SAW8KG0B - Seoul Semiconductor

Z-Power LED
X10490
Technical
Data
Sheet
RoHS
Specification
SSC-SAW8KG0B
REV.04
August 2013
1
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
SAW8KG0B
SAW8KG0B
Description
This surface-mount LED comes
in standard package dimension.
It has a substrate made up of a
molded plastic reflector sitting on
top of a bent lead frame. The die
is attached within the reflector
Cavity and the cavity is encapsulated
by silicone.
Features
사진
•
•
•
•
White colored SMT package.
Pb-free RefloW Soldering
Suitable for all SMT
Lead Free and RoHS
compliant
The package design coupled with careful
selection of component materials allow these
products to perform with high reliability.
Applications
• Interior lighting
• General lighting
• Indoor and out door
displays
• Architectural /
Decorative lighting
REV.04
August 2013
2
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Contents
1.
Outline dimensions
2.
Characteristics of SAW8KG0B LED
3.
Characteristic diagrams
4.
Color & Binning
5.
Bin Code Description
6.
Labeling
7.
Packing
8.
Recommended solder pad
9.
Soldering
10. Precaution for use
11. Handling of Silicone Resin LEDs
REV.04
August 2013
3
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
1. Outline dimensions
Top View
Bottom View
N.C
A
C
N.C
Slug : Anode
Cathode Mark
Side View
Circuit
Cathode
Anode
1
2
ESD Protection Device
[Note] Package Forward Current is 20mA
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] Undefined tolerance is ±0.1mm
REV.04
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
2. Characteristics of SAW8KG0B
(Ta=25℃)
Electro-Optical characteristics
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Forward Voltage*
VF
IF=20mA
20.7
22
23
V
Reverse Voltage
VR
IR=10mA
0.7
-
-
V
Iv
IF=20mA
-
17.02
(52.8)
-
Luminous Intensity*[1]
(3700~7000K)
Luminous Intensity*[1]
(2600~3700K)
Iv
IF=20mA
-
CCT
IF=20mA
2,600
-
7,000
K
2Θ1/2
IF=20mA
-
115
-
deg.
Ra
IF=20mA
80
82
90
-
1.5kΩ;100
pF
5
-
-
KV
IF=20mA
-
27
-
K/W
Color Correlated
Temperature
Viewing Angle
[2]
Color Rendering
Index*
ESD (HBM)
Thermal resistance
cd
(lm)
16.2
(50.1)
[3]
RthJS
[1] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package.
[2] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[3] Thermal resistance: RthJS (Junction / solder)
* Tolerance : VF :±0.4V, IV :±7%, Ra :±2, x,y :±0.01
[Note] All measurements were made under the standardized environment of SSC.
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Power Dissipation *[1]
Pd
0.58
W
Forward Current
IF
25
mA
Operating Temperature
Topr
-30~+85
℃
Storage Temperature
Tstg
-40~+100
℃
Junction Temperature
Tj
125
℃
[1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
* LED’s properties might be different from suggested values like above and below tables if operation condition
will be exceeded our parameter range.
REV.04
August 2013
5
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
3. Characteristic diagrams
Color Spectrum, Ta=25oC
1.
Cool white 4700 K~7000 K
2.
Neutral white 3700 K~4700 K
3.
Warm white 2600 K~3700 K
2600~3700K
3700~4700K
4700~7000K
Relative Emission Intensity
1.0
0.5
0.0
300
400
500
600
700
800
Wavelength [nm]
REV.04
August 2013
6
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Current – Voltage characteristics, Ta=25oC
Forward Current(A)
0.020
0.015
0.010
0.005
0.000
0
5
10
15
20
25
Forward Voltage [V]
Forward Current–Relative Luminous Intensity characteristics,
Ta=25oC
1.4
Relative Luminous Intensity
1.2
1.0
0.8
0.6
0.4
0.2
5
10
15
Forward Current IF [mA]
20
25
REV.04
August 2013
7
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Forward Voltage Shift - Junction Temperature characteristics,
IF=20mA
Relative Forward Voltage
1.0
0.8
0.6
0.4
0.2
0.0
30
45
60
75
90
105
120
O
Junction temperature Tj( C)
Relative Light Output - Junction Temperature characteristics,
IF=20mA
1.0
Relative Light Output
0.8
0.6
0.4
0.2
0.0
30
45
60
75
90
105
O
Junction temperature Tj( C)
8
120
REV.04
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Forward Current -Chromaticity Coordinate characteristics,
Ta=25℃
0.415
0.414
10mA
y
20mA
0.413
5mA
15mA
25mA
0.412
0.411
0.4392
0.4394
0.4396
0.4398
0.4400
x
Radiation pattern, IF=20mA
Normalized P/metrix [lux]
1.0
0.8
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
Angle [degree]
9
60
90
REV.04
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
0.420
0.415
25
50
y
Z-Power LED
X10490
Technical
Data
Sheet
Junction Temperature (℃) - Chromaticity Coordinate
characteristics
0.410
75
100
125
0.405
0.400
0.430
0.435
0.440
0.445
0.450
x
REV.04
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
4. Color & binning
1. SAW8KG0B
0.46
Cool White
Neutral White
Warm White
Planckian locus
0.44
0.42
2600K
2900K
3000K
3200K
G0
F1
E1
4500K
4700K
CIE Y
5000K
5600K
0.36
6000K
6500K
0.34
7000K
A0
A2
0.32
A1
A3
D1
D0
D3
C1
C0
B1 C2
B0
B3 C4
B2
B5
D2
C3
E2
H4
F3
F2
E0
H2
G3
G2
F0
4200K
5300K
G1
3700K
0.40
H1
H0
3500K
4000K
0.38
2700K
H3
H5
G5
G4
F5
E3
F4
E5
E4
D5
D4
C5
B4
A5
A4
0.30
0.28
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
CIE X
REV.04
August 2013
11
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● COLOR RANK
<IF=20mA, Ta=25℃>
6500~7000K
A0
A2
A4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3028
0.3304
0.3041
0.324
0.3055
0.3177
0.3041
0.324
0.3055
0.3177
0.3068
0.3113
0.3126
0.3324
0.3136
0.3256
0.3146
0.3187
0.3115
0.3393
0.3126
0.3324
0.3136
0.3256
6000~6500K
A1
A3
A5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3115
0.3393
0.3126
0.3324
0.3136
0.3256
0.3126
0.3324
0.3136
0.3256
0.3146
0.3187
0.321
0.3408
0.3216
0.3334
0.3221
0.3261
0.3205
0.3481
0.321
0.3408
0.3216
0.3334
5600~6000K
B0
B2
B4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3207
0.3462
0.3212
0.3389
0.3217
0.3316
0.3212
0.3389
0.3217
0.3316
0.3222
0.3243
0.3293
0.3461
0.3293
0.3384
0.3294
0.3306
0.3292
0.3539
0.3293
0.3461
0.3293
0.3384
5300~5600K
B1
B3
B5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3292
0.3539
0.3293
0.3461
0.3293
0.3384
0.3293
0.3461
0.3293
0.3384
0.3294
0.3306
0.3373
0.3534
0.3369
0.3451
0.3366
0.3369
0.3376
0.3616
0.3373
0.3534
0.3369
0.3451
REV.04
* Measurement Uncertainty of the Color Coordinates : ± 0.01
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● COLOR RANK
<IF=20mA, Ta=25℃>
5000~5300K
C0
C2
C4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3376
0.3616
0.3373
0.3534
0.3369
0.3451
0.3373
0.3534
0.3369
0.3451
0.3366
0.3369
0.3456
0.3601
0.3448
0.3514
0.344
0.3428
0.3463
0.3687
0.3456
0.3601
0.3448
0.3514
4700~5000K
C1
C3
C5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3463
0.3687
0.3456
0.3601
0.3448
0.3514
0.3456
0.3601
0.3448
0.3514
0.344
0.3428
0.3539
0.3669
0.3526
0.3578
0.3514
0.3487
0.3552
0.376
0.3539
0.3669
0.3526
0.3578
4500~4700K
D0
D2
D4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3548
0.3736
0.3536
0.3646
0.3523
0.3555
0.3536
0.3646
0.3523
0.3555
0.3511
0.3465
0.3625
0.3711
0.3608
0.3616
0.359
0.3521
0.3641
0.3804
0.3625
0.3711
0.3608
0.3616
4200~4500K
D1
D3
D5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3641
0.3804
0.3625
0.3711
0.3608
0.3616
0.3625
0.3711
0.3608
0.3616
0.359
0.3521
0.3714
0.3775
0.3692
0.3677
0.367
0.3578
0.3736
0.3874
0.3714
0.3775
0.3692
0.3677
REV.04
* Measurement Uncertainty of the Color Coordinates : ± 0.01
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● COLOR RANK
<IF=20mA, Ta=25℃>
4000~4200K
E0
E2
E4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3736
0.3874
0.3714
0.3775
0.3692
0.3677
0.3714
0.3775
0.3692
0.3677
0.367
0.3578
0.3842
0.3855
0.3813
0.3751
0.3783
0.3646
0.3869
0.3958
0.3842
0.3855
0.3813
0.3751
3700~4000K
E1
E3
E5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3869
0.3958
0.3842
0.3855
0.3813
0.3751
0.3842
0.3855
0.3813
0.3751
0.3783
0.3646
0.397
0.3935
0.3934
0.3825
0.3898
0.3716
0.4006
0.4044
0.397
0.3935
0.3934
0.3825
3500~3700K
F0
F2
F4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3996
0.4015
0.396
0.3907
0.3925
0.3798
0.396
0.3907
0.3925
0.3798
0.3889
0.369
0.4104
0.3978
0.4062
0.3865
0.4017
0.3751
0.4146
0.4089
0.4104
0.3978
0.4062
0.3865
3200~3500K
F1
F3
F5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4146
0.4089
0.4104
0.3978
0.4062
0.3865
0.4104
0.3978
0.4062
0.3865
0.4017
0.3751
0.4248
0.4048
0.4198
0.3931
0.4147
0.3814
0.4299
0.4165
0.4248
0.4048
0.4198
0.3931
REV.04
* Measurement Uncertainty of the Color Coordinates : ± 0.01
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● COLOR RANK
<IF=20mA, Ta=25℃>
3000~3200K
G0
G2
G4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4299
0.4165
0.4248
0.4048
0.4198
0.3931
0.4248
0.4048
0.4198
0.3931
0.4147
0.3814
0.4374
0.4093
0.4317
0.3973
0.4259
0.3853
0.443
0.4212
0.4374
0.4093
0.4317
0.3973
2900~3000K
G1
G3
G5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.443
0.4212
0.4374
0.4093
0.4317
0.3973
0.4374
0.4093
0.4317
0.3973
0.4259
0.3853
0.4499
0.4138
0.4436
0.4015
0.4373
0.3893
0.4562
0.426
0.4499
0.4138
0.4436
0.4015
2700~2900K
H0
H2
H4
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4562
0.426
0.4499
0.4138
0.4436
0.4015
0.4499
0.4138
0.4436
0.4015
0.4373
0.3893
0.462
0.4166
0.4551
0.4042
0.4483
0.3919
0.4687
0.4289
0.462
0.4166
0.4551
0.4042
2600~2700K
H1
H3
H5
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4687
0.4289
0.462
0.4166
0.4551
0.4042
0.462
0.4166
0.4551
0.4042
0.4483
0.3919
0.474
0.4194
0.4666
0.4069
0.4593
0.3944
0.481
0.4319
0.474
0.4194
0.4666
0.4069
REV.04
* Measurement Uncertainty of the Color Coordinates : ± 0.01
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Bin code description
1. Luminous Intensity Bins
- Luminous Intensity bin structure for Cool white, neutral white, warm white
· Example
BIN CODE : Y1G3B
Luminous Intensity bin
Bin Code
Luminous Intensity [cd] @ IF = 20mA
W5
13.5~14.8
41.9~45.9
X8
14.8~16.1
45.9~49.9
Y1
16.1~17.4
49.9~53.9
Z4
17.4~19.0
53.9~58.9
J0
19.0~20.3
58.9~62.9
*[note]
Flux (lm)
[Note] SSC sort the LED package according to the luminous intensity IV.
(The lumen table is only for reference.)
2. Color Rank
white product tested and binned by x,y coordinates and CC
· Example
BIN CODE : Z4G3B
[Note]
Color bin
Color Rank @ IF = 20mA
3. Voltage Bins
· Example
BIN CODE : Z4G3B
Voltage bin
Bin Code
Min.
Max.
A
20.7
21.5
B
21.5
22.2
C
22.2
23.0
[Note]
Forward Voltage (V)
@ IF = 20mA
REV.04
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Labeling
3,500
SAW8KG0B
REV.04
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
7. Packing
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
RoHS
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
b
a
REV.04
August 2013
18
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
15.4±1.0
180
13±0.3
60
2
22
13
Notes :
( Tolerance: ±0.2, Unit: mm )
[1] Quantity : 3,500pcs/Reel
[2] Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
[3] Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10º to the carrier tape
REV.04
[4] Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package
19
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
8. Recommended solder pad
Notes :
[1] All dimensions are in millimeters.
[2] Scale : none
[3] Undefined tolerance is ±0.1mm
This drawing without tolerances are for reference only.
REV.04
August 2013
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
9. Soldering
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
* Caution
1. Reflow soldering is recommended not to be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be
damaged.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
REV.04
August 2013
21
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
10. Precaution for use
(1) Storage
To avoid the moisture penetration, we recommend storing SSC LEDs in a dry box
with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum
humidity of RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens
may affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the
desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products
are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and
etc. When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring
the package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months
or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should
be used for storage.
(11) The appearance and specifications of the product may be modified for improvement
without notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of
fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and
photonic energy. The result can be a significant loss of light output from the fixture.
Knowledge of the properties of the materials selected to be used in the construction of fixtures
REV.04
can help prevent these issues.
August 2013
22
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
11. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
23
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not
REV.04
handle this product with acid or sulfur material in sealed space.
August 2013
(7) Avoid leaving fingerprints on silicone resin parts.
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-18 (Rev.00)