Technical Data Sheet Pb Free Specification YG101-IC1 SSC Drawn Approval Customer Approval Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet [ Contents ] 1. Description 2. Absolute maximum ratings 3. Electro-Optical characteristics 4. Characteristic diagrams 5. Reliability result 6. Rank 7. Outline Dimension 8. Material 9. Reel Structure 10. Packing 11. Soldering profile 12. Precaution for Use Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet YG101-IC1 - 1. Description Features Small size suitable for compact • 1.6 X 0.8 X 0.8 mm • Untinted, Diffused flat appliances. - YG101-IC1 Surface-mounted chip LED mold device. • - Pb-free and RoHS complaint Dominant Wavelength : 572nm component. - High brightness, High efficiency - Tape and Reel packing. Applications - Increases the life time of battery. Cellular phone’s keypad lightning Information Boards Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 2. Absolute maximum ratings (Ta=25℃) Parameter Symbol Value Unit Power Dissipation Pd 69 mW Forward Current IF 30 mA Peak Forward Current IFM *1 100 mA Operating Temperature Topr. -40 ~ 85 ℃ Storage Temperature Tstg. -40 ~ 100 ℃ *1 IFM conditions: Pulse width Tw≤ 1msec and Duty ratio≤1/10. 3. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Condition Min Typ Max Unit Forward Voltage VF IF=20㎃ 1.9 2.05 2.3 V Reverse Current IR VR=5V - - 10 uA Luminous Intensity*2 Iv IF=20㎃ 30 38 53 mcd Wavelength λd IF=20㎃ 568 572 576 nm Spectral Bandwidth Δλ IF=20㎃ - 15 - nm Viewing Angle*3 (Y) 2θ1/2 IF=20㎃ - 140 - ˚ *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All measurements were made under the standardized environment of SSC. (Tolerance : Iv ±10 %, λd ±2 nm, VF ±0.1 V) Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 4. Characteristic Diagrams Ta = 25o Forward Current vs. Forward Voltage Relative Luminous Intensity vs. Forward Current 1.6 Relative Luminous Intensity [a.u.] 30 Forward Current [mA] 25 20 15 10 5 0 1.8 1.9 2.0 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 2.1 0 Forward Voltage [V] 5 10 15 20 25 30 Forward Current [mA] Forward Current vs. Ambient Temperature Spectrum Relative Emission Intensity [a.u.] 35 Forward Current [mA] 30 25 20 15 10 5 0 -25 0 25 50 75 Ambient Temperature [℃ ] 100 1.0 0.8 0.6 0.4 0.2 0.0 400 500 600 700 Wavelength [nm] Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet Radiation Diagram Ta = 25o 90 120 60 150 30 180 0 X Y Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 5. Reliability Test Item Test Conditions Duration / Cycle Number Of Damaged Operating at Room temperature 20mA, @25℃ 500 hrs 0/22 Operating at High temperature 20mA, @85℃ 500 hrs 0/22 Operating at High temperature / High humidity 20mA, @60℃,90% 500 hrs 0/22 Thermal shock test -40~85℃ Shift (2hr/cycle) 100 cycle 0/22 Thermal resistance Test 85℃, 85% 24hrs Reflow 3 times (Max 260℃ 10sec) Thermal shock 30 cycle 1 time 0/22 MSL : 2a (30℃, 60% : 4 weeks) *Criterion OK Iv > Initial value * 0.5 VF Initial value ± 0.1V Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 6. Rank IF = 20mA BIN VF [V] WD [nm] IV [mcd] AAA 1.9~2.1 (A) 568.0~568.5 (A) 30~36 (A) ABA 1.9~2.1 (A) 568.5~569.0 (B) 30~36 (A) ACA 1.9~2.1 (A) 569.0~569.5 (C) 30~36 (A) ADA 1.9~2.1 (A) 569.5~570.0 (D) 30~36 (A) AEA 1.9~2.1 (A) 570.0~570.5 (E) 30~36 (A) AFA 1.9~2.1 (A) 570.5~571.0 (F) 30~36 (A) AGA 1.9~2.1 (A) 571.0~571.5 (G) 30~36 (A) AHA 1.9~2.1 (A) 571.5~572.0 (H) 30~36 (A) AIA 1.9~2.1 (A) 572.0~574.0 (I) 30~36 (A) AJA 1.9~2.1 (A) 574.0~576.0 (J) 30~36 (A) AAB 1.9~2.1 (A) 568.0~568.5 (A) 36~43 (B) ABB 1.9~2.1 (A) 568.5~569.0 (B) 36~43 (B) ACB 1.9~2.1 (A) 569.0~569.5 (C) 36~43 (B) ADB 1.9~2.1 (A) 569.5~570.0 (D) 36~43 (B) AEB 1.9~2.1 (A) 570.0~570.5 (E) 36~43 (B) AFB 1.9~2.1 (A) 570.5~571.0 (F) 36~43 (B) AGB 1.9~2.1 (A) 571.0~571.5 (G) 36~43 (B) AHB 1.9~2.1 (A) 571.5~572.0 (H) 36~43 (B) AIB 1.9~2.1 (A) 572.0~574.0 (I) 36~43 (B) AJB 1.9~2.1 (A) 574.0~576.0 (J) 36~43 (B) AAC 1.9~2.1 (A) 568.0~568.5 (A) 43~53 (C) ABC 1.9~2.1 (A) 568.5~569.0 (B) 43~53 (C) ACC 1.9~2.1 (A) 569.0~569.5 (C) 43~53 (C) ADC 1.9~2.1 (A) 569.5~570.0 (D) 43~53 (C) AEC 1.9~2.1 (A) 570.0~570.5 (E) 43~53 (C) AFC 1.9~2.1 (A) 570.5~571.0 (F) 43~53 (C) AGC 1.9~2.1 (A) 571.0~571.5 (G) 43~53 (C) AHC 1.9~2.1 (A) 571.5~572.0 (H) 43~53 (C) AIC 1.9~2.1 (A) 572.0~574.0 (I) 43~53 (C) AJC 1.9~2.1 (A) 574.0~576.0 (J) 43~53 (C) Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet IF = 20mA BIN VF [V] WD [nm] IV [mcd] BAA 2.1~2.3 (B) 568.0~568.5 (A) 30~36 (A) BBA 2.1~2.3 (B) 568.5~569.0 (B) 30~36 (A) BCA 2.1~2.3 (B) 569.0~569.5 (C) 30~36 (A) BDA 2.1~2.3 (B) 569.5~570.0 (D) 30~36 (A) BEA 2.1~2.3 (B) 570.0~570.5 (E) 30~36 (A) BFA 2.1~2.3 (B) 570.5~571.0 (F) 30~36 (A) BGA 2.1~2.3 (B) 571.0~571.5 (G) 30~36 (A) BHA 2.1~2.3 (B) 571.5~572.0 (H) 30~36 (A) BIA 2.1~2.3 (B) 572.0~574.0 (I) 30~36 (A) BJA 2.1~2.3 (B) 574.0~576.0 (J) 30~36 (A) BAB 2.1~2.3 (B) 568.0~568.5 (A) 36~43 (B) BBB 2.1~2.3 (B) 568.5~569.0 (B) 36~43 (B) BCB 2.1~2.3 (B) 569.0~569.5 (C) 36~43 (B) BDB 2.1~2.3 (B) 569.5~570.0 (D) 36~43 (B) BEB 2.1~2.3 (B) 570.0~570.5 (E) 36~43 (B) BFB 2.1~2.3 (B) 570.5~571.0 (F) 36~43 (B) BGB 2.1~2.3 (B) 571.0~571.5 (G) 36~43 (B) BHB 2.1~2.3 (B) 571.5~572.0 (H) 36~43 (B) BIB 2.1~2.3 (B) 572.0~574.0 (I) 36~43 (B) BJB 2.1~2.3 (B) 574.0~576.0 (J) 36~43 (B) BAC 2.1~2.3 (B) 568.0~568.5 (A) 43~53 (C) BBC 2.1~2.3 (B) 568.5~569.0 (B) 43~53 (C) BCC 2.1~2.3 (B) 569.0~569.5 (C) 43~53 (C) BDC 2.1~2.3 (B) 569.5~570.0 (D) 43~53 (C) BEC 2.1~2.3 (B) 570.0~570.5 (E) 43~53 (C) BFC 2.1~2.3 (B) 570.5~571.0 (F) 43~53 (C) BGC 2.1~2.3 (B) 571.0~571.5 (G) 43~53 (C) BHC 2.1~2.3 (B) 571.5~572.0 (H) 43~53 (C) BIC 2.1~2.3 (B) 572.0~574.0 (I) 43~53 (C) BJC 2.1~2.3 (B) 574.0~576.0 (J) 43~53 (C) Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Tolerance ±0.1, Unit : ㎜ 0.3 0.18 Polarity Mark Polarity Mark Cathode 1.1 1.2 Resin 1.6 PCB 0.4 ±0.05 Anode 2.4 0.8 0.8 0.3 Technical Data Sheet 7. Outline Dimension 0.8 [Recommended Solder Pattern] 8. Material Item Substrate chip wire Encapsulate Electrode Material BT-Resin PCB AlInGaP Gold Epoxy Au Plated Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 9. Reel Structure (1) Quantity : 4000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10℃ angle to be the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 10. Packing Reel RANK: XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR #### Aluminum Vinyl Bag RANK: ### DESI PAK ### ### ####### XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure 1 SIDE RANK: QUANTITY : XXXX c LOT NUMBER : XXXXXXXXXX PART NUMBER : 1 XXXXXX 2 SEOUL SEMICONDUCTOR CO., LTD. 2 SIDE RoHS b a LOT NUMBER Rank QTY Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 SEOUL SEMICONDUCTOR CO., LTD. Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 11. Soldering profile (1) Lead Solder Lead Solder Lead Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 o C / sec. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. Lead-frame Solder 1~5 oC / sec. 1~5 oC / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0) Technical Data Sheet 12. Precaution for Use (1) Storage LEDs must be stored at clean atmosphere. If the LEDs are stored for 3 months or more after shipment from SSC, storage in a sealed container with a nitrogen atmosphere is recommended. To avoid absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. * Shelf Life : 12 months at < 40ºC and 90%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. After opened and mounted the soldering shall be quickly. * Within 672 hours at factory conditions of equal to or less than 30ºC/60%RH, or Stored at < 10% RH (3) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (4) In the case of change color of indicator on desiccant, components shall be dried 10-12hr at 60±5ºC. (5) When the LED is operating, the driving current should be determined after considering the maximum ambient temperature requirements. (6) When using multiple LEDs, It is recommended to connect a resistor on each LED. Otherwise, LEDs may vary due to variation in forward voltage of the LEDs. (7) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage (8) Any mechanical force or excessive vibration should be avoided during temperature cooling process to normal temperature after reflow. (9) Rapid cooling shall be avoided. (10) LED should not be placed on a flexible area on the PCB. (11) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (12) Anti radioactive ray design is not considered for the products. (13) Damage prevention from ESD or Surge. It is highly recommended to use the wrist-band or anti electrostatic gloves when handling the LED’s All devices, equipments and machines mush be properly grounded (14) The appearance and specifications of the product may be modified for improvement without notice. Rev. 04 June 2012 WWW.SEOULSEMICON.COM 서식번호 : SSC-QP-7-07-25 (Rev.0.0)