Packaging Information / Reference Pattern Layout Dimensions ●WLP-5-03 Unit: mm ●Reference Pattern Layout ●Reference Pattern Layout Detail ●Reference Metal Mask Design テーピング仕様/ Taping Specifications WLP-5-03 ●リール/Reel Unit: mm 3,000pcs/Reel ●テーピング仕様/Taping Specifications direction of feed R Type :[Device orientation : Right] Standard feed ●WLP-5-03 Power Dissipation Power dissipation data for the WLP-5-03 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Conditions 40.0 Condition : Mount on a board Ambient : Natural convection Soldering : Lead (Pb) free Board Dimensions : 40mm×40mm（1600mm2 in one side） Metal Area : 1st Metal Layer about 50% 1.4 40.0 2nd Inner Metal Layer about 50% 2.54 2.5 28.9 3rd Inner Metal Layer about 50% 4th Metal Layer about 50% 4 separations is each layer connected to each pin Material : Glass Epoxy（FR-4） Thickness : 1.6mm Through-hole : 4 x 0.8 Diameter 2. 28.9 Power Dissipation vs. Ambient temperature Board Mount ( Tjmax=125℃) Ambient Temperature (℃) Power Dissipation Pd (mW) 25 750 85 300 Thermal Resistance (℃/W） 133.33 Power Dissipation Pd（mW） Pd vs. Ta Ambient Temperature Ta（℃） WLP-5-03構造図 WLP-5-03 Perspective RoHS対応品 RoHS Compliance ① ② ③ ④ ⑤ ⑥ ⑦ 項 目 材 料 備考 Item Material Note シリコンチップ シリコン Sillicon Chip Sillicon ウエハパッド開口部 アルミニウム Wafer Pad Opening Alminium ポリイミド 1 ポリイミド Polyimide 1 Polyimide 再配線層 銅 + チタン Re-Distribution Layer Copper + Titanium ポリイミド 2 ポリイミド Polyimide 2 Polyimide アンダーバンプメタル 銅 + チタン Under Bump Metal Copper + Titanium はんだボール スズ + 銀 + 銅 Solder Ball Tin + Silver + Copper 捺印表示 レーザー Marking Laser marking Ver.00