APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED Technical DD X10490 Data Sheet Application Note SBWW4F1A Introduction Features The ZC series are High Flux and High Efficacy COB (Chip On Board) series designed g for easyy to attach to lighting fixture directly without reflow process. • Power Saving • Long Life Time • Simple BOM • Miniaturization au a o • Low thermal resistance • RoHS compliant The customer don’t need to reflow COB on PCB and so luminance system can be simplified, reduced cost and has good thermal properties. ZC’s high flux output and compact size are suitable for replacement of halogen, incandescent and fluorescent conventional light source. Generally ZC series cab be applied to replacement light source with only one component, so it brings convenience for optic design ZC series is a long-lasting, environmentally friendly semiconductor light source. This application Thi li ti note t provides id assembly bl and d handling h dli information i f ti off ZC series. Applications • Bulb • Down Light • Task lighting • Outdoor / Pathway lighting Rev. 00 3 June 2011 www..com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED Technical DD X10490 Data Sheet Contents 1. Description -----------------------------------------------------------------------3 2 Mechanical 2. M h i l Dimension Di i ----------------------------------------------------------3 3 3. PCB soler pad and layout--------------------------------------------------------4 4. Junction Temperature -----------------------------------------------------------4 5. Mechanical Connection----------------------------------------------------------5 6. Silicone Surface Handling-------------------------------------------------------6 7. Precaution for use----------------------------------------------------------------6 8. Relative light-output vs Current -----------------------------------------------9 Rev. 00 2 June 2011 www..com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED Technical DD X10490 Data Sheet Component 1. Description The ZC-16 emitter is designed to operate at high voltage. ZC-16 PKG contains a high brightness, high voltage LED chip or array on a MCPCB substrate that functions as mechanical support for chips and connects LED chip to connection pads like as a cathode and anode. Each ZC-16 emitter contains a zener diode next to the LED chip to protect from ESD. A silicone covering LED chip helps to protect from physical impact. ZC-16 has metal PCB, silicone dam, phosphor Silicone, chips. PCB is base for chip bonding, dam is for silicone molding. The customer can connect electric source on PCB pad with electric cable by soldering. Silicone (over the chips) MCPCB Substrate Soldering Pad Figure 1. ZC-16 2. Mechanical Dimension Theoretical optical center is located at center of the ZC-16 package. Anode and cathode are on the surface of package and have the positive and negative sign beside of itself, see Figure2. Since any electrical shocks occur at the high voltage drive, appropriate designs and enough isolation distances are needed. needed Temperature Check Point Figure 2. ZC-16 mechanical dimension Rev. 00 3 June 2011 www..com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED Technical DD X10490 Data Sheet 3. Soldering Pad and layout ZC Series don’t require reflow process but can be electrically connected by soldering of wire at soldering Pad. The ZC-16 emitter can be mounted on the heat sink directly that function as the thermal path between the LED package and the heat sink. Temperature check point exists and can be used to calculate junction temperature and life time. Screw Hole Soldering Pad Dam Silicone Soldering Pad Reflector Fixing Pin Hole Temperature check point Figure 3. COB solder pad and layout 4. Junction Temperature Life time of the ZC-16 emitter is sensitive to junction temperature. But it is impossible to measure the junction temperature directly without any damage damage. Tj can be calculated by using thermal resistance between junction temperature and case temperature. The equation is “Tj[℃] = Tc[℃] + RΘ j-c[℃/W] x Power dissipation [W]” - Tj: Junction Temperature - Tc: Case Temperature - RΘ j-c: Thermal Resistance from Chip to Tc check Point Tj (Junction Temperature) Tc (Case Temperature) Figure g 4. Thermal modeling g of the ZC-16 emitter Rev. 00 4 June 2011 www..com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED Technical DD X10490 Data Sheet 5. Mechanical Connection - Please use M1.6 screw necessarily. Do not release screw while LED is operating. Use two screws. Fix LED package on heat sink tightly. Thermal conductivity silicone grease coating to rear COB surface is recommended for the good thermal dissipation < Top View > 3.0 1.6 < M1.6 screw > < Side View > Thermal Grease Heat Sink Figure g 5. ZC-16 is mounted on Heat sink with screw Rev. 00 5 June 2011 www..com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED Technical DD X10490 Data Sheet 6. Silicone Surface handling Improper handling of the LED packages can damage silicone. So, avoid touching silicone Surface of LED especially with sharp tools such as a pincette, only pick up the LEDs with the sides of the substrate. Physical force should not be applied to the silicone in excess of 3000gf or permanent and fatal damage will occur. Silicone has sensitivity to dust and debris that cause optical output decrease. In case of that, isopropyl alcohol (IPA) can be used to remove dust from the silicone. 7. Optic Design and Precaution 2nd Optic such as lens or reflector for down light could be mounted on PCB, especially reflector could be. Reflector is located around silicone dam, which can be fixed by hole. However reflector wearing in conductive material such as aluminum coating must be not contacted with pad on PCB or soldering cream because electric short happens and LEDs is turned-off or damaged. And lens for collimating could be also mounted on PCB. It also is located around silicone dam. Reflector Pin for fixing Figure 7. Reflector is mounted on PCB Good Position Bad Position After Soldering Figure 8. Reflector Mounting Position Rev. 00 6 June 2011 www..com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED Technical DD X10490 Data Sheet 8. Precaution for use • Storage To avoid the moisture penetration, we recommend storing LEDs in a dry box with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%. • Use Precaution after Opening the Packaging Required conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than 30% • Radioactive exposure is not considered for the products listed here in. • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. • When the LEDs are in operation the maximum current should be decided after measuring the package temperature. • LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with vacuum atmosphere should be used for storage. • The appearance and specifications of the product may be modified for improvement without notice. • Long time exposure of sunlight or occasional UV exposure will cause silicone discoloration. • Attaching LEDs, LEDs do not use adhesives that outgas organic vapor vapor. Rev. 00 7 June 2011 www..com 서식번호 : SSC-QP-7-07-25 (Rev.00) APCPCWM_4828539:WP_0000001WP_000000 APCPCWM_4828539:WP_0000001WP_0000001 Z-Power LED Technical DD X10490 Data Sheet 9. Relative light-output vs Current The ZC-16 emitter is binned at rectified 540mA constant current. Relative flux results are normalized to luminous flux at DC 540mA and luminous flux efficacy is varied as driving current (See Figure 8 & 9) 120 Relative luminous fluxx [%] 100 80 60 40 20 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 Forward Current [A] Figure 8. Relative luminous flux vs Current. Luminous s Flux Efficiency [lm/W] 130 120 110 100 90 80 70 60 0 2 4 6 8 10 12 14 16 18 20 LED Power Dissipation [W] Figure 9. Current vs. Luminous Flux efficacy [lm/W], Ta=25℃ Rev. 00 8 June 2011 www..com 서식번호 : SSC-QP-7-07-25 (Rev.00)