Product Specification Product Name: M903L Bluetooth SiP Module -BT 4.0 LE Version: XE Doc No: Date: Oct 23th, 2013 MtM Technology Corporation 12th floor, No. 186, Fuxing Road, Taoyuan City, Taoyuan County, Taiwan (R.O.C.) www.mtmtech.com.tw MtM Technology Corporation Document History Date Revise Contents Revise by Version Jan 23th,2013 Initial Version Brian Juang XA Apr 22th,2013 Update PIN DEFINIATION and REFERENCE Brian Juang XB DESIGN CIRCUIT with wake up pin feature Aug 21th,2013 Change mold design to metal lid Brian Juang XC Oct 1st,2013 Add 10.SiP Module Preparation and 11. Package Brian Juang XD Brian Juang XE Information Oct 23th,2013 Update 8.Reference Design Circuit and 4.1 Operating ambient temperature range © MtM Technology Corporation. All rights reserved. Page 2 / 18 MtM Technology Corporation INDEX 1 2 3 4 Description ...............................................................................................................................................4 Feature .....................................................................................................................................................5 Block Diagram.........................................................................................................................................6 Technical Specification ...........................................................................................................................7 4.1 Absolute Maximum Rating .....................................................................................................................7 4.2Recommendable Operation Condition .....................................................................................................7 4.2.1Temperature, humidity ..........................................................................................................................7 4.2.2Voltage ...................................................................................................................................................7 4.3 Wireless Specifications............................................................................................................................8 4.4 Radio Specifications Bluetooth 4.0 Low Energy ....................................................................................8 4.5 Power Consumption ................................................................................................................................8 5 6 7 8 9 10 Dimensions ...............................................................................................................................................9 Pin Assignments .................................................................................................................................... 11 Recommend Footprint ..........................................................................................................................13 Reference Design Circuit ......................................................................................................................14 Recommended Reflow Profile ..............................................................................................................15 SiP Module Preparation .......................................................................................................................16 10.1 Handling ..............................................................................................................................................16 10.2 SMT Preparation .................................................................................................................................16 11 Package Information ............................................................................................................................17 11.1 Product Marking ..................................................................................................................................17 11.2 Tray Drawing .......................................................................................................................................17 11.3 Packing Information ............................................................................................................................18 © MtM Technology Corporation. All rights reserved. Page 3 / 18 MtM Technology Corporation 1 Description The SiP module: M903L is a small size module that provides full function of Bluetooth 4.0 Low Energy in a tiny module via 32 pins LGA Foot Print. The M903L module provides everything required to create Bluetooth 4.0 Low Energy product with RF, baseband, MCU, qualified Bluetooth v4.0 stack and customer application running on a single IC. M903L enables ultra-low power connectivity and basic data transfer for applications previously limited by the power consumption, size constraints and complexity of other wireless standards. The low power consumption and excellent radio performance make it the best solution for OEM /ODM customers who require embedded Bluetooth 4.0 Low Energy feature, such as, IP camera, car key, sport and fitness watch, mouse, led light bulb etc. The module is based on CSR Bluetooth Low Energy single mode chipset provides Bluetooth Low Energy communication. M903L provides command line interface (CLI) for being easily controlled by a host CPU through UART communication. It also contains a 16 bit MCU to run a variety of applications and for embedded application development. For the software and driver development, we provide extensive technical document and reference software code for the system integration. Hardware evaluation kit and development utilities will be released base on listed OS and processors to OEM customers. © MtM Technology Corporation. All rights reserved. Page 4 / 18 MtM Technology Corporation 2 Feature Bluetooth® v4.0 LE radio technology Up to +6.0 dBm Tx power with transmit power control. High sensitivity (-90.0 dBm.) Dimension: 9 x 9 x 1.3mm High performance low power 16-bits microcontroller core Fast Connection Setup. Internal crystal oscillator (16MHz). Internal 32kHz crystal oscillator for Sleep Timer Serial interface for host: UART, SPI Applications interface for sensor: ADC, SPI , I2C, GPIO, PWM Command line Interface (CLI) for host: Node mode setting, Security manager, L2CAP command, Connection Management, power manager command. ORDRING INFORMATION Part Number Description M903L CLASS 2 Bluetooth single mode Module according BT-4.0. Bluetooth SMART © MtM Technology Corporation. All rights reserved. Page 5 / 18 MtM Technology Corporation 3 Block Diagram The M903L module is designed based on the CSR Bluetooth 4.0 LE single mode chipset solution. It supports UART command line interface to connect to the host processor. The simplified block diagram of the M903L module is depicted in the Fig. below. © MtM Technology Corporation. All rights reserved. Page 6 / 18 MtM Technology Corporation 4 Technical Specification 4.1 Absolute Maximum Rating No Description Value Unit –0.3 to 3.9 V Ratings Over Operating Free-Air Temperature Range 1 Supply voltage All supply pins must have the same voltage 2 Voltage on any digital pin –0.3 to +3.6 V 3 Operating ambient temperature –30 to 85 °C range 4 Storage temperature range –40 to 85 °C 5 Bluetooth RF inputs 10 dBm 6 ESD Protection: 2000 V 200 V 500 V All pads, according to human-body model, JEDEC STD 22, method A114 Machine Model Contact Discharge per JEDEC EIA/JESD22-A115 According to charged-device model, JEDEC STD 22, method C101 4.2Recommendable Operation Condition 4.2.1Temperature, humidity The M903L module has to withstand the operational requirements as listed in the table below. Operating Temperature Humidity range -30° to 85° Celsius Max 95% Non condensing, relative humidity 4.2.2Voltage Power supply for the M903L module will be provided by the host via the power pins Operating Condition Min. Typ. Max. DVDD_3V3 1.8 3.3 3.6 I/O supply voltage (VDD_PADS) 1.2 3.3 3.6 © MtM Technology Corporation. All rights reserved. Page 7 / 18 MtM Technology Corporation 4.3 Wireless Specifications The M903L module compliance with the following features and standards Features Description Bluetooth Standards Bluetooth core v4.0 Low Energy Antenna Port Support Single Antenna for Bluetooth Frequency Band 2.402 – 2.480 GHz 4.4 Radio Specifications Bluetooth 4.0 Low Energy Features Description Frequency Band 2.402– 2.480 GHz (2.4 GHz ISM Band) Number of selectable Sub channels 40 channels Modulation GFSK Supported rates <1Mbps Maximum receive level -10dBm (with PER < 8%) 4.5 Power Consumption Item Tx mode Rx mode Sleep Mode Condition 3.3V 1.8V I/O 3.3V 1.8V I/O Dormant Hibernate Deep Sleep © MtM Technology Corporation. All rights reserved. Page 8 / 18 Typ. 16 mA TBD TBD 16 mA TBD TBD <0.0006 mA <0.0015 mA <0.005 mA MtM Technology Corporation 5 Dimensions The size and thickness of the M903L module 9mm (W) x 9mm (L) x 1.3mm (H): © MtM Technology Corporation. All rights reserved. Page 9 / 18 MtM Technology Corporation © MtM Technology Corporation. All rights reserved. Page 10 / 18 MtM Technology Corporation 6 Pin Assignments The foot print dimension and pin definition is defined as below No Pin Name Pin Type Description 1 DVDD_3V3 Power Power input and regulator enable (active high) 2 NC - Reserved for internal use only 3 WAKE Analogue Pull up to wake up module from sleep mode 4 REG_IN Input Positive supply for Bluetooth radio and digital linear regulator. 5 GND Ground Ground connections. 6 RF RF Bluetooth transmitter / receiver. 7 GND Ground Ground connections. 8 NC - Reserved for internal use only 9 NC - Reserved for internal use only 10 NC - Reserved for internal use only 11 NC - Reserved for internal use only 12 NC - Reserved for internal use only 13 CSR_AIO_2 Analogue Analogue programmable I/O line. 14 CSR_AIO_1 Analogue Analogue programmable I/O line. 15 CSR_AIO_0 Analogue Analogue programmable I/O line. 16 UART1_TX Output UART TX 17 USART1_RX Input UART RX 18 PIO_3 Bidirectional Do not connect., reserved for internal used only 19 PIO_4 Bidirectional I²C2 clock or programmable I/O line. 20 CSR_SPI_CLK Bidirectional SPI debug CLK (slave mode) or programmable I/O line. 21 CSR_SPI_CS Bidirectional SPI debug CS (slave mode) or programmable I/O line. 22 CSR_SPI_MOSI Bidirectional SPI debug MOSI (slave mode) or programmable I/O line. 23 CSR_SPI_MISO Bidirectional SPI debug MISO (slave mode) or programmable I/O line. 24 PIO_9 Bidirectional Programmable I/O line. 25 PIO_10 Bidirectional I²C2 data input / output or programmable I/O © MtM Technology Corporation. All rights reserved. Page 11 / 18 MtM Technology Corporation line. 26 PIO_11 Bidirectional Programmable I/O line. 27 SPI_PIO#_SEL Input Selects Pin 20-23 as SPI debug interface or programmable I/O lines. 28 SMPS_LX Output High-voltage switch-mode regulator output. 29 CSR_I2C_PWR Power Do not connect., internal EEPROM I²C1 power 30 CSR_I2C_SCL Output Do not connect, internal EEPROM I²C1 clock 31 CSR_I2C_SDA Bidirectional Do not connect, internal EEPROM I²C1 data input / output 32 GND Ground Ground connections. 33-41 GND Ground Ground connections. © MtM Technology Corporation. All rights reserved. Page 12 / 18 MtM Technology Corporation 7 Recommend Footprint SM Pad SM Design Note: SM = Solder mask defined Pad = Copper defined © MtM Technology Corporation. All rights reserved. Page 13 / 18 MtM Technology Corporation 8 Reference Design Circuit Note: U2 is band pass filter which optional. Ensure the L1 trace width >= 220um © MtM Technology Corporation. All rights reserved. Page 14 / 18 MtM Technology Corporation 9 Recommended Reflow Profile Profile Condition a. Suitable for Lead-Free solder b. Between 155~160°C : 60~90 sec. c. Above 220°C : 60~90 sec. d. Peak Temperature : 240~245 ( <10 sec.) © MtM Technology Corporation. All rights reserved. Page 15 / 18 MtM Technology Corporation 10 SiP Module Preparation 10.1 Handling Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is aligned and tested, it should be transport and storage with anti-static tray and packing. This protective package must be remained in suitable environment until the module is assembled and soldered onto the main board. 10.2 SMT Preparation 1. Calculated shelf life in sealed bag: 6 months at <40℃ and <90% relative humidity (RH). 2. Peak package body temperature: 250℃. 3. After bag was opened, devices that will be subjected to reflow solder or other high temperature process must. A. Mounted within: 72 hours of factory conditions <30℃/60% RH. B. Stored at ≦10% RH with N2 flow box. 4. Devices require baking, before mounting, if: A. Package bag does not keep in vacuumed while first time open. B. Humidity Indicator Card is >10% when read at 23±5℃. C. Expose at 3A condition over 8 hours or Expose at 3B condition over 24 hours. 5. If baking is required, devices may be baked for 12 hours at 125±5℃. © MtM Technology Corporation. All rights reserved. Page 16 / 18 MtM Technology Corporation 11 Package Information 11.1 Product Marking 11.2 Tray Drawing Unit : mm © MtM Technology Corporation. All rights reserved. Page 17 / 18 MtM Technology Corporation 11.3 Packing Information ---------------------------------------------------------------------------------------------------------------------------------------- ---------------------------------------------------------------------------------------------------------------------------------------- ---------------------------------------------------------------------------------------------------------------------------------------- © MtM Technology Corporation. All rights reserved. Page 18 / 18