SZWW5A0A

Z-Power LED
X10490
Technical
Data
Sheet
Z5
Specification
Description
Features
• Super high Flux output
and high Luminance
• Designed for high
current operation
• SMT solderable
• Lead Free product
• RoHS compliant
The Z-Power series is designed for high
current operation and high flux output
applications.
It incorporates state of the art SMD
design and low thermal resistant material.
The Z Power LED is ideal light sources for general illumination
applications, custom designed solutions, automotive, large
LCD backlights and high performance torches.
Applications
• Automotive interior /
exterior lighting
• Automotive signal
lighting
• Automotive forward
lighting
• General Torch
• Architectural lighting
• Projector light source
• Traffic signals
• Task lighting
• Decorative / Pathway
lighting
• Remote / Solar
powered lighting
* The appearance and specifications of the product can be changed
for improvement without notice.
Rev. 09
August 2011
1
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서식번호 : SSC- QP- 7- 07- 25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Outline dimensions
Top View
ⓐ
ⓑ
Side View
Bottom View
ⓐ
ⓑ
Circuit
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] Undefined tolerance is ± 0.1mm
Rev. 09
August 2011
2
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Z-Power LED
X10490
Technical
Data
Sheet
Characteristics of Z5 (Part no : SZWW5A0A)
1. Warm white
1-1 Electro-Optical characteristics at 350mA
Value
Parameter
Symbol
Unit
Min
Luminous Flux
ФV [2]
[1]
Correlated Color Temperature
[3]
lm
3000
-
K
Ra
80
-
-
-
VF
3.3
4
V
RθJ-S
9
K /W
120
deg.
2
View Angle
80
-
[4]
Thermal resistance (J to S)
Max
CCT
CRI
Forward Voltage
Typ
Θ½
1-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
700
mA
Reverse Voltage
V
5
V
Power Dissipation
Pd
2.8
W
Junction Temperature
Tj
145(@ IF ≤ 700mA)
ºC
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
-
± 8,000V HBM
-
ESD Sensitivity
[5]
*Notes :
[1] SSC maintains a tolerance of ±10% on flux and power measurements.
[2] V is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
Color coordinate : 0.005, CCT ±5% tolerance.
[4] Tolerance is ±0.06V on forward voltage measurements
[5] A zener diode is included to protect the product from ESD.
Ф
Rev. 09
August 2011
3
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Z-Power LED
X10490
Technical
Data
Sheet
Temperature Characteristics Points
Ceramic
Ta
Lens
Tj
Ts
Tb
Metal-PCB
Solder
Ta
Color Spectrum TA=25℃
℃
Rev. 09
August 2011
4
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Z-Power LED
X10490
Technical
Data
Sheet
Forward Current Characteristics
Forward Voltage vs. Forward Current, Ta=25
℃
Forward Current vs. Normalized Relative Luminous Flux, Ta=25
℃
Rev. 09
August 2011
5
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Z-Power LED
X10490
Technical
Data
Sheet
Junction Temperature Characteristics
Relative Light Output vs. Junction Temperature at IF=350mA, Ta=25
℃
120
Relative Light Output[%]
100
80
60
40
20
0
20
40
60
80
100
120
140
160
o
Junction Temperature[ C]
Forward Voltage Shift vs. Junction Temperature at IF=350mA, Ta=25
℃
Forward Voltage Shift [V]
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
20
40
60
80
100
120
140
160
o
Junction Temperature [ C]
Rev. 09
August 2011
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Z-Power LED
X10490
Technical
Data
Sheet
Radiation pattern
0
1.0
30
Relative luminous flux
0.8
0.6
60
0.4
0.2
90
0.0
-80
-60
-40
-20
0
Angle(deg.)
Maximum Forward Current vs. Ambient Temperature
800
Forward Current(mA)
600
Rth=15K/W
Rth=20K/W
400
200
0
0
30
60
90
120
145
Ambient Temperature(C)
Rev. 09
August 2011
7
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Z-Power LED
X10490
Technical
Data
Sheet
Binning Structure
IF=350mA, Ta=25
℃
0.46
0.44
3000K
2900K
CIE Y
0.42
G8
3700K
F9
F1
G2
F0
0.40
F3
F5
0.38
F4
H2
G7
H1
BBL
H3
G3
H4
G5
G4
F2
H0
G1
G0
F8
G9
2600K
H9
H8
3200K
3500K
2700K
H6
H5
H7
G6
F7
F6
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
CIE X
* Note
Red area is ANSI Warm White bin.
Rev. 09
August 2011
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Z-Power LED
X10490
Technical
Data
Sheet
Color & Binning
● COLOR RANK
F8
F0
F2
F4
F6
<IF=350mA, Ta=25
CIE X
0.4037
0.3996
0.4146
0.4197
0.4037
0.3996
0.396
0.4104
0.4146
0.3996
0.396
0.3925
0.4062
0.4104
0.396
0.3925
0.3889
0.4017
0.4062
0.3925
0.3889
0.386
0.3983
0.4017
0.3889
CIE Y
0.414
0.4015
0.4089
0.4217
0.414
0.4015
0.3907
0.3978
0.4089
0.4015
0.3907
0.3798
0.3865
0.3978
0.3907
0.3798
0.369
0.3751
0.3865
0.3798
0.369
0.36
0.366
0.3751
0.369
F9
F1
F3
F5
F7
CIE X
0.4197
0.4146
0.4299
0.4354
0.4197
0.4146
0.4104
0.4248
0.4299
0.4146
0.4104
0.4062
0.4198
0.4248
0.4104
0.4062
0.4017
0.4147
0.4198
0.4062
0.4017
0.3983
0.4104
0.4147
0.4017
℃>
CIE Y
0.4217
0.4089
0.4165
0.4288
0.4217
0.4089
0.3978
0.4048
0.4165
0.4089
0.3978
0.3865
0.3931
0.4048
0.3978
0.3865
0.3751
0.3814
0.3931
0.3865
0.3751
0.366
0.3715
0.3814
0.3751
* Measurement Uncertainty of the Color Coordinates : ± 0.01
Rev. 09
August 2011
9
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Z-Power LED
X10490
Technical
Data
Sheet
● COLOR RANK
G8
G0
G2
G4
G6
<IF=350mA, Ta=25
CIE X
0.4354
0.4299
0.443
0.4487
0.4354
0.4299
0.4248
0.4374
0.443
0.4299
0.4248
0.4198
0.4317
0.4374
0.4248
0.4198
0.4147
0.4259
0.4317
0.4198
0.4147
0.4102
0.4207
0.4259
0.4147
CIE Y
0.4288
0.4165
0.4212
0.4333
0.4288
0.4165
0.4048
0.4093
0.4212
0.4165
0.4048
0.3931
0.3973
0.4093
0.4048
0.3931
0.3814
0.3853
0.3973
0.3931
0.3814
0.371
0.3744
0.3853
0.3814
G9
G1
G3
G5
G7
CIE X
0.4487
0.443
0.4562
0.4619
0.4487
0.443
0.4374
0.4499
0.4562
0.443
0.4374
0.4317
0.4436
0.4499
0.4374
0.4317
0.4259
0.4373
0.4436
0.4317
0.4259
0.4207
0.4312
0.4373
0.4259
℃>
CIE Y
0.4333
0.4212
0.426
0.4378
0.4333
0.4212
0.4093
0.4138
0.426
0.4212
0.4093
0.3973
0.4015
0.4138
0.4093
0.3973
0.3853
0.3893
0.4015
0.3973
0.3853
0.3744
0.3778
0.3893
0.3853
* Measurement Uncertainty of the Color Coordinates : ± 0.01
Rev. 09
August 2011
10
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Z-Power LED
X10490
Technical
Data
Sheet
● COLOR RANK
H8
H0
H2
H4
H6
<IF=350mA, Ta=25
CIE X
0.4619
0.4562
0.4687
0.4747
0.4619
0.4562
0.4499
0.462
0.4687
0.4562
0.4499
0.4436
0.4551
0.462
0.4499
0.4436
0.4373
0.4483
0.4551
0.4436
0.4373
0.4312
0.4422
0.4483
0.4373
CIE Y
0.4378
0.426
0.4289
0.441
0.4378
0.426
0.4138
0.4166
0.4289
0.426
0.4138
0.4015
0.4042
0.4166
0.4138
0.4015
0.3893
0.3919
0.4042
0.4015
0.3893
0.3778
0.3805
0.3919
0.3893
H9
H1
H3
H5
H7
CIE X
0.4747
0.4687
0.481
0.4875
0.4747
0.4687
0.462
0.474
0.481
0.4687
0.462
0.4551
0.4666
0.474
0.462
0.4551
0.4483
0.4593
0.4666
0.4551
0.4483
0.4422
0.4527
0.4593
0.4483
℃>
CIE Y
0.441
0.4289
0.4319
0.4435
0.441
0.4289
0.4166
0.4194
0.4319
0.4289
0.4166
0.4042
0.4069
0.4194
0.4166
0.4042
0.3919
0.3944
0.4069
0.4042
0.3919
0.3805
0.383
0.3944
0.3919
* Measurement Uncertainty of the Color Coordinates : ± 0.01
Rev. 09
August 2011
11
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Z-Power LED
X10490
Technical
Data
Sheet
Labeling
Rank :
# 1# 2# 3# 4
QUANTITY : 1000
Lot No : # # # # # # # # #
SSC PART NUMBER : SZWW5A0A
SZWW5A0A
Rank
# 1 # 2# 3 # 4
- #1 : Luminous Flux : LF [lm]
- #2#3 : Color Coordinates : x, y
- #4 : Forward Voltage : VF [V]
Rev. 09
August 2011
12
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Z-Power LED
X10490
Technical
Data
Sheet
Emitter Carrier & Reel Packaging
CATHODE MARK
22
13
Rev. 09
August 2011
13
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Z-Power LED
X10490
Technical
Data
Sheet
Recommended solder pad
SOLDER PAD
ISOLATION
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] This drawing without tolerances are for reference only
Rev. 09
August 2011
14
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Z-Power LED
X10490
Technical
Data
Sheet
Reflow Soldering Conditions / Profile
[°C]
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
Pre-heating
Rising
5 °C/sec
Cooling
-5 °C/sec
~
180
150
0
Time
[ Hr]
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Rev. 09
August 2011
15
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Z-Power LED
X10490
Technical
Data
Sheet
Precaution for use
• Storage
To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum
humidity of 50%.
• Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Soldering should be done immediately after opening the package (within 24Hrs).
b. Required conditions after opening the package
- Sealing
- Temperature : 5 ~ 40
℃
Humidity : less than 30%
c. If the package has been opened more than 1 week or the color of the desiccant changes,
±℃
components should be dried for 10-12hr at 60 5
• Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
• Do not rapidly cool device after soldering.
• Components should not be mounted on warped (non coplanar) portion of PCB.
• Radioactive exposure is not considered for the products listed here in.
• Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
• When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
• LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used
for storage.
• The appearance and specifications of the product may be modified for improvement without
notice.
• Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
• The slug is isolated from anode electrically.
Therefore, we recommend that you don’t isolate the heat sink.
• Attaching LEDs, do not use adhesives that outgas organic vapor.
Rev. 09
August 2011
16
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Z-Power LED
X10490
Technical
Data
Sheet
Handling of Silicone resin LEDs
The Z-Power LED is encapsulated with a silicone resin for the highest flux efficiency.
Notes for handling:
• Avoid touching silicone resin parts especially with sharp tools such as Pincette
(Tweezers)
• Avoid leaving fingerprints on silicone resin parts.
• Silicone resin will attract dust so use covered containers for storage.
• When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that excessive mechanical
pressure on the surface of the resin must be prevented.
• It is not recommend to cover the silicone resin of the LEDs with other resin
(epoxy, urethane, etc)
Rev. 09
August 2011
17
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