needed for conditioning of the sensor signal using an internal pn-junction temperature sensor. Refer to the ZSSC313x Functional Description for a detailed explanation of temperature sensor adaptation and adjustment. 2.5. System Control and Conditioning Calculation The system control supports the following tasks/features: 2.5.1. Managing the startup sequence Controlling the measurement cycle regarding to the EEPROM-stored configuration data Sensor signal conditioning (calculation of the 16-bit correction for each measurement signal using the EEPROM-stored conditioning coefficients and the ROM-based formulas) Processing communication requests received via the digital interfaces Performing failsafe tasks and message detected errors by setting diagnostic states General Working Modes ZSSC3138 supports three different working modes: Normal Operation Mode (NOM) – for continuous processing of signal conditioning Command Mode (CM) – for calibration and access to all internal registers Diagnostic Mode (DM) – for failure messages Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 17 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 2.5.2. Startup Phase 1 After power-on, the startup phase is processed, which includes Internal supply voltage settling including reset of the circuitry by the power-on reset block (POR). Refer to the ZSSC313x High Voltage Protection Description for power-on/off thresholds. Duration (beginning with VVDDA-VVSSA=0V): 500µs to 2ms; AOUT: high impedance. System start and configuration, EEPROM readout, and signature check. Duration: ~200µs; AOUT: lower diagnostic range (LDR). Processing the measurement cycle start routine. Duration: 5x A/D conversion time; AOUT behavior depends on configured one-wire communication mode (refer to section 2.6): OWIANA or OWIDIS AOUT: lower diagnostic range (LDR) OWIWIN or OWIENA AOUT: tri-state If an error is detected during the startup phase, the Diagnostic Mode (DM) is activated and the analog output at the AOUT pin remains in the lower diagnostic range. After the startup phase, the continuous running measurement and sensor signal conditioning cycle is started, and analog or digital output of the conditioned sensor signal is activated. If the one-wire communication mode OWIWIN is selected, the OWI startup window expires before analog output is available. 2.5.3. Conditioning Calculation The digitalized value for the bridge signal is processed with a conditioning formula to remove offset and rd temperature dependency and to compensate nonlinearity up to 3 order. The result is a non-negative 15-bit value for the measured bridge sensor signal in the range [0; 1). This value is available for readout via I²C or OWI communication. For the analog output, the value is clipped to the programmed output limits. Note: The extent of signal deviation that can be compensated by the conditioning calculation depends on the specific sensor signal characteristics. For a rough estimation, assume the following: offset compensation and gain correction are not limited. Notice that resolution of the digitally gained signal is determined by the ADC resolution in respect to the dynamic input range used. The temperature correction includes first and second order terms and should be adequate for all practically relevant cases. The non-linearity correction of the sensor signal is possible for second-order up to about 30% FS regarding ideal fit and for third-order up to about 20% FS. Overall, the conditioning formula applied is able to reduce the nonlinearity of the sensor signal by a factor of 10. 1 All timing values are roughly estimated for an oscillator frequency fOSC=3MHz and are proportional to that frequency. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 18 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 2.6. Analog or Digital Output The AOUT pin is used for analog output and for one-wire communication (OWI). The latter can be used for digital readout of the conditioned sensor signal and for end-of-line sensor module calibration. The ZSSC3138 supports different modes for the analog output in interaction with OWI communication: OWIENA: Analog output is deactivated; OWI readout of the signal data is enabled. OWIWIN: Analog output starts after the startup phase and after the OWI startup window if OWI communication is not initiated; OWI communication for configuration or for end-of-line calibration can be started during the OWI startup window (maximum ~500ms) by sending the START_CM command. OWIANA: Analog output starts after the startup phase; OWI communication for configuration or for endof-line calibration can be started during the OWI startup window (maximum ~500ms) by sending the START_CM command; for command transmission, the driven analog output at the AOUT pin must be overwritten by the external communication master (AOUT drive capability is current-limited). OWIDIS: Analog output starts after the startup phase; OWI readout of the signal data is disabled. The analog output signal is driven by an offset compensated, rail-to-rail output buffer that is current-limited to prevent damage to the ZSSC3138 from a short circuit between the analog output and power supply or ground. Output resolution of at least 12-bit in the range of 10% to 90% FS is ensured by a 12.4-bit resistor string DAC. 2.7. Serial Digital Interface TM TM The ZSSC3138 includes a serial digital I²C interface and a ZACwire interface for one-wire communication (OWI). The digital interfaces allow configuration and calibration of the sensor module. OWI communication can be used to perform an end-of-line calibration via the analog output pin AOUT of a completely assembled sensor module. The interfaces also provide the readout of the conditioned sensor signal data during normal operation. Refer to the ZSSC313x Functional Description for a detailed description of the serial interfaces and the communication protocols. 2.8. Failsafe Features The ZSSC3138 detects various failures. When a failure is detected, Diagnostic Mode (DM) is activated. DM is indicated by setting the output pin AOUT to the Lower Diagnostic Range (LDR). When using digital serial communication protocols (I²C™ or OWI) to read conditioning results data, the error status is indicated by a specific error code. A watchdog timer controls the proper operation of the microcontroller. The operation of the internal oscillator is monitored by an oscillator-failure detection circuit. EEPROM and RAM content are checked when accessed. Control registers are parity protected. The sensor connection is checked with regard to broken wires or short circuits (sensor connection check, sensor short check). Refer to the ZSSC313x Functional Description for a detailed description of failsafe features and methods of error indication. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 19 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 2.9. High Voltage, Reverse Polarity, and Short Circuit Protection The ZSSC3138 is designed for 5V power supply operation. The ZSSC3138 and the connected sensor are protected from overvoltage and reverse polarity damage by an internal supply voltage limiter. The analog output AOUT can be connected (short circuit, overvoltage, and reverse polarity) with all potentials in the protection range under all potential conditions at the pins VDDE and VSSE. To guarantee this operation, all external components (see application circuit in section 3) are required. The protection is not time-limited. Refer to the ZSSC313x High Voltage Protection Description for a detailed description of protection cases and conditions. Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 20 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 3 Application Circuit Examples The application circuits contain external components that are needed for overvoltage, reverse polarity, and short circuit protection. Note: Also check the ZSSC313x application notes for application examples and board layout. Table 3.1 External Components for Application Circuit Examples Symbol Component Min C1 Capacitor 100 C2 Capacitor 100 Capacitor 4 Capacitor 0 C3 1) C4, C5 1) Typ 2) Max Unit 470 nF Remarks nF 47 160 nF Value includes the load capacitor C3 and the capacitance of the connection cable. 10 nF Recommended to increase EMI immunity. Value includes the filter capacitor C4 and C5 and the sensor connection line capacitance. 1) Increasing capacitors C3, C4, and C5 increases EMI immunity. 2) Dimensioning is only for example and must be adapted to the requirements of the application. Figure 3.1 Application with On-Chip Diode Temperature Sensor Out / OWI GND C2 100nF 8 VSSE VDDE 7 +4.5V to +5.5V C3 47nF 10 VBN 11 VBR_B 12 VBP C4 Data Sheet April 10, 2015 C5 VDD 6 ZSSC3138 9 AOUT Sensor Bridge VSUPP n.c. 5 SCL 4 SCL SDA 3 SDA Serial Interface 13 VBR_T VSSA 2 14 n.c. VDDA 1 C1 100nF © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 21 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 4 Pin Configuration and Package Table 4.1 Pin Configuration and Definition Pin No Pin Name Description Remarks 1 VDDA Positive Analog Supply Voltage Internal analog supply 2 VSSA Negative Analog Supply Voltage Internal analog ground 3 SDA I²C™ Serial Data Digital I/O; internal pull-up to VDDA 4 SCL I²C™ Clock Digital input; internal pull-up to VDDA 5 N.C. Not connected 6 VDD Positive Digital Supply Voltage Internal digital supply 7 VDDE Positive External Supply Voltage High voltage analog supply 8 VSSE Negative External Supply Voltage Ground 9 AOUT Analog Output TM and ZACwire Serial Data High voltage analog I/O 10 VBN Negative Input from Sensor Bridge Analog input 11 VBR_B Negative Sensor Bridge Supply Voltage Analog I/O Depending on application circuit, short to VSSA 12 VBP Positive Input from Sensor Bridge Analog input 13 VBR_T Positive Sensor Bridge Supply Voltage Analog I/O Depending on application circuit, short to VDDA 14 N.C. Not connected The standard package of the ZSSC3138 is an RoHS-compliant SSOP14 “green” package (5.3mm body width) with a lead pitch of 0.65 mm. ZSSC3138 SSOP14 Pin Diagram VSSE VDDE AOUT VDD ZSSC 3138BPPPP LLLLLLLL YYWW Figure 4.1 VBN VBR_B VBP Data Sheet April 10, 2015 14 N.C. SCL SDA VSSA 1 VBR_T N.C. VDDA B PPPP LLLLLLLL YYWW Revision Product and Package Code Lot Number Date Code (Year, Work Week) © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 22 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 5 ESD Protection All pins have an ESD protection of >2000V according to the Human Body Model (HBM). The pins VDDE, VSSE and AOUT have an additional ESD protection of >4000V (HBM). ESD protection is tested with devices in SSOP14 packages during product qualification. The ESD test follows the Human Body Model with 1.5kOhm/100pF based on MIL 883, Method 3015.7. 6 Quality and Reliability The ZSSC3138 is qualified according to the AEC-Q100 standard, operating temperature grade 0. A fit rate <5fit (T=55°C, S=60%) is guaranteed. A typical fit rate of the semiconductor technology used is 2.5fit. 7 Customization For high-volume applications that require an upgraded or downgraded functionality compared to the ZSSC3138, ZMDI can customize the circuit design by adding or removing certain functional blocks. Please contact ZMDI for further information. 8 Ordering Information Product Sales Code Description Package ZSSC3138BA2T ZSSC3138 SSOP14 – temperature range -40 to +125°C Tube ZSSC3138BA2R ZSSC3138 SSOP14 – temperature range -40 to +125°C Reel ZSSC3138BA1B ZSSC3138 die – temperature range -40 to +125°C Tested dice on unsawn wafer ZSSC3138BA1C ZSSC3138 die – temperature range -40 to +125°C Tested dice on frame ZSSC3138BE2T ZSSC3138 SSOP14 – temperature range -40 to +150°C Tube ZSSC3138BE2R ZSSC3138 SSOP14 – temperature range -40 to +150°C Reel ZSSC3138BE1B ZSSC3138 die – temperature range -40 to +150°C Tested dice on unsawn wafer ZSSC3138BE1C ZSSC3138 die – temperature range -40 to +150°C Tested dice on frame ZSSC313xKITV1.1 ZSSC313x Evaluation Kit, revision 1.1, including Evaluation Board, Kit ZSSC3138 IC samples, USB cable ZSSC313x Mass Calibration System V1.1 Modular Mass Calibration System (MSC) for ZSSC313x including MCS boards, cable, connectors Data Sheet April 10, 2015 Kit © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 23 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 9 Related Documents Note: X_xy refers to the current revision of the document. Document File Name ZSSC3135 Feature Sheet ZSSC3135_FeatureSheet_Rev_X_xy.pdf ZSSC313x Functional Description ZSSC313x_FunctionalDescription_Rev_X_xy.pdf ZSSC313x Evaluation Kit Description ZSSC313x_Evaluation_Kit_Description_Rev_X_xy.pdf ZSSC313x Technical Note—EMC Design Guidelines* ZSSC313x_TN_EMC_Design_Guidelines_Rev_X_xy.pdf ZSSC313x Technical Note—High Voltage Protection* ZSSC313x_Tech_Note_HighVoltageProt_Rev_X_xy.pdf ZSSC313x Technical Note Die & Package Dimensions** ZSSC313x_Tech_Note_Die-Dim_Rev_X_xy.pdf ZSSC313x Temperature Profile Calculation Spread Sheet ZSSC313x_Temperature_Profile_Calculation_Rev_X_xy.xls ZSSC313x Bandwidth Calculation Spread Sheet** ZSSC313x_BandwidthCalculation_Rev_X_xy.xls Visit the ZSSC3138 product page (www.zmdi.com/zssc3138) on ZMDI’s website www.zmdi.com or contact your nearest sales office for the latest version of these documents. * Documents marked with an asterisk (*) require a login account for access on the web. For detailed instructions, visit www.zmdi.com/login-account-setup-procedure. ** Documents marked with a double asterisk (**) are available only on request (see page Error! Bookmark not defined. for contact information). Data Sheet April 10, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 24 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 10 Glossary Term Description ADC Analog-to-Digital Converter AEC Automotive Electronics Council AFE Analog Front-end AOUT Analog Output BAMP Buffer Amplifier BR Bridge Sensor Signal CM Command Mode CMC Calibration Microcontroller CMOS Complementary Metal Oxide Semiconductor DAC Digital-to-Analog Converter DM Diagnostic Mode EEPROM Electrically Erasable Programmable Read-Only Memory ESD Electrostatic Device LDR Lower Diagnostic Range MUX Multiplexer NOM Normal Operation Mode OWI One-Wire Communication PGA Programmable Gain Amplifier POR Power-on Reset RAM Random-Access Memory RISC Reduced Instruction Set Computer ROM Read-Only Memory SCC Sensor Connection Check SSC Sensor Signal Conditioner or Sensor Short Check depending on context. T Temperature Sensor Signal TS Temperature Sensor XZC eXtended Zero Compensation Data Sheet © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. April 10, 2015 25 of 26 ZSSC3138 Sensor Signal Conditioner for Ceramic Sensor Applications 11 Document Revision History Revision Date Description 1.00 October 18, 2011 First released revision. 1.10 January 20, 2012 Full revision. 1.20 September 25, 2012 Minor edits. Update for ZMDI contact information. 1.21 February 15, 2013 Updates to specifications 1.3.7.1, 1.3.7.2, and 1.3.7.3. Addition of RS factor (ADC Range Shift) to equation (2). Minor edits. Update for ZMD America contact information. 1.22 October 22, 2013 Updates for contact information and imagery for cover and headers. Updates for related documents. Update for available part codes and kit contents listed in ordering tables. 1.23 April 21, 2014 Corrections for part ordering table on page 3. Update for cover imagery. Update for contact information. 1.24 April 10, 2015 Update for contact info. Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.306 Fax +49.351.8822.337 USA Phone 1.855.275.9634 Phone +1.408.883.6310 Fax +1.408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Data Sheet April 10, 2015 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building Unit B, 906-1 660, Daewangpangyo-ro Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.24 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 26 of 26