Technical Data Sheet

Low Capacitance, 4-/8-Channel,
±15 V/+12 V iCMOS Multiplexers
ADG1208/ADG1209
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAMS
ADG1208
ADG1209
S1
S1A
DA
S4A
D
S1B
DB
S8
S4B
1-OF-4
DECODER
1-OF-8
DECODER
A0
A0 A1 A2 EN
APPLICATIONS
A1
05713-001
<1 pC charge injection over full signal range
1 pF off capacitance
33 V supply range
120 Ω on resistance
Fully specified at ±15 V/+12 V
3 V logic compatible inputs
Rail-to-rail operation
Break-before-make switching action
Available in a 16-lead TSSOP, a 16-lead LFCSP_WQ, and a
16-lead SOIC
Typical power consumption < 0.03 µW
EN
Figure 1.
Audio and video routing
Automatic test equipment
Data-acquisition systems
Battery-powered systems
Sample-and-hold systems
Communication systems
GENERAL DESCRIPTION
1.0
MUX (SOURCE TO DRAIN)
0.9 TA = 25°C
0.8
0.7
0.6
VDD = +15V
VSS = –15V
0.5
0.4
0.3
VDD = +12V
VSS = 0V
0.2
0.1
0
–15
VDD = +5V
VSS = –5V
–10
–5
0
VS (V)
5
10
15
05713-051
The iCMOS (industrial CMOS) modular manufacturing
process combines high voltage CMOS (complementary metaloxide semiconductor) and bipolar technologies. It enables the
development of a wide range of high performance analog ICs
capable of 33 V operation in a footprint that no other generation
of high voltage parts has been able to achieve. Unlike analog ICs
using conventional CMOS processes, iCMOS components can
tolerate high supply voltages while providing increased
performance, dramatically lower power consumption, and
reduced package size.
The ultralow capacitance and exceptionally low charge injection
of these multiplexers make them ideal solutions for data acquisition
and sample-and-hold applications, where low glitch and fast
settling are required. Figure 2 shows that there is minimum
charge injection over the entire signal range of the device.
iCMOS construction also ensures ultralow power dissipation,
making the parts ideally suited for portable and batterypowered instruments.
CHARGE INJECTION (pC)
The ADG1208 and ADG1209 are monolithic, iCMOS® analog
multiplexers comprising eight single channels and four differential
channels, respectively. The ADG1208 switches one of eight
inputs to a common output as determined by the 3-bit binary
address lines A0, A1, and A2. The ADG1209 switches one of
four differential inputs to a common differential output as
determined by the 2-bit binary address lines A0 and A1. An
EN input on both devices is used to enable or disable the device.
When disabled, all channels are switched off. When on, each
channel conducts equally well in both directions and has an
input signal range that extends to the supplies.
Figure 2. Source to Drain Charge Injection vs. Source Voltage
Rev. C
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Technical Support
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ADG1208/ADG1209
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
ESD Caution...................................................................................7
Applications ....................................................................................... 1
Pin Configurations and Function Descriptions ............................8
Functional Block Diagrams ............................................................. 1
Typical Performance Characteristics ........................................... 12
General Description ......................................................................... 1
Terminology .................................................................................... 16
Revision History ............................................................................... 2
Test Circuits..................................................................................... 17
Specifications..................................................................................... 3
Outline Dimensions ....................................................................... 19
Dual Supply ................................................................................... 3
Ordering Guide .......................................................................... 20
Single Supply ................................................................................. 5
Absolute Maximum Ratings ............................................................ 7
REVISION HISTORY
8/15—Rev. B to Rev. C
Changes to Features Section............................................................ 1
Added Figure 4; Renumbered Sequentially .................................. 8
Changes to Table 4 ............................................................................ 8
Changes to Figure 5 .......................................................................... 9
Added Table 5; Renumbered Sequentially .................................... 9
Added Figure 7................................................................................ 10
Changes to Table 7 .......................................................................... 10
Changes to Figure 8 ........................................................................ 11
Added Table 8.................................................................................. 11
Updated Outline Dimensions ....................................................... 19
Changes to Ordering Guide .......................................................... 20
1/09—Rev. A to Rev. B
Change to IDD Parameter, Table 1 ....................................................4
Change to IDD Parameter, Table 2 ....................................................6
4/07—Rev. 0 to Rev. A
Added 16-lead SOIC .......................................................... Universal
Changes to Table 1.............................................................................3
Changes to Table 2.............................................................................5
Changes to Figure 10 and Figure 11 ............................................ 10
Updated Outline Dimensions ....................................................... 17
Changes to Ordering Guide .......................................................... 18
4/06—Revision 0: Initial Version
Rev. C | Page 2 of 20
Data Sheet
ADG1208/ADG1209
SPECIFICATIONS
DUAL SUPPLY
VDD = +15 V ± 10%, VSS = –15 V ± 10%, GND = 0 V, unless otherwise noted. Temperature range is as follows: Y version: –40°C to +125°C.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
On Resistance Match Between Channels, ∆RON
On Resistance Flatness, RFLAT (On)
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
Drain Off Leakage, ID (Off )
ADG1208
ADG1209
Channel On Leakage, ID, IS (On)
ADG1208
ADG1209
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
+25ºC
−40ºC to
+85ºC
−40ºC to
+125ºC
VSS to VDD
120
200
3.5
6
20
64
±0.003
±0.1
±0.003
±0.1
±0.1
±0.02
±0.2
±0.2
240
270
10
12
76
83
±0.6
±1
±0.6
±0.6
±1
±1
±0.6
±0.6
±1
±1
2.0
0.8
±0.005
±0.1
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS1
Transition Time, tTRANSITION
2
Unit
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Ω max
nA typ
nA max
nA typ
nA max
nA max
nA typ
nA max
nA max
V min
V max
µA max
µA max
pF typ
Break-Before-Make Time Delay, tBBM
80
130
75
95
83
100
25
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Total Harmonic Distortion + Noise
0.4
−85
−85
0.15
ns typ
ns max
ns typ
ns max
ns typ
ns max
ns typ
ns min
pC typ
dB typ
dB typ
% typ
−3 dB Bandwidth
CS (Off )
550
1
1.5
6
7
3.5
4.5
MHz typ
pF typ
pF max
pF typ
pF max
pF typ
pF max
tON (EN)
tOFF (EN)
165
185
105
115
125
140
10
CD (Off ) ADG1208
CD (Off ) ADG1209
Rev. C | Page 3 of 20
Test Conditions/Comments
VS = ±10 V, IS = −1 mA, see Figure 31
VDD = +13.5 V, VSS = −13.5 V
VS = ±10 V, IS = −1 mA
VS = −5 V/0 V/+5 V, IS = −1 mA
VD = ±10 V, VS = −10 V, see Figure 32
VS = 1 V/10 V, VD = 10 V/1 V, see Figure 32
VS = VD = ±10 V, see Figure 33
VIN = VINL or VINH
RL = 300 Ω, CL = 35 pF
VS = 10 V, see Figure 34
RL = 300 Ω, CL = 35 pF
VS = 10 V, see Figure 36
RL = 300 Ω, CL = 35 pF
VS = 10 V, see Figure 36
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 10 V, see Figure 35
VS = 0 V, RS = 0 Ω, CL = 1 nF, see Figure 37
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 38
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 40
RL = 10 kΩ, 5 V rms, f = 20 Hz to 20 kHz,
see Figure 41
RL = 50 Ω, CL = 5 pF, see Figure 39
f = 1 MHz, VS = 0 V
f = 1 MHz, VS = 0 V
f = 1 MHz, VS = 0 V
f = 1 MHz, VS = 0 V
f = 1 MHz, VS = 0 V
f = 1 MHz, VS = 0 V
ADG1208/ADG1209
Parameter
CD, CS (On) ADG1208
CD, CS (On) ADG1209
POWER REQUIREMENTS
IDD
Data Sheet
+25ºC
7
8
5
6
−40ºC to
+85ºC
−40ºC to
+125ºC
0.002
1.0
IDD
220
380
ISS
0.002
1.0
ISS
VDD/VSS
1
0.002
1.0
±5/±16.5
Guaranteed by design, not subject to production test.
Rev. C | Page 4 of 20
Unit
pF typ
pF max
pF typ
pF max
µA typ
µA max
µA typ
µA max
µA typ
µA max
µA typ
µA max
V min/max
Test Conditions/Comments
f = 1 MHz, VS = 0 V
f = 1 MHz, VS = 0 V
f = 1 MHz, VS = 0 V
f = 1 MHz, VS = 0 V
VDD = +16.5 V, VSS = −16.5 V
Digital inputs = 0 V or VDD
Digital inputs = 5 V
Digital inputs = 0 V or VDD
Digital inputs = 5 V
|VDD | = |VSS|
Data Sheet
ADG1208/ADG1209
SINGLE SUPPLY
VDD = 12 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Temperature range is as follows: Y version: –40°C to +125°C.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance, RON
On Resistance Match Between Channels, ∆RON
On Resistance Flatness, RFLAT (On)
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
Drain Off Leakage, ID (Off )
ADG1208
ADG1209
Channel On Leakage ID, IS (On)
ADG1208
ADG1209
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINL or IINH
Digital Input Capacitance, CIN
DYNAMIC CHARACTERISTICS1
Transition Time, tTRANSITION
tON (EN)
tOFF (EN)
Break-Before-Make Time Delay, tBBM
+25ºC
−40ºC to
+85ºC
−40ºC to
+125ºC
0 to VDD
300
475
5
16
60
±0.003
±0.1
±0.003
±0.1
±0.1
±0.02
±0.2
±0.2
567
625
26
27
CD (Off ) ADG1208
CD (Off ) ADG1209
CD, CS (On) ADG1208
CD, CS (On) ADG1209
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Test Conditions/Comments
VS = 0 V to 10 V, IS = −1 mA, see Figure 31
VDD = 10.8 V, VSS = 0 V
VS = 0 V to 10 V, IS = −1 mA
VS = 3 V/6 V/9 V, IS = −1 mA
VDD = 13.2 V
VS = 1 V/10 V, VD = 10 V/1 V, see Figure 32
±0.6
±1
±0.6
±0.6
±1
±1
±0.6
±0.6
±1
±1
nA typ
nA max
nA typ
nA max
nA max
nA typ
nA max
nA max
2.0
0.8
V min
V max
±0.1
µA max
pF typ
VIN = VINL or VINH
ns typ
RL = 300 Ω, CL = 35 pF
VS = 8 V, see Figure 34
RL = 300 Ω, CL = 35 pF
VS = 8 V, see Figure 36
RL = 300 Ω, CL = 35 pF
VS = 8 V, see Figure 36
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 8 V, see Figure 35
VS = 6 V, RS = 0 Ω, CL = 1 nF, see Figure 37
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 38
RL = 50 Ω, CL = 5 pF, f = 1 MHz, see Figure 40
RL = 50 Ω, CL = 5 pF, see Figure 39
f = 1 MHz, VS = 6 V
f = 1 MHz, VS = 6 V
f = 1 MHz, VS = 6 V
f = 1 MHz, VS = 6 V
f = 1 MHz, VS = 6 V
f = 1 MHz, VS = 6 V
f = 1 MHz, VS = 6 V
f = 1 MHz, VS = 6 V
f = 1 MHz, VS = 6 V
f = 1 MHz, VS = 6 V
VS = 1 V/10 V, VD = 10 V/1 V, see Figure 32
VS = VD = 1 V or 10 V, see Figure 33
±0.001
3
100
170
90
110
105
130
45
210
235
140
160
155
175
ns typ
ns typ
20
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
−3 dB Bandwidth
CS (Off )
Unit
−0.2
−85
−85
450
1.2
1.8
7.5
9
4.5
5.5
9
10.5
6
7.5
Rev. C | Page 5 of 20
ns typ
ns min
pC typ
dB typ
dB typ
MHz typ
pF typ
pF max
pF typ
pF max
pF typ
pF max
pF typ
pF max
pF typ
pF max
ADG1208/ADG1209
Parameter
POWER REQUIREMENTS
IDD
Data Sheet
+25ºC
−40ºC to
+85ºC
−40ºC to
+125ºC
0.002
1.0
IDD
VDD
1
220
380
5/16.5
Guaranteed by design, not subject to production test.
Rev. C | Page 6 of 20
Unit
µA typ
µA max
µA typ
µA max
V min/max
Test Conditions/Comments
VDD = 13.2 V
Digital inputs = 0 V or VDD
Digital inputs = 5 V
VSS = 0 V, GND = 0 V
Data Sheet
ADG1208/ADG1209
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog, Digital Inputs1
Continuous Current, S or D
Peak Current, S or D (Pulsed at
1 ms, 10% Duty Cycle Maximum)
Operating Temperature Range
Industrial (Y Version)
Storage Temperature
Junction Temperature
θJA, Thermal Impedance
TSSOP
LFCSP_WQ
SOIC_N
Reflow Soldering Peak
Temperature (Pb-Free)
1
Rating
35 V
−0.3 V to +25 V
+0.3 V to −25 V
VSS − 0.3 V to VDD + 0.3 V or
30 mA (whichever occurs first)
30 mA
100 mA
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
–40°C to +125°C
–65°C to +150°C
150°C
112°C/W
30.4°C/W
77°C/W
260(+0/−5)°C
Overvoltages at A, EN, S, or D are clamped by internal diodes. Current should
be limited to the maximum ratings given.
Rev. C | Page 7 of 20
ADG1208/ADG1209
Data Sheet
A0 1
16
EN 2
VSS
3
15
A1
A2
ADG1208
14
GND
TOP VIEW
(Not to Scale)
A0 1
16
A1
EN 2
15
A2
VSS 3
14
GND
ADG1208
13
VDD
13 VDD
TOP VIEW
S2 5 (Not to Scale) 12 S5
S2 5
12
S5
S3 6
11
S6
S3 6
11
S6
S4 7
10
S7
S4 7
10
S7
D 8
9
S8
8
9
S8
D
05713-002
S1 4
S1 4
Figure 3. ADG1208 16-Lead TSSOP Pin Configuration
Figure 4. ADG1208 16-Lead SOIC Pin Configuration
Table 4. ADG1208 Pin Function Descriptions
Pin No.
1
2
Mnemonic
A0
EN
3
VSS
4
5
6
7
8
9
10
11
12
13
14
15
16
S1
S2
S3
S4
D
S8
S7
S6
S5
VDD
GND
A2
A1
05713-006
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Description
Logic Control Input.
Active High Digital Input. When low, the device is disabled and all switches are off. When
high, Ax logic inputs determine on switches.
Most Negative Power Supply Potential. In single-supply applications, it can be
connected to ground.
Source Terminal 1. Can be an input or an output.
Source Terminal 2. Can be an input or an output.
Source Terminal 3. Can be an input or an output.
Source Terminal 4. Can be an input or an output.
Drain Terminal. Can be an input or an output.
Source Terminal 8. Can be an input or an output.
Source Terminal 7. Can be an input or an output.
Source Terminal 6. Can be an input or an output.
Source Terminal 5. Can be an input or an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
Logic Control Input.
Rev. C | Page 8 of 20
13 A2
14 A1
16 EN
ADG1208/ADG1209
15 A0
Data Sheet
VSS 1
12 GND
S1 2
ADG1208
11 VDD
S2 3
TOP VIEW
(Not to Scale)
10 S5
9
S6
1. THE EXPOSED PAD IS CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, VSS.
05713-004
S7 8
S8 7
D 6
S4 5
S3 4
Figure 5. ADG1208 16-Lead LFCSP_WQ Pin Configuration
Table 5. ADG1208 Pin Function Descriptions
Pin No.
1
Mnemonic
VSS
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
S1
S2
S3
S4
D
S8
S7
S6
S5
VDD
GND
A2
A1
A0
EN
EPAD
Description
Most Negative Power Supply Potential. In single-supply applications, it can be
connected to ground.
Source Terminal 1. Can be an input or an output.
Source Terminal 2. Can be an input or an output.
Source Terminal 3. Can be an input or an output.
Source Terminal 4. Can be an input or an output.
Drain Terminal. Can be an input or an output.
Source Terminal 8. Can be an input or an output.
Source Terminal 7. Can be an input or an output.
Source Terminal 6. Can be an input or an output.
Source Terminal 5. Can be an input or an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
Logic Control Input.
Logic Control Input.
Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs
determine on switches.
The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal
capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 6. ADG1208 Truth Table
A2
X
0
0
0
0
1
1
1
1
A1
X
0
0
1
1
0
0
1
1
A0
X
0
1
0
1
0
1
0
1
EN
0
1
1
1
1
1
1
1
1
Rev. C | Page 9 of 20
On Switch
None
1
2
3
4
5
6
7
8
A0 1
16
EN 2
VSS
3
Data Sheet
15
A1
GND
ADG1209
14
VDD
TOP VIEW
(Not to Scale)
A0 1
16
A1
EN 2
15
A2
VSS 3
14
GND
ADG1209
13
S1B
13 VDD
TOP VIEW
S2 5 (Not to Scale) 12 S5
S2A 5
12
S2B
S3 6
11
S6
S3A 6
11
S3B
S4 7
10
S7
S4A 7
10
S4B
D 8
9
S8
8
9
DA
DB
05713-003
S1A 4
S1 4
Figure 7. ADG1209 16-Lead SOIC Pin Configuration
Figure 6. ADG1209 16-Lead TSSOP Pin Configuration
Table 7. ADG1209 Pin Function Descriptions
Pin No.
1
2
Mnemonic
A0
EN
3
VSS
4
5
6
7
8
9
10
11
12
13
14
15
16
S1A
S2A
S3A
S4A
DA
DB
S4B
S3B
S2B
S1B
VDD
GND
A1
05713-007
ADG1208/ADG1209
Description
Logic Control Input.
Active High Digital Input. When low, the device is disabled and all switches are off.
When high, Ax logic inputs determine on switches.
Most Negative Power Supply Potential. In single-supply applications, it can be
connected to ground.
Source Terminal 1A. Can be an input or an output.
Source Terminal 2A. Can be an input or an output.
Source Terminal 3A. Can be an input or an output.
Source Terminal 4A. Can be an input or an output.
Drain Terminal A. Can be an input or an output.
Drain Terminal B. Can be an input or an output.
Source Terminal 4B. Can be an input or an output.
Source Terminal 3B. Can be an input or an output.
Source Terminal 2B. Can be an input or an output.
Source Terminal 1B. Can be an input or an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
Rev. C | Page 10 of 20
13 A2
14 A1
16 EN
ADG1208/ADG1209
15 A0
Data Sheet
VSS 1
12 VDD
S1A 2
ADG1209
11 S1B
S2A 3
TOP VIEW
(Not to Scale)
10 S2B
9
1. THE EXPOSED PAD IS CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY,
IT IS RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, VSS.
05713-005
DB 7
S3B
S4B 8
DA 6
S4A 5
S3A 4
Figure 8. ADG1209 16-Lead LFCSP_WQ Pin Configuration
Table 8. ADG1209 Pin Function Descriptions
Pin No.
1
Mnemonic
VSS
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
S1A
S2A
S3A
S4A
DA
DB
S4B
S3B
S2B
S1B
VDD
GND
A1
A0
EN
EPAD
Description
Most Negative Power Supply Potential. In single-supply applications, it can be
connected to ground.
Source Terminal 1A. Can be an input or an output.
Source Terminal 2A. Can be an input or an output.
Source Terminal 3A. Can be an input or an output.
Source Terminal 4A. Can be an input or an output.
Drain Terminal A. Can be an input or an output.
Drain Terminal B. Can be an input or an output.
Source Terminal 4B. Can be an input or an output.
Source Terminal 3B. Can be an input or an output.
Source Terminal 2B. Can be an input or an output.
Source Terminal 1B. Can be an input or an output.
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Logic Control Input.
Logic Control Input.
Active High Digital Input. When low, the device is disabled and all switches are off.
When high, Ax logic inputs determine on switches.
The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal
capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG1209 Truth Table
A1
X
0
0
1
1
A0
X
0
1
0
1
EN
0
1
1
1
1
On Switch Pair
None
1
2
3
4
Rev. C | Page 11 of 20
ADG1208/ADG1209
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
250
200
TA = 25°C
180
VDD = +15V
VSS = –15V
VDD = +15V
VSS = –15V
VDD = +13.5V
VSS = –13.5V
160
200
TA = +125°C
ON RESISTANCE (Ω)
ON RESISTANCE (Ω)
140
120
VDD = +16.5V
VSS = –16.5V
100
80
60
TA = +85°C
150
TA = +25°C
100
TA = –40°C
50
40
–9 –6 –3
0
3
6
9
SOURCE OR DRAIN VOLTAGE (V)
12
15
18
0
–15
05713-030
0
–18 –15 –12
10
15
600
600
TA = 25°C
VDD = +4.5V
VSS = –4.5V
VDD = 12V
VSS = 0V
TA = +125°C
500
500
VDD = +5V
VSS = –5V
ON RESISTANCE (Ω)
400
VDD = +5.5V
VSS = –5.5V
300
200
TA = +85°C
400
TA = +25°C
300
TA = –40°C
200
100
100
–6
–4
–2
0
2
SOURCE OR DRAIN VOLTAGE (V)
4
6
0
05713-031
0
0
2
4
6
8
SOURCE OR DRAIN VOLTAGE (V)
10
12
05713-034
ON RESISTANCE (Ω)
–5
0
5
SOURCE OR DRAIN VOLTAGE (V)
Figure 12. On Resistance as a Function of VD (VS) for Different Temperatures,
Dual Supply
Figure 9. On Resistance as a Function of VD (VS) for Dual Supply
Figure 13. On Resistance as a Function of VD (VS) for Different Temperatures,
Single Supply
Figure 10. On Resistance as a Function of VD (VS) for Dual Supply
400
450
TA = 25°C
400
VDD = 10.8V
VSS = 0V
350
VDD = 12V
VSS = 0V
300
250
VDD = 13.2V
VSS = 0V
200
VDD = +15V
VSS = –15V
VBIAS = +10V/–10V
300
LEAKAGE CURRENT (pA)
ON RESISTANCE (Ω)
–10
05713-033
20
150
ID, S (ON) + +
200
ID (OFF) + –
100
IS (OFF) + –
0
ID, S (ON) – –
–100
ID (OFF) – +
–200
IS (OFF) – +
100
0
2
4
6
8
10
SOURCE OR DRAIN VOLTAGE (V)
12
14
Figure 11. On Resistance as a Function of VD (VS) for Single Supply
–400
05713-032
0
0
10
20
30
40 50 60 70 80
TEMPERATURE (°C)
90
100 110 120
05713-057
–300
50
Figure 14. ADG1208 Leakage Currents as a Function of Temperature, Dual Supply
Rev. C | Page 12 of 20
Data Sheet
ADG1208/ADG1209
150
6
VDD = 12V
VSS = 0V
VBIAS = 1V/10V
4
IS (OFF) + –
CHARGE INJECTION (pC)
ID, S (ON) + +
50
ID (OFF) + –
0
IS (OFF) – +
ID, S (ON) – –
–50
ID (OFF) – +
–100
2
0
VDD = +12V
VSS = 0V
VDD = +15V
VSS = –15V
–2
–4
0
10
20
30
40 50 60 70 80
TEMPERATURE (°C)
90
100 110 120
–6
–15
05713-058
–150
VDD = +5V
VSS = –5V
Figure 15. ADG1208 Leakage Currents as a Function of Temperature,
Single Supply
–10
–5
0
VS (V)
5
10
15
05713-041
LEAKAGE CURRENT (pA)
100
DEMUX (DRAIN TO SOURCE)
TA = 25°C
Figure 18. Drain-to-Source Charge Injection vs. Source Voltage
350
200
IDD PER CHANNEL
TA = 25C
180
300
160
VDD = +15V
VSS = –15V
VDD = +5V
VSS = –5V
250
120
TIME (ns)
IDD (µA)
140
100
80
60
200
VDD = +12V
VSS = 0V
150
VDD = +15V
VSS = –15V
100
40
2
4
6
8
10
LOGIC, INX (V)
12
14
16
0
–40
20
40
60
TEMPERATURE (°C)
80
100
120
0
1.0
MUX (SOURCE TO DRAIN)
0.9 TA = 25°C
–10
0.8
–20
OFF ISOLATION (dB)
0.7
0.6
VDD = +15V
VSS = –15V
0.5
0.4
0.3
VDD = +12V
VSS = 0V
0.2
VDD = +15V
VSS = –15V
TA = 25C
–30
–40
–50
–60
–70
–80
–90
0.1
VDD = +5V
VSS = –5V
–10
–5
0
VS (V)
–100
5
10
15
05713-040
CHARGE INJECTION (pC)
0
Figure 19. tON/tOFF Times vs. Temperature
Figure 16. IDD vs. Logic Level
0
–15
–20
–110
10k
100k
1M
10M
FREQUENCY (Hz)
100M
Figure 20. Off Isolation vs. Frequency
Figure 17. Source-to-Drain Charge Injection vs. Source Voltage
Rev. C | Page 13 of 20
1G
05713-049
0
05713-035
0
05713-052
50
VDD = +12V
VSS = 0V
20
ADG1208/ADG1209
Data Sheet
20
10
VDD = +15V
VSS = –15V
0 TA = 25°C
LOAD = 10kΩ
TA = 25°C
1
THD + N (%)
CROSSTALK (dB)
–20
–40
ADJACENT CHANNELS
–60
VDD = +15V, VSS = –15V, VS = +5Vrms
0.1
NONADJACENT
CHANNELS
–80
VDD = +5V, VSS = –5V, VS = +3.5Vrms
100k
1M
10M
FREQUENCY (Hz)
100M
1G
0.01
10
05713-042
–120
10k
100
Figure 21. ADG1208 Crosstalk vs. Frequency
100k
12
–20
VDD = +15V
VSS = –15V
TA = 25°C
10
CAPACITANCE (pF)
CROSSTALK (dB)
10k
Figure 24. THD + N vs. Frequency
0
–40
–60
1k
FREQUENCY (Hz)
05713-036
–100
ADJACENT CHANNELS
–80
–100
8
SOURCE/DRAIN ON
6
DRAIN OFF
4
2
SOURCE OFF
100k
1M
10M
FREQUENCY (Hz)
100M
1G
0
–15
05713-053
–120
10k
–10
–5
5
10
15
Figure 25. ADG1208 Capacitance vs. Source Voltage,
±15 V Dual Supply
Figure 22. ADG1209 Crosstalk vs. Frequency
–6.0
12
VDD = 12V
VSS = 0V
TA = 25°C
–6.5
10
SOURCE/DRAIN ON
CAPACITANCE (pF)
–7.0
–7.5
–8.0
–8.5
8
DRAIN OFF
6
4
–9.0
100k
1M
10M
FREQUENCY (Hz)
100M
1G
0
0
2
4
6
VBIAS (V)
8
10
Figure 26. ADG1208 Capacitance vs. Source Voltage,
12 V Single Supply
Figure 23. On Response vs. Frequency
Rev. C | Page 14 of 20
12
05713-045
–10.0
10k
SOURCE OFF
2
–9.5
05713-054
ON RESPONSE (dB)
0
VBIAS (V)
05713-043
NONADJACENT
CHANNELS
Data Sheet
ADG1208/ADG1209
12
8
VDD = 12V
VSS = 0V
TA = 25°C
7
10
SOURCE/DRAIN ON
CAPACITANCE (pF)
CAPACITANCE (pF)
6
8
DRAIN OFF
6
VDD = +5V
VSS = –5V
TA = 25°C
4
SOURCE/DRAIN ON
5
DRAIN OFF
4
3
2
SOURCE OFF
2
–4
–3
–2
–1
0
1
2
3
4
5
VBIAS (V)
0
05713-055
Figure 27. ADG1208 Capacitance vs. Source Voltage, ±5 V Dual Supply
0
4
6
VBIAS (V)
12
10
8
VDD = +15V
VSS = –15V
TA = 25°C
7
7
SOURCE/DRAIN ON
6
6
CAPACITANCE (pF)
SOURCE/DRAIN ON
5
4
DRAIN OFF
3
5
DRAIN OFF
4
3
VDD = +5V
VSS = –5V
TA = 25°C
2
2
SOURCE OFF
SOURCE OFF
1
1
–10
–5
0
VBIAS (V)
5
10
15
0
–5
05713-046
0
–15
8
Figure 29. ADG1209 Capacitance vs. Source Voltage, 12 V Single Supply
8
CAPACITANCE (pF)
2
Figure 28. ADG1209 Capacitance vs. Source Voltage, ±15 V Dual Supply
–4
–3
–2
–1
0
1
VBIAS (V)
2
3
4
5
05713-056
0
–5
05713-047
1
SOURCE OFF
Figure 30. ADG1209 Capacitance vs. Source Voltage, ±5 V Dual Supply
Rev. C | Page 15 of 20
ADG1208/ADG1209
Data Sheet
TERMINOLOGY
tTRANSITION
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
RON
Ohmic resistance between D and S.
∆RON
Difference between the RON of any two channels.
TBBM
Off time measured between the 80% point of both switches
when switching from one address state to another.
IS (Off)
Source leakage current when the switch is off.
ID (Off)
Drain leakage current when the switch is off.
VINL
Maximum input voltage for Logic 0.
ID, IS (On)
Channel leakage current when the switch is on.
VINH
Minimum input voltage for Logic 1.
VD (VS)
Analog voltage on Terminal D, Terminal S.
IINL (IINH)
Input current of the digital input.
CS (Off)
Channel input capacitance for off condition.
IDD
Positive supply current.
CD (Off)
Channel output capacitance for off condition.
ISS
Negative supply current.
CD, CS (On)
On switch capacitance.
Off Isolation
A measure of unwanted signal coupling through an off channel.
CIN
Digital input capacitance.
tON (EN)
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
Delay time between the 50% and 90% points of the digital input
and switch on condition.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
tOFF (EN)
Delay time between the 50% and 90% points of the digital input
and switch off condition.
On Response
The frequency response of the on switch.
Total Harmonic Distortion + Noise (THD + N)
The ratio of the harmonic amplitude plus noise of the signal to
the fundamental.
Rev. C | Page 16 of 20
Data Sheet
ADG1208/ADG1209
TEST CIRCUITS
V
IDS
Figure 31. On Resistance
A
VD
Figure 33. On Leakage
tr < 20ns
tf < 20ns
50%
D
NC = NO CONNECT
Figure 32. Off Leakage
3V
ADDRESS
DRIVE (VIN)
S
NC
VD
VS
05713-037
VS
A
50%
VDD
VSS
VDD
VSS
A0
S1
0V
VIN
VS1
A1
50Ω
S2–S7
A2
tTRANSITION
tTRANSITION
VS8
S8
ADG12081
90%
2.4V
OUTPUT
OUTPUT
D
EN
300Ω
GND
35pF
1SIMILAR
05713-022
90%
CONNECTION FOR ADG1209.
Figure 34. Address to Output Switching Times, tTRANSITION
3V
ADDRESS
DRIVE (VIN)
VDD
VSS
VDD
VSS
A0
S1
VIN
0V
VS
A1
50Ω
S2–S7
A2
S8
80%
ADG12081
80%
OUTPUT
2.4V
OUTPUT
D
EN
300Ω
GND
35pF
05713-023
tBBM
1SIMILAR CONNECTION FOR ADG1209.
Figure 35. Break-Before-Make Delay, tBBM
3V
ENABLE
DRIVE (VIN)
50%
VSS
VDD
VSS
A0
50%
S1
VS
A1
S2–S8
0V
A2
ADG12081
tOFF (EN)
0.9VO
OUTPUT
0.9VO
D
EN
VIN
50Ω
1SIMILAR
Figure 36. Enable Delay, tON (EN), tOFF (EN)
Rev. C | Page 17 of 20
GND
300Ω
CONNECTION FOR ADG1209.
35pF
05713-024
tON (EN)
OUTPUT
VDD
05713-039
D
D
05713-038
S
S
A
ID (ON)
ID (OFF)
IS (OFF)
ADG1208/ADG1209
Data Sheet
3V
VDD
VSS
VDD
VSS
A0
A1
VIN
A2
ADG12081
VOUT
RS
∆VOUT
S
D
VOUT
EN
VS
QINJ = CL × ∆VOUT
CL
1nF
GND
05713-025
VIN
1SIMILAR CONNECTION FOR ADG1209.
Figure 37. Charge Injection
VDD
VSS
VDD
NETWORK
ANALYZER
NETWORK
ANALYZER
VSS
S
VOUT
0.1µF
VDD
D
VS
S2
D
GND
VOUT
R
50Ω
VS
GND
OFF ISOLATION = 20 log
VOUT
VS
05713-026
RL
50Ω
VSS
S1
RL
50Ω
50Ω
50Ω
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
VOUT
VS
Figure 40. Channel-to-Channel Crosstalk
Figure 38. Off Isolation
VDD
VSS
0.1µF
0.1µF
05713-028
VDD
0.1µF
VSS
0.1µF
VDD
VDD
VSS
S
S
D
IN
VOUT
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
VS
V p-p
D
VIN
05713-027
INSERTION LOSS = 20 log
AUDIO PRECISION
VSS
RS
VS
GND
0.1µF
VDD
50Ω
RL
50Ω
VSS
0.1µF
NETWORK
ANALYZER
GND
RL
10kΩ
Figure 41. THD + Noise
Figure 39. Bandwidth
Rev. C | Page 18 of 20
VOUT
05713-029
0.1µF
Data Sheet
ADG1208/ADG1209
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
9
4.50
4.40
4.30
6.40
BSC
8
1
PIN 1
1.20
MAX
0.15
0.05
0.20
0.09
0.30
0.19
0.65
BSC
SEATING
PLANE
COPLANARITY
0.10
0.75
0.60
0.45
8°
0°
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 42. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
4.10
4.00 SQ
3.90
PIN 1
INDICATOR
0.35
0.30
0.25
0.65
BSC
PIN 1
INDICATOR
16
13
1
12
EXPOSED
PAD
2.25
2.10 SQ
1.95
9
TOP VIEW
0.80
0.75
0.70
4
0.25 MIN
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
5
8
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
111908-A
0.70
0.60
0.50
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
Figure 43. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-23)
Dimensions shown in millimeters
10.00 (0.3937)
9.80 (0.3858)
4.00 (0.1575)
3.80 (0.1496)
9
16
1
8
1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0039)
COPLANARITY
0.10
0.51 (0.0201)
0.31 (0.0122)
6.20 (0.2441)
5.80 (0.2283)
1.75 (0.0689)
1.35 (0.0531)
SEATING
PLANE
0.50 (0.0197)
0.25 (0.0098)
45°
8°
0°
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
Figure 44. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-16)
Dimensions shown in millimeters and (inches)
Rev. C | Page 19 of 20
060606-A
COMPLIANT TO JEDEC STANDARDS MS-012-AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
ADG1208/ADG1209
Data Sheet
ORDERING GUIDE
Model1
ADG1208YRUZ
ADG1208YRUZ-REEL7
ADG1208YCPZ-REEL
ADG1208YCPZ-REEL7
ADG1208YRZ
ADG1208YRZ-REEL7
ADG1209YRUZ
ADG1209YRUZ-REEL7
ADG1209YCPZ-REEL7
ADG1209YRZ
ADG1209YRZ-REEL7
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
Z = RoHS Compliant Part.
©2006–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05713-0-8/15(C)
Rev. C | Page 20 of 20
Package Option
RU-16
RU-16
CP-16-23
CP-16-23
R-16
R-16
RU-16
RU-16
CP-16-23
R-16
R-16