M25P16

Micron M25P16 Serial Flash Embedded Memory
Features
Micron M25P16 Serial Flash Embedded
Memory
16Mb, 3V
Features
• Electronic signature
– JEDEC standard 2-byte signature (2015h)
– Unique ID code (UID) and 16 bytes of read-only
data, available upon customer request
– RES command, one-byte signature (14h) for
backward compatibility
• More than 100,000 write cycles per sector
• More than 20 years data retention
• Automotive grade parts available
• Packages (RoHS compliant)
– SO8N (MN) 150 mils
– SO8W (MW) 208 mils
– SO16 (MF) 300 mils
– VFDFPN8 (MP) MLP8 6mm x 5mm
– VFDFPN8 (ME) MLP8 8mm x 6mm
– UFDFPN8 (MC) MLP8 4mm x 3mm
•
•
•
•
•
•
SPI bus compatible serial interface
16Mb Flash memory
75 MHz clock frequency (maximum)
2.7V to 3.6V single supply voltage
Page program (up to 256 bytes) in 0.64ms (TYP)
Erase capability
– Sector erase: 512Kb in 0.6 s (TYP)
– Bulk erase: 16Mb in 13 s (TYP)
• Write protection
– Hardware write protection: protected area size
defined by non-volatile bits BP0, BP1, BP2
• Deep power down: 1µA (TYP)
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
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Products and specifications discussed herein are subject to change by Micron without notice.
Micron M25P16 Serial Flash Embedded Memory
Features
Contents
Functional Description ..................................................................................................................................... 6
Signal Descriptions ........................................................................................................................................... 8
SPI Modes ........................................................................................................................................................ 9
Operating Features ......................................................................................................................................... 11
Page Programming ..................................................................................................................................... 11
Sector Erase, Bulk Erase .............................................................................................................................. 11
Polling during a Write, Program, or Erase Cycle ............................................................................................ 11
Active Power, Standby Power, and Deep Power-Down .................................................................................. 11
Status Register ............................................................................................................................................ 12
Data Protection by Protocol ........................................................................................................................ 12
Software Data Protection ............................................................................................................................ 12
Hardware Data Protection .......................................................................................................................... 12
Hold Condition .......................................................................................................................................... 13
Configuration and Memory Map ..................................................................................................................... 14
Memory Configuration and Block Diagram .................................................................................................. 14
Memory Map – 16Mb Density ......................................................................................................................... 15
Command Set Overview ................................................................................................................................. 16
WRITE ENABLE .............................................................................................................................................. 18
WRITE DISABLE ............................................................................................................................................. 19
READ IDENTIFICATION ................................................................................................................................. 20
READ STATUS REGISTER ................................................................................................................................ 22
WIP Bit ...................................................................................................................................................... 23
WEL Bit ...................................................................................................................................................... 23
Block Protect Bits ....................................................................................................................................... 23
SRWD Bit ................................................................................................................................................... 23
SRWD Bit ................................................................................................................................................... 23
WRITE STATUS REGISTER .............................................................................................................................. 24
READ DATA BYTES ......................................................................................................................................... 26
READ DATA BYTES at HIGHER SPEED ............................................................................................................ 27
PAGE PROGRAM ............................................................................................................................................ 28
SECTOR ERASE .............................................................................................................................................. 29
BULK ERASE .................................................................................................................................................. 30
DEEP POWER-DOWN ..................................................................................................................................... 31
RELEASE from DEEP POWER-DOWN .............................................................................................................. 32
READ ELECTRONIC SIGNATURE .................................................................................................................... 33
Power-Up/Down and Supply Line Decoupling ................................................................................................. 34
Power-Up Timing and Write Inhibit Voltage Threshold Specifications ............................................................... 36
Maximum Ratings and Operating Conditions .................................................................................................. 37
Electrical Characteristics ................................................................................................................................ 38
AC Characteristics .......................................................................................................................................... 39
Package Information ...................................................................................................................................... 45
Device Ordering Information .......................................................................................................................... 51
Standard Parts ............................................................................................................................................ 51
Automotive Parts ........................................................................................................................................ 52
Revision History ............................................................................................................................................. 54
Rev. I – 4/15 ................................................................................................................................................ 54
Rev. H – 1/14 .............................................................................................................................................. 54
Rev. G – 1/13 .............................................................................................................................................. 54
Rev. F – 10/12 ............................................................................................................................................. 54
Rev. E – 8/12 ............................................................................................................................................... 54
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Micron M25P16 Serial Flash Embedded Memory
Features
Rev. D – 5/12 ..............................................................................................................................................
Rev. C – 3/12 ...............................................................................................................................................
Rev. B – 3/12 ...............................................................................................................................................
Rev. A – 9/2011 ...........................................................................................................................................
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54
54
54
55
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Micron M25P16 Serial Flash Embedded Memory
Features
List of Figures
Figure 1: Logic Diagram ................................................................................................................................... 6
Figure 2: Pin Connections: SO8, VFQFPN , VDFPN ........................................................................................... 7
Figure 3: Pin Connections: SO16 ...................................................................................................................... 7
Figure 4: SPI Modes Supported ........................................................................................................................ 9
Figure 5: Bus Master and Memory Devices on the SPI Bus ............................................................................... 10
Figure 6: Hold Condition Activation ............................................................................................................... 13
Figure 7: Block Diagram ................................................................................................................................ 14
Figure 8: WRITE ENABLE Command Sequence .............................................................................................. 18
Figure 9: WRITE DISABLE Command Sequence ............................................................................................. 19
Figure 10: READ IDENTIFICATION Command Sequence ................................................................................ 21
Figure 11: READ STATUS REGISTER Command Sequence .............................................................................. 22
Figure 12: Status Register Format ................................................................................................................... 22
Figure 13: WRITE STATUS REGISTER Command Sequence ............................................................................. 24
Figure 14: READ DATA BYTES Command Sequence ........................................................................................ 26
Figure 15: READ DATA BYTES at HIGHER SPEED Command Sequence ........................................................... 27
Figure 16: PAGE PROGRAM Command Sequence ........................................................................................... 28
Figure 17: SECTOR ERASE Command Sequence ............................................................................................. 29
Figure 18: BULK ERASE Command Sequence ................................................................................................. 30
Figure 19: DEEP POWER-DOWN Command Sequence ................................................................................... 31
Figure 20: RELEASE from DEEP POWER-DOWN Command Sequence ............................................................. 32
Figure 21: READ ELECTRONIC SIGNATURE Command Sequence .................................................................. 33
Figure 22: Power-Up Timing .......................................................................................................................... 35
Figure 23: AC Measurement I/O Waveform ..................................................................................................... 39
Figure 24: Serial Input Timing ........................................................................................................................ 43
Figure 25: Write Protect Setup and Hold during WRSR when SRWD=1 Timing ................................................. 43
Figure 26: Hold Timing .................................................................................................................................. 44
Figure 27: Output Timing .............................................................................................................................. 44
Figure 28: SO8N 150 mils Body Width ............................................................................................................ 45
Figure 29: SO8W 208 mils Body Width ............................................................................................................ 46
Figure 30: SO16W 300 mils Body Width .......................................................................................................... 47
Figure 31: VFDFPN8 (MLP8) 6mm x 5mm ...................................................................................................... 48
Figure 32: VFDFPN8 (MLP8) 8mm x 6mm ...................................................................................................... 49
Figure 33: UFDFPN8 (MLP8) 4mm x 3mm ...................................................................................................... 50
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Micron M25P16 Serial Flash Embedded Memory
Features
List of Tables
Table 1: Signal Names ...................................................................................................................................... 6
Table 2: Signal Descriptions ............................................................................................................................. 8
Table 3: Protected Area Sizes .......................................................................................................................... 12
Table 4: Sectors 31:0 ...................................................................................................................................... 15
Table 5: Command Set Codes ........................................................................................................................ 17
Table 6: READ IDENTIFICATION Data Out Sequence ..................................................................................... 20
Table 7: Status Register Protection Modes ...................................................................................................... 25
Table 8: Power-Up Timing and V WI Threshold ................................................................................................. 36
Table 9: Absolute Maximum Ratings .............................................................................................................. 37
Table 10: Operating Conditions ...................................................................................................................... 37
Table 11: Data Retention and Endurance ........................................................................................................ 37
Table 12: DC Current Specifications ............................................................................................................... 38
Table 13: DC Voltage Specifications ................................................................................................................ 38
Table 14: AC Measurement Conditions ........................................................................................................... 39
Table 15: Capacitance .................................................................................................................................... 39
Table 16: AC Specifications (25 MHz, Device Grade 3, V CC[min]=2.7V) ............................................................. 39
Table 17: Instruction Times (25 MHz, Device Grade 3, V CC[min]=2.7V) ............................................................ 40
Table 18: AC Specifications (75 MHz, Device Grade 3 and 6, V CC[min]=2.7V) .................................................... 41
Table 19: Instruction Times (75 MHz, Device Grade 3 and 6, V CC[min]=2.7V) ................................................... 42
Table 20: Part Number Example ..................................................................................................................... 51
Table 21: Part Number Information Scheme ................................................................................................... 51
Table 22: Part Number Example ..................................................................................................................... 52
Table 23: Part Number Information Scheme ................................................................................................... 52
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Micron M25P16 Serial Flash Embedded Memory
Functional Description
Functional Description
The M25P16 is an 16Mb (2Mb x 8) serial Flash memory device with advanced write protection mechanisms accessed by a high speed SPI-compatible bus. The device supports
high-performance commands for clock frequency up to 75MHz.
The memory can be programmed 1 to 256 bytes at a time using the PAGE PROGRAM
command. It is organized as 32 sectors, each containing 256 pages. Each page is 256
bytes wide. Memory can be viewed either as 8,192 pages or as 2,097,152 bytes. The entire memory can be erased using the BULK ERASE command, or it can be erased one
sector at a time using the SECTOR ERASE command.
This datasheet details the functionality of the M25P16 device based on 110nm process.
Figure 1: Logic Diagram
VCC
DQ0
DQ1
C
S#
W#
HOLD#
VSS
Table 1: Signal Names
Signal Name
Function
Direction
C
Serial clock
Input
DQ0
Serial data input
Input
DQ1
Serial data output
Output
S#
Chip select
Input
W#
Write protect
Input
HOLD#
Hold
Input
VCC
Supply voltage
–
VSS
Ground
–
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Micron M25P16 Serial Flash Embedded Memory
Functional Description
Figure 2: Pin Connections: SO8, VFQFPN , VDFPN
Note:
S#
1
8
VCC
DQ1
2
7
HOLD#
W#
3
6
C
VSS
4
5
DQ0
1. There is an exposed central pad on the underside of the MLP8 package that is pulled internally to VSS, and must not be connected to any other voltage or signal line on the
PCB. The Package Mechanical section provides information on package dimensions and
how to identify pin 1.
Figure 3: Pin Connections: SO16
Notes:
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HOLD#
1
16
C
VCC
2
15
DQ0
DNU
3
14
DNU
DNU
4
13
DNU
DNU
5
12
DNU
DNU
6
11
DNU
S#
7
10
VSS
DQ1
8
9
W#/VPP
1. DU = Don't Use
2. The Package Mechanical section provides information on package dimensions and how
to identify pin 1.
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Micron M25P16 Serial Flash Embedded Memory
Signal Descriptions
Signal Descriptions
Table 2: Signal Descriptions
Signal
Type
DQ1
Output
Serial data: The DQ1 output signal is used to transfer data serially out of the device.
Data is shifted out on the falling edge of the serial clock (C).
DQ0
Input
Serial data: The DQ0 input signal is used to transfer data serially into the device. It
receives commands, addresses, and the data to be programmed. Values are latched on
the rising edge of the serial clock (C).
C
Input
Clock: The C input signal provides the timing of the serial interface. Commands, addresses, or data present at serial data input (DQ0) is latched on the rising edge of the
serial clock (C). Data on DQ1 changes after the falling edge of C.
S#
Input
Chip select: When the S# input signal is HIGH, the device is deselected and DQ1 is at
HIGH impedance. Unless an internal PROGRAM, ERASE, or WRITE STATUS REGISTER cycle is in progress, the device will be in the standby power mode (not the DEEP POWERDOWN mode). Driving S# LOW enables the device, placing it in the active power
mode. After power-up, a falling edge on S# is required prior to the start of any command.
HOLD#
Input
Hold: The HOLD# signal is used to pause any serial communications with the device
without deselecting the device. During the hold condition, DQ1 is High-Z. DQ0 and C
are "Don’t Care." To start the hold condition, the device must be selected, with S#
driven LOW.
W#
Input
Write protect: The W# input signal is used to freeze the size of the area of memory
that is protected against program or erase commands as specified by the values in
BP2, BP1, and BP0 bits of the Status Register.
VCC
Power
Device core power supply: Source voltage.
VSS
Ground
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Description
Ground: Reference for the VCC supply voltage.
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Micron M25P16 Serial Flash Embedded Memory
SPI Modes
SPI Modes
These devices can be driven by a microcontroller with its serial peripheral interface
(SPI) running in either of the following two SPI modes:
• CPOL=0, CPHA=0
• CPOL=1, CPHA=1
For these two modes, input data is latched in on the rising edge of serial clock (C), and
output data is available from the falling edge of C.
The difference between the two modes is the clock polarity when the bus master is in
STANDBY mode and not transferring data:
• C remains at 0 for (CPOL=0, CPHA=0)
• C remains at 1 for (CPOL=1, CPHA=1)
Figure 4: SPI Modes Supported
CPOL
CPHA
0
0
C
1
1
C
DQ0
MSB
MSB
DQ1
Because only one device is selected at a time, only one device drives the serial data output (DQ1) line at a time, while the other devices are HIGH-Z. An example of three devices connected to an MCU on an SPI bus is shown here.
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Micron M25P16 Serial Flash Embedded Memory
SPI Modes
Figure 5: Bus Master and Memory Devices on the SPI Bus
VSS
VCC
R
SDO
SPI interface with
(CPOL, CPHA) =
(0, 0) or (1, 1)
SDI
SCK
VCC
C
SPI Bus Master
DQ1 DQ0
SPI memory
device
R
CS3
CS2
DQ1
DQ0
SPI memory
device
R
VCC
C
VSS
R
DQ1 DQ0
VSS
SPI memory
device
CS1
S#
Notes:
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VCC
C
VSS
W#
HOLD#
S#
W#
HOLD#
S#
W#
HOLD#
1. WRITE PROTECT (W#) and HOLD# should be driven HIGH or LOW as appropriate.
2. Resistors (R) ensure that the memory device is not selected if the bus master leaves the
S# line HIGH-Z.
3. The bus master may enter a state where all I/O are HIGH-Z at the same time; for example, when the bus master is reset. Therefore, C must be connected to an external pulldown resistor so that when all I/O are HIGH-Z, S# is pulled HIGH while C is pulled LOW.
This ensures that S# and C do not go HIGH at the same time and that the tSHCH requirement is met.
4. The typical value of R is 100 kΩ, assuming that the time constant R × Cp (Cp = parasitic
capacitance of the bus line) is shorter than the time during which the bus master leaves
the SPI bus HIGH-Z.
5. Example: Given that Cp = 50 pF (R × Cp = 5μs), the application must ensure that the bus
master never leaves the SPI bus HIGH-Z for a time period shorter than 5μs.
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Micron M25P16 Serial Flash Embedded Memory
Operating Features
Operating Features
Page Programming
To program one data byte, two commands are required: WRITE ENABLE, which is one
byte, and a PAGE PROGRAM sequence, which is four bytes plus data. This is followed by
the internal PROGRAM cycle of duration tPP. To spread this overhead, the PAGE PROGRAM command allows up to 256 bytes to be programmed at a time (changing bits
from 1 to 0), provided they lie in consecutive addresses on the same page of memory. To
optimize timings, it is recommended to use the PAGE PROGRAM command to program
all consecutive targeted bytes in a single sequence than to use several PAGE PROGRAM
sequences with each containing only a few bytes.
Sector Erase, Bulk Erase
The PAGE PROGRAM command allows bits to be reset from 1 to 0. Before this can be
applied, the bytes of memory need to have been erased to all 1s (FFh). This can be achieved a sector at a time using the SECTOR ERASE command, or throughout the entire
memory using the BULK ERASE command. This starts an internal ERASE cycle of duration tSE or tBE. The ERASE command must be preceded by a WRITE ENABLE command.
Polling during a Write, Program, or Erase Cycle
An improvement in the time to complete the following commands can be achieved by
not waiting for the worst case delay (tW, tPP, tSE, or tBE).
• WRITE STATUS REGISTER
• PROGRAM
• ERASE (SECTOR ERASE, BULK ERASE)
The write in progress (WIP) bit is provided in the status register so that the application
program can monitor this bit in the status register, polling it to establish when the previous WRITE cycle, PROGRAM cycle, or ERASE cycle is complete.
Active Power, Standby Power, and Deep Power-Down
When chip select (S#) is LOW, the device is selected, and in the ACTIVE POWER mode.
When S# is HIGH, the device is deselected, but could remain in the ACTIVE POWER
mode until all internal cycles have completed (PROGRAM, ERASE, WRITE STATUS
REGISTER). The device then goes in to the STANDBY POWER mode. The device consumption drops to ICC1.
The DEEP POWER-DOWN mode is entered when the DEEP POWER-DOWN command
is executed. The device consumption drops further to I CC2. The device remains in this
mode until the RELEASE FROM DEEP POWER-DOWN command is executed. While in
the DEEP POWER-DOWN mode, the device ignores all WRITE, PROGRAM, and ERASE
commands. This provides an extra software protection mechanism when the device is
not in active use, by protecting the device from inadvertent WRITE, PROGRAM, or
ERASE operations. For further information, see the DEEP POWER DOWN command.
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Micron M25P16 Serial Flash Embedded Memory
Operating Features
Status Register
The status register contains a number of status and control bits that can be read or set
(as appropriate) by specific commands. For a detailed description of the status register
bits, see READ STATUS REGISTER (page 22).
Data Protection by Protocol
Non-volatile memory is used in environments that can include excessive noise. The following capabilities help protect data in these noisy environments.
Power on reset and an internal timer (tPUW) can provide protection against inadvertent
changes while the power supply is outside the operating specification.
PROGRAM, ERASE, and WRITE STATUS REGISTER commands are checked before they
are accepted for execution to ensure they consist of a number of clock pulses that is a
multiple of eight.
All commands that modify data must be preceded by a WRITE ENABLE command to set
the write enable latch (WEL) bit.
In addition to the low power consumption feature, the DEEP POWER-DOWN mode offers extra software protection since all PROGRAM, and ERASE commands are ignored
when the device is in this mode.
Software Data Protection
Memory can be configured as read-only using the block protect bits (BP2, BP1, BP0) as
shown in the Protected Area Sizes table.
Hardware Data Protection
Hardware data protection is implemented using the write protect signal applied on the
W# pin. This freezes the status register in a read-only mode. In this mode, the block protect (BP) bits and the status register write disable bit (SRWD) are protected.
Table 3: Protected Area Sizes
Status Register Content
Memory Content
BP Bit 2
BP Bit 1
BP Bit 0
0
0
0
none
All sectors (sectors 0 to 31)
0
0
1
Upper 32nd (sector 31)
Lower 31/32nds (sectors 0 to 30)
0
1
0
Upper 16th (sectors 30 and 31)
Lower 15/16ths (sectors 0 to 29)
0
1
1
Upper 8th (sectors 28 to 31)
Lower 7/8ths (sectors 0 to 27)
1
0
0
Upper 4th (sectors 24 to 31)
Lower 3/4ths (sectors 0 to 23)
1
0
1
Upper half (sectors 16 to 31)
Lower half (sectors 0 to 15)
1
1
0
All sectors (sectors 0 to 31)
none
1
1
1
All sectors (sectors 0 to 31)
none
Note:
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Protected Area
Unprotected Area
1. 0 0 0 = unprotected area (sectors): The device is ready to accept a BULK ERASE command
only if all block protect bits (BP2, BP1, BP0) are 0.
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Micron M25P16 Serial Flash Embedded Memory
Operating Features
Hold Condition
The HOLD# signal is used to pause any serial communications with the device without
resetting the clocking sequence. However, taking this signal LOW does not terminate
any WRITE STATUS REGISTER, PROGRAM, or ERASE cycle that is currently in progress.
To enter the hold condition, the device must be selected, with S# LOW. The hold condition starts on the falling edge of the HOLD# signal, if this coincides with serial clock (C)
being LOW. The hold condition ends on the rising edge of the HOLD# signal, if this coincides with C being LOW. If the falling edge does not coincide with C being LOW, the
hold condition starts after C next goes LOW. Similarly, if the rising edge does not coincide with C being LOW, the hold condition ends after C next goes LOW.
During the hold condition, DQ1 is HIGH impedance while DQ0 and C are Don’t Care.
Typically, the device remains selected with S# driven LOW for the duration of the hold
condition. This ensures that the state of the internal logic remains unchanged from the
moment of entering the hold condition. If S# goes HIGH while the device is in the hold
condition, the internal logic of the device is reset. To restart communication with the
device, it is necessary to drive HOLD# HIGH, and then to drive S# LOW. This prevents
the device from going back to the hold condition.
Figure 6: Hold Condition Activation
C
HOLD#
HOLD condition (standard use)
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HOLD condition (nonstandard use)
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Micron M25P16 Serial Flash Embedded Memory
Configuration and Memory Map
Configuration and Memory Map
Memory Configuration and Block Diagram
Each page of memory can be individually programmed; bits are programmed from 1 to
0. The device is sector or bulk-erasable, but not page-erasable; bits are erased from 0 to
1. The memory is configured as follows:
• 2, 097,152 bytes (8 bits each)
• 32 sectors (512Kb, 65KB each)
• 8,192 pages (256 bytes each)
Figure 7: Block Diagram
HOLD#
W#
High Voltage
Generator
Control Logic
S#
C
DQ0
I/O Shift Register
DQ1
Address Register
and Counter
Status
Register
256 Byte
Data Buffer
Y Decoder
1FFFFFh
00000h
000FFh
256 bytes (page size)
X Decoder
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Micron M25P16 Serial Flash Embedded Memory
Memory Map – 16Mb Density
Memory Map – 16Mb Density
Table 4: Sectors 31:0
Address Range
Sector
Start
End
31
001F 0000
001F FFFF
30
001E 0000
001E FFFF
29
001D 0000
001D FFFF
28
001C 0000
001C FFFF
27
001B 0000
001B FFFF
26
001A 0000
001A FFFF
25
0019 0000
0019 FFFF
24
0018 0000
0018 FFFF
23
0017 0000
0017 FFFF
22
0016 0000
0016 FFFF
21
0015 0000
0015 FFFF
20
0014 0000
0014 FFFF
19
0013 0000
0013 FFFF
18
0012 0000
0012 FFFF
17
0011 0000
0011 FFFF
16
0010 0000
0010 FFFF
15
000F 0000
000F FFFF
14
000E 0000
000E FFFF
13
000D 0000
000D FFFF
12
000C 0000
000C FFFF
11
000B 0000
000B FFFF
10
000A 0000
000A FFFF
9
0009 0000
0009 FFFF
8
0008 0000
0008 FFFF
7
0007 0000
0007 FFFF
6
0006 0000
0006 FFFF
5
0005 0000
0005 FFFF
4
0004 0000
0004 FFFF
3
0003 0000
0003 FFFF
2
0002 0000
0002 FFFF
1
0001 0000
0001 FFFF
0
0000 0000
0000 FFFF
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Micron M25P16 Serial Flash Embedded Memory
Command Set Overview
Command Set Overview
All commands, addresses, and data are shifted in and out of the device, most significant
bit first.
Serial data inputs DQ0 and DQ1 are sampled on the first rising edge of serial clock (C)
after chip select (S#) is driven LOW. Then, the one-byte command code must be shifted
in to the device, most significant bit first, on DQ0 and DQ1, each bit being latched on
the rising edges of C.
Every command sequence starts with a one-byte command code. Depending on the
command, this command code might be followed by address or data bytes, by address
and data bytes, or by neither address or data bytes. For the following commands, the
shifted-in command sequence is followed by a data-out sequence. S# can be driven
HIGH after any bit of the data-out sequence is being shifted out.
•
•
•
•
•
READ DATA BYTES (READ)
READ DATA BYTES at HIGHER SPEED
READ STATUS REGISTER
READ IDENTIFICATION
RELEASE from DEEP POWER-DOWN
For the following commands, S# must be driven HIGH exactly at a byte boundary. That
is, after an exact multiple of eight clock pulses following S# being driven LOW, S# must
be driven HIGH. Otherwise, the command is rejected and not executed.
•
•
•
•
•
•
PAGE PROGRAM
SECTOR ERASE
BULK ERASE
WRITE STATUS REGISTER
WRITE ENABLE
WRITE DISABLE
All attempts to access the memory array are ignored during a WRITE STATUS REGISTER
command cycle, a PROGRAM command cycle, or an ERASE command cycle. In addition, the internal cycle for each of these commands continues unaffected.
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Micron M25P16 Serial Flash Embedded Memory
Command Set Overview
Table 5: Command Set Codes
Command Name
Bytes
One-Byte
Command Code
Address
Dummy
Data
WRITE ENABLE
0000
0110
06h
0
0
0
WRITE DISABLE
0000
0100
04h
0
0
0
READ IDENTIFICATION
1001
1111
9Fh
0
0
1 to 20
1001
1110
9Eh
READ STATUS REGISTER
0000
0101
05h
0
0
1 to ∞
WRITE STATUS REGISTER
0000
0001
01h
0
0
1
READ DATA BYTES
0000
0011
03h
3
0
1 to ∞
READ DATA BYTES at HIGHER SPEED
0000
1011
0Bh
3
1
1 to ∞
PAGE PROGRAM
0000
0010
02h
3
0
1 to 256
SECTOR ERASE
1101
1000
D8h
3
0
0
BULK ERASE
1100
0111
C7h
0
0
0
DEEP POWER-DOWN
1011
1001
B9h
0
0
0
RELEASE from DEEP POWER-DOWN
1010
1011
ABh
0
0
1 to ∞
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Micron M25P16 Serial Flash Embedded Memory
WRITE ENABLE
WRITE ENABLE
The WRITE ENABLE command sets the write enable latch (WEL) bit.
The WEL bit must be set before execution of every PROGRAM, ERASE, and WRITE command.
The WRITE ENABLE command is entered by driving chip select (S#) LOW, sending the
command code, and then driving S# HIGH.
Figure 8: WRITE ENABLE Command Sequence
0
1
2
3
4
5
6
7
C
S#
Command bits
DQ[0]
0
0
0
0
0
LSB
1
1
0
MSB
DQ1
High-Z
Don’t Care
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Micron M25P16 Serial Flash Embedded Memory
WRITE DISABLE
WRITE DISABLE
The WRITE DISABLE command resets the write enable latch (WEL) bit.
The WRITE DISABLE command is entered by driving chip select (S#) LOW, sending the
command code, and then driving S# HIGH.
The WEL bit is reset under the following conditions:
•
•
•
•
•
Power-up
Completion of any ERASE operation
Completion of any PROGRAM operation
Completion of any WRITE REGISTER operation
Completion of WRITE DISABLE operation
Figure 9: WRITE DISABLE Command Sequence
0
1
2
3
4
5
6
7
C
S#
Command bits
DQ[0]
0
0
0
0
0
LSB
1
0
0
MSB
DQ1
High-Z
Don’t Care
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Micron M25P16 Serial Flash Embedded Memory
READ IDENTIFICATION
READ IDENTIFICATION
The READ IDENTIFICATION command reads the following device identification data:
• Manufacturer identification (1 byte): This is assigned by JEDEC.
• Device identification (2 bytes): This is assigned by device manufacturer; the first byte
indicates memory type and the second byte indicates device memory capacity.
• A Unique ID code (UID) (17 bytes,16 available upon customer request): The first byte
contains length of data to follow; the remaining 16 bytes contain optional Customized
Factory Data (CFD) content.
Table 6: READ IDENTIFICATION Data Out Sequence
Device Identification
UID
Manufacturer
Identification
Memory Type
Memory Capacity
CFD Length
CFD Content
20h
20h
15h
10h
16 bytes
Note:
1. The CFD bytes are read-only and can be programmed with customer data on demand. If
customers do not make requests, the devices are shipped with all the CFD bytes programmed to zero. Parts with a top marking year and week code greater than "06/2015"
and assembled in the UFDFPN8 4mm x 3mm CFD package area are programmed with an
UID. To decode top marking year and week codes (week of assembly), see TN-12-24 "Serial Flash Memory Device Marking for the M25P/PE/PX, M45PE, and N25Q Product Families" on micron.com.
A READ IDENTIFICATION command is not decoded while an ERASE or PROGRAM cycle is in progress and has no effect on a cycle in progress. The READ IDENTIFICATION
command must not be issued while the device is in DEEP POWER-DOWN mode.
The device is first selected by driving S# LOW. Then the 8-bit command code is shifted
in and content is shifted out on DQ1 as follows: the 24-bit device identification that is
stored in the memory, the 8-bit CFD length, followed by 16 bytes of CFD content. Each
bit is shifted out during the falling edge of serial clock (C).
The READ IDENTIFICATION command is terminated by driving S# HIGH at any time
during data output. When S# is driven HIGH, the device is put in the STANDBY POWER
mode and waits to be selected so that it can receive, decode, and execute commands.
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Micron M25P16 Serial Flash Embedded Memory
READ IDENTIFICATION
Figure 10: READ IDENTIFICATION Command Sequence
0
7
16
15
8
31
32
C
LSB
Command
DQ0
MSB
LSB
LSB
DQ1
High-Z
DOUT
DOUT
DOUT
MSB
DOUT
MSB
Manufacturer
identification
LSB
DOUT
DOUT
MSB
Device
identification
UID
Don’t Care
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Micron M25P16 Serial Flash Embedded Memory
READ STATUS REGISTER
READ STATUS REGISTER
The READ STATUS REGISTER command allows the status register to be read. The status
register may be read at any time, even while a PROGRAM, ERASE, or WRITE STATUS
REGISTER cycle is in progress. When one of these cycles is in progress, it is recommended to check the write in progress (WIP) bit before sending a new command to the device. It is also possible to read the status register continuously.
Figure 11: READ STATUS REGISTER Command Sequence
0
7
8
9
10
11
12
13
14
15
C
LSB
Command
DQ0
MSB
LSB
DQ1
DOUT
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
MSB
Don’t Care
Figure 12: Status Register Format
b7
SRWD
b0
0
BP2
0
BP1
BP0
WEL
WIP
status register write protect
block protect bits
write enable latch bit
write in progress bit
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Micron M25P16 Serial Flash Embedded Memory
READ STATUS REGISTER
WIP Bit
The write in progress (WIP) bit indicates whether the memory is busy with a WRITE
STATUS REGISTER cycle, a PROGRAM cycle, or an ERASE cycle. When the WIP bit is set
to 1, a cycle is in progress; when the WIP bit is set to 0, a cycle is not in progress.
WEL Bit
The write enable latch (WEL) bit indicates the status of the internal write enable latch.
When the WEL bit is set to 1, the internal write enable latch is set; when the WEL bit is
set to 0, the internal write enable latch is reset and no WRITE STATUS REGISTER, PROGRAM, or ERASE command is accepted.
Block Protect Bits
The block protect bits are non-volatile. They define the size of the area to be software
protected against PROGRAM and ERASE commands. The block protect bits are written
with the WRITE STATUS REGISTER command.
When one or more of the block protect bits is set to 1, the relevant memory area, as defined in the Protected Area Sizes table, becomes protected against PAGE PROGRAM and
SECTOR ERASE commands. The block protect bits can be written provided that the
HARDWARE PROTECTED mode has not been set. The BULK ERASE command is executed only if all block protect bits are 0.
SRWD Bit
The status register write disable (SRWD) bit is operated in conjunction with the write
protect (W#) signal. When the SRWD bit is set to 1 and W# is driven LOW, the device is
put in the hardware protected mode. In the hardware protected mode, the non-volatile
bits of the status register (SRWD, and the block protect bits) become read-only bits and
the WRITE STATUS REGISTER command is no longer accepted for execution.
SRWD Bit
The status register write disable (SRWD) bit is operated in conjunction with the write
protect (W#/VPP) signal. When the SRWD bit is set to 1 and W#/V PP is driven LOW, the
device is put in the hardware protected mode. In the hardware protected mode, the
non-volatile bits of the status register (SRWD, and the block protect bits) become readonly bits and the WRITE STATUS REGISTER command is no longer accepted for execution.
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Micron M25P16 Serial Flash Embedded Memory
WRITE STATUS REGISTER
WRITE STATUS REGISTER
The WRITE STATUS REGISTER command allows new values to be written to the status
register. Before the WRITE STATUS REGISTER command can be accepted, a WRITE ENABLE command must have been executed previously. After the WRITE ENABLE command has been decoded and executed, the device sets the write enable latch (WEL) bit.
The WRITE STATUS REGISTER command is entered by driving chip select (S#) LOW,
followed by the command code and the data byte on serial data input (DQ0). The
WRITE STATUS REGISTER command has no effect on b6, b5, b4, b1, and b0 of the status register. The status register b6 b5, and b4 are always read as ‘0’. S# must be driven
HIGH after the eighth bit of the data byte has been latched in. If not, the WRITE STATUS
REGISTER command is not executed.
Figure 13: WRITE STATUS REGISTER Command Sequence
0
7
8
9
10
11
12
13
15
14
C
LSB
Command
DQ0
MSB
LSB
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
As soon as S# is driven HIGH, the self-timed WRITE STATUS REGISTER cycle is initiated; its duration is tW. While the WRITE STATUS REGISTER cycle is in progress, the status register may still be read to check the value of the write in progress (WIP) bit. The
WIP bit is 1 during the self-timed WRITE STATUS REGISTER cycle, and is 0 when the
cycle is completed. Also, when the cycle is completed, the WEL bit is reset.
The WRITE STATUS REGISTER command allows the user to change the values of the
block protect bits (BP2, BP1, BP0). Setting these bit values defines the size of the area
that is to be treated as read-only, as defined in the Protected Area Sizes table.
The WRITE STATUS REGISTER command also allows the user to set and reset the status
register write disable (SRWD) bit in accordance with the write protect (W#/VPP) signal.
The SRWD bit and the W#/VPP signal allow the device to be put in the HARDWARE PROTECED (HPM) mode. The WRITE STATUS REGISTER command is not executed once
the HPM is entered. The options for enabling the status register protection modes are
summarized here.
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Micron M25P16 Serial Flash Embedded Memory
WRITE STATUS REGISTER
Table 7: Status Register Protection Modes
Memory Content
W#/VPP
Signal
SRWD
Bit
1
0
0
0
1
1
0
1
Protection
Mode (PM)
Status Register
Write Protection
Protected
Area
Unprotected
Area
Notes
SOFTWARE
PROTECTED mode
(SPM)
Software protection
Commands not
accepted
Commands
accepted
1, 2, 3
HARDWARE
PROTECTED mode
(HPM)
Hardware protection
Commands not
accepted
Commands
accepted
3, 4, 5,
Notes:
1. Software protection: status register is writable (SRWD, BP2, BP1, and BP0 bit values can
be changed) if the WRITE ENABLE command has set the WEL bit.
2. PAGE PROGRAM, SECTOR ERASE, AND BULK ERASE commands are not accepted.
3. PAGE PROGRAM and SECTOR ERASE commands can be accepted.
4. Hardware protection: status register is not writable (SRWD, BP2, BP1, and BP0 bit values
cannot be changed).
5. PAGE PROGRAM, SECTOR ERASE, AND BULK ERASE commands are not accepted.
When the SRWD bit of the status register is 0 (its initial delivery state), it is possible to
write to the status register provided that the WEL bit has been set previously by a WRITE
ENABLE command, regardless of whether the W#/VPP signal is driven HIGH or LOW.
When the status register SRWD bit is set to 1, two cases need to be considered depending on the state of the W#/VPP signal:
• If the W#/VPP signal is driven HIGH, it is possible to write to the status register provided that the WEL bit has been set previously by a WRITE ENABLE command.
• If the W#/VPP signal is driven LOW, it is not possible to write to the status register even
if the WEL bit has been set previously by a WRITE ENABLE command. Therefore, attempts to write to the status register are rejected, and are not accepted for execution.
The result is that all the data bytes in the memory area that have been put in SPM by
the status register block protect bits (BP2, BP1, BP0) are also hardware protected
against data modification.
Regardless of the order of the two events, the HPM can be entered in either of the following ways:
• Setting the status register SRWD bit after driving the W#/VPP signal LOW
• Driving the W#/VPP signal LOW after setting the status register SRWD bit.
The only way to exit the HPM is to pull the W#/VPP signal HIGH. If the W#/VPP signal is
permanently tied HIGH, the HPM can never be activated. In this case, only the SPM is
available, using the status register block protect bits (BP2, BP1, BP0).
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Micron M25P16 Serial Flash Embedded Memory
READ DATA BYTES
READ DATA BYTES
The device is first selected by driving chip select (S#) LOW. The command code for
READ DATA BYTES is followed by a 3-byte address (A23-A0), each bit being latched-in
during the rising edge of serial clock (C). Then the memory contents at that address is
shifted out on serial data output (DQ1), each bit being shifted out at a maximum frequency fR during the falling edge of C.
The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. Therefore, the entire
memory can be read with a single READ DATA BYTES command. When the highest address is reached, the address counter rolls over to 000000h, allowing the read sequence
to be continued indefinitely.
The READ DATA BYTES command is terminated by driving S# HIGH. S# can be driven
HIGH at any time during data output. Any READ DATA BYTES command issued while
an ERASE, PROGRAM, or WRITE cycle is in progress is rejected without any effect on
the cycle that is in progress.
Figure 14: READ DATA BYTES Command Sequence
0
7
8
Cx
C
LSB
MSB
DQ1
A[MIN]
Command
DQ[0]
A[MAX]
DOUT
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
Don’t Care
Note:
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1. Cx = 7 + (A[MAX] + 1).
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Micron M25P16 Serial Flash Embedded Memory
READ DATA BYTES at HIGHER SPEED
READ DATA BYTES at HIGHER SPEED
The device is first selected by driving chip select (S#) LOW. The command code for the
READ DATA BYTES at HIGHER SPEED command is followed by a 3-byte address (A23A0) and a dummy byte, each bit being latched-in during the rising edge of serial clock
(C). Then the memory contents at that address are shifted out on serial data output
(DQ1) at a maximum frequency fC, during the falling edge of C.
The first byte addressed can be at any location. The address is automatically incremented to the next higher address after each byte of data is shifted out. Therefore, the entire
memory can be read with a single READ DATA BYTES at HIGHER SPEED command.
When the highest address is reached, the address counter rolls over to 000000h, allowing the read sequence to be continued indefinitely.
The READ DATA BYTES at HIGHER SPEED command is terminated by driving S# HIGH.
S# can be driven HIGH at any time during data output. Any READ DATA BYTES at
HIGHER SPEED command issued while an ERASE, PROGRAM, or WRITE cycle is in
progress is rejected without any effect on the cycle that is in progress.
Figure 15: READ DATA BYTES at HIGHER SPEED Command Sequence
0
7
8
Cx
C
LSB
A[MIN]
Command
DQ0
MSB
DQ1
A[MAX]
DOUT
High-Z
DOUT
DOUT
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
DOUT
MSB
Dummy cycles
Note:
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Don’t Care
1. Cx = 7 + (A[MAX] + 1).
27
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Micron M25P16 Serial Flash Embedded Memory
PAGE PROGRAM
PAGE PROGRAM
The PAGE PROGRAM command allows bytes in the memory to be programmed, which
means the bits are changed from 1 to 0. Before a PAGE PROGRAM command can be accepted a WRITE ENABLE command must be executed. After the WRITE ENABLE command has been decoded, the device sets the write enable latch (WEL) bit.
The PAGE PROGRAM command is entered by driving chip select (S#) LOW, followed by
the command code, three address bytes, and at least one data byte on serial data input
(DQ0).
If the eight least significant address bits (A7-A0) are not all zero, all transmitted data that
goes beyond the end of the current page are programmed from the start address of the
same page; that is, from the address whose eight least significant bits (A7-A0) are all
zero. S# must be driven LOW for the entire duration of the sequence.
If more than 256 bytes are sent to the device, previously latched data are discarded and
the last 256 data bytes are guaranteed to be programmed correctly within the same
page. If less than 256 data bytes are sent to device, they are correctly programmed at the
requested addresses without any effects on the other bytes of the same page.
For optimized timings, it is recommended to use the PAGE PROGRAM command to
program all consecutive targeted bytes in a single sequence rather than to use several
PAGE PROGRAM sequences, each containing only a few bytes.
S# must be driven HIGH after the eighth bit of the last data byte has been latched in.
Otherwise the PAGE PROGRAM command is not executed.
As soon as S# is driven HIGH, the self-timed PAGE PROGRAM cycle is initiated; the cycles's duration is tPP. While the PAGE PROGRAM cycle is in progress, the status register
may be read to check the value of the write in progress (WIP) bit. The WIP bit is 1 during
the self-timed PAGE PROGRAM cycle, and 0 when the cycle is completed. At some unspecified time before the cycle is completed, the write enable latch (WEL) bit is reset.
A PAGE PROGRAM command is not executed if it applies to a page protected by the
block protect bits BP2, BP1, and BP0.
Figure 16: PAGE PROGRAM Command Sequence
0
7
8
Cx
C
LSB
A[MIN]
LSB
DIN
Command
DQ[0]
MSB
A[MAX]
Note:
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DIN
DIN
DIN
DIN
DIN
DIN
DIN
DIN
MSB
1. Cx = 7 + (A[MAX] + 1).
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Micron M25P16 Serial Flash Embedded Memory
SECTOR ERASE
SECTOR ERASE
The SECTOR ERASE command sets to 1 (FFh) all bits inside the chosen sector. Before
the SECTOR ERASE command can be accepted, a WRITE ENABLE command must have
been executed previously. After the WRITE ENABLE command has been decoded, the
device sets the write enable latch (WEL) bit.
The SECTOR ERASE command is entered by driving chip select (S#) LOW, followed by
the command code, and three address bytes on serial data input (DQ0). Any address inside the sector is a valid address for the SECTOR ERASE command. S# must be driven
LOW for the entire duration of the sequence.
S# must be driven HIGH after the eighth bit of the last address byte has been latched in.
Otherwise the SECTOR ERASE command is not executed. As soon as S# is driven HIGH,
the self-timed SECTOR ERASE cycle is initiated; the cycle's duration is tSE. While the
SECTOR ERASE cycle is in progress, the status register may be read to check the value of
the write in progress (WIP) bit. The WIP bit is 1 during the self-timed SECTOR ERASE
cycle, and is 0 when the cycle is completed. At some unspecified time before the cycle is
completed, the WEL bit is reset.
A SECTOR ERASE command is not executed if it applies to a sector that is hardware or
software protected.
Figure 17: SECTOR ERASE Command Sequence
0
7
8
Cx
C
LSB
DQ0
MSB
Note:
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A[MIN]
Command
A[MAX]
1. Cx = 7 + (A[MAX] + 1).
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Micron M25P16 Serial Flash Embedded Memory
BULK ERASE
BULK ERASE
The BULK ERASE command sets all bits to 1 (FFh). Before the BULK ERASE command
can be accepted, a WRITE ENABLE command must have been executed previously. After the WRITE ENABLE command has been decoded, the device sets the write enable
latch (WEL) bit.
The BULK ERASE command is entered by driving chip select (S#) LOW, followed by the
command code on serial data input (DQ0). S# must be driven LOW for the entire duration of the sequence.
S# must be driven HIGH after the eighth bit of the command code has been latched in.
Otherwise the BULK ERASE command is not executed. As soon as S# is driven HIGH,
the self-timed BULK ERASE cycle is initiated; the cycle's duration is tBE. While the BULK
ERASE cycle is in progress, the status register may be read to check the value of the write
In progress (WIP) bit. The WIP bit is 1 during the self-timed BULK ERASE cycle, and is 0
when the cycle is completed. At some unspecified time before the cycle is completed,
the WEL bit is reset.
The BULK ERASE command is executed only if all block protect (BP2, BP1, BP0) bits are
0. The BULK ERASE command is ignored if one or more sectors are protected.
Figure 18: BULK ERASE Command Sequence
0
7
C
LSB
Command
DQ0
MSB
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Micron M25P16 Serial Flash Embedded Memory
DEEP POWER-DOWN
DEEP POWER-DOWN
Executing the DEEP POWER-DOWN command is the only way to put the device in the
lowest power consumption mode, the DEEP POWER-DOWN mode. The DEEP POWERDOWN command can also be used as a software protection mechanism while the device is not in active use because in the DEEP POWER-DOWN mode the device ignores
all WRITE, PROGRAM, and ERASE commands.
Driving chip select (S#) HIGH deselects the device, and puts it in the STANDBY POWER
mode if there is no internal cycle currently in progress. Once in STANDBY POWER
mode, the DEEP POWER-DOWN mode can be entered by executing the DEEP POWERDOWN command, subsequently reducing the standby current from ICC1 to ICC2.
To take the device out of DEEP POWER-DOWN mode, the RELEASE from DEEP POWER-DOWN command must be issued. Other commands must not be issued while the
device is in DEEP POWER-DOWN mode. The DEEP POWER-DOWN mode stops automatically at power-down. The device always powers up in STANDBY POWER mode.
The DEEP POWER-DOWN command is entered by driving S# LOW, followed by the
command code on serial data input (DQ0). S# must be driven LOW for the entire duration of the sequence.
S# must be driven HIGH after the eighth bit of the command code has been latched in.
Otherwise the DEEP POWER-DOWN command is not executed. As soon as S# is driven
HIGH, it requires a delay of tDP before the supply current is reduced to ICC2 and the
DEEP POWER-DOWN mode is entered.
Any DEEP POWER-DOWN command issued while an ERASE, PROGRAM, or WRITE cycle is in progress is rejected without any effect on the cycle that is in progress.
Figure 19: DEEP POWER-DOWN Command Sequence
0
7
C
LSB
t
DP
Command
DQ0
MSB
Standby Mode
Deep Power-Down Mode
Don’t Care
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Micron M25P16 Serial Flash Embedded Memory
RELEASE from DEEP POWER-DOWN
RELEASE from DEEP POWER-DOWN
Once the device has entered DEEP POWER-DOWN mode, all commands are ignored except RELEASE from DEEP POWER-DOWN and READ ELECTRONIC SIGNATURE. Executing either of these commands takes the device out of the DEEP POWER-DOWN
mode.
The RELEASE from DEEP POWER-DOWN command is entered by driving chip select
(S#) LOW, followed by the command code on serial data input (DQ0). S# must be driven
LOW for the entire duration of the sequence.
The RELEASE from DEEP POWER-DOWN command is terminated by driving S# HIGH.
Sending additional clock cycles on serial clock C while S# is driven LOW causes the
command to be rejected and not executed.
After S# has been driven HIGH, followed by a delay, tRES, the device is put in the STANDBY mode. S# must remain HIGH at least until this period is over. The device waits to be
selected so that it can receive, decode, and execute commands.
Any RELEASE from DEEP POWER-DOWN command issued while an ERASE, PROGRAM, or WRITE cycle is in progress is rejected without any effect on the cycle that is in
progress.
Figure 20: RELEASE from DEEP POWER-DOWN Command Sequence
0
7
C
LSB
RDP
t
Command
DQ0
MSB
DQ1
High-Z
Deep Power-Down Mode
Standby Mode
Don’t Care
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Micron M25P16 Serial Flash Embedded Memory
READ ELECTRONIC SIGNATURE
READ ELECTRONIC SIGNATURE
Once the device enters DEEP POWER-DOWN mode, all commands are ignored except
READ ELECTRONIC SIGNATURE and RELEASE from DEEP POWER-DOWN. Executing
either of these commands takes the device out of the DEEP POWER-DOWN mode.
The READ ELECTRONIC SIGNATURE command is entered by driving chip select (S#)
LOW, followed by the command code and three dummy bytes on serial data input
(DQ0) . Each bit is latched in on the rising edge of serial clock C. The 8-bit electronic
signature is shifted out on serial data output DQ1 on the falling edge of C; S# must be
driven LOW the entire duration of the sequence for the electronic signature to be read.
However, driving S# HIGH after the command code, but before the entire 8-bit electronic signature has been output for the first time, still ensures that the device is put into
STANDBY mode.
Except while an ERASE, PROGRAM, or WRITE STATUS REGISTER cycle is in progress,
the READ ELECTRONIC SIGNATURE command provides access to the 8-bit electronic
signature of the device, and can be applied even if DEEP POWER-DOWN mode has not
been entered. The READ ELECTRONIC SIGNATURE command is not executed while an
ERASE, PROGRAM, or WRITE STATUS REGISTER cycle is in progress and has no effect
on the cycle in progress.
The READ ELECTRONIC SIGNATURE command is terminated by driving S# high after
the electronic signature has been read at least once. Sending additional clock cycles C
while S# is driven LOW causes the electronic signature to be output repeatedly.
If S# is driven HIGH, the device is put in STANDBY mode immediately unless it was previously in DEEP POWER-DOWN mode. If previously in DEEP POWER-DOWN mode, the
device transitions to STANDBY mode with delay as described here. Once in STANDBY
mode, the device waits to be selected so that it can receive, decode, and execute instructions.
• If S# is driven HIGH before the electronic signature is read, transition to STANDBY
mode is delayed by tRES1, as shown in the RELEASE from DEEP POWER-DOWN command sequence. S# must remain HIGH for at least tRES1(max).
• If S# is driven HIGH after the electronic signature is read, transition to STANDBY
mode is delayed by tRES2. S# must remain HIGH for at least tRES2(max).
Figure 21: READ ELECTRONIC SIGNATURE Command Sequence
0
7
8
Cx
C
RES2
t
LSB
Command
DQ0
MSB
DQ1
DOUT
High-Z
DOUT
DOUT
Electronic Signature
DOUT
DOUT
DOUT
DOUT
LSB
DOUT
MSB
Dummy cycles
Deep Power-Down
Standby
Don’t Care
Note:
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1. Cx = 7 + (A[MAX] + 1).
33
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Micron M25P16 Serial Flash Embedded Memory
Power-Up/Down and Supply Line Decoupling
Power-Up/Down and Supply Line Decoupling
At power-up and power-down, the device must not be selected; that is, chip select (S#)
must follow the voltage applied on V CC until V CC reaches the correct value:
• VCC,min at power-up, and then for a further delay of tVSL
• VSS at power-down
A safe configuration is provided in the SPI Modes section.
To avoid data corruption and inadvertent write operations during power-up, a poweron-reset (POR) circuit is included. The logic inside the device is held reset while V CC is
less than the POR threshold voltage, V WI – all operations are disabled, and the device
does not respond to any instruction. Moreover, the device ignores the following instructions until a time delay of tPUW has elapsed after the moment that V CC rises above the
VWI threshold:
•
•
•
•
•
WRITE ENABLE
PAGE PROGRAM
SECTOR ERASE
BULK ERASE
WRITE STATUS REGISTER
However, the correct operation of the device is not guaranteed if, by this time, V CC is still
below V CC.min. No WRITE STATUS REGISTER, PROGRAM, or ERASE instruction should
be sent until:
• tPUW after V CC has passed the V WI threshold
• tVSL after V CC has passed the V CC,min level
If the time, tVSL, has elapsed, after V CC rises above V CC,min, the device can be selected
for READ instructions even if the tPUW delay has not yet fully elapsed.
VPPH must be applied only when V CC is stable and in the V CC,min to V CC,max voltage
range.
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Micron M25P16 Serial Flash Embedded Memory
Power-Up/Down and Supply Line Decoupling
Figure 22: Power-Up Timing
VCC
VCC,max
PROGRAM, ERASE, and WRITE commands are rejected by the device
Chip selection not allowed
VCC,min
t
RESET state
of the
device
VSL
READ access allowed
Device fully
accessible
VWI
t
PUW
Time
After power-up, the device is in the following state:
•
•
•
•
•
Standby power mode (not the deep power-down mode)
Write enable latch (WEL) bit is reset
Write in progress (WIP) bit is reset
Write lock bit = 0
Lock down bit = 0
Normal precautions must be taken for supply line decoupling to stabilize the V CC supply. Each device in a system should have the V CC line decoupled by a suitable capacitor
close to the package pins; generally, this capacitor is of the order of 100 nF.
At power-down, when V CC drops from the operating voltage to below the POR threshold
voltage V WI, all operations are disabled and the device does not respond to any instruction.
Note: If power-down occurs while a WRITE, PROGRAM, or ERASE cycle is in progress,
some data corruption may result.
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Micron M25P16 Serial Flash Embedded Memory
Power-Up Timing and Write Inhibit Voltage Threshold Specifications
Power-Up Timing and Write Inhibit Voltage Threshold Specifications
Table 8: Power-Up Timing and VWI Threshold
Symbol
tVSL
Note:
Parameter
VCC(min) to S# LOW
Min
Max
Unit
30
–
μs
tPUW
Time delay to write instruction
1.0
10
ms
VWI
Write Inhibit voltage
1.0
2.1
V
1. Parameters are characterized only.
If the time, tVSL, has elapsed, after V CC rises above V CC(min), the device can be selected
for READ instructions even if the tPUW delay has not yet fully elapsed.
VPPH must be applied only when V CC is stable and in the V CCmin to V CCmax voltage
range.
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Micron M25P16 Serial Flash Embedded Memory
Maximum Ratings and Operating Conditions
Maximum Ratings and Operating Conditions
Caution: Stressing the device beyond the absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and operation of the device beyond any specification or condition in the operating sections of this data sheet is not
recommended. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
Table 9: Absolute Maximum Ratings
Symbol
Parameter
TSTG
Storage temperature
TLEAD
Lead temperature during soldering
VIO
Input and output voltage (with respect to ground)
VCC
Supply voltage
VESD
Electrostatic discharge voltage (Human Body model)
Notes:
Min
Max
Units
–65
150
°C
Notes
–
See note
°C
1
–0.6
VCC+0.6
V
2
–0.6
4.0
V
–2000
2000
V
3
1. The TLEAD signal is compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the Micron RoHS-compliant 7191395 specification, and the European directive
on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.
2. The minimum voltage may reach the value of –2V for no more than 20ns during transitions; the maximum may reach the value of VCC +2V for no more than 20ns during transitions.
3. The VESD signal: JEDEC Std JESD22-A114A (C1 = 100 pF, R1 = 1500Ω, R2 = 500Ω).
Table 10: Operating Conditions
Symbol
Min
Typical
Max
VCC
Supply voltage
Parameter
2.7
–
3.6
V
TA
Ambient operating temperature (grade 6)
–40
–
85
°C
1
TA
Ambient operating temperature (grade 3)
–40
–
125
°C
2
Notes:
Unit Notes
1. Autograde 6 and standard parts (grade 6) are tested to 85 °C. Autograde 6 follows the
high reliability certified test flow.
2. Autograde 3 is tested to 125 °C.
Table 11: Data Retention and Endurance
Symbol
Condition
Program/Erase Grade 6, grade 3, autograde 6
Cycles
Data Retention at 55°C
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Min
Max
Unit
100,000
–
Cycles per block
20
–
Years
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Micron M25P16 Serial Flash Embedded Memory
Electrical Characteristics
Electrical Characteristics
Table 12: DC Current Specifications
Symbol
ILI
Parameter
Test Conditions
Min
Max
Units
–
–
±2
µA
–
–
±2
µA
S# = VCC, VIN = VSS or VCC
–
50
µA
–
100
µA
–
10
µA
–
100
µA
C = 0.1VCC / 0.9VCC at 75MHz, DQ1 =
open
–
8
mA
C = 0.1VCC / 0.9VCC at 33MHz, DQ1 =
open
–
4
mA
Input leakage current
ILO
Output leakage current
ICC1
Standby current (grade 6)
ICC1
Standby current (grade 3)
ICC2
Deep power-down current (grade
6)
ICC2
Deep power-down current (grade
3)
ICC3
Operating current (READ)
S# = VCC, VIN = VSS or VCC
ICC4
Operating current
(PAGE PROGRAM)
S# = VCC
–
15
mA
ICC5
Operating current
(WRITE STATUS REGISTER)
S# = VCC
–
15
mA
ICC6
Operating current
(SECTOR ERASE)
S# = VCC
–
15
mA
ICC7
Operating current
(BULK ERASE)
S# = VCC
–
15
mA
Test Conditions
Min
Max
Units
Table 13: DC Voltage Specifications
Symbol
Parameter
VIL
Input LOW voltage
–
–0.5
0.3VCC
V
VIH
Input HIGH voltage
–
0.7VCC
VCC+0.4
V
VOL
Output LOW voltage
IOL = 1.6mA
–
0.4
V
VOH
Output HIGH voltage
IOH = –100µA
VCC–0.2
–
V
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Micron M25P16 Serial Flash Embedded Memory
AC Characteristics
AC Characteristics
In the following AC specifications, output HIGH-Z is defined as the point where data
out is no longer driven; however, this is not applicable to the M25PX64 device.
Table 14: AC Measurement Conditions
Symbol
Parameter
CL
Min
Max
Unit
30
30
pF
–
5
ns
Input pulse voltages
0.2 VCC
0.8 VCC
V
Input timing reference voltages
0.3 VCC
0.7 VCC
V
Output timing reference voltages
VCC / 2
VCC / 2
V
Load capacitance
Input rise and fall times
Figure 23: AC Measurement I/O Waveform
Input levels
Input and output
timing reference levels
0.8VCC
0.7VCC
0.5VCC
0.2VCC
0.3VCC
Table 15: Capacitance
Symbol Parameter
COUT
CIN
Test Condition
Min
Max
Unit
Notes
1
Output capacitance (DQ1)
VOUT = 0 V
–
8
pF
Input capacitance (other pins)
VIN = 0 V
–
6
pF
Note:
1. Values are sampled only, not 100% tested, at TA = 25°C and a frequency of 25 MHz.
Table 16: AC Specifications (25 MHz, Device Grade 3, VCC[min]=2.7V)
Symbol
Alt.
Parameter
Min
Typ
Max
Unit
Notes
fC
fC
Clock frequency for commands (See note)
D.C.
–
25
MHz
1
Clock frequency for READ command
fR
–
D.C.
–
20
MHz
tCH
tCLH
Clock HIGH time
18
–
–
ns
2
tCL
tCLL
Clock LOW time
18
–
–
ns
2
tCLCH
–
Clock rise time (peak to peak)
0.1
–
–
V/ns
3, 4
Clock fall time (peak to peak)
0.1
–
–
V/ns
3, 4
S# active setup time (relative to C)
10
–
–
ns
tCHCL
–
tSLCH
tCSS
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Micron M25P16 Serial Flash Embedded Memory
AC Characteristics
Table 16: AC Specifications (25 MHz, Device Grade 3, VCC[min]=2.7V) (Continued)
Symbol
Alt.
tCHSL
—
Min
Typ
Max
Unit
S# not active hold time (relative to C)
tDVCH
tCHDX
Parameter
10
–
–
ns
tDSU
Data in setup time
5
–
–
ns
tDH
Data in hold time
5
–
–
ns
tCHSH
–
S# active hold time (relative to C)
10
–
–
ns
tSHCH
–
S# not active setup time (relative to C)
10
–
–
ns
tSHSL
tCSH
S# deselect time
100
–
–
ns
tSHQZ
tDIS
Output disable time
–
–
15
ns
Clock LOW to output valid
–
–
15
ns
Output hold time
0
–
–
ns
Notes
3
tCLQV
tV
tCLQX
tHO
tHLCH
–
HOLD# setup time (relative to C)
10
–
–
ns
tCHHH
–
HOLD# hold time (relative to C)
10
–
–
ns
tHHCH
–
HOLD# setup time (relative to C)
10
–
–
ns
tCHHL
–
HOLD# hold time (relative to C)
10
–
–
ns
tHHQX
tLZ
HOLD# to output LOW-Z
–
–
15
ns
3
tHLQZ
tHZ
HOLD# to output HIGH-Z
–
–
20
ns
3
tWHSL
–
WRITE PROTECT setup time
20
–
–
ns
5
tSHWL
–
WRITE PROTECT hold time
100
–
–
ns
5
tDP
–
S# HIGH to DEEP POWER-DOWN mode
–
–
3
μs
3
tRES1
–
S# HIGH to STANDBY without READ ELECTRONIC SIGNATURE
–
–
30
μs
3
tRES2
–
S# HIGH to STANDBY with READ ELECTRONIC SIGNATURE
–
–
30
μs
3
Notes:
1. READ DATA BYTES at HIGHER SPEED, PAGE PROGRAM, SECTOR ERASE, BLOCK ERASE,
DEEP POWER-DOWN, READ ELECTRONIC SIGNATURE, WRITE ENABLE/DISABLE, READ ID,
READ/WRITE STATUS REGISTER
2. The tCH and tCL signals must be greater than or equal to 1/fC.
3. The tCLCH, tCHCL, tSHQZ, tHHQX, tHLQZ, tDP, tRES1, and tRES2 signal values are guaranteed by
characterization, not 100% tested in production.
4. The tCLCH and tCHCLsignals clock rise and fall time values are expressed as a slew-rate.
5. The tWHSL and tSHWLsignals are only applicable as a constraint for a WRITE STATUS REGISTER command when SRWD bit is set at 1.
Table 17: Instruction Times (25 MHz, Device Grade 3, VCC[min]=2.7V)
Symbol
Parameter
Min
Typ
Max
Units
1.5
15
ms
5
ms
tW
WRITE STATUS REGISTER cycle time
–
tPP
PAGE PROGRAM cycle time (256 bytes)
–
0.8
tPP
PAGE PROGRAM cycle time (n bytes)
–
int (n/8) x
0.025
tSE
SECTOR ERASE cycle time
–
0.8
3
s
tBE
BULK ERASE cycle time
–
10
20
s
Notes:
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Notes
2, 3
1. Applies to the entire table: Typical values are given for TA = 85 °C.
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Micron M25P16 Serial Flash Embedded Memory
AC Characteristics
2. When using the PAGE PROGRAM command to program consecutive bytes, optimized
timings are obtained in one sequence that includes all the bytes rather than in several
sequences of only a few bytes (1 < n < 256).
3. int(A) corresponds to the upper integer part of A. For example, int(12/8) = 2 and
int(32/8) = 4.
Table 18: AC Specifications (75 MHz, Device Grade 3 and 6, VCC[min]=2.7V)
Symbol
Alt.
Parameter
Min
Typ
Max
Unit
fC
fC
Clock frequency for all commands (except READ)
D.C.
–
75
MHz
Clock frequency for READ command
Notes
fR
–
D.C.
–
33
MHz
tCH
tCLH
Clock HIGH time
6
–
–
ns
2
tCL
tCLL
Clock LOW time
6
–
–
ns
2
tCLCH
–
Clock rise time (peak to peak)
0.1
–
–
V/ns
3, 4
Clock fall time (peak to peak)
3, 4
tCHCL
–
tSLCH
tCSS
tCHSL
0.1
–
–
V/ns
S# active setup time (relative to C)
5
–
–
ns
S# not active hold time (relative to C)
5
–
–
ns
Data In setup time
2
–
–
ns
tDVCH
tDSU
tCHDX
tDH
Data In hold time
5
–
–
ns
tCHSH
–
S# active hold time (relative to C)
5
–
–
ns
tSHCH
–
S# not active setup time (relative to C)
5
–
–
ns
tSHSL
tCSH
S# deselect time
100
–
–
ns
tSHQZ
tDIS
Output disable time
–
–
8
ns
tCLQV
tV
Clock LOW to output valid under 30 pF
–
–
8
ns
Clock LOW to output valid under 10 pF
–
–
6
ns
Output hold time
0
–
–
ns
tCLQX
tHO
tHLCH
–
HOLD# setup time (relative to C)
5
–
–
ns
tCHHH
–
HOLD# hold time (relative to C)
5
–
–
ns
tHHCH
–
HOLD# setup time (relative to C)
5
–
–
ns
tCHHL
–
HOLD# hold time (relative to C)
5
–
–
ns
3
tHHQX
tLZ
HOLD# to output LOW-Z
–
–
8
ns
3
tHLQZ
tHZ
HOLD# to output HIGH-Z
–
–
8
ns
3
tWHSL
–
WRITE PROTECT setup time
20
–
–
ns
5
tSHWL
–
WRITE PROTECT hold time
100
–
–
ns
5
tDP
–
S# HIGH to DEEP POWER-DOWN mode
–
–
3
μs
3
tRES1
–
S# HIGH to STANDBY without READ ELECTRONIC SIGNATURE
–
–
30
μs
3
tRES2
–
S# HIGH to STANDBY with READ ELECTRONIC SIGNATURE
–
–
30
μs
3
Notes:
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1. Applies to entire table: 110nm technology devices are identified by the process identification digit 4 in the device marking and the process letter B in the part number.
2. The tCH and tCL signal values must be greater than or equal to 1/fC.
3. The tCLCH, tCHCL, tSHQZ, tHHQX, tHLQZ, tDP, and tRDP signal values are guaranteed by characterization, not 100% tested in production.
4. The tCLCH and tCHCL signals clock rise and fall time values are expressed as a slew-rate.
41
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Micron M25P16 Serial Flash Embedded Memory
AC Characteristics
5. The tWHSL and tSHWL signal values are only applicable as a constraint for a WRITE STATUS
REGISTER command when SRWD bit is set at 1.
Table 19: Instruction Times (75 MHz, Device Grade 3 and 6, VCC[min]=2.7V)
Symbol
Min
Typ
Max
Units
tW
Parameter
WRITE STATUS REGISTER cycle time
–
1.3
15
ms
tPP
PAGE PROGRAM cycle time (256 bytes)
–
0.64
5
ms
tPP
PAGE PROGRAM cycle time (n bytes,
where n = 1 to 4)
–
0.01
tPP
PAGE PROGRAM cycle time (n bytes,
where n = 5 to 246)
–
int (n/8) x
0.02
tSE
SECTOR ERASE cycle time
–
0.6
3
s
tBE
BULK ERASE cycle time
–
13
40
s
Notes:
PDF: 09005aef8456656c
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Notes
3, 4
1. Applies to the entire table: Typical values are given for TA = 25 °C.
2. Applies to the entire table: 110nm technology devices are identified by the process identification digit 4 in the device marking and the process letter B in the part number.
3. When using the PAGE PROGRAM command to program consecutive bytes, optimized
timings are obtained in one sequence that includes all the bytes rather than in several
sequences of only a few bytes (1 < n < 256).
4. int(A) corresponds to the upper integer part of A. For example, int(12/8) = 2 and
int(32/8) = 4.
42
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Micron M25P16 Serial Flash Embedded Memory
AC Characteristics
Figure 24: Serial Input Timing
tSHSL
S#
tCHSL
tSLCH
tCHSH
tSHCH
C
tDVCH
tCHCL
tCHDX
DQ0
tCLCH
LSB IN
MSB IN
high impedance
DQ1
Figure 25: Write Protect Setup and Hold during WRSR when SRWD=1 Timing
W#/VPP
tSHWL
tWHSL
S#
C
DQ0
high impedance
DQ1
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Micron M25P16 Serial Flash Embedded Memory
AC Characteristics
Figure 26: Hold Timing
S#
tHLCH
tHHCH
tCHHL
C
tCHHH
tHLQZ
tHHQX
DQ1
DQ0
HOLD#
Figure 27: Output Timing
S#
tCH
C
tCLQV
tCLQX
tCLQV
tCL
tSHQZ
tCLQX
LSB OUT
DQ1
tQLQH
tQHQL
DQ0
ADDRESS
LSB IN
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Micron M25P16 Serial Flash Embedded Memory
Package Information
Package Information
Figure 28: SO8N 150 mils Body Width
0.25 MIN/
x 45°
0.50 MAX
1.75 MAX/
1.25 MIN
0.17 MIN/
0.23 MAX
0.10 MAX
0.28 MIN/
0.48 MAX
1.27 TYP
0.25mm
Gauge plane
4.90 ±0.10
8
0o MIN/
8o MAX
6.00 ±0.20
3.90 ±0.10
1
0.10 MIN/
0.25 MAX
0.40 MIN/
1.27 MAX
1.04 TYP
Notes:
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1. The 1 that appears in the top view of the package indicates the position of pin 1.
2. Drawing is not to scale.
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Micron M25P16 Serial Flash Embedded Memory
Package Information
Figure 29: SO8W 208 mils Body Width
1.70 MIN/
1.91 MAX
0.36 MIN/
0.48 MAX
1.78 MIN/
2.16 MAX
0.15 MIN/
0.25 MAX
0.1 MAX
1.27 TYP
5.08 MIN/
5.49 MAX
7.70 MIN/
8.10 MAX
5.08 MIN/
5.49 MAX
1
0.05 MIN/
0.25 MAX
Note:
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0º MIN/
10º MAX
0.5 MIN/
0.8 MAX
1. Drawing is not to scale.
46
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Micron M25P16 Serial Flash Embedded Memory
Package Information
Figure 30: SO16W 300 mils Body Width
h x 45°
10.30 ±0.20
16
9
0.23 MIN/
0.32 MAX
10.00 MIN/
10.65 MAX
7.50 ±0.10
1
8
0° MIN/8° MAX
2.5 ±0.15
0.1 Z
0.33 MIN/
0.51 MAX
1.27 TYP
Note:
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m25p16.pdf - Rev. I 4/15 EN
0.20 ±0.1
0.40 MIN/
1.27 MAX
Z
1. h = 0.25mm MIN, 0.75mm MAX
47
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Micron M25P16 Serial Flash Embedded Memory
Package Information
Figure 31: VFDFPN8 (MLP8) 6mm x 5mm
0.10 MAX/
0 MIN
5.75 TYP
Pin one
indicator
4.75 TYP
5 TYP
+0.30
4 -0.20
1.27
TYP
0.10 M C A B
B
0.15 C A
6 TYP
A
2x
0.15 C B
0.10 C B
0.10 C A
+0.15
0.60 -0.10
3.40 ±0.20
+0.08
0.40 -0.05
θ
12°
0.05
+0.15
0.85 -0.05
0.20 TYP
0 MIN/
0.05 MAX
Note:
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0.65 TYP
C
1. Drawing is not to scale.
48
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Micron M25P16 Serial Flash Embedded Memory
Package Information
Figure 32: VFDFPN8 (MLP8) 8mm x 6mm
8.00 TYP
6.00 TYP
1.27 MIN
4.80 TYP
0.40 -0.05
+0.08
5.16 TYP
0.50 -0.05
+0.10
0.85 TYP
0.82 MIN
0.15 MAX
0.05
0.00 MIN/0.05 MAX
Note:
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1. Drawing is not to scale.
49
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© 2011 Micron Technology, Inc. All rights reserved.
Micron M25P16 Serial Flash Embedded Memory
Package Information
Figure 33: UFDFPN8 (MLP8) 4mm x 3mm
0.80 ±0.10
Datum A
4.00 ±0.10
A
1
2
3
4
B
8 x (0.60 ±0.05)
Datum B
0.20 ±0.10
0.20 DIA TYP
3.00 ±0.10
(See note 1)
2X
0.10
See detail A
C
1
2X
0.10
8 x (0.30 ±0.05)
8
7
2
6
5
0.80 TYP
C
Top View
0.10
M C A B
0.05
M C
Bottom View
Datum A or B
// 0.10
0.05
C
-0.10
0.55
+0.05
C
0.60 ±0.05
C
Seating Plane
0.127 MIN/
0.15 MAX
0.02 -0.02
+0.03
Side View
Notes:
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0.80 TYP
Terminal Tip
0.40 TYP
Even Terminal/Side
Detail A
1. The dimension 0.30 ±0.05 applies to the metallic terminal and is measured between
0.15mm and 0.30mm from terminal tip. If the terminal has the optional radius on the
other end of the terminal, the dimensions should not be measured in that radius area.
2. Maximum package warping is 0.05mm; maximum allowable burrs is 0.076mm in all directions; bilateral coplanarity zone apples to the exposed heat sink slug as well as to the
terminals.
3. Drawing is not to scale.
50
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Micron M25P16 Serial Flash Embedded Memory
Device Ordering Information
Device Ordering Information
Standard Parts
Micron Serial NOR Flash devices are available in different configurations and densities.
Verify valid part numbers by using Micron's part catalog search at micron.com. To compare features and specifications by device type, visit micron.com/products. Contact the
factory for devices not found.
For more information on how to identify products and top-side marking by the process
identification letter, refer to technical note TN-12-24, "Serial Flash Memory Device
Marking for the M25P, M25PE, M25PX, and N25Q Product Families."
Table 20: Part Number Example
Part Number Category
Device
Type Density
M25P
16
Security
Features
Operating
Voltage
Package
Device
Grade
–
V
MN
6
Packing
Plating
Automotive
Option Technology Lithography
Grade
T
P
B
A
Table 21: Part Number Information Scheme
Part Number
Category
Category Details
Device type
M25P = Serial Flash memory for code storage
Density
16 = 16Mb (2 Meg x 8)
Security features
– = no extra security
Notes
1
S = CFD programmed with UID
Operating voltage
V = VCC = 2.7V to 3.6V
Package
MN = SO8N (150 mils width)
2
MW = SO8W (208 mils width)
MF = SO16W (300 mils width)
MP = VFDFPN8 6mm x 5mm (MLP8)
ME = VFDFPN8 8mm x 6mm (MLP8)
3
MC = UFDFPN8 4mm x 3mm (MLP8)
Device Grade
6 = Industrial temperature range: –40°C to 85°C. Device tested with standard test flow.
3 = Automotive temperature range: –40°C to 125°C. Device tested with high reliability
test flow.
Packing Option
4, 5
– = Standard packing (tube for SO8N, SO8W, and SO16W packages; tray for MLP packages)
T = Tape and reel packing
Plating technology
P or G = RoHS compliant
Lithography
B = 110nm technology, Fab 13 diffusion plant
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Micron M25P16 Serial Flash Embedded Memory
Device Ordering Information
Table 21: Part Number Information Scheme (Continued)
Part Number
Category
Automotive Grade
Category Details
Notes
A = Automotive: –40°C to 85°C part. Device tested with high reliability test flow.
– = Standard: –40°C to 125°C.
1.
2.
3.
4.
Secure options are available upon customer request.
Package is available only for products in the 110nm process technology.
Not for new designs. Use the MP package for new designs.
Micron recommends the use of the automotive grade device in the automotive environment, autograde 6 and grade 3.
5. Device grade 3 is available in an SO8 RoHS compliant package.
Notes:
Note: The category of second Level Interconnect is marked on the package and on the
inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label.
Automotive Parts
Table 22: Part Number Example
Part Number Category
Device
Type Density
M25P
16
Security
Features
Operating
Voltage
Package
Device
Grade
–
V
MN
6
Packing
Plating
Automotive
Option Technology Lithography
Grade
T
P
B
A
Table 23: Part Number Information Scheme
Part Number
Category
Category Details
Device type
M25P = Serial Flash memory for code storage
Density
16 = 8Mb (2 Meg x 8)
Security features
– = no extra security
Operating voltage
V = VCC = 2.7V to 3.6V
Package
MN = SO8N (150 mils width)
Notes
MF = SO16W (300 mils width)
Device Grade
6 = Industrial temperature range: –40°C to 85°C. Device tested with high reliability test
flow.
3 = Automotive temperature range: –40°C to 125°C. Device tested with high reliability
test flow.
Packing Option
1
– = Tube
T = Tape and reel packing
Y = Tray
Plating technology
P = RoHS compliant
Lithography
B = 110nm technology, Fab 13 diffusion plant
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Micron M25P16 Serial Flash Embedded Memory
Device Ordering Information
Table 23: Part Number Information Scheme (Continued)
Part Number
Category
Automotive Grade
Category Details
Notes
A = Automotive: –40°C to 85°C part. Only with temperature grade 6. Device tested with
high reliability test flow.
1
– = Automotive: –40°C to 125°C.
Note:
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1. Micron recommends the use of the automotive grade device in the automotive environment, autograde 6 and grade 3.
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Micron M25P16 Serial Flash Embedded Memory
Revision History
Revision History
Rev. I – 4/15
• UID programmed for package UFDFPN8 4 x 3
• Updated note 1 in the Read Identification Data Out Sequence table
Rev. H – 1/14
• In standard and automotive ordering information, revised package option and
changed Fab 2 to Fab 13
Rev. G – 1/13
• Removed part numbers from page 1
• Updated READ Identification in the Command Set Codes table to include 9Eh information
• Updated SO8W 208 mils Body Width drawing
• Updated Device Ordering Information section
Rev. F – 10/12
• Updated ordering information and package options
• Deleted old, extraneous pre-Micron revision history changes
Rev. E – 8/12
• Updated Command Set to include RELEASE FROM DEEP POWER-DOWN
• Updated Memory Map to eliminate the 64KB block box
Rev. D – 5/12
• In Signal Names table, changed direction column for DQ0 and DQ1 to input and output respectively
• Changed the Write Disable Command Sequenced graphic
• Revised Write Status Register topic
• Revised Power-Up/Down and Supply Line Decoupling topic
Rev. C – 3/12
• Updated address range in Memory Map
Rev. B – 3/12
• Corrected error in SO8N package drawing.
• Updated packing options in the Part Number Information Scheme table in Device Ordering Information
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Micron M25P16 Serial Flash Embedded Memory
Revision History
Rev. A – 9/2011
• Applied Micron brand
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
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