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64Mb, 3V, Multiple I/O Serial Flash Memory
Features
Micron Serial NOR Flash Memory
3V, Multiple I/O, 4KB Sector Erase
N25Q064A
Features
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•
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•
•
•
•
• Write protection
– Software write protection applicable to every
64KB sector via volatile lock bit
– Hardware write protection: protected area size
defined by five nonvolatile bits (BP0, BP1, BP2,
BP3, and TB)
– Additional smart protections, available upon request
• Electronic signature
– JEDEC-standard 2-byte signature (BA17h)
– Unique ID code (UID): 17 read-only bytes, including:
SPI-compatible serial bus interface
108 MHz (MAX) clock frequency
2.7–3.6V single supply voltage
Dual/quad I/O instruction provides increased
throughput up to 432 MHz
Supported protocols
– Extended SPI, dual I/O, and quad I/O
Execute-in-place (XIP) mode for all three protocols
– Configurable via volatile or nonvolatile registers
– Enables memory to work in XIP mode directly after power-on
PROGRAM/ERASE SUSPEND operations
Continuous read of entire memory via a single command
– Fast read
– Quad or dual output fast read
– Quad or dual I/O fast read
Flexible to fit application
– Configurable number of dummy cycles
– Output buffer configurable
64-byte, user-lockable, one-time programmable
(OTP) dedicated area
Erase capability
– Subsector erase 4KB uniform granularity blocks
– Sector erase 64KB uniform granularity blocks
– Full-chip erase
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• Two additional extended device ID (EDID)
bytes to identify device factory options
• Customized factory data (14 bytes)
• Minimum 100,000 ERASE cycles per sector
• More than 20 years data retention
• Packages JEDEC standard, all RoHS compliant
– F6 = V-PDFN-8 6mm x 5mm (MLP8 6mm x 5mm)
– F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)
– 12 = T-PBGA-24b05 6mm x 8mm
– 14 = T-PBGA-24b05 6mm x 8mm, 4x6 ball array
– SF = SOP2-16 300 mils body width (SO16W)
– SE = SOP2-8 208 mils body width (SO8W)
– 53 = XF-SCSP-8/2.93mm x 3.5mm (XFCSP)
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
64Mb, 3V, Multiple I/O Serial Flash Memory
Features
Contents
Device Description ........................................................................................................................................... 6
Features ....................................................................................................................................................... 6
Operating Protocols ...................................................................................................................................... 6
XIP Mode ..................................................................................................................................................... 6
Device Configurability .................................................................................................................................. 7
Signal Assignments ........................................................................................................................................... 8
Signal Descriptions ......................................................................................................................................... 11
Memory Organization .................................................................................................................................... 13
Memory Configuration and Block Diagram .................................................................................................. 13
Memory Map – 64Mb Density ......................................................................................................................... 14
Device Protection ........................................................................................................................................... 15
Serial Peripheral Interface Modes .................................................................................................................... 17
SPI Protocols .................................................................................................................................................. 19
Nonvolatile and Volatile Registers ................................................................................................................... 20
Status Register ............................................................................................................................................ 21
Nonvolatile and Volatile Configuration Registers .......................................................................................... 22
Enhanced Volatile Configuration Register .................................................................................................... 24
Flag Status Register ..................................................................................................................................... 25
Command Definitions .................................................................................................................................... 27
READ REGISTER and WRITE REGISTER Operations ........................................................................................ 29
READ STATUS REGISTER or FLAG STATUS REGISTER Command ................................................................ 29
READ NONVOLATILE CONFIGURATION REGISTER Command ................................................................... 29
READ VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command .................................. 30
WRITE STATUS REGISTER Command ......................................................................................................... 30
WRITE NONVOLATILE CONFIGURATION REGISTER Command ................................................................. 31
WRITE VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command ................................. 31
READ LOCK REGISTER Command .............................................................................................................. 32
WRITE LOCK REGISTER Command ............................................................................................................ 33
CLEAR FLAG STATUS REGISTER Command ................................................................................................ 34
READ IDENTIFICATION Operations ............................................................................................................... 35
READ ID and MULTIPLE I/O READ ID Commands ...................................................................................... 35
READ SERIAL FLASH DISCOVERY PARAMETER Command ......................................................................... 36
READ MEMORY Operations ............................................................................................................................ 39
PROGRAM Operations .................................................................................................................................... 43
WRITE Operations .......................................................................................................................................... 48
WRITE ENABLE Command ......................................................................................................................... 48
WRITE DISABLE Command ........................................................................................................................ 48
ERASE Operations .......................................................................................................................................... 50
SUBSECTOR ERASE Command ................................................................................................................... 50
SECTOR ERASE Command ......................................................................................................................... 50
BULK ERASE Command ............................................................................................................................. 51
PROGRAM/ERASE SUSPEND Command ..................................................................................................... 52
PROGRAM/ERASE RESUME Command ...................................................................................................... 54
ONE TIME PROGRAMMABLE Operations ....................................................................................................... 55
READ OTP ARRAY Command ...................................................................................................................... 55
PROGRAM OTP ARRAY Command .............................................................................................................. 55
XIP Mode ....................................................................................................................................................... 58
Activate or Terminate XIP Using Volatile Configuration Register ................................................................... 58
Activate or Terminate XIP Using Nonvolatile Configuration Register ............................................................. 58
Confirmation Bit Settings Required to Activate or Terminate XIP .................................................................. 59
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© 2011 Micron Technology, Inc. All rights reserved.
64Mb, 3V, Multiple I/O Serial Flash Memory
Features
Terminating XIP After a Controller and Memory Reset .................................................................................
Power-Up and Power-Down ............................................................................................................................
Power-Up and Power-Down Requirements ..................................................................................................
Power Loss Rescue Sequence ......................................................................................................................
AC Reset Specifications ...................................................................................................................................
Program and Erase Suspend Specifications ......................................................................................................
Absolute Ratings and Operating Conditions .....................................................................................................
DC Characteristics and Operating Conditions ..................................................................................................
AC Characteristics and Operating Conditions ..................................................................................................
Package Dimensions .......................................................................................................................................
Part Number Ordering Information .................................................................................................................
Revision History .............................................................................................................................................
Rev. N – 10/2014 .........................................................................................................................................
Rev. M – 1/2014 ..........................................................................................................................................
Rev. L – 10/2013 ..........................................................................................................................................
Rev. K – 08/2013 .........................................................................................................................................
Rev. J – 01/2013 ..........................................................................................................................................
Rev. I – 10/2012 ..........................................................................................................................................
Rev. H – 07/2012 .........................................................................................................................................
Rev. G – 06/2012 .........................................................................................................................................
Rev. F, Production – 10/2011 ........................................................................................................................
Rev. E, Production – 07/2011 .......................................................................................................................
Rev. D – 01/2011 .........................................................................................................................................
Rev. C – 11/2010 .........................................................................................................................................
Rev. B – 10/2010 .........................................................................................................................................
Rev. A – 05/2010 ..........................................................................................................................................
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
64Mb, 3V, Multiple I/O Serial Flash Memory
Features
List of Figures
Figure 1: Logic Diagram ................................................................................................................................... 7
Figure 2: 8-Pin, VDFPN8 – MLP8 and SOP2 – SO8W (Top View) ......................................................................... 8
Figure 3: 16-Pin, Plastic Small Outline – SO16 (Top View) .................................................................................. 8
Figure 4: 24-Ball TBGA , 5 x 5 (Balls Down) ....................................................................................................... 9
Figure 5: 24-Ball TBGA, 4 x 6 (Balls Down) ........................................................................................................ 9
Figure 6: 12-Ball XF-SCSP, 4 x 6 (Balls Down) .................................................................................................. 10
Figure 7: Block Diagram ................................................................................................................................ 13
Figure 8: Bus Master and Memory Devices on the SPI Bus ............................................................................... 18
Figure 9: SPI Modes ....................................................................................................................................... 18
Figure 10: Internal Configuration Register ...................................................................................................... 20
Figure 11: READ REGISTER Command .......................................................................................................... 29
Figure 12: WRITE REGISTER Command ......................................................................................................... 31
Figure 13: READ LOCK REGISTER Command ................................................................................................. 33
Figure 14: WRITE LOCK REGISTER Command ............................................................................................... 34
Figure 15: READ ID and MULTIPLE I/O Read ID Commands .......................................................................... 36
Figure 16: READ Command ........................................................................................................................... 40
Figure 17: FAST READ Command ................................................................................................................... 40
Figure 18: DUAL OUTPUT FAST READ ........................................................................................................... 41
Figure 19: DUAL INPUT/OUTPUT FAST READ Command .............................................................................. 41
Figure 20: QUAD OUTPUT FAST READ Command ......................................................................................... 42
Figure 21: QUAD INPUT/OUTPUT FAST READ Command ............................................................................. 42
Figure 22: PAGE PROGRAM Command .......................................................................................................... 44
Figure 23: DUAL INPUT FAST PROGRAM Command ...................................................................................... 45
Figure 24: EXTENDED DUAL INPUT FAST PROGRAM Command ................................................................... 45
Figure 25: QUAD INPUT FAST PROGRAM Command ..................................................................................... 46
Figure 26: EXTENDED QUAD INPUT FAST PROGRAM Command ................................................................... 47
Figure 27: WRITE ENABLE and WRITE DISABLE Command Sequence ............................................................ 49
Figure 28: SUBSECTOR and SECTOR ERASE Command .................................................................................. 51
Figure 29: BULK ERASE Command ................................................................................................................ 52
Figure 30: READ OTP Command .................................................................................................................... 55
Figure 31: PROGRAM OTP Command ............................................................................................................ 57
Figure 32: XIP Mode Directly After Power-On .................................................................................................. 59
Figure 33: Power-Up Timing .......................................................................................................................... 61
Figure 34: Reset AC Timing During PROGRAM or ERASE Cycle ........................................................................ 64
Figure 35: Serial Input Timing ........................................................................................................................ 64
Figure 36: Write Protect Setup and Hold During WRITE STATUS REGISTER Operation (SRWD = 1) ................... 65
Figure 37: Hold Timing .................................................................................................................................. 65
Figure 38: Output Timing .............................................................................................................................. 66
Figure 39: V PPH Timing .................................................................................................................................. 66
Figure 40: AC Timing Input/Output Reference Levels ...................................................................................... 69
Figure 41: V-PDFN-8 6mm x 5mm (MLP8) – Package Code: F6 ........................................................................ 73
Figure 42: V-PDFN-8 8mm x 6mm (MLP8) – Package Code: F8 ........................................................................ 74
Figure 43: T-PBGA-24b05 6mm x 8mm – Package Code: 12 .............................................................................. 75
Figure 44: T-PBGA-24b05 6mm x 8mm – Package Code: 14 .............................................................................. 76
Figure 45: SOP2-16 (300 mils body width) – Package Code: SF ......................................................................... 77
Figure 46: SOP2-8 (208 mils body width) – Package Code: SE ........................................................................... 78
Figure 47: XF-SCSP-8/2.93mm x 3.5mm – Package Code: 53 ............................................................................ 79
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Features
List of Tables
Table 1: Signal Descriptions ...........................................................................................................................
Table 2: Sectors[127:0] ...................................................................................................................................
Table 3: Data Protection using Device Protocols .............................................................................................
Table 4: Memory Sector Protection Truth Table ..............................................................................................
Table 5: Protected Area Sizes – Upper Area .....................................................................................................
Table 6: Protected Area Sizes – Lower Area ......................................................................................................
Table 7: SPI Modes ........................................................................................................................................
Table 8: Extended, Dual, and Quad SPI Protocols ............................................................................................
Table 9: Status Register Bit Definitions ...........................................................................................................
Table 10: Nonvolatile Configuration Register Bit Definitions ...........................................................................
Table 11: Volatile Configuration Register Bit Definitions ..................................................................................
Table 12: Sequence of Bytes During Wrap .......................................................................................................
Table 13: Supported Clock Frequencies ..........................................................................................................
Table 14: Enhanced Volatile Configuration Register Bit Definitions ..................................................................
Table 15: Flag Status Register Bit Definitions ..................................................................................................
Table 16: Command Set .................................................................................................................................
Table 17: Lock Register ..................................................................................................................................
Table 18: Data/Address Lines for READ ID and MULTIPLE I/O READ ID Commands .......................................
Table 19: Read ID Data Out ............................................................................................................................
Table 20: Extended Device ID, First Byte .........................................................................................................
Table 21: Serial Flash Discovery Parameter – Header Structure ........................................................................
Table 22: Parameter ID ..................................................................................................................................
Table 23: Command/Address/Data Lines for READ MEMORY Commands .......................................................
Table 24: Data/Address Lines for PROGRAM Commands ................................................................................
Table 25: Operations Allowed/Disallowed During Device States ......................................................................
Table 26: OTP Control Byte (Byte 64) ..............................................................................................................
Table 27: XIP Confirmation Bit .......................................................................................................................
Table 28: Effects of Running XIP in Different Protocols ....................................................................................
Table 29: Power-Up Timing and V WI Threshold ...............................................................................................
Table 30: AC RESET Conditions ......................................................................................................................
Table 31: Suspend Parameters .......................................................................................................................
Table 32: Absolute Ratings .............................................................................................................................
Table 33: Operating Conditions ......................................................................................................................
Table 34: Input/Output Capacitance ..............................................................................................................
Table 35: AC Timing Input/Output Conditions ...............................................................................................
Table 36: DC Current Characteristics and Operating Conditions ......................................................................
Table 37: DC Voltage Characteristics and Operating Conditions ......................................................................
Table 38: AC Characteristics and Operating Conditions ...................................................................................
Table 39: Part Number Information ................................................................................................................
Table 40: Package Details ...............................................................................................................................
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
64Mb, 3V, Multiple I/O Serial Flash Memory
Device Description
Device Description
The N25Q is the first high-performance multiple input/output serial Flash memory device manufactured on 65nm NOR technology. It features execute-in-place (XIP) functionality, advanced write protection mechanisms, and a high-speed SPI-compatible bus
interface. The innovative, high-performance, dual and quad input/output instructions
enable double or quadruple the transfer bandwidth for READ and PROGRAM operations.
Features
The memory is organized as 128 (64KB) main sectors that are further divided into 16
subsectors each (2048 subsectors in total). The memory can be erased one 4KB subsector at a time, 64KB sectors at a time, or as a whole.
The memory can be write protected by software through volatile and nonvolatile protection features, depending on the application needs. The protection granularity is of
64KB (sector granularity) for volatile protections
The device has 64 one-time programmable (OTP) bytes that can be read and programmed with the READ OTP and PROGRAM OTP commands. These 64 bytes can also be
permanently locked with a PROGRAM OTP command.
The device also has the ability to pause and resume PROGRAM and ERASE cycles by using dedicated PROGRAM/ERASE SUSPEND and RESUME instructions.
Operating Protocols
The memory can be operated with three different protocols:
• Extended SPI (standard SPI protocol upgraded with dual and quad operations)
• Dual I/O SPI
• Quad I/O SPI
The standard SPI protocol is extended and enhanced by dual and quad operations. In
addition, the dual SPI and quad SPI protocols improve the data access time and
throughput of a single I/O device by transmitting commands, addresses, and data
across two or four data lines.
XIP Mode
XIP mode requires only an address (no instruction) to output data, improving random
access time and eliminating the need to shadow code onto RAM for fast execution.
All protocols support XIP operation. For flexibility, multiple XIP entry and exit methods
are available. For applications that must enter XIP mode immediately after powering
up, XIP mode can be set as the default mode through the nonvolatile configuration register bits.
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
64Mb, 3V, Multiple I/O Serial Flash Memory
Device Description
Device Configurability
The N25Q family offers additional features that are configured through the nonvolatile
configuration register for default and/or nonvolatile settings. Volatile settings can be
configured through the volatile and volatile-enhanced configuration registers. These
configurable features include the following:
•
•
•
•
•
•
Number of dummy cycles for the fast READ commands
Output buffer impedance
SPI protocol types (extended SPI, DIO-SPI, or QIO-SPI)
Required XIP mode
Enabling/disabling HOLD (RESET function)
Enabling/disabling wrap mode
Figure 1: Logic Diagram
VCC
DQ0
DQ1
C
S#
VPP/W#/DQ2
HOLD#/DQ3
VSS
Note:
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1. Reset functionality is available in devices with a dedicated part number. See Part Number Ordering Information for more details.
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© 2011 Micron Technology, Inc. All rights reserved.
64Mb, 3V, Multiple I/O Serial Flash Memory
Signal Assignments
Signal Assignments
Figure 2: 8-Pin, VDFPN8 – MLP8 and SOP2 – SO8W (Top View)
Notes:
S#
1
8
VCC
DQ1
2
7
HOLD#/DQ3
W#/VPP/DQ2
3
6
C
VSS
4
5
DQ0
1. On the underside of the MLP8 package, there is an exposed central pad that is pulled
internally to VSS and must not be connected to any other voltage or signal line on the
PCB.
2. Reset functionality is available in devices with a dedicated part number. See Part Number Ordering Information for complete package names and details.
Figure 3: 16-Pin, Plastic Small Outline – SO16 (Top View)
Note:
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HOLD#/DQ3
1
16
C
VCC
2
15
DQ0
DNU
3
14
DNU
DNU
4
13
DNU
DNU
5
12
DNU
DNU
6
11
DNU
S#
7
10
VSS
DQ1
8
9
W#/VPP/DQ2
1. Reset functionality is available in devices with a dedicated part number. See Part Number Ordering Information for complete package names and details.
8
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© 2011 Micron Technology, Inc. All rights reserved.
64Mb, 3V, Multiple I/O Serial Flash Memory
Signal Assignments
Figure 4: 24-Ball TBGA , 5 x 5 (Balls Down)
1
2
3
4
5
NC
NC
NC
NC
NC
C
VSS
VCC
NC
NC
S#
NC W#/VPP/DQ2 NC
NC
DQ1
DQ0 HOLD#/DQ3 NC
NC
NC
A
B
C
D
E
Note:
NC
NC
NC
1. See Part Number Ordering Information for complete package names and details.
Figure 5: 24-Ball TBGA, 4 x 6 (Balls Down)
1
2
3
4
NC
NC
NC
NC
NC
C
VSS
VCC
NC
S#
NC W#/VPP/DQ2
NC
DQ1
DQ0 HOLD#/DQ3
NC
NC
NC
NC
NC
NC
NC
NC
A
B
C
D
E
F
Note:
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1. See Part Number Ordering Information for complete package names and details.
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
64Mb, 3V, Multiple I/O Serial Flash Memory
Signal Assignments
Figure 6: 12-Ball XF-SCSP, 4 x 6 (Balls Down)
1
A
2
3
4
NC
NC
VCC
B
C
S#
DQ1
HOLD#/DQ3
D
C
W#/ VPP /DQ2
E
F
Note:
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DQ0
NC
VSS
NC
1. See Part Number Ordering Information for complete package names and details.
10
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64Mb, 3V, Multiple I/O Serial Flash Memory
Signal Descriptions
Signal Descriptions
The signal description table below is a comprehensive list of signals for the N25 family
devices. All signals listed may not be supported on this device. See Signal Assignments
for information specific to this device.
Table 1: Signal Descriptions
Symbol
Type
Description
C
Input
Clock: Provides the timing of the serial interface. Commands, addresses, or data present at serial data inputs are latched on the rising edge of the clock. Data is shifted out on the falling
edge of the clock.
S#
Input
Chip select: When S# is HIGH, the device is deselected and DQ1 is at High-Z. When in extended SPI mode, with the device deselected, DQ1 is tri-stated. Unless an internal PROGRAM,
ERASE, or WRITE STATUS REGISTER cycle is in progress, the device enters standby power mode
(not deep power-down mode). Driving S# LOW enables the device, placing it in the active power mode. After power-up, a falling edge on S# is required prior to the start of any command.
DQ0
Input
and I/O
Serial data: Transfers data serially into the device. It receives command codes, addresses, and
the data to be programmed. Values are latched on the rising edge of the clock. DQ0 is used for
input/output during the following operations: DUAL OUTPUT FAST READ, QUAD OUTPUT FAST
READ, DUAL INPUT/OUTPUT FAST READ, and QUAD INPUT/OUTPUT FAST READ. When used for
output, data is shifted out on the falling edge of the clock.
In DIO-SPI, DQ0 always acts as an input/output.
In QIO-SPI, DQ0 always acts as an input/output, with the exception of the PROGRAM or ERASE
cycle performed with VPP. The device temporarily enters the extended SPI protocol and then returns to QIO-SPI as soon as VPP goes LOW.
DQ1
Output
and I/O
Serial data:Transfers data serially out of the device. Data is shifted out on the falling edge of
the clock. DQ1 is used for input/output during the following operations: DUAL INPUT FAST
PROGRAM, QUAD INPUT FAST PROGRAM, DUAL INPUT EXTENDED FAST PROGRAM, and QUAD
INPUT EXTENDED FAST PROGRAM. When used for input, data is latched on the rising edge of
the clock.
In DIO-SPI, DQ1 always acts as an input/output.
In QIO-SPI, DQ1 always acts as an input/output, with the exception of the PROGRAM or ERASE
cycle performed with the enhanced program supply voltage (VPP). In this case the device temporarily enters the extended SPI protocol and then returns to QIO-SPI as soon as VPP goes LOW.
DQ2
Input
and I/O
DQ2: When in QIO-SPI mode or in extended SPI mode using QUAD FAST READ commands, the
signal functions as DQ2, providing input/output.
All data input drivers are always enabled except when used as an output. Micron recommends
customers drive the data signals normally (to avoid unnecessary switching current) and float
the signals before the memory device drives data on them.
DQ3
Input
and I/O
DQ3: When in quad SPI mode or in extended SPI mode using quad FAST READ commands, the
signal functions as DQ3, providing input/output. HOLD# is disabled and RESET# is disabled if
the device is selected.
RESET#
Control
Input
RESET: This is a hardware RESET# signal. When RESET# is driven HIGH, the memory is in the
normal operating mode. When RESET# is driven LOW, the memory enters reset mode and output is High-Z. If RESET# is driven LOW while an internal WRITE, PROGRAM, or ERASE operation
is in progress, data may be lost.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Signal Descriptions
Table 1: Signal Descriptions (Continued)
Symbol
Type
HOLD#
Control
Input
HOLD: Pauses any serial communications with the device without deselecting the device. DQ1
(output) is High-Z. DQ0 (input) and the clock are "Don't Care." To enable HOLD, the device
must be selected with S# driven LOW.
HOLD# is used for input/output during the following operations: QUAD OUTPUT FAST READ,
QUAD INPUT/OUTPUT FAST READ, QUAD INPUT FAST PROGRAM, and QUAD INPUT EXTENDED
FAST PROGRAM.
In QIO-SPI, HOLD# acts as an I/O (DQ3 functionality), and the HOLD# functionality is disabled
when the device is selected. When the device is deselected (S# is HIGH) in parts with RESET#
functionality, it is possible to reset the device unless this functionality is not disabled by means
of dedicated registers bits.
The HOLD# functionality can be disabled using bit 4 of the NVCR or bit 4 of the VECR.
W#
Control
Input
Write protect: W# can be used as a protection control input or in QIO-SPI operations. When in
extended SPI with single or dual commands, the WRITE PROTECT function is selectable by the
voltage range applied to the signal. If voltage range is low (0V to VCC), the signal acts as a
write protection control input. The memory size protected against PROGRAM or ERASE operations is locked as specified in the status register block protect bits 3:0.
W# is used as an input/output (DQ2 functionality) during QUAD INPUT FAST READ and QUAD
INPUT/OUTPUT FAST READ operations and in QIO-SPI.
VPP
Power
Supply voltage: If VPP is in the voltage range of VPPH, the signal acts as an additional power
supply, as defined in the AC Measurement Conditions table.
During QIFP, QIEFP, and QIO-SPI PROGRAM/ERASE operations, it is possible to use the additional VPP power supply to speed up internal operations. However, to enable this functionality, it is
necessary to set bit 3 of the VECR to 0.
In this case, VPP is used as an I/O until the end of the operation. After the last input data is shifted in, the application should apply VPP voltage to VPP within 200ms to speed up the internal
operations. If the VPP voltage is not applied within 200ms, the PROGRAM/ERASE operations
start at standard speed.
The default value of VECR bit 3 is 1, and the VPP functionality for quad I/O modify operations is
disabled.
VCC
Power
Device core power supply: Source voltage.
VSS
Ground
DNU
–
Do not use.
NC
–
No connect.
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Description
Ground: Reference for the VCC supply voltage.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Memory Organization
Memory Organization
Memory Configuration and Block Diagram
Each page of memory can be individually programmed. Bits are programmed from one
through zero. The device is subsector, sector, or bulk-erasable, but not page-erasable.
Bits are erased from zero through one. The memory is configured as 8,388,608 bytes (8
bits each); 128 sectors (64KB each); 2048 subsectors (4KB each); and 37,768 pages (256
bytes each); and 64 OTP bytes are located outside the main memory array.
Figure 7: Block Diagram
HOLD#
W#/VPP
High voltage
generator
Control logic
64 OTP bytes
S#
C
DQ0
DQ1
I/O shift register
Address register
and counter
256 byte
data buffer
Status
register
Y decoder
7FFFFFh
000000h
000FFFh
256 bytes (page size)
X decoder
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64Mb, 3V, Multiple I/O Serial Flash Memory
Memory Map – 64Mb Density
Memory Map – 64Mb Density
Table 2: Sectors[127:0]
Address Range
Sector
Subsector
Start
End
127
2047
007F F000h
007F FFFFh
⋮
⋮
⋮
2032
007F 0000h
007F 0FFFh
⋮
⋮
⋮
⋮
63
1023
003F F000h
003F FFFFh
⋮
⋮
⋮
1008
003F 0000h
003F 0FFFh
⋮
⋮
⋮
⋮
0
15
0000 F000h
0000 FFFFh
⋮
⋮
⋮
0
0000 0000h
0000 0FFFh
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64Mb, 3V, Multiple I/O Serial Flash Memory
Device Protection
Device Protection
Table 3: Data Protection using Device Protocols
Note 1 applies to the entire table
Protection by:
Description
Power-on reset and internal timer
Protects the device against inadvertent data changes while the power supply is outside the operating specification.
Command execution check
Ensures that the number of clock pulses is a multiple of one byte before executing a
PROGRAM or ERASE command, or any command that writes to the device registers.
WRITE ENABLE operation
Ensures that commands modifying device data must be preceded by a WRITE ENABLE
command, which sets the write enable latch bit in the status register.
Note:
1. Extended, dual, and quad SPI protocol functionality ensures that device data is protected from excessive noise.
Table 4: Memory Sector Protection Truth Table
Note 1 applies to the entire table
Sector Lock Register
Sector Lock
Down Bit
Sector Write Lock
Bit
0
0
Sector unprotected from PROGRAM and ERASE operations. Protection status reversible.
0
1
Sector protected from PROGRAM and ERASE operations. Protection status reversible.
1
0
Sector unprotected from PROGRAM and ERASE operations. Protection status not
reversible except by power cycle or reset.
1
1
Sector protected from PROGRAM and ERASE operations. Protection status not
reversible except by power cycle or reset.
Note:
Memory Sector Protection Status
1. Sector lock register bits are written to when the WRITE LOCK REGISTER command is executed. The command will not execute unless the sector lock down bit is cleared (see the
WRITE LOCK REGISTER command).
Table 5: Protected Area Sizes – Upper Area
Note 1 applies to the entire table
Status Register Content
Memory Content
Top/
Bottom
Bit
BP3
BP2
BP1
BP0
Protected Area
Unprotected Area
0
0
0
0
0
None
All sectors
0
0
0
0
1
Upper 128th
Sectors (0 to 126)
0
0
0
1
0
Upper 64th
Sectors (0 to 125)
0
0
0
1
1
Upper 32nd
Sectors (0 to 123)
0
0
1
0
0
Upper 16th
Sectors (0 to119)
0
0
1
0
1
Upper 8th
Sectors (0 to 111)
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64Mb, 3V, Multiple I/O Serial Flash Memory
Device Protection
Table 5: Protected Area Sizes – Upper Area (Continued)
Note 1 applies to the entire table
Status Register Content
Memory Content
Top/
Bottom
Bit
BP3
BP2
BP1
BP0
Protected Area
Unprotected Area
0
0
1
1
0
Upper quarter
Sectors (0 to 95)
0
0
1
1
1
Upper half
Sectors (0 to 63)
0
1
0
0
0
All sectors
None
0
1
0
0
1
All sectors
None
0
1
0
1
0
All sectors
None
0
1
0
1
1
All sectors
None
0
1
1
0
0
All sectors
None
0
1
1
0
1
All sectors
None
0
1
1
1
0
All sectors
None
0
1
1
1
1
All sectors
None
Note:
1. See the Status Register for details on the top/bottom bit and the BP 3:0 bits.
Table 6: Protected Area Sizes – Lower Area
Note 1 applies to the entire table
Status Register Content
Memory Content
Top/
Bottom
Bit
BP3
BP2
BP1
BP0
Protected Area
Unprotected Area
1
0
0
0
0
None
All sectors
1
0
0
0
1
Lower 128th
Sectors (1 to 127)
1
0
0
1
0
Lower 64th
Sectors (2 to 127)
1
0
0
1
1
Lower 32nd
Sectors (4 to 127)
1
0
1
0
0
Lower 16th
Sectors (8 to 127)
1
0
1
0
1
Lower 8th
Sectors (16 to 127)
1
0
1
1
0
Lower quarter
Sectors (32 to 127)
1
0
1
1
1
Lower half
Sectors (64 to 127)
1
1
0
0
0
All sectors
None
1
1
0
0
1
All sectors
None
1
1
0
1
0
All sectors
None
1
1
0
1
1
All sectors
None
1
1
1
0
0
All sectors
None
1
1
1
0
1
All sectors
None
1
1
1
1
0
All sectors
None
1
1
1
1
1
All sectors
None
Note:
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1. See the Status Register for details on the top/bottom bit and the BP 3:0 bits.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Serial Peripheral Interface Modes
Serial Peripheral Interface Modes
The device can be driven by a microcontroller while its serial peripheral interface is in
either of the two modes shown here. The difference between the two modes is the clock
polarity when the bus master is in standby mode and not transferring data. Input data is
latched in on the rising edge of the clock, and output data is available from the falling
edge of the clock.
Table 7: SPI Modes
Note:
Note 1 applies to the entire table
SPI Modes
Clock Polarity
CPOL = 0, CPHA = 0
C remains at 0 for (CPOL = 0, CPHA = 0)
CPOL = 1, CPHA = 1
C remains at 1 for (CPOL = 1, CPHA = 1)
1. The listed SPI modes are supported in extended, dual, and quad SPI protocols.
Shown below is an example of three memory devices in extended SPI protocol in a simple connection to an MCU on an SPI bus. Because only one device is selected at a time,
that one device drives DQ1, while the other devices are High-Z.
Resistors ensure the device is not selected if the bus master leaves S# High-Z. The bus
master might enter a state in which all input/output is High-Z simultaneously, such as
when the bus master is reset. Therefore, the serial clock must be connected to an external pull-down resistor so that S# is pulled HIGH while the serial clock is pulled LOW.
This ensures that S# and the serial clock are not HIGH simultaneously and that tSHCH
is met. The typical resistor value of 100kΩ, assuming that the time constant R × Cp (Cp =
parasitic capacitance of the bus line), is shorter than the time the bus master leaves the
SPI bus in High-Z.
Example: Cp = 50pF, that is R × Cp = 5μs. The application must ensure that the bus master never leaves the SPI bus High-Z for a time period shorter than 5μs. W# and HOLD#
should be driven either HIGH or LOW, as appropriate.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Serial Peripheral Interface Modes
Figure 8: Bus Master and Memory Devices on the SPI Bus
VSS
VCC
R
SDO
SPI interface:
(CPOL, CPHA) =
(0, 0) or (1, 1)
SDI
SCK
VCC
C
SPI bus master
DQ1 DQ0
R
CS3
SPI memory
device
VCC
C
VSS
R
DQ1
DQ0
SPI memory
device
VCC
C
VSS
R
DQ1 DQ0
VSS
SPI memory
device
CS2 CS1
S#
W# HOLD#
S#
W# HOLD#
S#
W# HOLD#
Figure 9: SPI Modes
CPOL CPHA
0
0
C
1
1
C
DQ0
MSB
DQ1
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MSB
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64Mb, 3V, Multiple I/O Serial Flash Memory
SPI Protocols
SPI Protocols
Table 8: Extended, Dual, and Quad SPI Protocols
Protocol
Name
Command
Input
Extended
DQ0
Multiple DQn
lines, depending
on the command
Dual
DQ[1:0]
DQ[1:0]
Address
Input
Data
Input/Output
Description
Multiple DQn
Device default protocol from the factory. Additional comlines, depending mands extend the standard SPI protocol and enable address
on the command or data transmission on multiple DQn lines.
DQ[1:0]
Volatile selectable: When the enhanced volatile configuration register bit 6 is set to 0 and bit 7 is set to 1, the device enters the dual SPI protocol immediately after the
WRITE ENHANCED VOLATILE CONFIGURATION REGISTER
command. The device returns to the default protocol after
the next power-on. In addition, the device can return to default protocol using the rescue sequence or through new
WRITE ENHANCED VOLATILE CONFIGURATION REGISTER
command, without power-off or power-on.
Nonvolatile selectable: When nonvolatile configuration
register bit 2 is set, the device enters the dual SPI protocol
after the next power-on. Once this register bit is set, the device defaults to the dual SPI protocol after all subsequent
power-on sequences until the nonvolatile configuration
register bit is reset to 1.
Quad1
DQ[3:0]
DQ[3:0]
DQ[3:0]
Volatile selectable: When the enhanced volatile configuration register bit 7 is set to 0, the device enters the quad
SPI protocol immediately after the WRITE ENHANCED VOLATILE CONFIGURATION REGISTER command. The device returns to the default protocol after the next power-on. In addition, the device can return to default protocol using the
rescue sequence or through new WRITE ENHANCED VOLATILE CONFIGURATION REGISTER command, without poweroff or power-on.
Nonvolatile selectable: When nonvolatile configuration
register bit 3 is set to 0, the device enters the quad SPI protocol after the next power-on. Once this register bit is set,
the device defaults to the quad SPI protocol after all subsequent power-on sequences until the nonvolatile configuration register bit is reset to 1.
Note:
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1. In quad SPI protocol, all command/address input and data I/O are transmitted on four
lines except during a PROGRAM and ERASE cycle performed with VPP. In this case, the
device enters the extended SPI protocol to temporarily allow the application to perform
a PROGRAM/ERASE SUSPEND operation or to check the write-in-progress bit in the status register or the program/erase controller bit in the flag status register. Then, when
VPP goes LOW, the device returns to the quad SPI protocol.
19
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64Mb, 3V, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Nonvolatile and Volatile Registers
The device features the following volatile and nonvolatile registers that users can access
to store device parameters and operating configurations:
•
•
•
•
•
Status register
Nonvolatile and volatile configuration registers
Enhanced volatile configuration register
Flag status register
Lock register
Note: The lock register is defined in READ LOCK REGISTER Command.
In addition to these user-accessible registers, the working condition of memory is set by
an internal configuration register that is not directly accessible to users. As shown below, parameters in the internal configuration register are loaded from the nonvolatile
configuration register during each device boot phase or power-on reset. In this sense,
then, the nonvolatile configuration register contains the default settings of memory.
Also, during the life of an application, each time a WRITE VOLATILE or ENHANCED
VOLATILE CONFIGURATION REGISTER command executes to set configuration parameters in these respective registers, these new settings are copied to the internal configuration register. Therefore, memory settings can be changed in real time. However, at
the next power-on reset, the memory boots according to the memory settings defined
in the nonvolatile configuration register parameters.
Figure 10: Internal Configuration Register
Nonvolatile configuration register
Register download is executed only during
the power-on phase or after a reset,
overwriting configuration register settings
on the internal configuration register.
Volatile configuration register and
enhanced volatile configuration register
Internal configuration
register
Register download is executed after a
WRITE VOLATILE OR ENHANCED VOLATILE
CONFIGURATION REGISTER command,
overwriting configuration register
settings on the internal configuration register.
Device behavior
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64Mb, 3V, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Status Register
Table 9: Status Register Bit Definitions
Note 1 applies to entire table
Bit
Name
Settings
Description
Notes
7
Status register
0 = Enabled
write enable/disable 1 = Disabled
Nonvolatile bit: Used with the W/VPP signal to enable or
disable writing to the status register.
3
5
Top/bottom
0 = Top
1 = Bottom
Nonvolatile bit: Determines whether the protected memory area defined by the block protect bits starts from the
top or bottom of the memory array.
4
6, 4:2
Block protect 3–0
See Protected Area
Sizes – Upper Area
and Lower Area
tables in Device
Protection
Nonvolatile bit: Defines memory to be software protected against PROGRAM or ERASE operations. When one or
more block protect bits is set to 1, a designated memory
area is protected from PROGRAM and ERASE operations.
4
1
Write enable latch
0 = Cleared (Default) Volatile bit: The device always powers up with this bit
1 = Set
cleared to prevent inadvertent WRITE STATUS REGISTER,
PROGRAM, or ERASE operations. To enable these operations, the WRITE ENABLE operation must be executed first
to set this bit.
2
0
Write in progress
0 = Ready
1 = Busy
Notes:
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Volatile bit: Indicates if one of the following command cycles is in progress:
WRITE STATUS REGISTER
WRITE NONVOLATILE CONFIGURATION REGISTER
PROGRAM
ERASE
2
1. Bits can be read from or written to using READ STATUS REGISTER or WRITE STATUS REGISTER commands, respectively.
2. Volatile bits are cleared to 0 by a power cycle or reset.
3. The status register write enable/disable bit, combined with the W#/VPP signal as described in the Signal Descriptions, provides hardware data protection for the device as follows: When the enable/disable bit is set to 1, and the W#/VPP signal is driven LOW, the
status register nonvolatile bits become read-only and the WRITE STATUS REGISTER operation will not execute. The only way to exit this hardware-protected mode is to drive
W#/VPP HIGH.
4. See Protected Area Sizes tables in Device Protection. The BULK ERASE command is executed only if all bits are 0.
21
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64Mb, 3V, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Nonvolatile and Volatile Configuration Registers
Table 10: Nonvolatile Configuration Register Bit Definitions
Note 1 applies to entire table
Bit Name
Settings
Description
Notes
15:12 Number of
dummy clock
cycles
0000 (identical to 1111)
0001
0010
.
.
1101
1110
1111
Sets the number of dummy clock cycles subsequent to all FAST READ commands.
The default setting targets the maximum allowed frequency and guarantees backward compatibility.
11:9
XIP mode at
power-on reset
000 = XIP: Fast Read
001 = XIP: Dual Output Fast Read
010 = XIP: Dual I/O Fast Read
011 = XIP: Quad Output Fast Read
100 = XIP: Quad I/O Fast Read
101 = Reserved
110 = Reserved
111 = Disabled (Default)
Enables the device to operate in the selected XIP
mode immediately after power-on reset.
8:6
Output driver 000 = Reserved
strength
001 = 90 Ohms
010 = 60 Ohms
011 = 45 Ohms
100 = Reserved
101 = 20 Ohms
110 = 15 Ohms
111 = 30 (Default)
Optimizes impedance at VCC/2 output voltage.
5
Reserved
X
"Don't Care."
4
Reset/hold
0 = Disabled
1 = Enabled (Default)
Enables or disables hold or reset.
(Available on dedicated part numbers.)
3
Quad I/O pro- 0 = Enabled
Enables or disables quad I/O protocol.
tocol
1 = Disabled (Default, Extended SPI protcocol)
4
2
Dual I/O protocol
0 = Enabled
1 = Disabled (Default, Extended SPI protocol)
Enables or disables dual I/O protocol.
4
Reserved
X
"Don't Care."
1:0
Notes:
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2, 3
1. Settings determine device memory configuration after power-on. The device ships from
the factory with all bits erased to 1 (FFFFh). The register is read from or written to by
READ NONVOLATILE CONFIGURATION REGISTER or WRITE NONVOLATILE CONFIGURATION REGISTER commands, respectively.
2. The 0000 and 1111 settings are identical in that they both define the default state,
which is the maximum frequency of fc = 108 MHz. This ensures backward compatibility.
3. If the number of dummy clock cycles is insufficient for the operating frequency, the
memory reads wrong data. The number of cycles must be set according to and sufficient
22
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64Mb, 3V, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
for the clock frequency, which varies by the type of FAST READ command, as shown in
the Supported Clock Frequencies table.
4. If bits 2 and 3 are both set to 0, the device operates in quad I/O. When bits 2 or 3 are
reset to 0, the device operates in dual I/O or quad I/O respectively, after the next poweron.
Table 11: Volatile Configuration Register Bit Definitions
Note 1 applies to entire table
Bit
Name
Settings
7:4
Description
Notes
Number of dummy clock cycles
0000 (identical to 1111)
0001
0010
.
.
1101
1110
1111
Sets the number of dummy clock cycles subsequent to
all FAST READ commands.
The default setting targets maximum allowed frequency and guarantees backward compatibility.
3
XIP
0 = Enable
1 = Disable (default)
Enables or disables XIP. For device part numbers with
the feature digit equal to 2 or 4, this bit is always
"Don't Care," so the device operates in XIP mode without setting this bit.
2
Reserved
X = Default
0b = Fixed value.
Wrap
00 = 16-byte boundary
aligned
16-byte wrap: Output data wraps within an aligned 16byte boundary starting from the 3-byte address issued
after the command code.
01 = 32-byte boundary
aligned
32-byte wrap: Output data wraps within an aligned 32byte boundary starting from the 3-byte address issued
after the command code.
10 = 64-byte boundary
aligned
64-byte wrap: Output data wraps within an aligned 64byte boundary starting from the 3-byte address issued
after the command code.
11 = sequential (default)
Continuous reading (default): All bytes are read sequentially.
1:0
Notes:
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2, 3
4
1. Settings determine the device memory configuration upon a change of those settings by
the WRITE VOLATILE CONFIGURATION REGISTER command. The register is read from or
written to by READ VOLATILE CONFIGURATION REGISTER or WRITE VOLATILE CONFIGURATION REGISTER commands respectively.
2. The 0000 and 1111 settings are identical in that they both define the default state,
which is the maximum frequency of fc = 108 MHz. This ensures backward compatibility.
3. If the number of dummy clock cycles is insufficient for the operating frequency, the
memory reads wrong data. The number of cycles must be set according to and be sufficient for the clock frequency, which varies by the type of FAST READ command, as
shown in the Supported Clock Frequencies table.
4. See the Sequence of Bytes During Wrap table.
23
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64Mb, 3V, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Table 12: Sequence of Bytes During Wrap
Starting Address
16-Byte Wrap
32-Byte Wrap
64-Byte Wrap
0
0-1-2- . . . -15-0-1- . .
0-1-2- . . . -31-0-1- . .
0-1-2- . . . -63-0-1- . .
1
1-2- . . . -15-0-1-2- . .
1-2- . . . -31-0-1-2- . .
1-2- . . . -63-0-1-2- . .
15
15-0-1-2-3- . . . -15-0-1- . .
15-16-17- . . . -31-0-1- . .
15-16-17- . . . -63-0-1- . .
31
31-16-17- . . . -31-16-17- . .
31-0-1-2-3- . . . -31-0-1- . .
31-32-33- . . . -63-0-1- . .
63
63-48-49- . . . -63-48-49- . .
63-32-33- . . . -63-32-33- . .
63-0-1- . . . -63-0-1- . .
Table 13: Supported Clock Frequencies
Note 1 applies to entire table
Number of Dummy
Clock Cycles
FAST READ
DUAL OUTPUT
FAST READ
DUAL I/O FAST
READ
QUAD OUTPUT
FAST READ
QUAD I/O FAST
READ
1
54
50
39
43
20
2
95
85
59
56
39
3
105
95
75
70
49
4
108
105
88
83
59
5
108
108
94
94
69
6
108
108
105
105
78
7
108
108
108
108
86
8
108
108
108
108
95
9
108
108
108
108
105
10
108
108
108
108
108
Note:
1. Values are guaranteed by characterization and not 100% tested in production.
Enhanced Volatile Configuration Register
Table 14: Enhanced Volatile Configuration Register Bit Definitions
Note 1 applies to entire table
Bit
Name
Settings
Description
Notes
7
Quad I/O protocol
0 = Enabled
Enables or disables quad I/O protocol.
1 = Disabled (Default,
extended SPI protocol)
2
6
Dual I/O protocol
0 = Enabled
Enables or disables dual I/O protocol.
1 = Disabled (Default,
extended SPI protocol)
2
5
Reserved
X = Default
0b = Fixed value.
4
Reset/hold
0 = Disabled
1 = Enabled (Default)
Enables or disables hold or reset.
(Available on dedicated part numbers.)
3
VPP accelerator
0 = Enabled
1 = Disabled (Default)
Enables or disables VPP acceleration for QUAD
INPUT FAST PROGRAM and QUAD INPUT EXTENDED FAST PROGRAM OPERATIONS.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
Table 14: Enhanced Volatile Configuration Register Bit Definitions (Continued)
Note 1 applies to entire table
Bit
Name
2:0
Settings
Output driver strength 000 = Reserved
001 = 90 Ohms
010 = 60 Ohms
011 = 45 Ohms
100 = Reserved
101 = 20 Ohms
110 = 15 Ohms
111 = 30 (Default)
Notes:
Description
Notes
Optimizes impedance at VCC/2 output voltage.
1. Settings determine the device memory configuration upon a change of those settings by
the WRITE ENHANCED VOLATILE CONFIGURATION REGISTER command. The register is
read from or written to in all protocols by READ ENHANCED VOLATILE CONFIGURATION
REGISTER or WRITE ENHANCED VOLATILE CONFIGURATION REGISTER commands, respectively.
2. If bits 6 and 7 are both set to 0, the device operates in quad I/O. When either bit 6 or 7 is
reset to 0, the device operates in dual I/O or quad I/O, respectively, following the next
WRITE ENHANCED VOLATILE CONFIGURATION command.
Flag Status Register
Table 15: Flag Status Register Bit Definitions
Note 1 applies to entire table
Bit Name
Settings
Description
Notes
7
Program or
erase
controller
0 = Busy
1 = Ready
Status bit: Indicates whether a PROGRAM, ERASE,
WRITE STATUS REGISTER, or WRITE NONVOLATILE CONFIGURATION command cycle is in progress.
2, 3
6
Erase suspend
0 = Not in effect
1 = In effect
Status bit: Indicates whether an ERASE operation has
been or is going to be suspended.
3
5
Erase
0 = Clear
1 = Failure or protection error
Error bit: Indicates whether an ERASE operation has
succeeded or failed.
4, 5
4
Program
0 = Clear
1 = Failure or protection error
Error bit: Indicates whether a PROGRAM operation has
succeeded or failed. Moreover, indicates an attempt to
program a 0 to a 1 when VPP = VPPH and the data pattern is a multiple of 64 bits.
4, 5
3
VPP
0 = Enabled
1 = Disabled (Default)
Error bit: Indicates an invalid voltage on VPP during a
PROGRAM or ERASE operation.
4, 5
2
Program
suspend
0 = Not in effect
1 = In effect
Status bit: Indicates whether a PROGRAM operation
has been or is going to be suspended.
3
1
Protection
0 = Clear
1 = Failure or protection error
Error bit: Indicates whether an ERASE or a PROGRAM
operation has attempted to modify the protected array
sector. Moreover, indicates whether a PROGRAM operation has attempted to access the locked OTP space.
0
Reserved
Reserved
Reserved
Notes:
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4, 5
1. Register bits are read by READ FLAG STATUS REGISTER command. All bits are volatile.
25
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64Mb, 3V, Multiple I/O Serial Flash Memory
Nonvolatile and Volatile Registers
2. These program/erase controller settings apply only to PROGRAM or ERASE command cycles in progress; they do not apply to a WRITE command cycle in progress.
3. Status bits are reset automatically.
4. Error bits must be reset by CLEAR FLAG STATUS REGISTER command.
5. Typical errors include operation failures and protection errors caused by issuing a command before the error bit has been reset to 0.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Command Definitions
Command Definitions
Table 16: Command Set
Note 1 applies to entire table
Code
Extended
Dual
I/O
Quad
I/O
Data
Bytes
Notes
9E/9Fh
Yes
No
No
1 to 20
2
MULTIPLE I/O READ ID
AFh
No
Yes
Yes
1 to 3
2
READ SERIAL FLASH
DISCOVERY PARAMETER
5Ah
Yes
Yes
Yes
1 to ∞
5
READ
03h
Yes
No
No
1 to ∞
4
FAST READ
0Bh
Yes
Yes
Yes
DUAL OUTPUT FAST READ
3Bh
Yes
Yes
No
DUAL INPUT/OUTPUT FAST READ
0Bh
3Bh
BBh
Yes
Yes
No
QUAD OUTPUT FAST READ
6Bh
Yes
No
Yes
QUAD INPUT/OUTPUT FAST READ
0Bh
6Bh
EBh
Yes
No
Yes
WRITE ENABLE
06h
Yes
Yes
Yes
0
2
WRITE DISABLE
04h
Yes
Yes
Yes
1 to ∞
2
1
2, 8
Yes
Yes
Yes
1 to ∞
4
1
4, 8
1 to ∞
2
Command
IDENTIFICATION Operations
READ ID
READ Operations
5
1 to ∞
5
5, 6
1 to ∞
5
5, 7
WRITE Operations
REGISTER Operations
READ STATUS REGISTER
05h
WRITE STATUS REGISTER
01h
READ LOCK REGISTER
E8h
WRITE LOCK REGISTER
E5h
READ FLAG STATUS REGISTER
70h
CLEAR FLAG STATUS REGISTER
50h
READ NONVOLATILE
CONFIGURATION REGISTER
B5h
WRITE NONVOLATILE
CONFIGURATION REGISTER
B1h
READ VOLATILE
CONFIGURATION REGISTER
85h
WRITE VOLATILE
CONFIGURATION REGISTER
81h
READ ENHANCED VOLATILE
CONFIGURATION REGISTER
65h
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Yes
Yes
Yes
Yes
Yes
Yes
0
2
2
2, 8
Yes
Yes
27
Yes
Yes
Yes
Yes
1 to ∞
2
1
2, 8
1 to ∞
2
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64Mb, 3V, Multiple I/O Serial Flash Memory
Command Definitions
Table 16: Command Set (Continued)
Note 1 applies to entire table
Code
Extended
Dual
I/O
Quad
I/O
Data
Bytes
Notes
61h
Yes
Yes
Yes
1
2, 8
PAGE PROGRAM
02h
Yes
Yes
Yes
1 to 256
4, 8
DUAL INPUT FAST PROGRAM
A2h
Yes
Yes
No
1 to 256
4, 8
EXTENDED DUAL INPUT
FAST PROGRAM
02h
A2h
D2h
Yes
Yes
No
QUAD INPUT FAST PROGRAM
32h
Yes
No
Yes
EXTENDED QUAD INPUT
FAST PROGRAM
02h
32h
12h
Yes
No
Yes
SUBSECTOR ERASE
20h
Yes
Yes
Yes
SECTOR ERASE
D8h
Command
WRITE ENHANCED VOLATILE
CONFIGURATION REGISTER
PROGRAM Operations
4, 6, 8
1 to 256
4, 8
4, 7, 8
ERASE Operations
BULK ERASE
C7h
PROGRAM/ERASE RESUME
7Ah
PROGRAM/ERASE SUSPEND
75h
0
4, 8
4, 8
2, 8
Yes
Yes
Yes
0
Yes
Yes
Yes
1 to 64
2, 8
ONE-TIME PROGRAMMABLE (OTP) Operations
READ OTP ARRAY
4Bh
PROGRAM OTP ARRAY
42h
Notes:
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5
4
1. Yes in the protocol columns indicates that the command is supported and has the same
functionality and command sequence as other commands marked Yes.
2. Address bytes = 0. Dummy clock cycles = 0.
3. Address bytes = 3. Dummy clock cycles default = 8.
4. Address bytes = 3. Dummy clock cycles = 0.
5. Address bytes = 3. Dummy clock cycles default = 8. Dummy clock cycles default = 10
(when quad SPI protocol is enabled). Dummy clock cycles is configurable by the user.
6. When the device is in dual SPI protocol, the command can be entered with any of these
three codes. The different codes enable compatibility between dual SPI and extended
SPI protocols.
7. When the device is in quad SPI protocol, the command can be entered with any of these
three codes. The different codes enable compatibility between quad SPI and extended
SPI protocols.
8. The WRITE ENABLE command must be issued first before this command can be executed.
28
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
READ REGISTER and WRITE REGISTER Operations
READ STATUS REGISTER or FLAG STATUS REGISTER Command
To initiate a READ STATUS REGISTER command, S# is driven LOW. For extended SPI
protocol, the command code is input on DQ0, and output on DQ1. For dual SPI protocol, the command code is input on DQ[1:0], and output on DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0], and is output on DQ[3:0]. The operation is
terminated by driving S# HIGH at any time during data output.
The status register can be read continuously and at any time, including during a PROGRAM, ERASE, or WRITE operation.
The flag status register can be read continuously and at any time, including during an
ERASE or WRITE operation.
If one of these operations is in progress, checking the write in progress bit or P/E controller bit is recommended before executing the command.
Figure 11: READ REGISTER Command
Extended
0
7
9
8
10
11
12
13
14
15
C
LSB
Command
DQ0
MSB
LSB
DOUT
High-Z
DQ1
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
MSB
Dual
0
3
4
5
6
7
C
LSB
MSB
Quad
LSB
DOUT
DOUT
Command
DQ[1:0]
DOUT
DOUT
DOUT
MSB
0
1
2
3
C
LSB
Command
DQ[3:0]
MSB
Notes:
DOUT
LSB
DOUT
DOUT
Don’t Care
MSB
1. Supports all READ REGISTER commands except READ LOCK REGISTER.
2. A READ NONVOLATILE CONFIGURATION REGISTER operation will output data starting
from the least significant byte.
READ NONVOLATILE CONFIGURATION REGISTER Command
To execute a READ NONVOLATILE CONFIGURATION REGISTER command, S# is driven LOW. For extended SPI protocol, the command code is input on DQ0, and output on
DQ1. For dual SPI protocol, the command code is input on DQ[1:0], and output on
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0], and is output
on DQ[3:0]. The operation is terminated by driving S# HIGH at any time during data
output.
The nonvolatile configuration register can be read continuously. After all 16 bits of the
register have been read, a 0 is output. All reserved fields output a value of 1.
READ VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command
To execute a READ VOLATILE CONFIGURATION REGISTER command or a READ ENHANCED VOLATILE CONFIGURATION REGISTER command, S# is driven LOW. For extended SPI protocol, the command code is input on DQ0, and output on DQ1. For dual
SPI protocol, the command code is input on DQ[1:0], and output on DQ[1:0]. For quad
SPI protocol, the command code is input on DQ[3:0], and is output on DQ[3:0]. The operation is terminated by driving S# HIGH at any time during data output.
When the register is read continuously, the same byte is output repeatedly.
WRITE STATUS REGISTER Command
To issue a WRITE STATUS REGISTER command, the WRITE ENABLE command must be
executed to set the write enable latch bit to 1. S# is driven LOW and held LOW until the
eighth bit of the last data byte has been latched in, after which it must be driven HIGH.
For extended SPI protocol, the command code is input on DQ0, followed by the data
bytes. For dual SPI protocol, the command code is input on DQ[1:0], followed by the data bytes. For quad SPI protocol, the command code is input on DQ[3:0], followed by the
data bytes. When S# is driven HIGH, the operation, which is self-timed, is initiated; its
duration is tW.
This command is used to write new values to status register bits 7:2, enabling software
data protection. The status register can also be combined with the W#/V PP signal to
provide hardware data protection. The WRITE STATUS REGISTER command has no effect on status register bits 1:0.
When the operation is in progress, the write in progress bit is set to 1. The write enable
latch bit is cleared to 0, whether the operation is successful or not. The status register
and flag status register can be polled for the operation status. When the operation completes, the write in progress bit is cleared to 0, whether the operation is successful or
not.
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
Figure 12: WRITE REGISTER Command
Extended
0
7
8
9
10
11
12
13
15
14
C
LSB
LSB
DIN
Command
DQ0
MSB
Dual
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
0
3
4
5
6
7
C
LSB
MSB
Quad
LSB
DIN
Command
DQ[1:0]
DIN
DIN
DIN
DIN
MSB
0
1
2
3
C
LSB
LSB
Command
DQ[3:0]
MSB
Notes:
DIN
DIN
DIN
MSB
1. Supports all WRITE REGISTER commands except WRITE LOCK REGISTER.
2. Waveform must be extended for each protocol, to 23 for extended, 11 for dual, and 5
for quad.
3. A WRITE NONVOLATILE CONFIGURATION REGISTER operation requires data being sent
starting from least significant byte.
WRITE NONVOLATILE CONFIGURATION REGISTER Command
To execute the WRITE NONVOLATILE CONFIGURATION REGISTER command, the
WRITE ENABLE command must be executed to set the write enable latch bit to 1. S# is
driven LOW and held LOW until the 16th bit of the last data byte has been latched in,
after which it must be driven HIGH. For extended SPI protocol, the command code is
input on DQ0, followed by two data bytes. For dual SPI protocol, the command code is
input on DQ[1:0], followed by the data bytes. For quad SPI protocol, the command code
is input on DQ[3:0], followed by the data bytes. When S# is driven HIGH, the operation,
which is self-timed, is initiated; its duration is tWNVCR.
When the operation is in progress, the write in progress bit is set to 1. The write enable
latch bit is cleared to 0, whether the operation is successful or not. The status register
and flag status register can be polled for the operation status. When the operation completes, the write in progress bit is cleared to 0, whether the operation is successful or
not. If S# is not driven HIGH, the command is not executed, flag status register error
bits are not set, and the write enable latch remains set to 1.
WRITE VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command
To execute a WRITE VOLATILE CONFIGURATION REGISTER command or a WRITE
ENHANCED VOLATILE CONFIGURATION REGISTER command, the WRITE ENABLE
command must be executed to set the write enable latch bit to 1. S# is driven LOW and
held LOW until the eighth bit of the last data byte has been latched in, after which it
must be driven HIGH. For extended SPI protocol, the command code is input on DQ0,
followed by the data bytes. For dual SPI protocol, the command code is input on
DQ[1:0], followed by the data bytes. For quad SPI protocol, the command code is input
on DQ[3:0], followed by the data bytes.
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DIN
64Mb, 3V, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
If S# is not driven HIGH, the command is not executed, the flag status register error bits
are not set and the write enable latch remains set to 1. Reserved bits are not affected by
this command.
READ LOCK REGISTER Command
To execute the READ LOCK REGISTER command, S# is driven LOW. For extended SPI
protocol, the command code is input on DQ0, followed by three address bytes that
point to a location in the sector. For dual SPI protocol, the command code is input on
DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0]. Each address
bit is latched in during the rising edge of the clock. For extended SPI protocol, data is
shifted out on DQ1 at a maximum frequency fC during the falling edge of the clock. For
dual SPI protocol, data is shifted out on DQ[1:0], and for quad SPI protocol, data is shifted out on DQ[3:0]. The operation is terminated by driving S# HIGH at any time during
data output.
When the register is read continuously, the same byte is output repeatedly. Any READ
LOCK REGISTER command that is executed while an ERASE, PROGRAM, or WRITE cycle is in progress is rejected with no affect on the cycle in progress.
Table 17: Lock Register
Note 1 applies to entire table
Bit
Name
Settings
Description
Reserved
0
Bit values are 0.
1
Sector lock down
0 = Cleared (Default) Volatile bit: the device always powers-up with this bit cleared,
1 = Set
which means sector lock down and sector write lock bits can be
set.
When this bit set, neither of the lock register bits can be written
to until the next power cycle.
0
Sector write lock
0 = Cleared (Default) Volatile bit: the device always powers-up with this bit cleared,
1 = Set
which means that PROGRAM and ERASE operations in this sector
can be executed and sector content modified.
When this bit is set, PROGRAM and ERASE operations in this sector will not be executed.
Note:
1. Sector lock register bits 1:0 are written to by the WRITE LOCK REGISTER command. The
command will not execute unless the sector lock down bit is cleared.
7:2
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
Figure 13: READ LOCK REGISTER Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ[0]
MSB
A[MAX]
DOUT
High-Z
DQ1
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
Dual
0
3
4
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[1:0]
MSB
A[MAX]
Quad
0
1
MSB
2
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[3:0]
MSB
A[MAX]
Note:
LSB
DOUT
DOUT
Don’t Care
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + ((A[MAX] + 1)/2).
For quad SPI protocol, Cx = 1 + ((A[MAX] + 1)/4).
WRITE LOCK REGISTER Command
To initiate the WRITE LOCK REGISTER command, the WRITE ENABLE command must
be executed to set the write enable latch bit to 1. S# is driven LOW and held LOW until
the eighth bit of the last data byte has been latched in, after which it must be driven
HIGH. The command code is input on DQn, followed by three address bytes that point
to a location in the sector, and then one data byte that contains the desired settings for
lock register bits 0 and 1. Each address bit is latched in during the rising edge of the
clock.
When execution is complete, the write enable latch bit is cleared within tSHSL2 and no
error bits are set. Because lock register bits are volatile, change to the bits is immediate.
WRITE LOCK REGISTER can be executed when an ERASE SUSPEND operation is in effect. If S# is not driven HIGH, the command is not executed, flag status register error
bits are not set, and the write enable latch remains set to 1.
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ REGISTER and WRITE REGISTER Operations
Figure 14: WRITE LOCK REGISTER Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
LSB
Command
DQ0
MSB
A[MAX]
Dual
0
3
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
4
Cx
C
LSB
A[MIN]
LSB
Command
DQ[1:0]
MSB
A[MAX]
Quad
0
1
DIN
MSB
2
Cx
C
LSB
A[MIN]
LSB
Command
DQ[3:0]
MSB
A[MAX]
Note:
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + ((A[MAX] + 1)/2).
For quad SPI protocol, Cx = 1 + ((A[MAX] + 1)/4).
CLEAR FLAG STATUS REGISTER Command
To execute the CLEAR FLAG STATUS REGISTER command and reset the error bits
(erase, program, and protection), S# is driven LOW. For extended SPI protocol, the command code is input on DQ0. For dual SPI protocol, the command code is input on
DQ[1:0]. For quad SPI protocol, the command code is input on DQ[3:0]. The operation
is terminated by driving S# HIGH at any time.
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ IDENTIFICATION Operations
READ IDENTIFICATION Operations
READ ID and MULTIPLE I/O READ ID Commands
To execute the READ ID or MULTIPLE I/O READ ID commands, S# is driven LOW and
the command code is input on DQn. The device outputs the information shown in the
tables below. If an ERASE or PROGRAM cycle is in progress when the command is executed, the command is not decoded and the command cycle in progress is not affected.
When S# is driven HIGH, the device goes to standby. The operation is terminated by
driving S# HIGH at any time during data output.
Table 18: Data/Address Lines for READ ID and MULTIPLE I/O READ ID Commands
Command Name
READ ID
MULTIPLE I/O READ ID
Note:
Data In
Data Out
Unique ID
is Output
Extended
Dual
Quad
DQ0
DQ0
Yes
Yes
No
No
DQ[3:0]
DQ[1:0]
No
No
Yes
Yes
1. Yes in the protocol columns indicates that the command is supported and has the same
functionality and command sequence as other commands marked Yes.
Table 19: Read ID Data Out
Size
(Bytes)
Name
Content Value
1
Manufacturer ID
20h
JEDEC
2
Device ID
Memory Type
BAh
Manufacturer
Memory Capacity
17h (64Mb)
17
Assigned by
Unique ID
1 Byte: Length of data to follow
10h
2 Bytes: Extended device ID and device
configuration information
ID and information such as uniform
architecture, and HOLD
or RESET functionality
14 Bytes: Customized factory data
Unique ID code (n read-only bytes)
Note:
Factory
1. The 17 bytes of information in the unique ID is read by the READ ID command, but cannot be read by the MULTIPLE I/O READ ID command.
Table 20: Extended Device ID, First Byte
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Reserved
Reserved
1 = Reverse BP
scheme
0 = Standard BP
scheme
Volatile configuration
register, XIP bit setting:
0 = Required
1 = Not required
HOLD#/RESET#:
0 = HOLD
1 = RESET
Addressing:
0 = by byte
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Bit 1
Bit 0
Architecture:
00 = Uniform
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ IDENTIFICATION Operations
Figure 15: READ ID and MULTIPLE I/O Read ID Commands
Extended (READ ID)
0
7
16
15
8
31
32
C
LSB
DQ0
Command
MSB
LSB
DOUT
DOUT
High-Z
DQ1
MSB
DOUT
MSB
Manufacturer
identification
Dual (MULTIPLE I/O READ ID )
0
LSB
DOUT
3
MSB
UID
Device
identification
8
7
4
LSB
DOUT
DOUT
15
C
LSB
DQ[1:0]
LSB
DOUT
DOUT
Command
MSB
MSB
DOUT
MSB
Manufacturer
identification
Quad (MULTIPLE I/O READ ID )
0
LSB
DOUT
1
Device
identification
4
3
2
7
C
LSB
DQ[3:0]
Command
MSB
DOUT
LSB
DOUT
MSB
LSB
DOUT
MSB
Manufacturer
identification
Note:
DOUT
Device
identification
Don’t Care
1. The READ ID command is represented by the extended SPI protocol timing shown first.
The MULTIPLE I/O READ ID command is represented by the dual and quad SPI protocols
are shown below extended SPI protocol.
READ SERIAL FLASH DISCOVERY PARAMETER Command
To execute READ SERIAL FLASH DISCOVERY PARAMETER command, S# is driven
LOW. The command code is input on DQ0, followed by three address bytes and 8 dummy clock cycles in extended or dual SPI protocol, 10 dummy clock cycles in quad SPI
protocol. The device outputs the information starting from the specified address. When
the 2048-byte boundary is reached, the data output wraps to address 0 of the serial
Flash discovery parameter table. The operation is terminated by driving S# HIGH at any
time during data output.
The operation always executes in continuous mode so the read burst wrap setting in the
volatile configuration register does not apply.
Note: Data to be stored in the serial Flash discovery parameter area is still in the definition phase.
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ IDENTIFICATION Operations
Table 21: Serial Flash Discovery Parameter – Header Structure
Description
Byte
Address
Bits
Data
00h
7:0
53h
01h
7:0
46h
02h
7:0
44h
SFDP signature
03h
7:0
50h
Minor
04h
7:0
00h
Major
05h
7:0
01h
Number of parameter headers
06h
7:0
00h
Unused
07h
7:0
FFh
Parameter ID (0)
08h
7:0
00h
Parameter minor revision
09h
7:0
00h
Parameter major revision
0Ah
7:0
01h
Parameter length (in DW)
0Bh
7:0
09h
Parameter table pointer
0Ch
7:0
30h
0Dh
7:0
00h
0Eh
7:0
00h
0Fh
7:0
FFh
SFDP revision
Unused
Note:
1. Locations 10h to 2Fh contain FFh.
Table 22: Parameter ID
Description
Minimum block/sector erase sizes
Byte
Address
Bits
Data
30h
1:0
01b
Write granularity
2
1
WRITE ENABLE command required for writing to volatile status
registers
3
0
WRITE ENABLE command code select for writing to volatile status
register
4
0
Unused
7:5
111b
4KB ERASE command code
31h
7:0
20h
Supports 1-1-2 fast read
32h
0
1
2:1
00b
Supports double transfer rate clocking
3
0
Supports 1-2-2 fast read
4
1
Supports 1-4-4 fast read
5
1
Supports 1-1-4 fast read
6
1
Address bytes
Unused
Reserved
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33h
37
7
1
7:0
FFh
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ IDENTIFICATION Operations
Table 22: Parameter ID (Continued)
Description
Flash size (in bits)
1-4-4 FAST READ DUMMY cycle count
Byte
Address
Bits
Data
34h
7:0
FFh
35h
7:0
FFh
36h
7:0
FFh
37h
7:0
03h
38h
4:0
01001b
7:5
001b
1-4-4 fast read number of mode bits
1-4-4 FAST READ command code
39h
7:0
EBh
1-1-4 FAST READ DUMMY cycle count
3Ah
4:0
00111b
7:5
001b
1-1-4 fast read number of mode bits
1-1-4 FAST READ command code
3Bh
7:0
6Bh
1-1-2 FAST READ DUMMY cycle count
3Ch
4:0
01000b
1-1-2 fast read number of mode bits
7:5
000b
1-1-2 FAST READ command code
3Dh
7:0
3Bh
1-2-2 FAST READ DUMMY cycle count
3Eh
4:0
00111b
7:5
001b
1-2-2 fast read number of mode bits
1-2-2 Instruction opcode
3Fh
7:0
BBh
Supports 2-2-2 fast read
40h
0
1
3:1
111b
4
1
Reserved
Supports 4-4-4 fast read
Reserved
7:5
111b
Reserved
43:41h
FFFFFFh
FFFFFFh
Reserved
45:44h
FFFFh
FFFFh
46h
4:0
00111b
2-2-2 FAST READ DUMMY cycle count
2-2-2 fast read number of mode bits
2-2-2 FAST READ command code
Reserved
4-4-4 FAST READ DUMMY cycle count
7:5
001b
47h
7:0
BBh
49:48h
FFFFh
FFFFh
4Ah
4:0
01001b
4-4-4 fast read number of mode bits
7:5
001b
4-4-4 FAST READ command code
4Bh
7:0
EBh
Sector type 1 size
4Ch
7:0
0Ch
Sector type 1 command code
4Dh
7:0
20h
Sector type 2 size
4Eh
7:0
10h
Sector type 2 command code
4Fh
7:0
D8h
Sector type 3 size
50h
7:0
00h
Sector type 3 command code
51h
7:0
00h
Sector type 4 size
52h
7:0
00h
Sector type 4 command code
53h
7:0
00h
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ MEMORY Operations
READ MEMORY Operations
The device supports default reading and writing to an A[MAX:MIN] of A[23:0].
To execute READ MEMORY commands, S# is driven LOW. The command code is input
on DQn, followed by input on DQn of three address bytes. Each address bit is latched in
during the rising edge of the clock. The addressed byte can be at any location, and the
address automatically increments to the next address after each byte of data is shifted
out; therefore, the entire memory can be read with a single command. The operation is
terminated by driving S# HIGH at any time during data output.
Table 23: Command/Address/Data Lines for READ MEMORY Commands
Note 1 applies to entire table
Command Name
DUAL
QUAD
DUAL OUTPUT INPUT/OUTPUT QUAD OUTPUT INPUT/OUTPUT
FAST READ
FAST READ
FAST READ
FAST READ
READ
FAST
READ
03
0B
3B
BB
6B
EB
Supported
Yes
Yes
Yes
Yes
Yes
Yes
Command Input
DQ0
DQ0
DQ0
DQ0
DQ0
DQ0
Address Input
DQ0
DQ0
DQ0
DQ[1:0]
DQ0
DQ[3:0]
Data Output
DQ1
DQ1
DQ[1:0]
DQ[1:0]
DQ[3:0]
DQ[3:0]
Extended SPI Protocol
Dual SPI Protocol
Supported
No
Yes
Yes
Yes
No
No
Command Input
–
DQ[1:0]
DQ[1:0]
DQ[1:0]
–
–
Address Input
–
DQ[1:0]
DQ[1:0]
DQ[1:0]
–
–
Data Output
–
DQ[1:0]
DQ[1:0]
DQ[1:0]
–
–
No
Yes
No
No
Yes
Yes
Command Input
–
DQ[3:0]
–
–
DQ[3:0]
DQ[3:0]
Address Input
–
DQ[3:0]
–
–
DQ[3:0]
DQ[3:0]
Data Output
–
DQ[3:0]
–
–
DQ[3:0]
DQ[3:0]
Quad SPI Protocol
Supported
Notes:
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1. Yes in the "Supported" row for each protocol indicates that the command in that column is supported; when supported, a command's functionality is identical for the entire
column regardless of the protocol. For example, a FAST READ functions the same for all
three protocols even though its data is input/output differently depending on the protocol.
2. FAST READ is similar to READ, but requires dummy clock cycles following the address
bytes and can operate at a higher frequency (fC).
39
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ MEMORY Operations
Figure 16: READ Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ[0]
MSB
A[MAX]
DOUT
High-Z
DQ1
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
Don’t Care
Note:
1. Cx = 7 + (A[MAX] + 1).
Figure 17: FAST READ Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ0
MSB
A[MAX]
DQ1
DOUT
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
Dummy cycles
Dual
0
3
4
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[1:0]
MSB
A[MAX]
MSB
Dummy cycles
Quad
0
1
2
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[3:0]
MSB
A[MAX]
MSB
Don’t Care
Dummy cycles
Note:
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LSB
DOUT
DOUT
1. For extended protocol, Cx = 7 + (A[MAX] + 1); For dual protocol, Cx = 3 + (A[MAX] + 1)/2;
For quad protocol, Cx = 1 + (A[MAX] + 1)/4.
40
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ MEMORY Operations
Figure 18: DUAL OUTPUT FAST READ
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ0
MSB
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
A[MAX]
High-Z
DQ1
DOUT
MSB
Dummy cycles
Dual
0
3
4
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[1:0]
MSB
A[MAX]
DOUT
MSB
Dummy cycles
Note:
1. Cx = 7 + (A[MAX] + 1).
Figure 19: DUAL INPUT/OUTPUT FAST READ Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ0
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
High-Z
DQ1
A[MAX]
DOUT
MSB
Dummy cycles
Dual
0
3
4
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[1:0]
MSB
A[MAX]
DOUT
MSB
Dummy cycles
Note:
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1. Cx = 7 + (A[MAX] + 1)/2.
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64Mb, 3V, Multiple I/O Serial Flash Memory
READ MEMORY Operations
Figure 20: QUAD OUTPUT FAST READ Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
DOUT
LSB
DOUT
DOUT
High-Z
DOUT
DOUT
DOUT
‘1’
DOUT
DOUT
DOUT
Command
DQ0
MSB
A[MAX]
DQ[2:1]
DQ3
MSB
Dummy cycles
Quad
0
1
2
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[3:0]
MSB
A[MAX]
LSB
DOUT
DOUT
MSB
Dummy cycles
Note:
1. Cx = 7 + (A[MAX] + 1).
Figure 21: QUAD INPUT/OUTPUT FAST READ Command
Extended
0
7
8
Cx
C
LSB
DQ0
Command
DOUT
LSB
DOUT
DOUT
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
A[MIN]
MSB
DQ[2:1]
‘1’
DQ3
A[MAX]
MSB
Dummy cycles
Quad
0
1
2
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[3:0]
MSB
A[MAX]
LSB
DOUT
DOUT
MSB
Dummy cycles
Note:
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1. Cx = 7 + (A[MAX] + 1)/4.
42
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64Mb, 3V, Multiple I/O Serial Flash Memory
PROGRAM Operations
PROGRAM Operations
PROGRAM commands are initiated by first executing the WRITE ENABLE command to
set the write enable latch bit to 1. S# is then driven LOW and held LOW until the eighth
bit of the last data byte has been latched in, after which it must be driven HIGH. The
command code is input on DQ0, followed by input on DQ[n] of address bytes and at
least one data byte. Each address bit is latched in during the rising edge of the clock.
When S# is driven HIGH, the operation, which is self-timed, is initiated; its duration is
tPP.
If the bits of the least significant address, which is the starting address, are not all zero,
all data transmitted beyond the end of the current page is programmed from the starting address of the same page. If the number of bytes sent to the device exceed the maximum page size, previously latched data is discarded and only the last maximum pagesize number of data bytes are guaranteed to be programmed correctly within the same
page. If the number of bytes sent to the device is less than the maximum page size, they
are correctly programmed at the specified addresses without any effect on the other
bytes of the same page.
When the operation is in progress, the write in progress bit is set to 1. The write enable
latch bit is cleared to 0, whether the operation is successful or not. The status register
and flag status register can be polled for the operation status. An operation can be
paused or resumed by the PROGRAM/ERASE SUSPEND or PROGRAM/ERASE RESUME
command, respectively. When the operation completes, the write in progress bit is
cleared to 0.
If the operation times out, the write enable latch bit is reset and the program fail bit is
set to 1. If S# is not driven HIGH, the command is not executed, flag status register error
bits are not set, and the write enable latch remains set to 1. When a command is applied
to a protected sector, the command is not executed, the write enable latch bit remains
set to 1, and flag status register bits 1 and 4 are set.
Table 24: Data/Address Lines for PROGRAM Commands
Note 1 applies to entire table
Command Name
PAGE PROGRAM
Data In
Address In
Extended
Dual
Quad
DQ0
DQ0
Yes
Yes
Yes
DUAL INPUT FAST PROGRAM
DQ[1:0]
DQ0
Yes
Yes
No
EXTENDED DUAL INPUT
FAST PROGRAM
DQ[1:0]
DQ[1:0]
Yes
Yes
No
QUAD INPUT FAST PROGRAM
DQ[3:0]
DQ0
Yes
No
Yes
EXTENDED QUAD INPUT
FAST PROGRAM
DQ[3:0]
DQ[3:0]
Yes
No
Yes
Note:
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1. Yes in the protocol columns indicates that the command is supported and has the same
functionality and command sequence as other commands marked Yes.
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64Mb, 3V, Multiple I/O Serial Flash Memory
PROGRAM Operations
Figure 22: PAGE PROGRAM Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
LSB
Command
DQ0
MSB
A[MAX]
Dual
0
3
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
4
Cx
C
LSB
A[MIN]
LSB
Command
DQ[1:0]
MSB
A[MAX]
Quad
0
1
DIN
MSB
2
Cx
C
LSB
A[MIN]
LSB
Command
DQ[3:0]
MSB
A[MAX]
Note:
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
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64Mb, 3V, Multiple I/O Serial Flash Memory
PROGRAM Operations
Figure 23: DUAL INPUT FAST PROGRAM Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ0
MSB
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
A[MAX]
High-Z
DQ1
LSB
DIN
MSB
Dual
0
3
4
Cx
C
LSB
A[MIN]
LSB
DIN
Command
DQ[1:0]
MSB
Note:
A[MAX]
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
Figure 24: EXTENDED DUAL INPUT FAST PROGRAM Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
LSB
Command
DQ0
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
High-Z
DQ1
A[MAX]
Dual
0
3
MSB
4
Cx
C
LSB
A[MIN]
LSB
Command
DQ[1:0]
MSB
Note:
A[MAX]
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1)/2.
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
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64Mb, 3V, Multiple I/O Serial Flash Memory
PROGRAM Operations
Figure 25: QUAD INPUT FAST PROGRAM Command
Extended
0
7
8
Cx
C
LSB
DQ0
MSB
DQ[3:1]
A[MIN]
LSB
Command
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
A[MAX]
High-Z
MSB
Quad
0
1
2
Cx
C
A[MIN]
LSB
MSB
Note:
LSB
Command
DQ[3:0]
A[MAX]
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1)/4.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
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64Mb, 3V, Multiple I/O Serial Flash Memory
PROGRAM Operations
Figure 26: EXTENDED QUAD INPUT FAST PROGRAM Command
Extended
0
7
8
Cx
C
LSB
DQ0
A[MIN]
LSB
DIN
DIN
DIN
High-Z
DIN
DIN
DIN
‘1’
DIN
DIN
DIN
DIN
DIN
Command
MSB
DQ[2:1]
DQ3
A[MAX]
Quad
0
1
MSB
2
Cx
C
LSB
MSB
Note:
A[MIN]
LSB
Command
DQ[3:0]
A[MAX]
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1)/4.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
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64Mb, 3V, Multiple I/O Serial Flash Memory
WRITE Operations
WRITE Operations
WRITE ENABLE Command
The WRITE ENABLE operation sets the write enable latch bit. To execute a WRITE ENABLE command, S# is driven LOW and held LOW until the eighth bit of the command
code has been latched in, after which it must be driven HIGH. The command code is
input on DQ0 for extended SPI protocol, on DQ[1:0] for dual SPI protocol, and on
DQ[3:0] for quad SPI protocol.
The write enable latch bit must be set before every PROGRAM, ERASE, and WRITE command. If S# is not driven HIGH after the command code has been latched in, the command is not executed, flag status register error bits are not set, and the write enable
latch remains cleared to its default setting of 0.
WRITE DISABLE Command
The WRITE DISABLE operation clears the write enable latch bit. To execute a WRITE
DISABLE command, S# is driven LOW and held LOW until the eighth bit of the command code has been latched in, after which it must be driven HIGH. The command
code is input on DQ0 for extended SPI protocol, on DQ[1:0] for dual SPI protocol, and
on DQ[3:0] for quad SPI protocol.
If S# is not driven HIGH after the command code has been latched in, the command is
not executed, flag status register error bits are not set, and the write enable latch remains set to 1.
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64Mb, 3V, Multiple I/O Serial Flash Memory
WRITE Operations
Figure 27: WRITE ENABLE and WRITE DISABLE Command Sequence
Extended
0
1
2
3
4
5
6
7
C
S#
Command Bits
DQ0
0
0
0
0
0
LSB
1
1
0
MSB
High-Z
DQ1
Dual
0
1
2
3
C
S#
Command Bits
DQ0
DQ1
LSB
0
0
1
0
0
0
0
1
MSB
Quad
0
1
C
S#
Command Bits LSB
DQ0
0
0
DQ1
0
1
DQ2
0
1
DQ3
0
0
Don’t Care
MSB
Note:
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1. Shown here is the WRITE ENABLE command code, which is 06h or 0000 0110 binary. The
WRITE DISABLE command sequence is identical, except the WRITE DISABLE command
code is 04h or 0000 0100 binary.
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64Mb, 3V, Multiple I/O Serial Flash Memory
ERASE Operations
ERASE Operations
SUBSECTOR ERASE Command
To execute the SUBSECTOR ERASE command (and set the selected subsector bits set to
FFh), the WRITE ENABLE command must be issued to set the write enable latch bit to
1. S# is driven LOW and held LOW until the eighth bit of the last data byte has been
latched in, after which it must be driven HIGH. The command code is input on DQ0,
followed by three address bytes; any address within the subsector is valid. Each address
bit is latched in during the rising edge of the clock. When S# is driven HIGH, the operation, which is self-timed, is initiated; its duration is tSSE. The operation can be suspended and resumed by the PROGRAM/ERASE SUSPEND and PROGRAM/ERASE RESUME
commands, respectively.
If the write enable latch bit is not set, the device ignores the SUBSECTOR ERASE command and no error bits are set to indicate operation failure.
When the operation is in progress, the write in progress bit is set to 1. The write enable
latch bit is cleared to 0, whether the operation is successful or not. The status register
and flag status register can be polled for the operation status. When the operation completes, the write in progress bit is cleared to 0.
If the operation times out, the write enable latch bit is reset and the erase error bit is set
to 1. If S# is not driven HIGH, the command is not executed, flag status register error
bits are not set, and the write enable latch remains set to 1. When a command is applied
to a protected subsector, the command is not executed. Instead, the write enable latch
bit remains set to 1, and flag status register bits 1 and 5 are set.
SECTOR ERASE Command
To execute the SECTOR ERASE command (and set selected sector bits to FFh), the
WRITE ENABLE command must be issued to set the write enable latch bit to 1. S# is
driven LOW and held LOW until the eighth bit of the last data byte has been latched in,
after which it must be driven HIGH. The command code is input on DQ0, followed by
three address bytes; any address within the sector is valid. Each address bit is latched in
during the rising edge of the clock. When S# is driven HIGH, the operation, which is
self-timed, is initiated; its duration is tSE. The operation can be suspended and resumed
by the PROGRAM/ERASE SUSPEND and PROGRAM/ERASE RESUME commands, respectively.
If the write enable latch bit is not set, the device ignores the SECTOR ERASE command
and no error bits are set to indicate operation failure.
When the operation is in progress, the write in progress bit is set to 1 and the write enable latch bit is cleared to 0, whether the operation is successful or not. The status register and flag status register can be polled for the operation status. When the operation
completes, the write in progress bit is cleared to 0.
If the operation times out, the write enable latch bit is reset and erase error bit is set to
1. If S# is not driven HIGH, the command is not executed, flag status register error bits
are not set, and the write enable latch remains set to 1. When a command is applied to a
protected sector, the command is not executed. Instead, the write enable latch bit remains set to 1, and flag status register bits 1 and 5 are set.
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64Mb, 3V, Multiple I/O Serial Flash Memory
ERASE Operations
Figure 28: SUBSECTOR and SECTOR ERASE Command
Extended
0
7
8
Cx
C
LSB
DQ0
A[MIN]
Command
MSB
Dual
A[MAX]
0
3
4
Cx
C
LSB
DQ0[1:0]
A[MIN]
Command
MSB
Quad
A[MAX]
0
1
2
Cx
C
LSB
MSB
Note:
A[MIN]
Command
DQ0[3:0]
A[MAX]
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
BULK ERASE Command
To initiate the BULK ERASE command, the WRITE ENABLE command must be issued
to set the write enable latch bit to 1. S# is driven LOW and held LOW until the eighth bit
of the last data byte has been latched in, after which it must be driven HIGH. The command code is input on DQ0. When S# is driven HIGH, the operation, which is selftimed, is initiated; its duration is tBE.
If the write enable latch bit is not set, the device ignores the BULK ERASE command
and no error bits are set to indicate operation failure.
When the operation is in progress, the write in progress bit is set to 1 and the write enable latch bit is cleared to 0, whether the operation is successful or not. The status register and flag status register can be polled for the operation status. When the operation
completes, the write in progress bit is cleared to 0.
If the operation times out, the write enable latch bit is reset and erase error bit is set to
1. If S# is not driven HIGH, the command is not executed, the flag status register error
bits are not set, and the write enable latch remains set to 1.
The command is not executed if any sector is locked. Instead, the write enable latch bit
remains set to 1, and flag status register bits 1 and 5 are set.
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64Mb, 3V, Multiple I/O Serial Flash Memory
ERASE Operations
Figure 29: BULK ERASE Command
Extended
0
7
C
LSB
Command
DQ0
MSB
Dual
0
3
C
LSB
Command
DQ0[1:0]
MSB
Quad
0
1
C
LSB
Command
DQ0[3:0]
MSB
PROGRAM/ERASE SUSPEND Command
To initiate the PROGRAM/ERASE SUSPEND command, S# is driven LOW. The command code is input on DQ0. The operation is terminated by the PROGRAM/ERASE RESUME command.
PROGRAM/ERASE SUSPEND command enables the memory controller to interrupt
and suspend an array PROGRAM or ERASE operation within the program/erase latency.
If a SUSPEND command is issued during a PROGRAM operation, then the flag status
register bit 2 is set to 1. After erase/program latency time, the flag status register bit 7 is
also set to 1, showing the device to be in a suspended state, waiting for any operation
(see the Operations Allowed/Disallowed During Device States table).
If a SUSPEND command is issued during an ERASE operation, then the flag status register bit 6 is set to 1. After erase/program latency time, the flag status register bit 7 is also
set to 1, showing that device to be in a suspended state, waiting for any operation (see
the Operations Allowed/Disallowed During Device States table).
If the time remaining to complete the operation is less than the suspend latency, the device completes the operation and clears the flag status register bits 2 or 6, as applicable.
Because the suspend state is volatile, if there is a power cycle, the suspend state information is lost and the flag status register powers up as 80h.
During an ERASE SUSPEND operation, a PROGRAM or READ operation is possible in
any sector except the one in a suspended state. Reading from a sector that is in a suspended state will output indeterminate data. The device ignores a PROGRAM command to a sector that is in an ERASE SUSPEND state; it also sets the flag status register
bit 4 to 1: program failure/protection error, and leaves the write enable latch bit unchanged. The commands allowed during an erase suspend state include the WRITE
LOCK REGISTER command, the WRITE VOLATILE CONFIGURATION REGISTER com-
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64Mb, 3V, Multiple I/O Serial Flash Memory
ERASE Operations
mand, and the WRITE ENHANCED VOLATILE CONFIGURATION REGISTER command.
When the ERASE operation resumes, it does not check the new lock status of the WRITE
LOCK REGISTER command.
During a PROGRAM SUSPEND operation, a READ operation is possible in any page except the one in a suspended state. Reading from a page that is in a suspended state will
output indeterminate data. The commands allowed during a program suspend state include the WRITE VOLATILE CONFIGURATION REGISTER command and the WRITE
ENHANCED VOLATILE CONFIGURATION REGISTER command.
It is possible to nest a PROGRAM/ERASE SUSPEND operation inside a PROGRAM/
ERASE SUSPEND operation just once. Issue an ERASE command and suspend it. Then
issue a PROGRAM command and suspend it also. With the two operations suspended,
the next PROGRAM/ERASE RESUME command resumes the latter operation, and a second PROGRAM/ERASE RESUME command resumes the former (or first) operation.
Table 25: Operations Allowed/Disallowed During Device States
Note 1 applies to entire table
Standby
Operation
State
Program or
Erase State
Subsector Erase Suspend or
Program Suspend State
Erase Suspend
State
Notes
READ
Yes
No
Yes
Yes
2
PROGRAM
Yes
No
No
Yes/No
3
ERASE
Yes
No
No
No
4
WRITE
Yes
No
No
No
5
WRITE
Yes
No
Yes
Yes
6
READ
Yes
Yes
Yes
Yes
7
SUSPEND
No
Yes
No
No
8
Notes:
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1. The device can be in only one state at a time. Depending on the state of the device,
some operations are allowed (Yes) and others are not (No). For example, when the device is in the standby state, all operations except SUSPEND are allowed in any sector. For
all device states except the erase suspend state, if an operation is allowed or disallowed
in one sector, it is allowed or disallowed in all other sectors. In the erase suspend state, a
PROGRAM operation is allowed in any sector except the one in which an ERASE operation has been suspended.
2. All READ operations except READ STATUS REGISTER and READ FLAG REGISTER. When issued to a sector or subsector that is simultaneously in an erase suspend state, the READ
operation is accepted, but the data output is not guaranteed until the erase has completed.
3. All PROGRAM operations except PROGRAM OTP. In the erase suspend state, a PROGRAM
operation is allowed in any sector (Yes) except the sector (No) in which an ERASE operation has been suspended.
4. Applies to the SECTOR ERASE or SUBSECTOR ERASE operation.
5. Applies to the following operations: WRITE STATUS REGISTER, WRITE NONVOLATILE
CONFIGURATION REGISTER, PROGRAM OTP, and BULK ERASE.
6. Applies to the following operations: WRITE ENABLE, WRITE DISABLE, CLEAR FLAG STATUS REGISTER, WRITE LOCK REGISTER, WRITE VOLATILE, and ENHANCED VOLATILE CONFIGURATION REGISTER.
7. Applies to the READ STATUS REGISTER or READ FLAG STATUS REGISTER operation.
8. Applies to the PROGRAM SUSPEND or ERASE SUSPEND operation.
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64Mb, 3V, Multiple I/O Serial Flash Memory
ERASE Operations
PROGRAM/ERASE RESUME Command
To initiate the PROGRAM/ERASE RESUME command, S# is driven LOW. The command
code is input on DQ0. The operation is terminated by driving S# HIGH.
When this command is executed, the status register write in progress bit is set to 1, and
the flag status register program erase controller bit is set to 0. This command is ignored
if the device is not in a suspended state.
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64Mb, 3V, Multiple I/O Serial Flash Memory
ONE TIME PROGRAMMABLE Operations
ONE TIME PROGRAMMABLE Operations
READ OTP ARRAY Command
To initiate a READ OTP ARRAY command, S# is driven LOW. The command code is input on DQ0, followed by three bytes and dummy clock cycles. Each address bit is latched in during the rising edge of C. Data is shifted out on DQ1, beginning from the specified address and at a maximum frequency of fC (MAX) on the falling edge of the clock.
The address increments automatically to the next address after each byte of data is shifted out. There is no rollover mechanism; therefore, if read continuously, after location
40h, the device continues to output data at location 40h. The operation is terminated by
driving S# HIGH at any time during data output.
Figure 30: READ OTP Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ0
MSB
A[MAX]
DQ1
DOUT
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
Dummy cycles
Dual
0
3
4
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[1:0]
MSB
A[MAX]
MSB
Dummy cycles
Quad
0
1
2
Cx
C
LSB
A[MIN]
DOUT
Command
DQ[3:0]
MSB
A[MAX]
LSB
DOUT
DOUT
MSB
Don’t Care
Dummy cycles
Note:
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
PROGRAM OTP ARRAY Command
To initiate the PROGRAM OTP ARRAY command, the WRITE ENABLE command must
be issued to set the write enable latch bit to 1; otherwise, the PROGRAM OTP ARRAY
command is ignored and flag status register bits are not set. S# is driven LOW and held
LOW until the eighth bit of the last data byte has been latched in, after which it must be
driven HIGH. The command code is input on DQ0, followed by three bytes and at least
one data byte. Each address bit is latched in during the rising edge of the clock. When S#
is driven HIGH, the operation, which is self-timed, is initiated; its duration is tPOTP.
There is no rollover mechanism; therefore, after a maximum of 65 bytes are latched in
and subsequent bytes are discarded.
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64Mb, 3V, Multiple I/O Serial Flash Memory
ONE TIME PROGRAMMABLE Operations
PROGRAM OTP ARRAY programs, at most, 64 bytes to the OTP memory area and one
OTP control byte. When the operation is in progress, the write in progress bit is set to 1.
The write enable latch bit is cleared to 0, whether the operation is successful or not, and
the status register and flag status register can be polled for the operation status. When
the operation completes, the write in progress bit is cleared to 0.
If the operation times out, the write enable latch bit is reset and the program fail bit is
set to 1. If S# is not driven HIGH, the command is not executed, flag status register error
bits are not set, and the write enable latch remains set to 1.
The OTP control byte (byte 64) is used to permanently lock the OTP memory array.
Table 26: OTP Control Byte (Byte 64)
Bit Name
0
OTP control byte
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Settings
Description
0 = Locked
1 = Unlocked
(Default)
Used to permanently lock the OTP array (byte 64). When bit 0 = 1, the
OTP array can be programmed. When bit 0 = 0, the OTP array is read only.
Once bit 0 has been programmed to 0, it can no longer be changed to 1.
PROGRAM OTP ARRAY is ignored, write enable latch bit remains set, and
flag status register bits 1 and 4 are set.
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64Mb, 3V, Multiple I/O Serial Flash Memory
ONE TIME PROGRAMMABLE Operations
Figure 31: PROGRAM OTP Command
Extended
0
7
8
Cx
C
LSB
A[MIN]
LSB
Command
DQ0
MSB
A[MAX]
Dual
0
3
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
4
Cx
C
LSB
A[MIN]
LSB
Command
DQ[1:0]
MSB
A[MAX]
Quad
0
1
DIN
MSB
2
Cx
C
LSB
A[MIN]
LSB
Command
DQ[3:0]
MSB
A[MAX]
Note:
DIN
MSB
1. For extended SPI protocol, Cx = 7 + (A[MAX] + 1).
For dual SPI protocol, Cx = 3 + (A[MAX] + 1)/2.
For quad SPI protocol, Cx = 1 + (A[MAX] + 1)/4.
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64Mb, 3V, Multiple I/O Serial Flash Memory
XIP Mode
XIP Mode
Execute-in-place (XIP) mode allows the memory to be read by sending an address to the
device and then receiving the data on one, two, or four pins in parallel, depending on
the customer requirements. XIP mode offers maximum flexibility to the application,
saves instruction overhead, and reduces random access time.
Activate or Terminate XIP Using Volatile Configuration Register
Applications that boot in SPI and must switch to XIP use the volatile configuration register. XIP provides faster memory READ operations by requiring only an address to execute, rather than a command code and an address.
To activate XIP requires two steps. First, enable XIP by setting volatile configuration register bit 3 to 0. Next, drive the XIP confirmation bit to 0 during the next FAST READ operation. XIP is then active. Once in XIP, any command that occurs after S# is toggled requires only address bits to execute; a command code is not necessary, and device operations use the SPI protocol that is enabled. XIP is terminated by driving the XIP confirmation bit to 1. The device automatically resets volatile configuration register bit 3 to 1.
Note: For devices with basic XIP, indicated by a part number feature set digit of 2 or 4, it
is not necessary to set the volatile configuration register bit 3 to 0 to enable XIP. Instead,
it is enabled by setting the XIP confirmation bit to 0 during the first dummy clock cycle
after any FAST READ command.
Activate or Terminate XIP Using Nonvolatile Configuration Register
Applications that must boot directly in XIP use the nonvolatile configuration register. To
enable a device to power-up in XIP using the nonvolatile configuration register, set nonvolatile configuration register bits [11:9]. Settings vary according to protocol, as explained in the Nonvolatile Configuration Register section. Because the device boots directly in XIP, the confirmation bit is already set to 0, and after the next power cycle, XIP
is active. Once in XIP, a command code is unnecessary, and device operations use the
SPI protocol currently enabled. XIP is terminated by driving the XIP confirmation bit to
1.
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64Mb, 3V, Multiple I/O Serial Flash Memory
XIP Mode
Figure 32: XIP Mode Directly After Power-On
Mode 3
C
tVSI
VCC
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15 16
Mode 0
(<100µ)
NVCR check:
XIP enabled
S#
A[MIN]
DQ0
LSB
DOUT DOUT DOUT DOUT DOUT
Xb
DOUT DOUT DOUT DOUT DOUT
DQ[3:1]
A[MAX]
MSB
Dummy cycles
Note:
1. Xb is the XIP confirmation bit and should be set as follows: 0 to keep XIP state; 1 to exit
XIP mode and return to standard read mode.
Confirmation Bit Settings Required to Activate or Terminate XIP
The XIP confirmation bit setting activates or terminates XIP after it has been enabled or
disabled. This bit is the value on DQ0 during the first dummy clock cycle in the FAST
READ operation. XIP requires at least one additional clock cycle to send the XIP confirmation bit to the memory on DQ0 during the first dummy clock cycle.
Table 27: XIP Confirmation Bit
Bit Value
Description
0
Activates XIP: While this bit is 0, XIP remains activated.
1
Terminates XIP: When this bit is set to 1, XIP is terminated and the device returns
to SPI.
Table 28: Effects of Running XIP in Different Protocols
Protocol
Effect
Notes
Extended I/O,
Dual I/O
In a device with a dedicated part number where RST# is enabled, a LOW pulse on RST#
resets XIP and the device to the state it was in previous to the last power-up, as defined
by the nonvolatile configuration register.
Dual I/O
Values of DQ1 during the first dummy clock cycle are "Don't Care."
Quad I/O
Values of DQ[3:1] during the first dummy clock cycle are "Don't Care."
In a device with a dedicated part number where RST# is enabled, a LOW pulse on RST#
resets XIP and the device to the state it was in previous to the last power-up, as defined
by the nonvolatile configuration register.
Note:
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1
1. In a device with a dedicated part number, memory can be reset only when the device is
deselected.
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64Mb, 3V, Multiple I/O Serial Flash Memory
XIP Mode
Terminating XIP After a Controller and Memory Reset
The system controller and the device can become out of synchronization if, during the
life of the application, the system controller is reset without the device being reset. In
such a case, the controller can reset the memory to power-on reset if the memory has
reset functionality. (Reset is available in devices with a dedicated part number.)
If reset functionality is not available, has been disabled, or is not supported by the controller, the controller must execute the following sequence to terminate XIP in the
memory device. In quad I/O protocol, drive DQ0 = 1 with S# held LOW for seven clock
cycles; S# must driven HIGH before the eighth clock cycle. In dual I/O protocol, drive
DQ0 = 1 with S# held LOW for 13 clock cycles; S# must driven HIGH before the fourteenth clock cycle. If the device is in extended protocol, drive DQ0 = 1 with S# held LOW
for 25 clock cycles; S# must driven HIGH before the twenty-sixth clock cycle.
These sequences cause the controller to set the XIP confirmation bit to 1, thereby terminating XIP. However, it does not reset the device or interrupt PROGRAM/ERASE operations that may be in progress.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Power-Up and Power-Down
Power-Up and Power-Down
Power-Up and Power-Down Requirements
At power-up and power-down, the device must not be selected; that is, S# must follow
the voltage applied on V CC until V CC reaches the correct values: V CC,min at power-up and
VSS at power-down.
To avoid data corruption and inadvertent WRITE operations during power-up, a poweron reset circuit is included. The logic inside the device is held to RESET while V CC is less
than the power-on reset threshold voltage shown here; all operations are disabled, and
the device does not respond to any instruction. During a standard power-up phase, the
device ignores all commands except READ STATUS REGISTER and READ FLAG STATUS
REGISTER. These operations can be used to check the memory internal state. After
power-up, the device is in standby power mode; the write enable latch bit is reset; the
write in progress bit is reset; and the lock registers are configured as: (write lock bit, lock
down bit) = (0,0).
Normal precautions must be taken for supply line decoupling to stabilize the V CC supply. Each device in a system should have the V CC line decoupled by a suitable capacitor
(typically 100nF) close to the package pins. At power-down, when V CC drops from the
operating voltage to below the power-on-reset threshold voltage shown here, all operations are disabled and the device does not respond to any command.
Note: If power-down occurs while a WRITE, PROGRAM, or ERASE cycle is in progress,
data corruption may result.
VPPH must be applied only when V CC is stable and in the V CC,min to V CC,max voltage
range.
Figure 33: Power-Up Timing
VCC
VCC,max
Chip selection not allowed
VCC,min
Chip
reset
VWI
tVTW
= tVTR
Polling allowed
Device fully accessible
SPI protocol
Starting protocol
defined by NVCR
WIP = 1
WEL = 0
WIP = 0
WEL = 0
Time
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64Mb, 3V, Multiple I/O Serial Flash Memory
Power-Up and Power-Down
Table 29: Power-Up Timing and VWI Threshold
Note 1 applies to entire table
Symbol
Parameter
Min
Max
Unit
tVTR
VCC,min to read
–
150
µs
tVTW
VCC,min to device fully accessible
–
150
µs
VWI
Write inhibit voltage
1.5
2.5
V
Note:
1. Parameters listed are characterized only.
Power Loss Rescue Sequence
If a power loss occurs during a WRITE NONVOLATILE CONFIGURATION REGISTER
command, after the next power-on, the device might begin in an undetermined state
(XIP mode or an unnecessary protocol). If this happens, until the next power-up, a rescue sequence must reset the device to a fixed state (extended SPI protocol without XIP).
After the rescue sequence, the issue should be resolved by running the WRITE NONVOLATILE CONFIGURATION REGISTER command again. The rescue sequence is composed of two parts that must be run in the correct order. During the entire sequence,
tSHSL2 must be at least 50ns. The first part of the sequence is DQ0 (PAD DATA) and
DQ3 (PAD HOLD) equal to 1 for the situations listed below:
• 7 clock cycles within S# LOW (S# becomes HIGH before 8th clock cycle)
• + 13 clock cycles within S# LOW (S# becomes HIGH before 14th clock cycle)
• + 25 clock cycles within S# LOW (S# becomes HIGH before 26th clock cycle)
The second part of the sequence is exiting from dual or quad SPI protocol by using the
following FFh sequence: DQ0 and DQ3 equal to 1 for 8 clock cycles within S# LOW; S#
becomes HIGH before 9th clock cycle.
After this two-part sequence the extended SPI protocol is active.
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64Mb, 3V, Multiple I/O Serial Flash Memory
AC Reset Specifications
AC Reset Specifications
Table 30: AC RESET Conditions
Note 1 applies to entire table
Parameter
Symbol
Reset pulse
width
Reset recovery
time
S# deselect to
reset valid
Conditions
Min
Typ
Max
Unit
50
–
–
ns
Device deselected (S# HIGH) and is in XIP mode
–
–
40
ns
Device deselected (S# HIGH) and is in standby mode
–
–
40
ns
Commands are being decoded, any READ operations are
in progress or any WRITE operation to volatile registers
are in progress
–
–
40
ns
Any device array PROGRAM/ERASE/SUSPEND/RESUME,
PROGRAM OTP, NONVOLATILE SECTOR LOCK, and ERASE
NONVOLATILE SECTOR LOCK ARRAY operations are in
progress
–
–
30
µs
While a WRITE STATUS REGISTER operation is in progress
–
tW
–
ms
While a WRITE NONVOLATILE CONFIGURATION REGISTER operation is in progress
–
tWNVCR
–
ms
On completion or suspension of a SUBSECTOR ERASE operation
–
tSSE
–
s
Deselect to reset valid in quad output or in QIO-SPI
2
–
–
ns
tRLRH2
tRHSL
tSHRV
Notes:
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1. Values are guaranteed by characterization; not 100% tested.
2. The device reset is possible but not guaranteed if tRLRH < 50ns.
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64Mb, 3V, Multiple I/O Serial Flash Memory
AC Reset Specifications
Figure 34: Reset AC Timing During PROGRAM or ERASE Cycle
S#
tSHRH
tRHSL
tRLRH
RESET#
Don’t Care
Figure 35: Serial Input Timing
tSHSL
S#
tCHSL
tSLCH
tCHSH
tSHCH
C
tDVCH tCHDX
DQ0
DQ1
tCHCL
tCLCH
MSB in
LSB in
High-Z
High-Z
Don’t Care
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64Mb, 3V, Multiple I/O Serial Flash Memory
AC Reset Specifications
Figure 36: Write Protect Setup and Hold During WRITE STATUS REGISTER Operation (SRWD = 1)
W#/VPP
tWHSL
tSHWL
S#
C
DQ0
DQ1
High-Z
High-Z
Don’t Care
Figure 37: Hold Timing
S#
tCHHL
tHLCH
tHHCH
C
tHLQZ
tCHHH
tHHQX
DQ0
DQ1
HOLD#
Don’t Care
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64Mb, 3V, Multiple I/O Serial Flash Memory
AC Reset Specifications
Figure 38: Output Timing
S#
tCLQV
tCLQV
tCLQX
tCLQX
tCL
tCH
C
tSHQZ
DQ0
LSB out
DQ1 Address
LSB in
Don’t Care
Figure 39: VPPH Timing
End of command
(identified by WIP polling)
S#
C
DQ0
tVPPHSL
VPPH
VPP
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64Mb, 3V, Multiple I/O Serial Flash Memory
Program and Erase Suspend Specifications
Program and Erase Suspend Specifications
Table 31: Suspend Parameters
Parameter
Condition
Typ
Max
Units
Notes
Erase to suspend
Sector erase or erase resume to erase suspend
700
–
µs
1
Program to suspend
Program resume to program suspend
5
–
µs
1
Subsector erase to suspend
Subsector erase or subsector erase resume to erase suspend
50
–
µs
1
Suspend latency
Program
7
–
µs
2
Suspend latency
Subsector erase
15
–
µs
2
Suspend latency
Erase
15
–
µs
3
Notes:
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1. Timing is not internally controlled.
2. Any READ command accepted.
3. Any command except the following are accepted: SECTOR, SUBSECTOR, or BULK ERASE;
WRITE STATUS REGISTER; WRITE NONVOLATILE CONFIGURATION REGISTER; and PROGRAM OTP.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Absolute Ratings and Operating Conditions
Absolute Ratings and Operating Conditions
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only. Exposure to absolute maximum rating and operating conditions for
extended periods may adversely affect reliability. Stressing the device beyond the absolute maximum ratings may cause permanent damage.
Table 32: Absolute Ratings
Symbol
Parameter
Min
Max
Units
TSTG
Storage temperature
–65
150
°C
TLEAD
Lead temperature during soldering
–
See note 1
°C
4.0
V
Notes
VCC
Supply voltage
–0.6
VPP
Fast program/erase voltage
–0.2
10
V
VIO
Input/output voltage with respect to ground
–0.6
VCC + 0.6
V
2
VESD
Electrostatic discharge voltage
(human body model)
–2000
2000
V
3
Notes:
1. Compliant with JEDEC Standard J-STD-020C (for small-body, Sn-Pb or Pb assembly),
RoHS, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
2. For periods of less than 2ns, VIL can undershoot to –1.0V and VIH can overshoot to VCC +
1.0V.
3. JEDEC Standard JESD22-A114A (C1 = 100pF, R1 = 1500Ω, R2 = 500Ω).
Table 33: Operating Conditions
Symbol
Min
Max
Units
VCC
Supply voltage
Parameter
2.7
3.6
V
VPPH
Supply voltage on VPP
8.5
9.5
V
TA
Ambient operating temperature
–40
85
°C
TA
Ambient operating temperature, automotive
–40
125
°C
Table 34: Input/Output Capacitance
Note 1 applies to entire table
Symbol
Description
CIN/OUT
CIN
Input/output capacitance
(DQ0/DQ1/DQ2/DQ3)
Input capacitance (other pins)
Note:
PDF: 09005aef845665f4
n25q_064a_3v_65nm.pdf - Rev. N 10/14 EN
Test Condition
Min
Max
Units
VOUT = 0V
–
8
pF
VIN = 0V
–
6
pF
1. These parameters are sampled only, not 100% tested. TA = 25°C at 54 MHz.
68
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64Mb, 3V, Multiple I/O Serial Flash Memory
Absolute Ratings and Operating Conditions
Table 35: AC Timing Input/Output Conditions
Symbol
Description
CL
Load capacitance
–
Input rise and fall times
Min
Max
Units
Notes
30
30
pF
1
–
5
ns
Input pulse voltages
0.2VCC to 0.8VCC
V
Input timing reference voltages
0.3VCC to 0.7VCC
V
Output timing reference voltages
VCC/2
V
Notes:
VCC/2
2
1. Output buffers are configurable by user.
2. For quad/dual operations: 0V to VCC.
Figure 40: AC Timing Input/Output Reference Levels
Input levels1
I/O timing
reference levels
0.8VCC
0.7VCC
0.5VCC
0.3VCC
0.2VCC
Note:
PDF: 09005aef845665f4
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1. 0.8VCC = VCC for dual/quad operations; 0.2VCC = 0V for dual/quad operations.
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64Mb, 3V, Multiple I/O Serial Flash Memory
DC Characteristics and Operating Conditions
DC Characteristics and Operating Conditions
Table 36: DC Current Characteristics and Operating Conditions
Parameter
Symbol
Test Conditions
Min
Max
Unit
ILI
–
–
±2
µA
Input leakage current
Output leakage current
ILO
–
–
±2
µA
Standby current
ICC1
S = VCC, VIN = VSS or VCC
–
100
µA
Standby current (automotive)
ICC1
S = VCC, VIN = VSS or VCC
-
150
µA
Operating current
(fast-read extended I/O)
ICC3
C = 0.1VCC/0.9VCC at 108 MHz, DQ1
= open
–
15
mA
C = 0.1VCC/0.9VCC at 54 MHz, DQ1
= open
–
6
mA
Operating current (fast-read dual I/O)
C = 0.1VCC/0.9VCC at 108 MHz
–
18
mA
Operating current (fast-read quad I/O)
C = 0.1VCC/0.9VCC at 108 MHz
–
20
mA
Operating current (program)
ICC4
S# = VCC
–
20
mA
Operating current (write status register)
ICC5
S# = VCC
–
20
mA
Operating current (erase)
ICC6
S# = VCC
–
20
mA
Table 37: DC Voltage Characteristics and Operating Conditions
Parameter
Min
Max
Unit
Input low voltage
VIL
–0.5
0.3VCC
V
Input high voltage
VIH
0.7VCC
VCC + 0.4
V
Output low voltage
VOL
IOL = 1.6mA
–
0.4
V
Output high voltage
VOH
IOH = –100µA
VCC - 0.2
–
V
PDF: 09005aef845665f4
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Symbol
Conditions
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64Mb, 3V, Multiple I/O Serial Flash Memory
AC Characteristics and Operating Conditions
AC Characteristics and Operating Conditions
Table 38: AC Characteristics and Operating Conditions
Symbol
Min
Typ1
Max
Unit
Clock frequency for all commands other than
READ (SPI-ER, QIO-SPI protocol)
fC
DC
–
108
MHz
Clock frequency for READ commands
fR
DC
–
54
MHz
Clock HIGH time
tCH
4
–
–
ns
2
Clock LOW time
tCL
4
–
–
ns
1
Clock rise time (peak-to-peak)
tCLCH
0.1
–
–
V/ns
3, 4
Clock fall time (peak-to-peak)
tCHCL
0.1
–
–
V/ns
3, 4
S# active setup time (relative to clock)
tSLCH
4
–
–
ns
S# not active hold time (relative to clock)
tCHSL
4
–
–
ns
Data in setup time
tDVCH
2
–
–
ns
Data in hold time
tCHDX
3
–
–
ns
S# active hold time (relative to clock)
tCHSH
4
–
–
ns
S# not active setup time (relative to clock)
tSHCH
4
–
–
ns
S# deselect time after a READ command
tSHSL1
20
–
–
ns
S# deselect time after a nonREAD command
tSHSL2
50
–
–
ns
Output disable time
tSHQZ
–
–
8
ns
Clock LOW to output valid under 30pF
tCLQV
–
–
7
ns
Parameter
Clock LOW to output valid under 10pF
Notes
3
–
–
5
ns
Output hold time (clock LOW)
tCLQX
1
–
–
ns
Output hold time (clock HIGH)
tCHQX
1
–
–
ns
HOLD command setup time (relative to clock)
tHLCH
4
–
–
ns
HOLD command hold time (relative to clock)
tCHHH
4
–
–
ns
HOLD command setup time (relative to clock)
tHHCH
4
–
–
ns
HOLD command hold time (relative to clock)
tCHHL
4
–
–
ns
HOLD command to output Low-Z
tHHQX
–
–
8
ns
3
HOLD command to output High-Z
tHLQZ
–
–
8
ns
3
Write protect setup time
tWHSL
20
–
–
ns
5
Write protect hold time
tSHWL
100
–
–
ns
5
tVPPHSL
200
–
–
ns
6
tW
–
1.3
8
ms
tWNVCR
–
0.2
3
s
Enhanced VPPH HIGH to S# LOW for extended
and dual I/O page program
WRITE STATUS REGISTER cycle time
Write NONVOLATILE CONFIGURATION REGISTER cycle time
CLEAR FLAG STATUS REGISTER cycle time
WRITE VOLATILE CONFIGURATION REGISTER
cycle time
WRITE VOLATILE ENHANCED CONFIGURATION
REGISTER cycle time
PDF: 09005aef845665f4
n25q_064a_3v_65nm.pdf - Rev. N 10/14 EN
tCFSR
–
40
–
ns
tWVCR
–
40
–
ns
tWRVECR
–
40
–
ns
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64Mb, 3V, Multiple I/O Serial Flash Memory
AC Characteristics and Operating Conditions
Table 38: AC Characteristics and Operating Conditions (Continued)
Symbol
Min
Typ1
Max
Unit
Notes
tPP
–
0.5
5
ms
7
PAGE PROGRAM cycle time (n bytes)
–
int(n/8) ×
0.0158
5
ms
7
PAGE PROGRAM cycle time, VPP = VPPH (256
bytes)
–
0.4
5
ms
7
7
Parameter
PAGE PROGRAM cycle time (256 bytes)
PROGRAM OTP cycle time (64 bytes)
Subsector ERASE cycle time
Sector ERASE cycle time
–
0.2
–
ms
tSSE
–
0.25
0.8
s
tSE
–
0.7
3
s
–
0.6
3
s
Sector ERASE cycle time (with VPP = VPPH)
tBE
Bulk ERASE cycle time
Bulk ERASE cycle time (with VPP = VPPH)
Notes:
PDF: 09005aef845665f4
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–
60
120
s
–
50
120
s
1.
2.
3.
4.
5.
Typical values given for TA = 25 °C.
tCH + tCL must add up to 1/fC.
Value guaranteed by characterization; not 100% tested.
Expressed as a slew-rate.
Only applicable as a constraint for a WRITE STATUS REGISTER command when STATUS
REGISTER WRITE is set to 1.
6. VPPH should be kept at a valid level until the PROGRAM or ERASE operation has completed and its result (success or failure) is known.
7. When using the PAGE PROGRAM command to program consecutive bytes, optimized
timings are obtained with one sequence including all the bytes versus several sequences
of only a few bytes (1 < n < 256).
8. int(A) corresponds to the upper integer part of A. For example int(12/8) = 2, int(32/8) = 4
int(15.3) =16.
72
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64Mb, 3V, Multiple I/O Serial Flash Memory
Package Dimensions
Package Dimensions
Figure 41: V-PDFN-8 6mm x 5mm (MLP8) – Package Code: F6
0.10 MAX/
0 MIN
5.75 TYP
Pin one
indicator
4.75 TYP
5 TYP
+0.30
4 -0.20
1.27
TYP
0.10 M C A B
B
0.15 C A
6 TYP
A
2x
0.15 C B
0.10 C B
0.10 C A
+0.15
0.60 -0.10
3.40 ±0.20
+0.08
0.40 -0.05
θ
12°
0.05
+0.15
0.85 -0.05
0.20 TYP
0 MIN/
0.05 MAX
Notes:
PDF: 09005aef845665f4
n25q_064a_3v_65nm.pdf - Rev. N 10/14 EN
0.65 TYP
C
1. All dimensions are in millimeters.
2. See Part Number Ordering Information for complete package names and details.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Package Dimensions
Figure 42: V-PDFN-8 8mm x 6mm (MLP8) – Package Code: F8
aaa C
Pin 1 ID
Ø0.3
4.80 TYP
aaa C
6.00 TYP
Pin 1 ID R 0.20
(NE - 1) × 1.27 TYP
B
0.50 -0.05
+0.10
8
1
7
2
6
3
5
4
5.16 TYP
0.2
MIN
1.27
TYP
+0.08
0.40 -0.05
eee M C A B
fff M C
8.00 TYP
A
bbb C
ddd C
0.85 TYP/
1 MAX
0.05 MAX
Notes:
PDF: 09005aef845665f4
n25q_064a_3v_65nm.pdf - Rev. N 10/14 EN
1. All dimensions are in millimeters.
2. See Part Number Ordering Information for complete package names and details.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Package Dimensions
Figure 43: T-PBGA-24b05 6mm x 8mm – Package Code: 12
0.79 TYP
Seating
plane
A
0.1 A
Ball A1 ID
24X Ø0.40 ±0.05
5
4
3
2
Ball A1 ID
1
A
B
C
4.00
8 ±0.10
D
1.00 TYP
E
1.00 TYP
1.20 MAX
4.00
0.20 MIN
6 ±0.10
Notes:
PDF: 09005aef845665f4
n25q_064a_3v_65nm.pdf - Rev. N 10/14 EN
1. All dimensions are in millimeters.
2. See Part Number Ordering Information for complete package names and details.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Package Dimensions
Figure 44: T-PBGA-24b05 6mm x 8mm – Package Code: 14
Seating plane
0.1 A
A
24X Ø0.4
Dimensions apply
to solder balls postreflow on Ø0.4 SMD
ball pads.
Ball A1 ID
4
3
2
Ball A1 ID
1
A
B
5 CTR
C
8 ±0.1
D
E
1 TYP
F
1 TYP
1.08 ±0.12
3 CTR
0.2 MIN
6 ±0.1
Notes:
PDF: 09005aef845665f4
n25q_064a_3v_65nm.pdf - Rev. N 10/14 EN
1. All dimensions are in millimeters.
2. See Part Number Ordering Information for complete package names and details.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Package Dimensions
Figure 45: SOP2-16 (300 mils body width) – Package Code: SF
h x 45°
10.30 ±0.20
16
9
0.23 MIN/
0.32 MAX
10.00 MIN/
10.65 MAX
7.50 ±0.10
1
8
0° MIN/8° MAX
2.5 ±0.15
0.20 ±0.1
0.1 Z
0.33 MIN/
0.51 MAX
1.27 TYP
Notes:
PDF: 09005aef845665f4
n25q_064a_3v_65nm.pdf - Rev. N 10/14 EN
0.40 MIN/
1.27 MAX
Z
1. All dimensions are in millimeters.
2. See Part Number Ordering Information for complete package names and details.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Package Dimensions
Figure 46: SOP2-8 (208 mils body width) – Package Code: SE
1.70 MIN/
1.91 MAX
0.36 MIN/
0.48 MAX
1.78 MIN/
2.16 MAX
0.15 MIN/
0.25 MAX
0.1 MAX
1.27 TYP
5.08 MIN/
5.49 MAX
7.70 MIN/
8.10 MAX
5.08 MIN/
5.49 MAX
1
0.05 MIN/
0.25 MAX
Notes:
PDF: 09005aef845665f4
n25q_064a_3v_65nm.pdf - Rev. N 10/14 EN
0º MIN/
10º MAX
0.5 MIN/
0.8 MAX
1. All dimensions are in millimeters.
2. See Part Number Ordering Information for complete package names and details.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Package Dimensions
Figure 47: XF-SCSP-8/2.93mm x 3.5mm – Package Code: 53
Seating plane
A
12X Ø0.3
Dimensions apply
to solder balls postreflow on Ø0.3 ±0.004
UBM ball pads.
0.08 A
Ball A1 ID
4
3
2
1
A
3.5 ±0.03
B
2.5
CTR
C
D
E
0.5 TYP
F
0.31 ±0.1
0.5
TYP
0.14 MIN
1.5 CTR
2.93 ±0.03
Notes:
PDF: 09005aef845665f4
n25q_064a_3v_65nm.pdf - Rev. N 10/14 EN
1. All dimensions are in millimeters.
2. See Part Number Ordering Information for complete package names and details.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Part Number Ordering Information
Part Number Ordering Information
Micron Serial NOR Flash devices are available in different configurations and densities.
Verify valid part numbers by using Micron’s part catalog search at micron.com. To compare features and specifications by device type, visit micron.com/products. Contact the
factory for devices not found.
For more information on how to identify products and top-side marking by the process
identification letter, refer to technical note TN-12-24, "Serial Flash Memory Device
Marking for the M25P, M25PE, M25PX, and N25Q Product Families."
Table 39: Part Number Information
Part Number
Category
Category Details
Device type
N25Q = Serial NOR Flash memory, Multiple Input/Output (Single, Dual, Quad I/O), XIP
Density
064 = 64Mb
Technology
A = 65nm
Feature set
1 = Byte addressability; HOLD pin; Micron XIP
Notes
2 = Byte addressability; HOLD pin; Basic XIP
3 = Byte addressability; RST# pin; Micron XIP
4 = Byte addressability; RST# pin; Basic XIP
Operating voltage
3 = VCC = 2.7 to 3.6V
Block structure
E = Uniform (64KB and 4KB)
Package
(RoHS-compliant)
F6 = V-PDFN-8 6mm x 5mm (MLP8 6mm x 5mm)
F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)
12 = T-PBGA-24b05 6mm x 8mm
14 = T-PBGA-24b05 6mm x 8mm, 4x6 ball array
SF = SOP2-16 300 mils body width (SO16W)
SE = SOP2-8 208 mils body width (SO8W)
53 = XF-SCSP-8/2.93mm x 3.5mm (XFCSP)
Temperature and
test flow
4 = IT: –40°C to +85°C; Device tested with standard test flow
A = Automotive temperature range: –40 to +125°C; Device tested with high reliability certified test flow
H = IT: –40°C to +85°C; Device tested with high reliability certified test flow
Security features
0 = Default
Shipping material
E = Tray
F = Tape and reel
G = Tube
Note:
PDF: 09005aef845665f4
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1
1. Additional secure options are available upon customer request.
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64Mb, 3V, Multiple I/O Serial Flash Memory
Part Number Ordering Information
Table 40: Package Details
Micron SPI
and JEDEC
Package
Name
Shortened
Package
Name
V-PDFN-8
6mm x 5mm
DFN/6mm x
5mm
V-PDFN-8
8mm x 6mm
DFN/8mm x
6mm
T-PBGA24b05/6mm x
8mm
M25P
M45PE
Symbol
N25Q
Symbol
Very thin, plastic small-outline, 8 terminal pads (no
leads), 6mm x 5mm
MP
F6
MLP8, DFN8,
VDFPN8,
VFQFPN8
V-PSON1-8/6mm
x 5mm, VSON
Very thin, plastic small outline, 8 terminal pads (no
leads), 8mm x 6mm
ME
F8
MLP8, VDFPN8
V-PSON1-8/8mm
x 6mm, VSON
TBGA 24
Thin plastic ball grid array, 24
balls, 6mm x 8mm
ZM
12
TBGA24 6mm x
8mm
–
T-PBGA24b05/6mm x
8mm
4x6 ball array
TBGA 24
Thin plastic ball grid array, 24
balls, 6mm x 8mm,
4x6 ball array
–
14
TBGA24 6mm x
8mm
4x6 ball array
–
SOP2- 16/
300 mil
SO16W
Small-outline integrated circuit, 16 pins, wide (300 mil)
MF
SF
SO16 wide 300
mil body width
SOIC-16/300 mil,
SOP 16L 300 mil
SOP2- 8/
208 mil
SO8W
Small-outline integrated circuit, 8-pins, wide (208 mil)
MW
SE
SO8 wide 208
mil body width
SOIC-8/208 mil,
SOP 8L 200 mil
XF-SCSP-8/
2.93mm x
3.5mm
XFCSP
Wafer level, chip-scale package, 12 balls ( 8 active balls ),
2.93mm x 3.5mm x 0.41mm
–
53
–
WLCSP
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Package Description
81
M25P
M45PE Package Names
Alternate
Package Name
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64Mb, 3V, Multiple I/O Serial Flash Memory
Revision History
Revision History
Rev. N – 10/2014
•
•
•
•
Reviewed Table 11 Bit 3 settings
Added Standby current Icc1 for automotive
Reviewed the SFDP table
Changed the title of figure 6 to "12-Ball XF-SCSP, 4 x 6 (Balls Down)"
Rev. M – 1/2014
• Replaced F6 package
Rev. L – 10/2013
• Added QGGS ballout and XFCSP package information
Rev. K – 08/2013
• Added T-PBGA-24b05 6mm x 8mm, 4 x 6 ball array ballout and package information
Rev. J – 01/2013
•
•
•
•
•
•
Updated HOLD# description in Signal Description table
Updated SOP2-8 (208 mils body width) - Package Code: SE in Package Dimensions
Updated the READ ID Operation figure in READ ID Operations
Updated ERASE Operations
Added link to part number chart in Part Number Ordering Information
Updated part numbers in Features
Rev. I – 10/2012
• Updated tBE from 250 to 120 in AC Characteristics and Operating Conditions.
Rev. H – 07/2012
• Updated part numbers
Rev. G – 06/2012
• Updated tSSE specification in AC Reset Conditions table
Rev. F, Production – 10/2011
• Micron rebrand
Rev. E, Production – 07/2011
• Revised SO8W package dimensions
Rev. D – 01/2011
• Revised SO8W package dimensions
PDF: 09005aef845665f4
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64Mb, 3V, Multiple I/O Serial Flash Memory
Revision History
Rev. C – 11/2010
• In Ordering Information, changed the following: – E = Uniform (Uniform 4KB subsector erase and Uniform 64KB sector erase)
Rev. B – 10/2010
• Updated package information
Rev. A – 05/2010
• Initial release
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
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