WiLink™ 6.0 single-chip WLAN, Bluetooth® and FM solutions Product Bulletin TI’s WiLink 6.0 mobile platform is a complete hardware and software offering comprised of proven WLAN, Bluetooth® and FM cores integrated onto a single chip. ™ There are four solutions in the WiLink 6.0 product offering. The WL1271 supports 802.11b/g/n in the 2.4-GHz band, while the WL1273 supports 802.11a/b/g/n with 2.4-GHz and 5-GHz band support. Both single-chip solutions support Bluetooth 2.1 Release, ANT and FM transmit and receive. The WL1271/3L support in addition to the above, Bluetooth Low Energy Specification 4.0 + EDR. The WiLink 6.0 single-chip solutions are manufactured in 65-nm CMOS process and use TI’s DRP™ technology to deliver low power, a small form factor and low cost requirements of handset manufacturers worldwide. Key benefits TI’s WiLink 6.0 platform is pre integrated, optimized and validated with a variety of processor platforms, including TI’s OMAP processor family to lower required integration efforts and acceleate time to to market for a wide range of applications. The WiLink 6.0 solution includes TI’s proven, robust coexistence platform, which addresses system-wide interference issues, encompassing radio design, and hardware and software solutions. Coexistence expertise is becoming increasingly important as more radios are being added to the handset. TI leads the market in coexistence solutions for Bluetooth and mWLAN with hundreds of consumer devices shipping in the market since 2003 using TI’s coexistence platform. WiLink™ 6.0 Solution Host Clocks Host I/F SDIO/SPI Legacy I/F WLAN Bluetooth® MAC/BB WLAN Bluetooth MAC/BB FM MAC/BB FM Radio WLAN Bluetooth FrontEnd Filter Filter • Single-chip mobile WLAN, Bluetooth® and FM solution implemented in 65-nm CMOS process using TI’s DRP™ technology enables: - Reduced power consumption for extended battery life - Bill of material reduction - Small form factor • Proven enhanced user experience with range-extended mobile WLAN (802.11a/b/g/n), Bluetooth and FM functional cores • Sophisticated ELP™ low-power technology with on-chip processing optimizations for extended battery life • Coexistence features enable simultaneous operation of each integrated function • Supports Bluetooth low energy Technology and ANT The WiLink Software Development Kit (SDK) 6.x included with the WiLink 6.0 platform is optimized for embedded and portable applications. This includes support for Android, Linux®, Windows ™, and Symbian™ operating systems, as well as lab testing and manufacturing software. It is also partitioned to minimize host CPU loading and power consumption to further extend battery life in portable applications. www.ti.com/wilink6 WiLink 6.0 solution Important Notice: The products and services of Texas Instruments Incorporated and its subsidiaries described herein are sold subject to TI’s standard terms and conditions of sale. Customers are advised to obtain the most current and complete information about TI products and services before placing orders. TI assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company’s products or services does not constitute TI’s approval, warranty or endorsement thereof. The platform bar, WiLink, ELP, DRP and OMAP are trademarks of Texas Instruments. The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc., and any use of such marks by Texas Instruments is under license. All other trademarks are the property of their respective owners. © 2010 Texas Instruments Incorporated B010208 SWMT013D