Data Sheet Rev. 1.04 / August 2014 ZSSC3016 Low Power, High Resolution 16-Bit Sensor Signal Conditioner Mobile Sensing ICs Smart and Mobile ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Brief Description Benefits The ZSSC3016 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3016 can perform offset, st nd span, and 1 and 2 order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. Features Flexible, programmable analog front-end design; up to 16-bit scalable, charge-balancing, twosegment analog-to-digital converter (ADC) Fully programmable gain amplifier for optimizing sensor signals: gain range 14 to 72 (linear factor) Internal auto-compensated temperature sensor Digital compensation of individual sensor offset; st nd 1 and 2 order digital compensation of sensor gain st nd Digital compensation of 1 and 2 order temperature gain and offset drift Intelligent power management unit Typical sensor elements can achieve accuracy of better than ±0.10% FSO @ -40 to 85 °C Support Evaluation Kit Physical Characteristics Supply voltage range: 1.8 to 3.6V Current consumption: 1mA (operating mode) Sleep State current: 70nA (25°C) Temperature resolution: <0.003K/LSB Operation temperature: –40°C to +85 °C Small die size Delivery options: die for wafer bonding ZSSC3016 Application Example VSS VDD VSS Batte ry EOC VDD Sensor Module VDD EOC VSS Sensor Bridge SEL SEL ZSSC3016 SS SS 4 VSSB 3 INN MISO MISO 2 VDDB 1 INP MOSI SDA MOSI_SDA VPP Microcontroller Signal Output / Post-processing The measured and corrected bridge values are provided at the digital output pins, which can be 2 configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, nonvolatile, multiple-time programmable (MTP) memory. Programming the ZSSC3016 is simple via the serial interface and the PC-controlled calibration software provided in the ZMDI Development Kit. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The digital mating is fast and precise, eliminating the overhead normally associated with trimming external components and multi-pass calibration routines. Integrated 18-bit calibration math DSP Fully corrected signal at digital output Minimize calibration costs through the one-pass calibration concept No external trimming components required Highly integrated CMOS design Layout customized for die-die bonding with sensor for high-density chip-on-board assembly Excellent for low-voltage and low-power battery applications SCLK SCL SCLK_SCL VPP 6.75V … programming voltage for setup & calibration * I2C™ is a trademark of NXP. For more information, contact ZMDI via [email protected]. © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04— August 27, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC ZSSC3016 Block Diagram Applications The ZSSC3016 is designed for operation in calibrated resistive (e.g., pressure) sensor modules: Barometric altitude measurement for portable navigation Altitude measurement for emergency call systems and car navigation Inside hard disk pressure measurement Weather forecast Fan control Ordering Information (Contact ZMDI Sales for additional options.) Ordering Examples Description Package ZSSC3016CC1B Temperature range: –40°C to +85°C, consumer-level parameters according to section 1 of the data sheet ZSSC3016CI1B Temperature range: –40°C to +85°C, industrial-level parameters according Wafer (304µm) unsawn to section 1 of the data sheet, 10 years MTP data retention ZSSC3016CI1D ES Engineering samples, temperature range: –40°C to +85°C Dice in waffle pack ZSSC3016KIT ZSSC3016 Evaluation Kit, including sample and modular evaluation board (Evaluation Software is downloadable from www.zmdi.com/zssc3016) Kit Sales and Further Information www.zmdi.com Wafer (304µm) unsawn [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.306 Fax +49.351.8822.337 USA Phone 1.855.275.9634 Phone +1.408.883.6310 Fax +1.408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building 11th Floor, Unit JA-1102 670 Sampyeong-dong Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04— August 27, 2014. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Table of Contents 1 IC Characteristics ............................................................................................................................................. 7 1.1. Absolute Maximum Ratings ....................................................................................................................... 7 1.2. Operating Conditions ................................................................................................................................. 7 1.3. Electrical Parameters ................................................................................................................................ 8 1.4. Power Supply Rejection Ratio vs. Frequency ......................................................................................... 10 2 Circuit Description .......................................................................................................................................... 11 2.1. Brief Description ...................................................................................................................................... 11 2.2. Signal Flow and Block Diagram............................................................................................................... 11 2.3. Analog Front End ..................................................................................................................................... 12 2.3.1. Amplifier ............................................................................................................................................ 12 2.3.2. Analog-to-Digital Converter ............................................................................................................... 14 2.3.3. Temperature Measurement .............................................................................................................. 17 2.3.4. Bridge Supply .................................................................................................................................... 17 2.4. Digital Section .......................................................................................................................................... 17 2.4.1. Digital Signal Processor (DSP) Core ................................................................................................ 17 2.4.2. MTP Memory..................................................................................................................................... 18 2.4.3. Clock Generator ................................................................................................................................ 18 2.4.4. Power Supervision ............................................................................................................................ 18 2.4.5. Interface ............................................................................................................................................ 18 3 Functional Description .................................................................................................................................... 19 3.1. Power Up ................................................................................................................................................. 19 3.2. Measurements ......................................................................................................................................... 19 3.3. Operational Modes .................................................................................................................................. 19 3.4. Command Interpretation .......................................................................................................................... 22 2 3.4.1. SPI/I C™ Commands ....................................................................................................................... 22 3.5. Communication Interface ......................................................................................................................... 24 3.5.1. Common Functionality ...................................................................................................................... 24 3.5.2. SPI .................................................................................................................................................... 26 2 3.5.3. I C™ .................................................................................................................................................. 28 3.6. Memory .................................................................................................................................................... 30 3.6.1. Programming Memory ...................................................................................................................... 30 3.6.2. Memory Status Commands .............................................................................................................. 31 3.6.3. Memory Contents .............................................................................................................................. 32 3.7. Calibration Sequence .............................................................................................................................. 38 3.7.1. Calibration Step 1 – Assigning Unique Identification ........................................................................ 38 3.7.2. Calibration Step 2 – Data Collection ................................................................................................. 38 3.7.3. Calibration Step 3 – Coefficient Calculations .................................................................................... 39 3.8. The Calibration Math ............................................................................................................................... 40 3.8.1. Bridge Signal Compensation ............................................................................................................ 40 3.8.2. Temperature Signal Compensation .................................................................................................. 42 4 Die Pad Assignments ..................................................................................................................................... 43 Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 4 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 5 6 7 8 9 Quality and Reliability ..................................................................................................................................... 44 Ordering Sales Codes .................................................................................................................................... 44 Related Documents ........................................................................................................................................ 45 Glossary ......................................................................................................................................................... 45 Document Revision History ............................................................................................................................ 46 Table of Figures Figure 2.1 Figure 2.2 Figure 3.1 Figure 3.2 Figure 3.3 Figure 3.4 Figure 3.5 Figure 3.6 Figure 3.7 Figure 3.8 Figure 3.9 Figure 3.10 Figure 3.11 Figure 4.1 ZSSC3016 Functional Block Diagram .............................................................................................. 11 ADC Offset ........................................................................................................................................ 16 Operational Flow Chart: Power up.................................................................................................... 20 Operational Flow Chart: Command Mode and Normal Mode .......................................................... 21 SPI configuration CPHA=0 ............................................................................................................... 26 SPI Configuration CPHA=1 .............................................................................................................. 27 SPI Command Request .................................................................................................................... 27 SPI Read Status ............................................................................................................................... 28 SPI Read Data .................................................................................................................................. 28 2 I C™ Command Request ................................................................................................................. 29 2 I C™ Read Status ............................................................................................................................ 29 2 I C™ Read Data ............................................................................................................................... 30 Memory Program Operation ............................................................................................................. 31 ZSSC3016 Pad Assignments ........................................................................................................... 43 Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 5 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC List of Tables Table 1.1 Table 1.2 Table 1.3 Table 1.4 Table 2.1 Table 2.2 Table 2.3 Table 2.4 Table 2.5 Table 2.6 Table 2.7 Table 3.1 Table 3.2 Table 3.3 Table 3.4 Table 3.5 Table 3.6 Table 3.7 Table 3.8 Table 4.1 Maximum Ratings ............................................................................................................................... 7 Operating Conditions .......................................................................................................................... 7 Constraints for VDD Power-on Reset ................................................................................................. 8 Electrical Parameters .......................................................................................................................... 8 Amplifier Gain: Stage 1 ..................................................................................................................... 12 Amplifier Gain: Stage 2 ..................................................................................................................... 13 Gain Polarity ..................................................................................................................................... 13 MSB/LSB Settings ............................................................................................................................ 14 ADC Conversion Times for a Single A2D Conversion...................................................................... 15 Conversion Times vs. Noise Performance for 16-Bit Fully Signal Conditioned Results (AZBM, BM, AZTM, TM and Digital SSC Correction) .................................................................................... 15 ADC Offset Settings .......................................................................................................................... 17 2 SPI/I C™ Commands ....................................................................................................................... 22 Get_Raw Commands ....................................................................................................................... 24 General Status Byte .......................................................................................................................... 25 Status Byte for Read Operations ...................................................................................................... 25 Status Byte for Write Operations ...................................................................................................... 25 Mode Status ...................................................................................................................................... 25 Memory Status Word ........................................................................................................................ 31 MTP Memory Content Assignments. ................................................................................................ 32 Pad Assignments .............................................................................................................................. 43 Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 6 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 1 IC Characteristics 1.1. Absolute Maximum Ratings Table 1.1 Maximum Ratings PARAMETER SYMBOL Min Voltage Reference Vss Analog Supply Voltage Voltage at all Analog and Digital IO Pins Input Current into any Pin except Supply Pins 1 Electrostatic Discharge Tolerance – Human Body Model (HBM1) Storage Temperature 1 2 2 TYP MAX UNITS 0 0 V VDD -0.4 3.63 V VA_IO, VD_IO -0.5 VDD+0.5 V Iin -100 100 mA VHBM1 2000 - V TSTOR -50 125 °C Latch-up resistance; reference for pin is 0V. HBM1: C = 100pF charged to VHBM1 with resistor R = 1.5k in series based on MIL 883, Method 3015.7. ESD protection referring to the Human Body Model is tested with devices in ceramic dual in-line packages (CDIP) during product qualification. 1.2. Operating Conditions Reference for all voltages is Vss. Table 1.2 Operating Conditions PARAMETER SYMBOL MIN TYP MAX UNIT Supply Voltage VDD 1.8 - 3.6 V VDD Rise Time tVDD 200 μs Bridge Current IVDDB 600 μA Operation Temperature Range Tamb -40 85 °C CL 0.01 50 nF External capacitance between VDDB and VSS Data Sheet August 27, 2014 - © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 7 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC In order to achieve minimum current consumption in idle mode, a dynamic power-on-reset (POR) circuit is implemented. The VDD low level and the subsequent rise time and VDD rising slope must fulfill specific constraints to guarantee an overall IC reset, respectively. In general, lower VDD low levels allow for slower rising of the subsequent on-ramp of VDD. The following table shows the relevant reset parameters and conditions. Other combinations may also be possible. The reset trigger can be influenced by increasing the power down time and relaxing, e.g. the VDD rising slope requirement. Table 1.3 Constraints for VDD Power-on Reset PARAMETER SYMBOL MIN TYP MAX UNIT tSPIKE 3 - - ms VDD Low Level VDDlow 0 - 0.2 V VDD Rising Slope SRVDD 10 - - V/ms Power Down Time (duration of VDD Low Level) 1.3. Electrical Parameters All parameter values are valid only under specified operating conditions. All voltages are referenced to Vss. Table 1.4 Electrical Parameters PARAMETER SYMBOL CONDITIONS/COMMENTS MIN TYP MAX UNIT 1.60 1.67 1.74 V Active State, average 900 1500 µA Sleep State at 25°C 70 250 nA SUPPLY Bridge Supply Voltage, ADC Reference Voltage VDDB Current Consumption IVDD Power Supply Rejection (see Figure 3.1) 20·log10(VDD/VDDB) PSRVDD Memory Program Voltage internally generated where VDD = 1.8V 17 dB where VDD = 2V 32 dB VPP MTP program at VPP-pin 6.5 Mean Program Current IVPP Peak Program Current IVPPmax Data Sheet August 27, 2014 6.75 7 V MTP program at VPP-pin 2 5 mA MTP Program at VPP-pin, dynamic switch-on current draw for max. 1usec 13 20 mA © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 8 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC PARAMETER SYMBOL CONDITIONS/COMMENTS MIN TYP MAX UNIT ANALOG TO DIGITAL CONVERTER (ADC) Resolution rADC 10 ADC Clock Frequency fADC Reference Voltage n Vrefn VDDB *0.03 Reference Voltage p Vrefp VDDB *0.97 Offset A2D_Offset 8-step programmable offset Integral Nonlinearity (INL) INLADC Based on ideal slope -4 - +4 LSB Differential Nonlinearity DNLADC Tested / verified within design -1 - +1 LSB Conversion Rate, 16bit single fS,raw Conversions per second for single 16bit A2D conversion 6 - 355 Hz Internal ADC clock 0.925 16 1 1/16 1.12 Bit MHz 8/16 AMPLIFIER Gain Gamp 32 steps 13.2 Gain Error Gerr referred to nominal gain -1.5 72 - 1.5 % 0.01 %FS * O 3 175 Hz 0.65 1.05 SENSOR SIGNAL CONDITIONING PERFORMANCE IC Accuracy Error ErrA,IC Conversion Rate, 16bit SSC fS, SSC Accuracy error for ideally linear (in temperature and e.g. pressure) sensor Conversion per second for fully corrected 16bit measurement INPUT Input Voltage Range VINP, VINN Bridge Resistance RBR Input voltage range at INP and INN 2 10 V 50 kΩ 1 ms 2.5 ms 0.5 ms 2 ms POWER UP tSTA1 Start-up Time tSTA2 tWUP1 Wake-up Time tWUP2 * VDD ramp up to interface communication VDD ramp up to analog operation Sleep to Active State interface communication Sleep to Active State analog operation Percentage referred to maximum full-scale output; e.g., for 16-bit measurements: ErrA,IC [%FSO] = 100 · MAX{ | ADCmeas – ADCideal | } / 216 Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 9 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC PARAMETER SYMBOL CONDITIONS/COMMENTS MIN TYP MAX 3.7 4 4.3 UNIT OSCILLATOR Internal Oscillator Frequency fCLK MHz INTERNAL TEMPERATURE SENSOR Temperature Resolution for full range: -40°C to +85°C 0.003 K/LSB INTERFACE and MEMORY fC,SPI I²C Clock Frequency fC,I2C Program Time tVPP MTP programming time 500 Data Retention tRET_MTP for industrial-level IC-version: 1000h @ 150°C 10 1.4. * max. capacitance at MISO-line: 40pF @ VDD=1.8V SPI Clock Frequency * 20 MHz 3.4 MHz 600 µs a Power Supply Rejection Ratio vs. Frequency With maximum ambient temperature of 85°C Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 10 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 2 Circuit Description 2.1. Brief Description The ZSSC3016 provides a highly accurate amplification of bridge sensor signals. The compensation of sensor offset, sensitivity, temperature drift, and non-linearity is accomplished via an 18-bit DSP core running a correction algorithm with calibration coefficients stored in an MTP memory. The ZSSC3016 can be configured for a wide 2 range of resistive bridge sensor types. A digital interface (SPI or I C™) enables communication. The ZSSC3016 supports two operational modes: Normal Mode and Command Mode. Normal Mode is supposed to be the mode being used typically, in which the IC wakes up from a Sleep (low power) State, runs a measurement in Active State and turns back automatically to the Sleep State. 2.2. Signal Flow and Block Diagram See Figure 2.1 for the ZSSC3016 block diagram. The sensor bridge supply V DDB and the power supply for analog circuitry are provided by a voltage regulator, which is optimized for power supply disturbance rejection (PSRR). See section 1.4 for a graph of PSRR versus frequency. To improve noise suppression, the digital blocks are powered by a separate voltage regulator. A power supervision circuit monitors all supply voltages and generates appropriate reset signals for initializing the digital blocks. The state machine controls the analog circuitry to perform the three measurement types: bridge, temperature, and offset measurement. The multiplexer selects the signal input to the amplifier, which can be the external signals from the input pins INP and INN, the internal temperature reference sensor signals, or an input short for measuring offset. A full measurement request will trigger an automatic sequence of all measurement types and all input signals, respectively. The Temperature Reference Sensor block is based on a bridge-type temperature sensor. The inherit (IC-fabrication related) device mismatch is suppressed by dynamic element matching technique. Figure 2.1 ZSSC3016 Functional Block Diagram Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 11 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC The amplifier consists of two stages with programmable gain values. The 1/f noise and inherent offset are suppressed by auto-zero and chopper stabilizer techniques. This auto-zero sequence is performed before each bridge sensor and temperature measurement to compensate for the inherent offset of the amplifier. The ZSSC3016 employs a charge-balancing analog-to-digital converter (ADC) based on switched-capacitor technique with inherit low-pass behavior and noise suppression. The programmable resolution from 10 to 16 bit provides flexibility for adapting the conversion characteristics. To improve power supply noise suppression, the ADC uses the bridge supply VDDB as its reference voltage. The remaining IC-internal and the sensor element offset i.e., the overall system offset (amplifier and ADC) can be canceled by an offset and auto-zero measurement, respectively. st nd The DSP accomplishes the auto-zero, span, and 1 and 2 order temperature compensation of the measured bridge signal. The correction coefficients are stored in the MTP memory. 2 The ZSSC3016 supports SPI and I C™ interface communication for controlling, configuration and measurement result output. 2.3. Analog Front End 2.3.1. Amplifier The amplifier has a differential architecture and consists of two stages. The amplification of each stage and the sensor bridge gain polarity are programmable via settings in the Measurement Configuration Register (BM_config) in the MTP memory (see section 2.4.2). The first five bits of BM_config are the programmable gain settings Gain_stage1 and Gain_stage2. The options for the programmable gain settings are listed in Table 2.1 and Table 2.2. Table 2.1 Amplifier Gain: Stage 1 Gain_stage1 Bit G1 Bit G0 Stage 1 Gain Setting 0 0 12 0 1 20 1 0 30 1 1 40 Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 12 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Table 2.2 Amplifier Gain: Stage 2 Gain_stage2 Bit G4 Bit G3 Bit G2 Stage 2 Gain Setting 0 0 0 1.1 0 0 1 1.2 0 1 0 1.3 0 1 1 1.4 1 0 0 1.5 1 0 1 1.6 1 1 0 1.7 1 1 1 1.8 If needed, the polarity of the sensor bridge gain can be reversed by setting the Gain_Polarity bit in the BM_config register (see section 2.4.2). Changing the gain polarity is achieved by inverting the chopper clock. Table 2.3 gives the settings for the Gain_Polarity bit. This feature enables to apply a sensor to the ZSSC3016 with swapped input signals at INN and INP e.g., to avoid crossing wires for the final sensor module’s assembly. Table 2.3 Gain Polarity Gain_Polarity Bit Gain Setting Description 0 +1 No polarity change. 1 -1 Gain polarity is inverted. The inherent amplifier offset is suppressed by means of auto zero and chopper techniques. The most appropriate gain and offset setup for a specific sensor element can be determined by these steps: 1) Collect the sensor element’s characteristic, statistical data (over temperature, ambient sensor parameter and over production tolerances): a. Minimum differential output voltage: Vmin b. Maximum differential output voltage: Vmax Remark: The best possible setup can only be determined if the absolute value of V max is bigger than the absolute value of Vmin. If this is not the case, the gain polarity should be swapped. 2) If Vmin and Vmax have different signs (normally: Vmax is positive and Vmin is negative), then the required ADC offset shift can be selected using the ratio: RatioOffset = |Vmin| / (Vmax – Vmin) Then, the respective offset setup (A2D_offset) is the nearest integer of multiples of 1/16 in the range of th 1/16 to 8/16 (cp. Table 2.7): A2D_offset = Round_to_x16 {RatioOffset}. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 13 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 3) One of the two following cases is valid. a. If RatioOffset – A2D_offset ≤ 0 then calculate theoretical optimum gain: Gainopt =(1 – A2D_offset) · Vref / Vmax b. If RatioOffset – A2D_offset > 0 then calculate theoretical optimum gain: Gainopt = A2D_offset · Vref / |Vmin| with: Vref = Vrefp – Vrefn = 0.94·VDDB,min ~ 1.5V 4) Select the setup gain (Gainsetup) as the nearest gain to Gainopt, where Gainsetup ≤ Gainopt. 2.3.2. Analog-to-Digital Converter A second-order charge-balancing analog-to-digital converter (ADC) is used to convert the amplifier signal. To allow optimizing the trade-off between conversion time and resolution, the conversion is split into a MSB coarse conversion and an LSB fine conversion. The MSB-LSB segmentation is programmable via the Msb and Lsb settings in the BM_config register stored in the MTP memory (see section 2.4.2). The final ADC resolution is MSB LSB determined by MSB+LSB-1. The conversion time is proportional to 2 +2 . During the MSB coarse MSB conversion, the ADC input signal is sampled and integrated 2 times, resulting in inherit low-pass behavior and noise suppression. Possible settings are listed in Table 2.4. Table 2.4 MSB/LSB Settings Msb Setup Bits in BM_config Number of MSB Coarse Conversion Bits Lsb Setup Bits in BM_config Number of LSB Fine Conversion Bits 00BIN 10 00BIN 0 01BIN 12 01BIN 3 10BIN 14 10BIN 5 11BIN 16 11BIN 7 Useful MSB/LSB setups are with LSB = 0 (MSB-only conversions) or combinations of MSB > LSB with MSB + LSB ≤ 17. Resolutions beyond 16-bit mainly digitize the collected front-end noise and typically do not improve the system performance. MSB/LSB segmentations with LSB > MSB are also not useful because typically the resolution remains the same as with the inverse MSB/LSB segmentation, but the noise performance becomes significantly worse yet the required conversion time stays the same. The ADC conversion times for different MSB/LSB settings are listed in Table 2.5. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 14 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Table 2.5 ADC Conversion Times for a Single A2D Conversion Note: Bold font indicates the preferred settings. MSB [Bit] LSB [Bit] 10 0 1169 12 0 4625 14 0 18449 16 0 73745 10 3 1176 12 3 4632 14 3 18456 10 5 1200 12 5 4656 10 7 1296 Table 2.6 Bridge & Temperature Measurement Conversion Time in s Conversion Times vs. Noise Performance for 16-Bit Fully Signal Conditioned Results (AZBM, BM, AZTM, TM and Digital SSC Correction) Note: Pink shading indicates the default settings for temperature sensor measurement segmentation. † * ADC Segmentation: Temperature Sensor [MSB/LSB] ADC Segmentation: Bridge Sensor [MSB/LSB] Measurement Duration, MEASURE (ACHEX) [ms] 3-sigma Noise for SSC† corrected Output [counts] 10 / 7 10 / 7 5.8 8.6 10 / 7 12 / 5 13.2 6.4 10 / 7 14 / 3 43.0 5.8 10 / 7 16 / 0 164.1 5.6 12 / 5 * 10 / 7 13.2 8.4 12 / 5 * 12 / 5 20.5 6.4 12 / 5 * 14 / 3 50.5 5.6 12 / 5 * 16 / 0 170.3 5.1 14 / 3 10 / 7 43.0 7.6 14 / 3 12 / 5 50.5 5.9 14 / 3 14 / 3 80.7 4.4 Reference noise values obtained with setup: 13.7kOhm sensor bridge, 25°C, Gain=64, ADC-shift=-1/16…15/16, VDD=1.8V . ZMDI-recommendation for temperature sensor measurement’s ADC segmentation. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 15 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC ADC Segmentation: Temperature Sensor [MSB/LSB] ADC Segmentation: Bridge Sensor [MSB/LSB] Measurement Duration, MEASURE (ACHEX) [ms] 3-sigma Noise for SSC† corrected Output [counts] 14 / 3 16 / 0 200.3 4.4 16 / 0 10 / 7 162.6 6.9 16 / 0 12 / 5 170.3 5.4 16 / 0 14 / 3 200.3 4.1 16 / 0 16 / 0 319.5 4.0 The ADC offset is programmable in 8 steps so that the ADC input voltage range can be adapted to the voltage range at the input pins INP and INN. Possible ADC input voltages are shown in Figure 2.2, where VAGND = VDDB/2. The ADC offset is controlled by the A2D_Offset setting in the Measurement Configuration Register (BM_config) in the MTP memory (see section 2.4.2). The ADC offset settings are listed in Table 2.7. Figure 2.2 ADC Offset ADCout 1 VIP, A2D_Offset = 1/16 VIN, A2D_Offset = 1/16 8/16 VIP, A2D_Offset = 8/16 A2D_Offset VIN, A2D_Offset = 8/16 1/16 0 Data Sheet August 27, 2014 Vrefn VAGND Vrefp VIN, VIP © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 16 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Table 2.7 ADC Offset Settings Z2 Z1 Z0 ADC Differential Input Range/Vref Where Vref = Vrefp - Vrefn A2D_Offset 0 0 0 -1/16 to 15/16 1/16 0 0 1 -2/16 to 14/16 2/16 0 1 0 -3/16 to 13/16 3/16 0 1 1 -4/16 to 12/16 4/16 1 0 0 -5/16 to 11/16 5/16 1 0 1 -6/16 to 10/16 6/16 1 1 0 -7/16 to 9/16 7/16 1 1 1 -8/16 to 8/16 8/16 2.3.3. Temperature Measurement The ZSSC3016 provides an internal temperature sensor measurement to allow compensation for temperature effects. See section 1.3 for the temperature sensor resolution. The temperature sensor uses bipolar transistors. Any transistor circuitry mismatch is suppressed by dynamic element matching technique. The temperature output signal is a differential voltage that is adapted by the amplifier for the ADC input. For temperature measurements, the ADC offset and amplifier gain setting are defined by ZMDI. The ADC MSB/LSB segmentation is programmable by the user for optimizing resolution or conversion time (see section 0). Due to offset cancellation, the MSB conversion for temperature measurement is approximately twice as long as for the other measurements (see Table 2.5). 2.3.4. Bridge Supply The ZSSC3016 provides dedicated bridge supply pins VDDB and VSSB. The ADC reference voltages for the sensor bridge measurement are derived from these internal voltages so that bridge supply disturbances are suppressed. The current drive ability of VDDB is limited (see IVDDB in section 1.2). 2.4. 2.4.1. Digital Section Digital Signal Processor (DSP) Core The DSP Core block performs the algorithm for correcting the sensor signal. The resulting coefficients are stored in the MTP memory. When the measurement results are available, the "end of conversion" signal is set at the EOC pin. The internal EOC information is valid only if both the measurement and calculation have been completed. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 17 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 2.4.2. MTP Memory The ZSSC3016’s memory is designed with an OTP (one-time programmable) structure. The memory is organized in 4 one-time programmable pages. When data in the currently valid memory page has to be updated, normally a new page must be selected by increasing the page counter and the whole memory content has to be written in it’s updated version. The user has access to a 24 x 16 bit storage area for values such as calibration coefficients. Dedicated calibration values are stored in an area not accessible to the user. An external supply at pin VPP is required for programming the OTP (see VPP in section 1.3). There is no over-write or erase function for the MTP memory. The physical memory function is such that each single bit which has not yet been set to 1 (so, still being 0) can be changed to 1, still. So, it is possible to (partially) re-program an MTP-register, e.g.: Assume MTP-address 11HEX was written with 8421HEX which is 1000 0100 0010 0001binary. Due to whatever reason there would be the need to change the register content to A6A7 HEX which is 1010 0110 1010 0111binary. This can be achieved by either writing A6A7 HEX (any already written bit will be ignored automatically) or just writing the difference to 8421HEX, which is 2286HEX. The content of a re-written register can generally be determined by: content Register = contentold (AND) contentnew. If contentRegister equals contentnew, a re-write is possible – this can logically only be guaranteed for contentold = 0000HEX. Or, in other words, depending on the former and the newly intended MTP-address and register content a re-programming could be possible. 2.4.3. Clock Generator The clock generator provides a 4MHz clock signal. The frequency is trimmed during production test. 2.4.4. Power Supervision The Power Supervision block monitors all power supplies to ensure a defined reset of all digital blocks during power-up or power supply interruptions. 2.4.5. Interface 2 * The ZSSC3016 can communicate with the user’s PC via an SPI or I C™ interface . The interface type is selectable via the voltage level on the SEL pin: SEL = 0 -> SPI Mode 2 SEL = 1 -> I C™ Mode If the SEL pin is not connected, I²C™ communication will be selected (IC-internal pull-up at SEL pin). Further, the SPI-specific pins (like: SS, MISO) do not need to be connected at all for I²C operation. To also provide interface accessibility in Sleep State (all IC features inactive except for the digital interface logic), the interface circuitry is directly supplied by VDD. *. Functional I2C™ interface properties correspond to the NXP I²C™ bus specification Rev. 0.3 (June 2009). Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 18 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 3 Functional Description 3.1. Power Up Specifications for this section are given in sections 1.2 and 1.3. On power-up, the ZSSC3016 communication interface is able to receive the first command after a time t STA1 from when the VDD supply is within operating specifications. The ZSSC3016 can begin the first measurement after a time of tSTA2.from when the VDD supply is operational. The wake up time from Sleep State to Active State after receiving the activating command is defined as tWUP1 and tWUP2. In Command Mode, subsequent commands can be sent after tWUP1. The first measurement starts after tWUP2 if measurement request was sent. 3.2. Measurements Available measurement procedures are AZBM: auto-zero bridge measurement BM: bridge measurement AZTM: auto-zero temperature measurement TM: temperature measurement AZBM: The configuration for bridge measurements is loaded. The Multiplexer connects the Amplifier input to the AGND analog ground reference. An analog-to-digital conversion is performed so that the inherent system offset for the bridge configuration is converted by the ADC to a 16-bit digital word. BM: The configuration for bridge measurements is loaded. The Multiplexer connects the Amplifier input to the bridge pins: INP and INN. An analog-to-digital conversion is performed. The result is a 16-bit digital word. AZTM: The configuration for temperature measurements is loaded. The Multiplexer connects the Amplifier input to AGND. An analog-to-digital conversion is performed so that the inherent system offset for the temperature configuration is converted by the ADC to a 16-bit digital word. TM: The configuration for temperature measurements is loaded. The Multiplexer connects the Amplifier input to the internal temperature sensor. An analog-to-digital conversion is performed. The result is a 16-bit digital word. The typical application’s measurement cycle is a complete SSC-measurement (using the command: ACHEX) with AZBM, BM, AZTM, TM followed by a signal correction calculation. 3.3. Operational Modes Figure 3.1 illustrates the ZSSC3016 power-up sequence and subsequent operation depending on the selected 2 interface communication mode (I C™ or SPI). With either interface, after the voltage regulators are switched on, the ZSSC3016’s low voltage section (LV) is active while the related interface configuration information is read from memory. Then the LV section is switched off, the ZSSC3016 goes into Sleep State, and the interface is ready to receive commands. Since the interface is always powered by V DD, it is referred to as the high voltage section (HV). Figure 3.2 shows the ZSSC3016 operation in Normal Mode and Command Mode including when the LV and HV sections are active as indicated by the color legend. The Normal Mode automatically returns to Sleep State after executing the requested measurements. In Command Mode, the ZSSC3016 remains active if a dedicated command (Start_NOM) was sent, which is helpful during calibration. Command Mode can only be entered if Start_CM is the very first command after POR. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 19 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Figure 3.1 Operational Flow Chart: Power up IC Power On I2C - Interface SPI - Interface yes (I2C) SEL==1 no (SPI) Switch off pull-up at SEL Power up LV „power up LV“ Data/Status from LV Save IC-ID/Data/Status LV operation Data/Status from LV LV operation Save Setup/Data/Status Command Mode ==Active no yes Command Mode == Active no Power down (switch off LV and wait for command) no yes no Power down (switch off LV and wait for command) Receive command Received CMD ID == IC-ID no no RST(SS)==1 yes yes Read_bit == 1 (Data fetch) Receive command yes Command == NOP Execute Data Fetch yes Color Legend: LV-Operation Data Sheet August 27, 2014 Execute Data Fetch HV-Operation © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 20 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Figure 3.2 Operational Flow Chart: Command Mode and Normal Mode Start LV Get command from HV CM active CMD==Start_CM yes Receive command no INVALID_CMD Case (Command) Start_NOM Case (Command) CM inactive INVALID_CMD Execute command REGULAR_CMD Data/Status from LV Data/Status from LV REGULAR_CMD Execute command Color Legend: LV-Operation End LV HV-Operation Normal Mode Data Sheet August 27, 2014 Command Mode © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 21 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 3.4. Command Interpretation 3.4.1. 2 SPI/I C™ Commands The user-accessible section of memory includes addresses 00HEX through 17HEX in the OTP memory that is designated by the user memory page pointer. Because each of the four OTP memory pages cannot be rewritten or erased, the memory page pointer must be incremented to the next OTP memory page in order to write to memory again (see Table 3.1 for the command). After all four user-accessible OTP memory pages have been used, further write operations are not possible and the “Memory Full” bit is returned as set in the status byte after write operations (see section 3.5.1). 2 The SPI/I C™ commands supported by the ZSSC3016 are listed in Table 3.1. The command to read an address in the user memory is the same as its address. The command to read the 16-bit memory status of the data at an address in user memory is the address plus 20HEX. The command to write to an address in user memory is the address plus 40HEX. There is a ZMDI-reserved section of memory, which can be read but not over-written by the user. Table 3.1 2 SPI/I C™ Commands Command (Byte) Normal Mode Command Mode Read data in user memory address matching command (addresses 00HEX to 17HEX; might not be using all addresses). yes yes 16-bit user memory status Read memory status for address specified by command minus 20HEX (addresses 00HEX to 17HEX respectively; see section 3.6.2 for a description of the memory status). yes yes 40HEX to 57HEX + data (0000HEX to FFFFHEX) — Write data to user memory at address specified by command minus 40HEX (addresses 00HEX to 17HEX respectively; might not be using all addresses). no yes 70HEX to 7EHEX 16-bit ZMDI-reserved memory data Read data in ZMDI-reserved memory at address specified by command minus 70HEX nd (2 set of addresses 00HEX to 0EHEX respectively). no yes 16-bit ZMDI-reserved memory status Read memory status bytes for ZMDIreserved memory data at address specified nd by command minus 80HEX (2 set of addresses 00HEX to 0EHEX respectively; see section 3.6.2 for a description of the memory status bytes). no yes Increment user memory page pointer. no yes 00HEX to 17HEX 20HEX to 37HEX 80HEX to 8EHEX 5EHEX * Returns 16-bit user data — Description * Every response starts with a status byte followed by the data word as described in section 3.5.1. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 22 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Command (Byte) A0HEX to A7HEX + XXXXHEX 16-bit wide raw data (see Table 3.2) A8HEX Description Normal Mode Command Mode Get_Raw This command can be used to perform a measurement and write the raw ADC data into the output register. The LSB of the command determines how the AFE configuration register is loaded for the Get_Raw measurement (see Table 3.2). yes yes Start_NOM Exit Command Mode and transition to Normal Mode. When a Start_NOM command is executed, a flag is checked to see if the user or ZMDI-reserved memory page was programmed during Command Mode without having written the memory check sum. If so, the device will set “ChecksumC/Z_Flag:=0” (see section 3.5.1). no yes yes no no yes * Returns — A9HEX — Start_CM Exit Normal transition to Command Mode. AAHEX — Write_ChecksumC If not yet written, the checksum for the valid user MTP page is calculated and written to MTP. The VPP voltage must be applied before, during, and after this command. Mode and ChecksumC_Flag is set to 1 afterwards. If the VPP voltage is NOT available and the write fails, the CheckSumC_Flag remains 0. ACHEX FXHEX Data Sheet August 27, 2014 16-bit fully corrected bridge measurement data + 16-bit corrected internal temperature Measure Triggers full measurement cycle (AZBM, BM, AZTM, TM, as described in section 3.2) and calculation and storage of data in interface (configurations from MTP). yes yes Status + last data NOP yes yes Only valid for SPI (see section 3.5.1). © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 23 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Table 3.2 Get_Raw Commands Command Measurement AFE Configuration Register A0HEX + 0000HEX BM – Bridge Measurement BM_Config A1HEX + ssssHEX BM – Bridge Measurement ssss is the user’s configuration setting for the measurement provided via the interface. The format and purpose of configuration bits must be equal to the definitions for BM_Config. A2HEX + 0000HEX BM-AZBM – Auto-Zero 1) Measurement corrected Bridge A3HEX + ssssHEX BM-AZBM – Auto-Zero 2) Measurement corrected Bridge A4HEX + 0000HEX TM – Temperature Measurement ZMDI-defined register A5HEX + ssssHEX TM – Temperature Measurement ssss is the user’s configuration setting for the measurement provided via the interface. The format and purpose of configuration bits must be equal to the definitions for BM_Config being valid for temperature measurement in this case (bits [15:13] will be ignored). A6HEX + 0000HEX TM-AZTM – Auto-Zero corrected Temperature 1) Measurement A7HEX + ssssHEX TM-AZTM – Auto-Zero corrected Temperature 2) Measurement BM_Config ssss is the user’s configuration setting for the measurement provided via the interface. The format and purpose of configuration bits must be equal to the definitions for BM_Config. ZMDI-defined register ssss is the user’s configuration setting for the measurement provided via the interface. The format and purpose of configuration bits must be equal to the definitions for BM_Config being valid for temperature measurement in this case (bits [15:13] will be ignored). 1) Recommended for raw data collection during calibration coefficient determination using pre-programmed (in MTP) measurement setups 2) Recommended for raw data collection during calibration coefficient determination using un-programmed (not in MTP), external measurement setups, e.g. for evaluation purposes 3.5. Communication Interface 3.5.1. Common Functionality Commands are handled by the command interpreter in the LV section. Commands that need additional data are not treated differently than other commands because the HV interface is able to buffer the command and all data that belongs to the command and the command interpreter is activated as soon as a command byte is received. Every response starts with a status byte followed by the data word. The data word depends on the previous 2 command. It is possible to read the same data more than once if the read request is repeated (I C™) or a NOP command is sent (SPI). If the next command is not a read request (I²C™) or a NOP (SPI), it invalidates any previous data. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 24 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC The status byte contains the following bits (see Table 3.3, Table 3.4, and Table 3.5 for sequence): Power indication (bit 6): 1 if the device is powered (VDDB on); 0 if not powered. This is needed for SPI Mode where the master reads all zeros if the device is not powered or in power-on reset (POR). Busy indication (bit 5): 1 if the device is busy, which indicates that the data for the last command is not available yet. No new commands are processed if the device is busy. Actual ZSSC3016 mode (bits 4:3): 00 = Normal Mode; 01 = Command Mode; 10 = ZMDI-reserved. Memory integrity/error flag (bit 2): 0 if integrity test passed, 1 if test failed. This bit indicates whether the checksum-based integrity check passed or failed. Correctable errors are not reported but can be queried with the memory status commands (see section 3.6.2). The memory error status bit is calculated only during the power-up sequence, so a newly written CRC will only be used for memory verification and status update after a subsequent IC power-on reset (POR). Data transfer/correction (bit 1): If the last command was a memory write, this bit is 0 if the last memory write was successful (memory not full yet), otherwise it is 1 (e.g. page increase but being already on last MTP page). If the last command was a memory read, this bit is 1 if the data was corrected. Table 3.3 General Status Byte Bit 7 6 5 Meaning 0 Powered? Busy? Table 3.4 7 6 5 Meaning 0 Powered? Busy? Mode 2 1 0 Memory error? Data transfer Special 4 3 2 1 0 Mode Memory error? Data corrected? ALU saturation? Status Byte for Write Operations Bit 7 6 5 Meaning 0 Powered? Busy? Table 3.6 3 Status Byte for Read Operations Bit Table 3.5 4 4 3 Mode 2 Memory error? 1 Memory full? MTP write reject? 0 Don’t care Mode Status Status[4:3] Mode 00 Normal Mode 01 Command Mode 10 ZMDI-Reserved 11 Command Mode and Reserved The memory error status bit is only calculated during the power-up sequence, so a newly written CRC will only be used for memory verification after a subsequent power-on reset (POR). Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 25 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC There are two independent checksum flags: Checksum_C_Flag for the user memory page(s) and Checksum_Z _Flag for ZMDI-reserved page(s). The code assignment for both flags is 0 indicates the checksum (for the ZMDI/user page) has not been successfully written yet; the checksum still needs to be written. 1 indicates the checksum (for the ZMDI/user page) has successfully been written. Further status information are provided by the EOC pin. The EOC pin is set high when a measurement and calculation have been completed. 3.5.2. SPI The SPI Mode is available when the SEL pin = 0. The polarity (controlled by CPOL bit) and the phase (controlled by CPHA bit) of the SPI clock (CKP_CKE) and the polarity of the SS signal (SS_polarity) are programmable as described in Table 3.8. CKP_CKE is two bits: CPHA, which selects which edge of SCLK latches data, and CPOL which indicates whether SCLK is high or low when it is idle. The different combinations of polarity and phase are illustrated in the figures below. Figure 3.3 SPI configuration CPHA=0 CPHA=0 SCLK (CPOL=0) SCLK (CPOL=1) MOSI MSB Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB MISO MSB Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB /SS SAMPLE Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 26 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Figure 3.4 SPI Configuration CPHA=1 CPHA=1 SCLK (CPOL=0) SCLK (CPOL=1) MOSI MSB Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB MISO MSB Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB /SS SAMPLE In SPI mode, each command except NOP is started as shown in Figure 3.5. After the execution of a command (busy = 0), the expected data can be read as illustrated in Figure 3.6 or if no data are returned by the command, the next command can be send. The status can be read at any time with the NOP command (see Figure 3.7 Figure 3.5 SPI Command Request Command Request MOSI Command other than NOP CmdDat <15:8> CmdDat <7:0> MISO Status Data Data Note: A command request always consists of 3 bytes. If the command is shorter, then it must be completed with 0s. The data on MISO depend on the preceding command. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 27 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Figure 3.6 SPI Read Status Read Status MOSI Command = NOP MISO Status Figure 3.7 SPI Read Data Read Data (a) Example: after the completion of a Memory Read command MOSI Command = NOP 00HEX 00HEX MISO Status MemDat <15:8> MemDat <7:0> (b) Example: after the completion of a Full Measurement command (ACHEX) 3.5.3. MOSI Command = NOP 00HEX 00HEX 00HEX 00HEX MISO Status BridgeDat <15:8> BridgeDat <7:0> TempDat <15:8> TempDat <7:0> 2 I C™ 2 2 I C™ Mode is selected by SEL = 1. In I C™ Mode, each command is started as shown in figure x.1. Only the number of bytes that is needed for the command has to be sent. An exception is the HS-mode where always 3 Bytes must be sent like in SPI mode. After the execution of a command (busy = 0) the expected data can be read as illustrated in Figure 3.10 or if no data are returned by the command the next command can be sent. The status can be read at any time as described in Figure 3.9. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 28 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 2 Figure 3.8 I C™ Command Request Command Request (I2C Write) S SlaveAddr from master to slave S START condition from slave to master P STOP condition A acknowledge N not acknowledge 0 A Command A P write S SlaveAddr 0 A Command A CmdDat <15:8> A CmdDat <7:0> A P write Figure 3.9 2 I C™ Read Status Read Status (I2C Read) S SlaveAddr 1 A Status N P read Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 29 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 2 Figure 3.10 I C™ Read Data Read Data (I2C Read) (a) Example: after the completion of a Memory Read command S SlaveAddr 1 A Status A MemDat <15:8> A MemDat <7:0> N P read (b) Example: after the completion of a Full Measurement command (ACHEX) S SlaveAddr 1 A Status A BridgeDat <15:8> A BridgeDat <7:0> A TempDat <15:8> A TempDat <7:0> N P read All mandatory I²C™ bus protocol features are implemented. Optional features like clock stretching, 10-bit slave address, etc., are not supported by the ZSSC3016’s interface. In I²C™ High Speed Mode, a command consists of a fixed length of three bytes. 3.6. Memory In the ZSSC3016, the memory is organized page-wise and can be programmed multiple (4) times (MTP). The MTP is organized in pages. Each register can only be programmed once per page. The valid page is determined by the page counter which can be incremented with the command 5E HEX – this leads to a reset of all registers and a re-programming is necessary. Increasing the customer page counter will disable all old register contents of the former page. It is possible to (re-)program 4 pages totally. Resetting the page counter is not possible. The page th counter starts with 0 and can become 3 at maximum. If the 4 memory page has been used, no further changes in the memory are possible – careful writing and page incrementing is strongly recommended. There are two MTP page types: 3.6.1. Customer Page: Accessible by means of regular write operations (40HEX to 57HEX). It contains: IC-ID, interface setup data, measurement setup information, calibration coefficients, etc. ZMDI Page: Only accessible for write operations by ZMDI. The ZMDI page contains specific trim information and is programmed during manufacturing test by ZMDI. Programming Memory Programming memory requires a supply voltage VPP at the VPP pin (see section 1.3 for specifications). The program timing is shown in Figure 3.11. Supplying the ZSSC3016 with VDD>1.8V during memory programming is recommended. After the memory is programmed, it must be read again to verify the validity of the memory content. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 30 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Figure 3.11 Memory Program Operation command Start_CM MemWr VPP 3.6.2. MemWr tVPP MemWr MemRd tVPP MemWr memory write customer address MemRd memory read customer address Memory Status Commands The 16-bit memory status answer for the commands: 20HEX to 37HEX and 80HEX to 8EHEX contains the following information: One bit indicating if the data read was corrected. Two bits indicating the current page in use. One bit indicating if the respective page’s CRC has already been written properly (including having had sufficient programming voltage applied to the VPP pin during the CRC write operation) Table 3.7 Memory Status Word Bit 15 (MSB) 14 13 12 11:0 Data Sheet August 27, 2014 Description Data was corrected (0: no, 1: yes) Current page CRC not yet written (Checksum_C_Flag for user page register or Checksum_Z_Flag for ZMDI page’s register) Undefined – do not use © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 31 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 3.6.3. Memory Contents Table 3.8 MTP Memory Content Assignments. MTP Address Word / Bit Range Default Setting Description Notes / Explanations 00HEX 15:0 0000HEX Cust_ID0 Customer ID byte 0 (combines with memory word 01HEX to form customer ID) 01HEX 15:0 0000HEX Cust_ID1 Customer ID byte 1 (combines with memory word 00HEX to form customer ID) Slave_Addr I²C slave address; valid range: 00HEX to 7FHEX (default: 00HEX), Remark: address codes 04HEX to 2 07HEX reserved for entering I C™ High Speed Mode - Reserved Interface Configuration 6:0 000 0000BI N 8:7 00BIN Determines the polarity of the Slave Select pin (SS) for SPI operation: 9 0BIN SS_polarity Clock polarity and clock-edge select—determines polarity and phase of SPI interface clock with the following modes: 02HEX 11:10 00BIN CKP_CKE 15:12 Data Sheet August 27, 2014 0 Slave Select is active low (SPI & ZSSC3016 are active if SS==0) 1 Slave Select is active high (SPI & ZSSC3016 are active if SS==1) - 00 SCLK is low in idle state, data latch with rising edge and data output with falling edge 01 SCLK is low in idle state, data latch with falling edge and data output with rising edge 10 SCLK is high in idle state, data latch with falling edge and data output with rising edge 11 SCLK is high in idle state, data latch with rising edge and data output with falling edge Not assigned © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 32 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC MTP Address Word / Bit Range Default Setting Description Notes / Explanations Signal Conditioning Parameters 0 0BIN Offset_B[16] Bridge offset, bit[16]—functions as the MSB and combines with Offset_B[15:0] in 05HEX to form the 17-bit coefficient’s absolute value 1 0BIN Offset_B_sign Sign for sensor bridge offset (Offset_B): 0 => a positive value or 1 => a negative value 2 0BIN Gain_B[16] Bridge gain, bit[16] —functions as the MSB and combines with Gain_B[15:0] in 06HEX to form the 17bit coefficient’s absolute value 3 0BIN Gain_B_sign Sign of the sensor bridge gain (Gain_B): 0 => a positive value or 1 => a negative value Tcg[16] 1 -order temperature coefficient of the bridge gain, bit[16] —functions as the MSB and combines with Tcg[15:0] in 07HEX to form 17-bit coefficient’s absolute value Tcg_sign Sign off 1 -order temperature coefficient (Tcg): 0 => a positive value or 1 => a negative value Tco[16] 1 -order temperature coefficient of the bridge offset, bit[16] —functions as the MSB and combines with Tco[15:0] in 08HEX to form 17bit coefficient’s absolute value Tco_sign Sign of 1 -order temperature coefficient (Tco): 0 => a positive value or 1 => a negative value SOT_tco[16] 2 -order temperature coefficient of the bridge offset, bit[16] —functions as the MSB and combines with SOT_tco[15:0] in 09HEX to form 17-bit coefficient’s absolute value SOT_tco_sign Separate setting if 2 -order temperature coefficient (SOT_tco) is: 0 => a positive value or 1 => a negative value SOT_tcg[16] 2 -order temperature coefficient of the bridge gain, bit[16] —functions as the MSB and combines with SOT_tcg[15:0] in 0AHEX to form 17-bit coefficient’s absolute value SOT_tcg_sign Separate setting (sign) if 2 -order temperature coefficient (SOT_tcg) is: 0 => a positive value or 1 => a negative value st 4 0BIN st 5 0BIN st 03HEX 6 0BIN st 7 0BIN nd 8 0BIN nd 9 0BIN nd 10 0BIN nd 11 Data Sheet August 27, 2014 0BIN © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 33 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC MTP Address Word / Bit Range Default Setting Description Notes / Explanations nd 12 0BIN SOT_bridge[16] 2 -order coefficient of the bridge signal, bit[16] — functions as the MSB and combines with SOT_bridge[15:0] in 0BHEX to form 17-bit coefficient’s absolute value SOT_bridge_sign Separate setting if 2 -order bridge coefficient (SOT_bridge) is 0 => a positive value or 1 => a negative value nd 13 0BIN Type of second order curve correction for the bridge sensor signal. 14 0BIN SOT_curve 15 0BIN TSETL_sign Separate setting T_SETL is 0 => a positive value or 1 => a negative value 0 parabolic curve 1 s-shaped curve 0 0BIN Gain_T[16] Temperature gain of temperature sensor, bit[16] functions as the MSB and combines with Gain_T[15:0] in 0DHEX to form 17-bit coefficient’s absolute value 1 0BIN Gain_T_sign Separate setting if the temperature gain (Gain_T) is: 0 => a positive value or 1 => a negative value SOT_T[16] 2 -order temperature coefficient of temp. sensor, bit[16] functions as the MSB and combines with SOT_T[15:0] in 0EHEX to form 17-bit coefficient’s absolute value nd 2 0BIN nd 3 0BIN SOT_T_sign Separate setting if 2 -order temperature coefficient (SOT_T) is 0 => a positive value or 1 => a negative value 4 0BIN Offset_T[16] Temperature offset of temp. sensor, bit[16] functions as the MSB and combines with Offset_T[15:0] in 0CHEX to form 17-bit coefficient’s absolute value 04HEX Data Sheet August 27, 2014 5 0BIN Offset_T_sign Separate setting if the temperature offset (Offset_T) is 0 => a positive value or 1 => a negative value 15:6 0 0000 000 0BIN - Not assigned © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 34 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC MTP Address Word / Bit Range Default Setting Description Notes / Explanations Bits [15:0] of the bridge offset correction coefficient, which is an 18-bit wide absolute value (the respective MSBs Offset_B[16] and sign, Offset_B_sign, are under bits[1:0] in 03HEX) 05HEX 15:0 0000HEX (7000HEX) Offset_B[15:0] [-1/16 to 15/16] = 7000HEX (default for volume) [-2/16 to 14/16] = 6000HEX [-3/16 to 13/16] = 5000HEX [-4/16 to 12/16] = 4000HEX [-5/16 to 11/16] = 3000HEX [-6/16 to 10/16] = 2000HEX [-7/16 to 9/16] = 1000HEX [-8/16 to 8/16] = 0000HEX (default for prototypes) Gain_B[15:0] Bits[15:0] of 17-bit wide absolute value of the bridge gain coefficient (default for prototypes: 0000HEX; default for volume production: 8000HEX—the respective MSBs, Gain_B[16] and sign, Gain_B_sign, are under bits[3:2] in 03HEX) 0000HEX Tcg[15:0] Coefficient for temperature correction of the bridge gain term – the respective MSBs, Tcg[16] and sign, Tcg_sign, are under (bits[5:4] in 03HEX) 15:0 0000HEX Tco[15:0] Coefficient for temperature correction of the bridge offset term – the respective MSBs, Tco[16] and sign, Tco_sign, are under (bits[7:6] in 03HEX) 15:0 0000HEX SOT_tco[15:0] 2 order term applied to Tco – the respective MSBs, SOT_tco[16] and sign, SOT_tco_sign, are under (bits[9:8] in 03HEX) SOT_tcg[15:0] 2 order term applied to Tcg. – the respective MSBs, SOT_tcg[16] and sign, SOT_tcg_sign, are under (bits[11:10] in 03HEX) SOT_bridge[15:0] 2 order term applied to the sensor bridge readout – the respective MSBs, SOT_bridge[16] and sign, SOT_bridge_sign are under (bits[13:12] in 03HEX) 06HEX 15:0 07HEX 15:0 08HEX 09HEX 0000HEX (8000HEX) nd nd 0AHEX 15:0 0000HEX nd 0BHEX 15:0 0000HEX Bits [15:0] of the temperature offset correction coefficient (the respective MSBs, Offset_T[16] and sign, Offset_T_sign, are under (bits[5:4] in 04HEX) 0CHEX Data Sheet August 27, 2014 15:0 0000HEX (7000HEX) Offset_T[15:0] [-1/16 to 15/16] = 7000HEX (default for volume) [-2/16 to 14/16] = 6000HEX [-3/16 to 13/16] = 5000HEX [-4/16 to 12/16] = 4000HEX [-5/16 to 11/16] = 3000HEX [-6/16 to 10/16] = 2000HEX [-7/16 to 9/16] = 1000HEX [-8/16 to 8/16] = 0000HEX (default for prototypes) © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 35 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC MTP Address 0DHEX Word / Bit Range 15:0 Default Setting 0000HEX (8000HEX) Description Notes / Explanations Gain_T[15:0] Bits [15:0] of the absolute value of the temperature gain coefficient (default for prototypes: 0000HEX; default for volume production: 8000HEX — the respective MSBs, Gain_T[16] and sign, Gain_T_sign, are under bits[1:0] in 04HEX) nd 0EHEX 15:0 0000HEX SOT_T[15:0] 2 order term applied to the temperature reading – the respective MSBs, SOT_T[16] and sign, SOT_T_sign, are under (bits[3:2] in 04HEX) 0FHEX 15:0 0000HEX T_SETL Stores raw temperature reading at the temperature at which low calibration points were taken Measurement Configuration Register (BM_config) st Gain setting for the 1 PREÀMP stage with Gain_stage1: 1:0 00BIN Gain_stage1 00 12 01 20 10 30 11 40 Gain setting for the 2 Gain_stage2: 4:2 000BIN Gain_stage2 10HEX nd PREAMP stage with 000 1.1 001 1.2 010 1.3 011 1.4 100 1.5 101 1.6 110 1.7 111 1.8 Set up the polarity of the sensor bridge’s gain (inverting of the chopper) with 5 0BIN Gain_polarity 0 positive (no polarity change) 1 negative (180° polarity change ) Absolute number of bits for the MSB conversion in the ADC with Msb: 7:6 00BIN (11BIN) Msb Data Sheet August 27, 2014 00 10-bit 01 12-bit 10 14-bit 11 16-bit © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 36 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC MTP Address Word / Bit Range Default Setting Description Notes / Explanations Absolute number of bits for the MSB conversion in the ADC with Lsb: 9:8 00BIN Lsb 00 0-bit (single stage CB_ADC) 01 3-bit 10 5-bit 11 7-bit ADC offset and resulting A2D input range [Vref] with A2D_Offset: 12:10 000BIN A2D_Offset 000 1/16 results in range [-1/16, 15/16] 001 2/16 results in range [-2/16, 14/16 010 3/16 results in range [-3/16, 13/16] 011 4/16 results in range [-4/16, 12/16] 100 5/16 results in range [-5/16, 11/16] 101 6/16 results in range [-6/16, 10/16] 110 7/16 results in range [-7/16, 9/16] 111 8/16 results in range [-8/16, 8/16] Selection between fixed ADC segmentations for temperature measurements: 14:13 00BIN Temp_ADC 15 0BIN - 00 setup according to ZMDI-reserved memory (recommended setup for best performance and speed trade-off) 01 MSB=16, LSB=0 (16-bit) 10 MSB=10, LSB=7 (16-bit) 11 MSB=12, LSB=5 (16-bit) Reserved 11HEX Not assigned 12HEX Not assigned 13HEX Not assigned 14HEX Not assigned 15HEX Not assigned 16HEX Not assigned 17HEX Generated (checksum) for user page through a linear feedback shift register (LFSR); signature is checked with power-up to ensure memory content integrity Data Sheet August 27, 2014 15:0 - ChecksumC © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 37 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 3.7. Calibration Sequence Calibration essentially involves collecting raw signal and temperature data from the sensor-IC system for different known bridge values and temperatures. This raw data can then be processed by the calibration master (assumed to be a PC), and the calculated calibration coefficients can then be written to MTP memory. Below is a brief overview of the steps involved in calibrating the ZSSC3016. There are three main steps to calibration: 1. Assigning a unique identification to the ZSSC3016. This identification is written to shadow RAM and later programmed in MTP memory. This unique identification can be stored in the two 16-bit registers dedicated to customer ID. It can be used as an index into a database stored on the calibration PC. This database will contain all the raw values of bridge readings and temperature readings for that part, as well as the known bridge measurand conditions and temperature to which the bridge was exposed. 2. Data collection. Data collection involves getting uncorrected or raw data from the bridge at different known measurand values and temperatures. Then this data is stored on the calibration PC using the unique identification of the device as the index to the database. 3. Coefficient calculation and storage in MTP memory. After enough data points have been collected to calculate all the desired coefficients, the coefficients can be calculated by the calibrating PC and written to the shadow RAM. After that, MTP memory is programmed with the contents of the shadow RAM. 4. Result. The sensor signal and the characteristic temperature effect on output will be linearized according to the setup-dependent maximum output range. It is essential to perform the calibration with a fixed programming setup during the data collection phase. In order to prevent any accidental misprocessing, it is further recommended to keep the MTP memory setup stable during the whole calibration process as well as in the subsequent operation. A ZSSC3016 calibration only fits the single setup used during its calibration. Changes of functional parameters after a successful calibration can decrease the precision and accuracy performance of the ZSSC3016 as well as of the whole application. 3.7.1. Calibration Step 1 – Assigning Unique Identification Assign a unique identification number to the ZSSC3016 by using the memory write command (40HEX + data and 41HEX + data; see Table 3.1 and Table 3.8) to write the identification number to Cust_ID0 at memory address 00HEX and Cust_ID1 at address 01HEX as described in section 3.6.1. These two 16-bit registers allow for more than 4 trillion unique devices. 3.7.2. Calibration Step 2 – Data Collection The number of unique points (measurand and/or temperature) at which calibration must be performed generally depends on the requirements of the application and the behavior of the resistive bridge in use. The minimum number of points required is equal to the number of bridge coefficients to be corrected with a minimum of three different temperatures at three different bridge values. For a full calibration resulting in values for all 7 possible bridge coefficients and 3 possible temperature coefficients, a minimum of 7 pairs of bridge with temperature measurements must be collected. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 38 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Within this minimum 3x3 measurements field, data must be collected for the specific value pairs (at known conditions) and then processed to calculate the coefficients. In order to obtain the potentially best and most robust coefficients, it is recommended that measurement pairs (temperature vs. pressure) be collected at the outer corners of the intended operation range or at least at points which are located far from each other. It is also essential to provide highly precise reference values as nominal, expected values. The measurement precision of the external calibration-measurement equipment should be ten times more accurate than the expected ZSSC3016 output precision after calibration in order to avoid precision losses caused by the nominal reference values (e.g., pressure signal and temperature deviations). Note: An appropriate selection of measurement pairs can significantly improve the overall system performance. The determination of the measurand-related coefficients will use all of the measurement pairs. For the temperature-related correction coefficients, 3 (at three different temperatures) of the e.g. 7 measurement pairs will be used. Note: There is an inherent redundancy in the 7 bridge-related and 3 temperature-related coefficients. Since the temperature is a necessary output (which also needs correction), the temperature-related information is mathematically separated, which supports faster and more efficient DSP calculations during the normal usage of the sensor-IC system. The recommended approach for data collection is to make use of the raw-measurement commands: 3.7.3. For bridge sensor values: A2HEX + 0000HEX: Single bridge measurement for which the configuration register will be loaded from the BM_Config register (10HEX in MTP); preprogramming the measurement setup in the MTP is required. A3HEX + ssssHEX: Single bridge measurement for which `the BM_Config configuration register (Gain, ADC, Offset, etc.) will be loaded as ssssHEX and must be provided externally via the interface. For temperature values A6HEX + 0000HEX: Single temperature measurement for which the configuration register will be loaded from an internal temperature configuration register (preprogrammed by ZMDI in MTP); preprogramming of the respective configuration is done by ZMDI prior to IC delivery. This is the recommended approach for temperature data collection. A7HEX + ssssHEX: Single temperature measurement for which the configuration register (Gain, ADC, Offset, etc.) will be loaded as ssssHEX and must be provided externally via the interface. The data composition of the temperature configuration register is similar to the BM_config (address 10HEX) register for the bridge sensor. Calibration Step 3 – Coefficient Calculations The math to perform the coefficient calculation is complicated and will not be discussed in detail. There is a brief overview in the next section. ZMDI will provide software (DLLs) to perform the coefficient calculation (external to the sensor-IC system) based on auto-zero corrected values. After the coefficients are calculated, the final step is to write them to the MTP memory of the ZSSC3016. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 39 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 3.8. The Calibration Math 3.8.1. Bridge Signal Compensation The saturation check in the ZSSC3016 is enhanced compared with older SSCs from ZMDI. Even saturation effects of the internal calculation steps are detected, even though the final correction output will still be determined. It is possible to get seemingly useful signal conditioning results which have seen an intermediate saturation during the calculations – these cases are detectable by observing the status bit[0] for each measurement result. Details about the saturation limits and the valid ranges for values are provided in the following equations. SOT_curve selects whether second-order equations compensate for sensor nonlinearity with a parabolic or S-shaped curve. The parabolic compensation is recommended. The correction formula for the differential signal reading is represented as a two-step process depending on the SOT_curve setting. Equations for the parabolic SOT_curve setting (SOT_curve = 0): Simplified: T T _ Raw TSETL (5) T SOT _ tcg T Tcg 15 15 2 2 T SOT _ tco K 2 Offset _ B BR _ Raw 15 T Tco 2 215 Gain _ B K1 15 (delimited to positive number range) Z BP 15 K 2 2 215 2 Z BP SOT _ bridge (delimited to positive number range) B 15 Z BP 215 2 215 K1 215 (6) (7) (8) (9) Complete: T T _ Raw TSETL 217 217 1 (10) 2 1 17 2 1 217 1 217 1 15 T SOT _ tcg K1 2 15 T Tcg 2 215 217 217 217 217 17 T K 2 Offset _ B BR _ Raw 15 2 Data Sheet August 27, 2014 (11) 2 1 17 2 1 SOT _ tco T Tco 15 17 2 2 17 2 17 217 1 217 217 1 217 217 1 217 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. (12) 40 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 17 Z BP 217 1 2 1 217 1 Gain _ B K1 15 K 2 215 2 17 215 2 17 2 0 Z BP B 15 2 217 1 2 1 SOT _ bridge 15 Z 2 BP 215 217 17 2 17 (13) 216 1 0 (14) Equations for the S-shaped SOT_curve setting (SOT_curve = 1): Simplified: Gain _ B K1 Z BS 15 K 2 215 2 B (15) Z BS SOT _ bridge Z BS 215 215 15 15 2 2 (delimited to positive number range) (16) Complete: 17 Z BS 217 1 2 1 Gain _ B K 1 K 15 215 2 17 2 17 2 2 Z BS B 15 2 (17) 217 1 2 1 SOT _ bridge 15 Z 2 BS 17 215 2 17 2 216 2 1 215 217 0 17 17 (18) Where 2 B = Corrected bridge reading output via I C™ or SPI; range [0HEX .. FFFFHEX]; BR_Raw = Raw bridge reading from ADC after AZ correction; range [-1FFFFHEX .. 1FFFFHEX]; Gain_B = Bridge gain term; range [-1FFFFHEX .. 1FFFFHEX]; Offset_B = Bridge offset term; range [-1FFFFHEX .. 1FFFFHEX]; Tcg = Temperature coefficient gain term; range [-1FFFFHEX .. 1FFFFHEX]; Tco = Temperature coefficient offset term; range [-1FFFFHEX .. 1FFFFHEX]; T_Raw = Raw temperature reading after AZ correction; range [-1FFFFHEX .. 1FFFFHEX]; TSETL = T_Raw reading at which low calibration was performed (e.g. 25°C); range [-FFFFHEX .. FFFFHEX]; SOT_tcg = Second-order term for Tcg non-linearity; range [-1FFFFHEX .. 1FFFFHEX]; SOT_tco = Second-order term for Tco non-linearity; range [-1FFFFHEX .. 1FFFFHEX]; SOT_bridge = Data Sheet August 27, 2014 Second-order term for bridge non-linearity; range [-1FFFFHEX .. 1FFFFHEX]; © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 41 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC = absolute value; ulll = bound/saturation number range from ll to ul, over/under-flow is reported as saturation in status byte. 3.8.2. Temperature Signal Compensation Temperature is measured internally. Temperature correction contains both linear gain and offset terms as well as a second-order term to correct for any nonlinearities. For temperature, second-order compensation for nonlinearity is always parabolic. Again, the correction formula is best represented as a two-step process as follows: Simplified: Gain _ T ZT T _ Raw Offset _ T 215 215 Z SOT _ T T 15T 15 Z T 215 2 2 (delimited to positive number range) (19) (delimited to positive number range) (20) Complete: 217 1 2 1 Gain _ T 217 1 Z T T _ Raw Offset _ T 215 17 2 15 217 2 0 17 216 1 2 1 217 1 Z T SOT _ T 15 T 15 15 Z T 2 2 2 17 17 2 2 0 17 (21) (22) Where Gain_T = Gain coefficient for temperature; range [-1FFFFHEX .. 1FFFFHEX]; T_Raw = Raw temperature reading after AZ correction; range [-1FFFFHEX .. 1FFFFHEX]; Offset_T = Offset coefficient for temperature; range [-1FFFFHEX .. 1FFFFHEX]; SOT_T = Second-order term for temperature source non-linearity; range [-1FFFFHEX .. 1FFFFHEX] Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 42 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 4 Die Pad Assignments The ZSSC3016 is available in die form. See Figure 4.1 for additional dimensions. Note that the ZMDI-test pads are for ZMDI use only. Figure 4.1 ZSSC3016 Pad Assignments Table 4.1 Pad Assignments Name Direction Type IN Supply IN OUT OUT IN IN Supply Analog Analog Analog Analog VDD1 VDD2 VSS VSSB VDDB INP INN Data Sheet August 27, 2014 Description IC positive supply voltage for the IC, regular bond pad IC positive supply voltage for the IC, special pad (electrically connected to VDD1, also bondable) Ground reference voltage signal Negative bridge supply (bridge sensor ground) Positive bridge supply Positive bridge signal Negative bridge signal © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 43 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Name Direction Type OUT Digital IN IN IN IN/Out OUT IN Digital Analog Digital Digital Digital Digital EOC1 EOC2 SEL VPP SCLK/SCL MOSI/SDA MISO SS Description End of conversion, regular bond pad End of conversion, special pad (electrically connected to EOC1, also bondable) I²C or SPI interface select Memory programming voltage Clock input for I²C/SPI Data input for SPI; data in/out for I²C Data output for SPI Slave select for SPI 5 Quality and Reliability The ZSSC3016 is available as “consumer” and “industrial” qualified IC version. For the consumer version, all data sheet parameters are guaranteed if not stated otherwise. Additionally the MTP’s data retention capability (over ten years; see Table 1.4) is guaranteed for the industrial IC version. 6 Ordering Sales Codes Ordering Examples Description Package ZSSC3016CC1B Temperature range: –40°C to +85°C, consumer-level parameters according to section 1 of the data sheet ZSSC3016CI1B Temperature range: –40°C to +85°C, industrial-level parameters according Wafer (304µm) unsawn to section 1 of the data sheet, 10 years MTP data retention ZSSC3016CI1D ES Engineering samples, temperature range: –40°C to +85°C Dice in waffle pack ZSSC3016KIT ZSSC3016 Evaluation Kit, including sample and modular evaluation board (Evaluation Software is downloadable from www.zmdi.com/zssc3016) Kit Wafer (304µm) unsawn Contact ZMDI Sales for more information and additional package options. Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 44 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC 7 Related Documents Note: X_xy indicates the current version of the document. Document File Name ZSSC3016 Feature Sheet ZSSC3016_FeatureSheet_RevX_xy.pdf ZSSC3016 Application Note — Application Circuits* ZSSC3016_AN_ApplicationCircuit_RevX_xy.pdf ZSSC30x6 Evaluation Kit Documentation ZSSC30x6_EvaluationKit_RevX_xy.pdf ZSSC30x6 Application Note — Calibration* ZSSC30x6_AN_Calibration_RevX_xy.pdf Visit the ZSSC3016 product page www.zmdi.com/zssc3016 on ZMDI’s website www.zmdi.com or contact your nearest sales office for ordering information or the latest version of these documents. * Documents marked with an asterisk (*) require a free customer login. To set up a login account, click login in the upper right corner of the web site. 8 Glossary Term Description A2D Analog-to-digital ACK Acknowledge (interface’s protocol indicator for successful data/command transfer) ADC Analog-to-digital converter or conversion AZ Auto-Zero (unspecific) AZS Auto-Zero measurement for sensor bridge path AZT Auto-Zero Measurement for temperature path CLK Clock DAC Digital-to-analog conversion or converter DF Data Fetch (this is a command type) DSP Digital signal processor (digital configuration, calibration, calculation, communication unit) FSO Full scale output (value in percent relative to the ADC maximum output code; resolution dependent) LSB Least significant bit (“fine” portion of the converted signal) LFSR Linear Feedback Shift Register MR Measurement Request (this is a command type) MSB Most significant bit (“coarse” portion of the converted signal) NACK Not Acknowledge (interface’s protocol indicator for unsuccessful data/command transfer) POR Power-on reset Data Sheet August 27, 2014 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 45 of 46 ZSSC3016 Low Power 16 Bit Sensor Signal Conditioner IC Term Description PreAmp Preamplifier SM Signal measurement SOT Second-order term TC Temperature coefficient (of a resistor or the equivalent bridge resistance) TM Temperature measurement 9 Document Revision History Revision Date Description 1.00 December 07, 2011 First release. 1.01 January 10, 2012 Reset description added. 1.02 August 27, 2012 Temperature sensor description statement corrected, section 2.2, sensor adaption description added. 1.03 March 07, 2013 Sales information update. 1.04 August 27, 2014 Imagery for cover and header updated. Sales information updated. Minor edits for die information. Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.306 Fax +49.351.8822.337 USA Phone 1.855.275.9634 Phone +1.408.883.6310 Fax +1.408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Data Sheet August 27, 2014 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building 11th Floor, Unit JA-1102 670 Sampyeong-dong Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2014 Zentrum Mikroelektronik Dresden AG — Rev. 1.04 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice. 46 of 46