APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Application Note SBW*1F1A Introduction Features • Power Saving • Long Life Time • Simple BOM • Miniaturization • Low thermal resistance • RoHS compliant The ZC(Z-power COB) series are High Flux and High Efficacy COB (Chip On Board) series designed for easy to attach to lighting fixture directly without reflow process. The customer don’t need to reflow COB on PCB and so luminance system can be simplified, reduced cost and has good thermal properties. ZC’s high flux output and compact size are suitable for replacement of halogen, incandescent and fluorescent conventional light source. Generally ZC series can be applied to replacement light source with only one component, so it brings convenience for optic design ZC series is a long-lasting, environmentally friendly semiconductor light source. This application note provides assembly and handling information of ZC series. Applications • Bulb • Down Light • Task lighting • Decorative / Pathway lighting SBW*1F1A(rev.00) November. 2012 1 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Contents 1. Description -----------------------------------------------------------------------3 2. Mechanical Dimension ----------------------------------------------------------3 3. PCB solder pad and layout ------------------------------------------------------4 4. Junction Temperature ----------------------------------------------------------4 5. Mechanical Connection----------------------------------------------------------6 6. Silicone Surface Handling-------------------------------------------------------7 7. Optic Design and Precaution ---------------------------------------------------7 8. Electrical Characteristics--------------------------------------------------------8 9. Precaution for use ---------------------------------------------------------------9 10. Relative light-output vs Current---------------------------------------------10 SBW*1F1A November. 2012 2 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Component 1. Description The ZC6 emitter is designed to operate at high voltage. ZC6 PKG contains a high brightness, high voltage LED chip or array on a MCPCB substrate that functions as mechanical support for chips and connects LED chip to connection pads like as a cathode and anode. Each ZC6 emitter contains a zener diode next to the LED chip to protect from ESD. A silicone covering LED chip helps to protect from physical impact. ZC6 has metal PCB, silicone dam, phosphor Silicone, chips. PCB is base for chip bonding, dam is for silicone molding. The customer can connect electric source on PCB pad with electric cable by soldering. Silicone (over the chips) MCPCB Substrate Soldering Pad Figure 1. ZC6 2. Mechanical Dimension Theoretical optical center is located at center of the ZC6 package. Anode and cathode are on the surface of package and have the positive and negative sign beside of itself, see Figure2. Since any electrical shocks occur at the high voltage drive, appropriate designs and enough isolation distances are needed. Temperature Check Point Figure 2. ZC6 mechanical dimension SBW*1F1A November. 2012 3 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 3. Soldering Pad and layout ZC Series don’t need reflow process but can be electrically connected by soldering at soldering Pad. The ZC6 emitter can be mounted on the heat sink directly that function as the thermal path between the LED package and the heat sink. Temperature check point exists and can be used to calculate junction temperature and life time. Screw Hole Soldering Pad Dam Silicone Temperature check point Figure 3. COB solder pad and layout 4. Junction Temperature Life time of the ZC6 emitter is sensitive to junction temperature. But it is impossible to measure the junction temperature directly without any damage. Tj can be calculated by using thermal resistance between junction temperature and case temperature. The equation is “Tj[℃] = Tc[℃] + RΘ j-c[℃/W] x Power dissipation [W]” - Tj: Junction Temperature - Tc: Case Temperature - RΘ j-c: Thermal Resistance from Chip to Tc check Point SBW*1F1A November. 2012 4 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Tj (Junction Temperature) Tc (Case Temperature) Figure 4. Thermal modeling of the ZC6 emitter The position of COB’s Tc measure point and Juctrion temperature is different(See figure 4). So Temperature difference by the each position occurs. The temperature difference is about 18℃. Temperature difference of the minimum and maximum is 15℃ from the average (See figure 5). For example, if temperature in Tc measure point is 85℃, Tj is 18℃ higher than Tj (Tc(85℃) + RΘ j-c x Pd). Junction point temp.(℃)※ △Temp. 15℃ 160 Min Typ 130 Max 100 70 40 20 40 60 80 120 100 Tc point temp. (℃) Figure 5. Temperaure difference of Tc measure point and Tj SBW*1F1A November. 2012 5 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 5. Mechanical Connection ZC series is easy to connect the heatsink by M1.6 screws. Be carefully not fix tightly to the package and heatsink. And fix the package to heasink by using the thermal grease in whole area of the package because it is good for the thermal conductivity. - Please use M1.6 screw necessarily. - Do not release screw while LED is operating. - Use two screws. - Fix LED package on heat sink tightly. - Thermal conductivity silicone grease coating to rear COB surface is recommended for the good thermal dissipation < Top View > 3.0 1.6 < M1.6 screw > < Side View > Thermal Grease Heat Sink Figure 6. ZC6 is mounted on Heat sink with screw SBW*1F1A November. 2012 6 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 6. Silicone Surface handling Improper handling of the LED packages can damage silicone. So, avoid touching silicone Surface of LED especially with sharp tools such as a pincette. Pick up the LEDs with the sides of the substrate and surface of the substrate ecept for resin portion and the polarity pads. The handling area of the LED package is shown in the figure 7 good example. Physical force should not be applied to the silicone in excess of 3000gf or permanent and fatal damage will occur. Silicone has sensitivity to dust and debris that cause optical output decrease. In case of that, isopropyl alcohol (IPA) can be used to remove dust from the silicone. Bad Example Good Example Figure 7. Examples for Silicone Surface handling 7. Optic Design and Precaution 2nd Optic such as lens or reflector for down light could be mounted on PCB, especially reflector could be. Reflector is located around silicone dam, which can be fixed by hole(See figure 8-1). However reflector wearing in conductive material such as aluminum coating must not be contacted with pad on PCB or solder cream because electric short happens and LEDs is turned-off or damaged (See figure 8-2). And lens for collimating could be also mounted on PCB. It also is located around silicone dam. Figure 8-1. Reflector is mounted on PCB SBW*1F1A November. 2012 7 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet Figure 8-2. Reflector mounting position 8. Electrical Characteristics In general higher voltage will increase efficiency of the converter. And if the current is lower, the price of the converter is decreases. For example, in case of the current of less than 300mA, the price of converter is decreased. The typical voltage of the ZC6 is 26.5V (max.28V). Range of voltage is from 26V to 28V. 40 1.6 36.6V Current [A] 1.2 1.0 28.6V 25.0V 20 0.52A 0.6 15 13.1V 0.27A 0.25A 9.3V 0.18A 0.2 SSC 30 25 0.7A 0.8 0.4 35 EDISON SHARP Voltage [V] 1.4 10 5 CITIZEN BRIDGELUX Figure 9. Forward Current and Forward Voltage Level SBW*1F1A November. 2012 8 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 9. Precaution for use • Storage To avoid the moisture penetration, we recommend storing LEDs in a dry box with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%. • Use Precaution after Opening the Packaging Required conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than 30% • Radioactive exposure is not considered for the products listed here in. • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. • When the LEDs are in operation the maximum current should be decided after measuring the package temperature. • LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with vacuum atmosphere should be used for storage. • The appearance and specifications of the product may be modified for improvement without notice. • Long time exposure of sunlight or occasional UV exposure will cause silicone discoloration. • Attaching LEDs, do not use adhesives that outgas organic vapor. SBW*1F1A November. 2012 9 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 10. Relative light-output vs Current The ZC6 emitter is binned at rectified 270mA constant current. Relative flux results are normalized to luminous flux at DC 270mA and luminous flux efficacy is varied as driving current (See Figure 10,11,12,13) 1) SBW01F1A 170 Luminous Flux Efficiency [lm/W] 160 150 140 130 120 110 100 90 0.0 0.1 0.2 0.3 Forward Current [A] Figure 10. Relative luminous flux vs Current. 170 Luminous Flux Efficiency [lm/W] 160 150 140 130 120 110 100 90 0 2 4 6 8 LED Power Dissipation [W] Figure 11. Current vs. Luminous Flux efficacy [lm/W], Ta=25℃ SBW*1F1A November. 2012 10 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_0000001 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED X10490 Technical Data Sheet 2) SBWW1F1A Luminous Flux Efficiency [lm/W] 130 120 110 100 90 80 70 60 0.0 0.1 0.2 0.3 Forward Current [A] Figure 12. Relative luminous flux vs Current. Luminous Flux Efficiency [lm/W] 130 120 110 100 90 80 70 0 2 4 6 8 LED Power Dissipation [W] Figure 13. Current vs. Luminous Flux efficacy [lm/W], Ta=25℃ SBW*1F1A November. 2012 11 www.seoulsemicon.com 서식번호 : SSC-QP-7-07-25 (Rev.00)