Product Data Sheet STR0FS12A-Mid-Power LED Achieving the best system cost in Mid/High Power Mid Power LED – 2525 series STR0FS12A RoHS Product Brief Description Features and Benefits • The package has a substrate made up of a flexible film and Cu material • It incorporates state of the art SMD design and low thermal resistant material • • • • • • The package design coupled with careful selection of component materials allow these products to perform with high reliability High flux output and high luminance Mid to High Power package Compact size package SMT solderable RoHS compliant Key Applications • • • • General lighting Replacement lamps Architectural Commercial Table 1. Product Selection Table Dominant Wavelength [nm] Part Number STR0FS12A Rev1.0, Aug 3, 2015 Color Min. Typ. Max. Red 610 - 630 1 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Table of Contents Index • Product Brief 1 • Table of Contents 2 • Performance Characteristics 3 • Characteristics Graph 4 • Color Bin Structure 9 • Mechanical Dimensions 10 • Recommended Solder Pad 11 • Reflow Soldering Characteristics 12 • Emitter Tape & Reel Packaging 13 • Product Nomenclature 15 • Handling of Silicone Resin for LEDs 16 • Precaution For Use 17 • Company Information 20 Rev1.0, Aug 3, 2015 2 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Performance Characteristics Table 2. Characteristics, IF=150mA, Tj= 25ºC, RH30% Value Parameter Symbol Unit Min. Typ. Max. 150 - mA 2.6 V Forward Current IF - Forward Voltage VF 1.8 ФV - 24 - lm λdom 610 - 630 Nm 2Θ1/2 - 140 - Deg. RθJ-S - 21 - ℃/W Luminous Flux [1] Dominant Wavelength Viewing Angle[2] Thermal resistance (J to S) [3] ESD Sensitivity(HBM) - Class 3A JESD22-A114-E Table 3. Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current IF 300 mA Power Dissipation PD 0.8 W Junction Temperature Tj 125 ºC Operating Temperature Topr -40 ~ + 85 ºC Storage Temperature Tstg -40 ~ + 100 ºC Notes : (1) Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements. (2) 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. (3) Thermal resistance is junction to TS point (Refer to page 12). • • • LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. Thermal resistance can be increased substantially depending on the heat sink design/operating condition, and the maximum possible driving current will decrease accordingly. All measurements were made under the standardized environment of Seoul Semiconductor Rev1.0, Aug 3, 2015 3 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Characteristics Graph Relative Luminous Intensity (a.u.) Fig 1. Color Spectrum, Tj = 25ºC, IF=150mA 1.0 0.5 0.0 400 500 600 700 Wavelength [nm] Fig 2. Radiant Pattern, Tj = 25ºC, IF=150mA Rev1.0, Aug 3, 2015 4 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Characteristics Graph Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC 0.30 Forward Current [A] 0.25 0.20 0.15 0.10 0.05 0.00 0.0 0.5 1.0 1.5 2.0 2.5 Forward Voltage [V] Fig 4. Forward Current vs. Relative Luminous Intensity, Tj = 25ºC Relative Luminous Intensity [a.u.] 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 Forward Current [A] Rev1.0, Aug 3, 2015 5 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Characteristics Graph Relative Luminous Intensity [a.u.] Fig 5. Junction Temperature vs. Relative Radiant Power, IF=150mA 1.0 0.8 0.6 0.4 0.2 0.0 25 45 65 85 105 125 O Junction temperature Tj( C) Fig 6. Junction Temperature vs. Relative Forward Voltage, IF=150mA Relative Forward Voltage 1.0 0.8 0.6 0.4 0.2 0.0 25 45 65 85 105 125 O Junction temperature Tj( C) Rev1.0, Aug 3, 2015 6 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Characteristics Graph Peak Wavelength Shift (nm) Fig 7. Junction Temperature vs. Peak Wavelength Shift, IF=150mA 14 12 10 8 6 4 2 0 25 45 65 85 105 125 O Junction Temperature Tj( C) Rev1.0, Aug 3, 2015 7 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Characteristics Graph Fig 8. Ambient Temperature vs. Maximum Forward Current, Tj_max = 125℃ 350 Forward Current [mA] 300 250 200 150 Rth(j-a) = 40K/W Rth(j-a) = 50K/W Rth(j-a) = 60K/W 100 50 0 0 25 50 75 100 125 O Ambient Temperature Ta [ C] Rev1.0, Aug 3, 2015 8 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Color Bin Structure Table 4. Bin Code description, Tj=25℃, IF=150mA Luminous Flux (lm) Dominant Wavelength (nm) Forward Voltage (V) Part Number STR0FS12A Rev1.0, Aug 3, 2015 Bin Code Min. Max. Bin Code Min. Max. Bin Code Min. Max. N1 20 24 R1 610 620 Z 1.8 2.0 N2 24 28 R2 620 630 A 2.0 2.2 N3 28 32 B 2.2 2.4 C 2.4 2.6 D 2.6 2.8 9 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Mechanical Dimensions < Top View > < Bottom View > Cathode Anode < Side View > Circuit Cathode Anode 1 2 ESD Protection Device Notes : (1) All dimensions are in millimeters. (2) Scale : none. (3) Undefined tolerance is ±0.1mm. (4) The appearance and specifications of the product may be changed for improvement without notice. Rev1.0, Aug 3, 2015 10 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Recommended Solder Pad < Solder Pad > TS point Notes : (1) All dimensions are in millimeters. (2) Scale : none. (3) Undefined tolerance is ±0.1mm . (4) The appearance and specifications of the product may be changed for improvement without notice. Rev1.0, Aug 3, 2015 11 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Table 5. Reflow Soldering Characteristics Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Ts_max to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Ts_min) - Temperature Max (Ts_max) - Time (Ts_min to Ts_max) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution : (1) Reflow soldering is recommended not to be done more than two times In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LEDs during heating. (5) After soldering, do not warp the circuit board. Rev1.0, Aug 3, 2015 12 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Emitter Tape & Reel Packaging ( Tolerance: ±0.2, Unit: mm ) Notes : (1) Quantity : Max. 3,500pcs/reel. (2) Cumulative tolerance : Cumulative tolerance/10 pitches to be ±0.2mm. (3) Adhesion strength of cover tape : Adhesion strength to be 0.1~0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape. (4) Package : P/N, Manufacturing data code No. and Quantity to be indicated on a damp proof package. Rev1.0, Aug 3, 2015 13 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Emitter Tape & Reel Packaging Reel Aluminum Bag Outer Box Rev1.0, Aug 3, 2015 14 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Product Nomenclature Table 6. Part Numbering System : X1X2X3X4X5X6X7X8 Part Number Code Description Part Number Value X1 Company S X2 Top View LED series T X3 Color Specification R0 Red X4 Package series FS FS series X5X6 Characteristic code 12 X7 Revision A Table 7. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17 Lot Number Code Description Y1Y2 Year Y3 Month Y4Y5 Day Y6 Top View LED series Y7Y8Y9Y10 Mass order Y11Y12Y13Y14Y15Y16Y17 Internal Number Rev1.0, Aug 3, 2015 Lot Number 15 Value www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. Rev1.0, Aug 3, 2015 16 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 1 year (MSL 2) or the color of the desiccant changes, components should be dried for 10-12hr at 60±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. Rev1.0, Aug 3, 2015 17 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Precaution for Use (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) Attaching LEDs, do not use adhesives that outgas organic vapor. (15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (16) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev1.0, Aug 3, 2015 18 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev1.0, Aug 3, 2015 19 www.seoulsemicon.com Product Data Sheet STR0FS12A-Mid-Power LED Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev1.0, Aug 3, 2015 20 www.seoulsemicon.com