Application Note AN120 Using CC2590 Front End with CC2541 By Abhishek Chattopadhyay Keywords • • • • 1 • CC2540 • CC2541 • CC2590 Bluetooth® low energy systems Range Extender External PA External LNA Introduction The CC2541 is TI's Bluetooth® low energy RF System-on-Chip (SoC) for the 2.4 GHz unlicensed ISM band. This chip enables consumer applications by offering state-ofthe-art selectivity/co-existence, excellent link budget, and low voltage operation. The CC2540 is similar to the CC2541. It does not have the I2C like the CC2541, but has an USB interface instead. The CC2540 has the ability to output 4dBm during transmits; the CC2541 can only output 0dBm. However, unlike the CC2541 the CC2540 cannot be used in the proprietary mode. CC2590 is a range extender for 2.4-GHz RF transceivers, transmitters and SoC products from Texas Instruments. CC2590 increases the link budget by providing a Power Amplifier (PA) for higher output power and a Low Noise Amplifier (LNA) for improved receiver sensitivity. CC2590 further contains RF switches, RF matching, and a balun for a seamless interface with the CC2541. This allows for simple design of high wireless applications. performance This application note talks about the use of range extenders, specifically the CC2590, with the CC2541. It further describes the expected performance from this combination as well as important factors to consider with respect to the layout and regulatory requirements. The combined CC2541 and CC2590 solution is suitable for systems targeting compliance with FCC CFR47 Part 15. The RF front end of CC2541 is similar to that in the CC2540. Therefore similar performance from a combo board using a CC2540 instead of a CC2541 can be expected. Texas Instruments Bluetooth® low energy SW solutions, BLE-Stack includes the (www.ti.com/blestack) necessary SW changes for using the CC2590. Page 1 of 19 SWRA422 Application Note AN120 Table of Contents KEYWORDS.............................................................................................................................. 1 1 INTRODUCTION ............................................................................................................. 1 2 ABBREVIATIONS ........................................................................................................... 2 3 ABSOLUTE MAXIMUM RATINGS ................................................................................. 3 4 ELECTRICAL SPECIFICATIONS ................................................................................... 3 4.1 OPERATING CONDITIONS............................................................................................ 3 4.2 CURRENT CONSUMPTION ........................................................................................... 3 4.3 RECEIVE PARAMETERS .............................................................................................. 4 4.4 RECEIVED SIGNAL STRENGTH INDICATOR (RSSI)........................................................ 4 4.5 TRANSMIT PARAMETERS ............................................................................................ 5 4.6 OUTPUT POWER PROGRAMMING ................................................................................ 5 4.7 TYPICAL PERFORMANCE CURVES ............................................................................... 6 5 APPLICATION CIRCUIT ............................................................................................... 10 5.1 POWER DECOUPLING AND RF LOADING .................................................................... 10 5.2 INPUT/ OUTPUT MATCHING AND FILTERING ............................................................... 10 5.3 BIAS RESISTOR ........................................................................................................ 11 5.4 ANTENNA CONSIDERATIONS ..................................................................................... 11 6 PCB LAYOUT CONSIDERATIONS.............................................................................. 12 6.1 THE GAIN OF THE CC2590....................................................................................... 12 7 REGULATORY REQUIREMENTS ............................................................................... 13 7.1 DUTY CYCLING WHEN COMPLYING WITH FCC ........................................................... 14 7.2 COMPLIANCE OF FCC PART 15.247 WHEN USING THE CC2541 WITH THE CC2590.... 14 8 CONTROLLING THE CC2590...................................................................................... 18 9 REFERENCES .............................................................................................................. 19 10 GENERAL INFORMATION........................................................................................... 19 10.1 DOCUMENT HISTORY ............................................................................................... 19 2 Abbreviations SoC DSSS DUT EIRP EM EVM HG ISM FCC FHSS LNA PA PCB PSD RF RSSI RX SG TX VSWR System-on-Chip Direct Sequence Spread Spectrum Device Under Test Equivalent Isotropically Radiated Power Evaluation Module Error Vector Magnitude High Gain Mode of CC2541 Industrial, Scientific, Medical Federal Communications Commission Frequency Hopping Spread Spectrum Low Noise Amplifier Power Amplifier Printed Circuit Board Power Spectral Density Radio Frequency Receive Signal Strength Indicator Receive, Receive Mode Standard Gain Mode of CC2541 Transmit, Transmit Mode Voltage Standing Wave Ratio Page 2 of 19 SWRA422 Application Note AN120 3 Absolute Maximum Ratings The absolute maximum ratings and operating conditions listed in the CC2541 datasheet [1] and the CC2590 datasheet [4] must be followed at all times. Stress exceeding one or more of these limiting values may cause permanent damage to any of the devices. 4 Electrical Specifications Note that these characteristics values are only valid when using the recommended register settings listed in the CC2541 user guide [3] and the ones presented in Section 4.6 and in Chapter 8. 4.1 Operating Conditions Parameter Operating Frequency Operating Supply Voltage Operating Temperature Min 2400 2.0 -40 Max 2483.5 3.6 85 Unit MHz V °C Table 4.1 Operating Conditions 4.2 Current Consumption TC = 25°C, VDD = 3.0 V, f = 2440 MHz if nothing else is stated. The CC2541 and CC2590 are both set to receive in High Gain mode. All parameters are measured on the CC2541 CC2590EM reference design [9] with a 50 Ω load. Parameter Receive Current Transmit Current Power Down Current Condition Wait for sync, -90 dBm input level Wait for sync, -50 dBm input level TXPOWER = 0xF1 TXPOWER = 0xE1 TXPOWER = 0xD1 TXPOWER = 0xC1 TXPOWER = 0xB1 TXPOWER = 0xA1 PM2 Typical 21.6 21.6 41.1 36.6 32.8 30.5 28.8 27.5 1 Unit mA mA uA Table 4.2 Current Consumption Page 3 of 19 SWRA422 Application Note AN120 4.3 Receive Parameters TC = 25°C, VDD = 3.0 V, f = 2440 MHz if nothing else is stated. The CC2590 is set to receive in its High Gain mode. All parameters are measured on the CC2541 - CC2590EM reference design with a 50 Ω load. Parameter Receive Sensitivity HG Receive Sensitivity SG Saturation Condition 1 % PER 1 % PER Typical -95 -92 6.9 Table 4.3 Receive Parameters 4.4 Received Signal Strength Indicator (RSSI) Due to in the external LNA and the offset in CC2541 the RSSI readouts from CC2541 CC2590 is different from RSSI offset values for a standalone CC2541 design. The offset values for the CC2541-CC2590EM [9] are shown in Table 4.4. The CC2590 is set to receive in its High Gain mode. The BLE stack will have the CC2590 set such that it will always receive in its High Gain mode. The user shall have the ability to choose the Standard Gain or High Gain mode of the CC2541. CC2541-CC2590EM LNA mode High Gain Standard Gain RSSI offset 112.7 103.3 1 Table 4.4 RSSI Compensation 1 Real RSSI = Register value – RSSI offset Page 4 of 19 SWRA422 Unit dBm dBm dBm Application Note AN120 4.5 Transmit Parameters TC = 25°C, VDD = 3.0 V, f = 2440 MHz if nothing else is stated. All parameters are measured on the CC2541 - CC2590EM reference design with a 50 Ω load. Radiated measurements are done with a Titanis 2.4GHz swivel antenna from Antenova [10]. Parameter Radiated Emission with TXPOWER = 0xE1 Complies with FCC 15.247. See Chapter 7 for more details about regulatory requirements and compliance Condition Typical 1 Unit Conducted 2·RF (FCC restricted band) 1 Conducted 3·RF (FCC restricted band) -52.6 -56.2 dBm dBm Radiated 2·RF (FCC restricted band)1 -49.1 dBm Table 4.5 Transmit Parameters 1 The maximum allowed spurious emission signal level by FCC is -41.2 dBm 4.6 Output Power Programming The RF output power of the CC2541 - CC2590EM is controlled by the 8-bit value in the CC2541 TXPOWER register. Table 4.6 shows the typical output power and current consumption for the recommended power settings. The results are given for TC = 25°C, VDD = 3.0 V and f = 2440 MHz, and are measured on the CC2541 - CC2590EM reference design with a 50 Ω load. For recommendations for the remaining CC2541 registers, see Chapter 8 or use the settings given by SmartRF Studio. TXPOWER 0xF1 0xE1 0xD1 0xC1 0xB1 0xA1 Power [dBm] 10.4 8.9 7.3 5.5 3.1 1.4 Current [mA] 41.1 36.6 32.8 30.5 28.8 27.5 Table 4.6 Power Table Note that the recommended power settings given in Table 4.6 are a subset of all the possible TXPOWER register settings. However, using other settings than those recommended might result in suboptimal performance in areas like current consumption and spurious emission. When using the BLE stack, to change the settings the stack will have to be modified. The BLE stack will have the recommended settings incorporated in it. Page 5 of 19 SWRA422 Application Note AN120 4.7 Typical Performance Curves TC = 25°C, VDD = 3.0 V, f = 2440 MHz if nothing else is stated. The CC2590 is set to receive in its High Gain mode. All parameters are measured on the CC2541 - CC2590EM reference design with a 50 Ω load. Figure 4.1 Output Power vs. Frequency, TXPOWER = 0xE1, 0xB1, 0xF1 Figure 4.2 Output Power vs. Power Supply Voltage Page 6 of 19 SWRA422 Application Note AN120 Figure 4.3 Output Power vs. Temperature Figure 4.4 Sensitivity vs. Frequency Page 7 of 19 SWRA422 Application Note AN120 Figure 4.5 Sensitivity vs. Power Supply Voltage Figure 4.6 Sensitivity vs. Temperature Page 8 of 19 SWRA422 Application Note AN120 Figure 4.7 Saturation vs. Frequency Figure 4.8 RSSI Readout vs. Input Power Page 9 of 19 SWRA422 Application Note AN120 5 Application Circuit Only a few external components are required for the CC2541 - CC2590 reference design. A typical application circuit is shown below in Figure 5.1. Note that the application circuit figure does not show how the board layout should be done. The board layout will greatly influence the RF performance of the CC2541 - CC2590EM. TI provides a compact CC2541 CC2590EM reference design[9]. It is highly recommended that the reference design provided be followed. The layout, stack-up and schematic for the CC2590 need to be copied exactly to obtain good performance. Note that the reference design also includes bill of materials with manufacturers and part numbers. VDD VDD C11 C102 L102 C103 = TLINE inductor VDD VDD C131 TL131 AVDD_LNA TL101 AVDD_PA AVDD_BIAS UNUSED TL11 C161 C42 RF_P RXTX RXTX RXTX C111 C113 RF_P NC L111 CC2590 ANT L112 L41 C41 RF_P RF_P RF_N RF_N RF_N L42 C21 RF_N PA_EN(P1_2) PAEN C112 LNA_EN(P1_3) EN BIAS CC2541 HGM_EN(P1_1) HGM C22 R151 Figure 5.1 Application Circuit for the CC2541 with CC2590 5.1 Power Decoupling and RF Loading Proper power supply decoupling must be used for optimum performance. In Figure 5.1, only the decoupling components for the CC2590 are shown. This is because, in addition to decoupling, the parallel capacitors C11, C101, C102, C103 and C131 together with, L102, TL11, TL101 and TL131 also work as RF loads. These therefore ensure the optimal performance from the CC2590. C161 decouples the AVDD_BIAS power. The placement and size of the decoupling components, the power supply filtering and the PCB transmission lines are very important to achieve the best performance. Details about the importance of copying the CC2541 - CC2590EM reference design exactly and potential consequences of changes are explained in chapter 6. 5.2 Input/ Output Matching and Filtering The RF input/output of CC2541 is differential complex impedance. The CC2590 includes a balun and a matching network in addition to the PA, LNA and RF switches which makes the interface to the CC2541 seamless. Only a few components between the CC2541 and CC2590 are necessary for RF matching. Page 10 of 19 SWRA422 Application Note AN120 Note that the PCB transmission lines that connect the two devices also are part of the RF matching. It is therefore important to copy the distance between the devices, the transmission lines and the stack-up of the PCB according to the reference design to ensure optimum performance. The network between the CC2590 and the antenna (L111, L112, C112, C111 and C113) matches the CC2590 to a 50 Ω load and provides filtering to facilitate meeting regulatory requirements. C111 also works as a DC-block. 5.3 Bias resistor R151 is a bias resistor. The bias resistor is used to set an accurate bias current for internal use in the CC2590. 5.4 Antenna Considerations The TI reference design contains two antenna options. As default, the SMA connector is connected to the output of CC2590 through a 0 Ω resistor. This resistor can be desoldered and rotated 90° clockwise in order to connect to the PCB antenna, which is a planar inverted F antenna (PIFA). Note that all testing and characterization has been done using the SMA connector. The PCB antenna has only been functionally tested by establishing a link between two EMs. Please refer to the antenna selection guide [5] and the Inverted F antenna design note [6] for further details on the antenna solutions. Page 11 of 19 SWRA422 Application Note AN120 6 PCB Layout Considerations The Texas Instruments reference design uses a 1.6 mm (0.062”) 4-layer PCB solution. Note that the different layers have different thickness; it is important to follow the recommendation given in the CC2541 - CC2590EM reference design [9] to ensure optimum performance. The top layer is used for components and signal routing, and the open areas are filled with metallization connected to ground using several vias. The areas under the two chips are used for grounding and must be well connected to the ground plane with multiple vias. Footprint recommendation for the CC2590 is given in the CC2590 datasheet [4]. Layer two is a complete ground plane and is not used for any routing. This is done to ensure short return current paths. The low impedance of the ground plane prevents any unwanted signal coupling between any of the nodes that are decoupled to it. Layer three is a power plane. The power plane ensures low impedance traces at radio frequencies and prevents unwanted radiation from power traces. Layer four is used for routing, and as with layer one, open areas are filled with metallization connected to ground using several vias. 6.1 The Gain of the CC2590 Changing the layout or the stack-up of the reference design [9] affects the gain of the CC2590. This is because the gain of the CC2590 can be viewed as a function of both the onchip impedance and the external impedance contributions. Internal on-chip routing and capacitance, bond wires (often several in parallel), the PCB transmission lines, the thermal reliefs on the decoupling capacitors’ ground nodes, capacitance and parasitics of the decoupling capacitors, the inductance of the vias to the ground plane and the soldering of the chip will therefore contribute to the actual performance of the CC2590. A simplified model of all of these contributions is shown in Figure 6.1. Due to all the contributors to the CC2590 performance, several observations can be made on how changing layout and PCB stack-up affects the amplifier: • • • Misplacing the decoupling capacitor or using an arbitrary capacitor will change the inductance, and hence move the resonance frequency of the amplifier, i.e. the frequency with maximum gain. Bad soldering of the ground paddle can reduce the gain significantly. Too few or too long vias will reduce the gain significantly. This is why a checkered pattern of vias/ solder paste and a 4-layer PCB with the ground plane close to the top layer has been chosen for the CC2541 - CC2590EM reference design. Page 12 of 19 SWRA422 Application Note AN120 TLINE Bondwire V_out V_in Bondwire(s), soldering, gnd vias Figure 6.1 Simplified Model of the Impedance Contributors in the CC2590 Design 7 Regulatory Requirements In the United States, the Federal Communications Commission (FCC) is responsible for the regulation of all RF devices. CFR 47, Part 15, regulates RF products intended for unlicensed operation. A product intended for unlicensed operation has to be subject to compliance testing. If the product is approved, the FCC will issue an identification number. The specific frequency bands used for unlicensed radio equipment for the 2.4 GHz band are regulated by section 15.247 and 15.249. General rules for certification measurements are found in section 15.35. Restricted bands and general limits for spurious emissions are found in sections 15.205 and 15.209. The CC2541 - CC2590EM reference design [9] has been tested for compliance with FCC Part 15.247. While it is not a formal certification, it does give a good representation of emissions with respect to compliance requirements. The FCC Part 15.247 compliance is generally a tougher requirement than ETSI compliance (EN 300 328) due to the restricted bands of operation. There are however requirements with regards to ETSI compliance (EN 300 328) that prevents operation at maximum output power. The clause 4.3.2.2 Maximum Power Spectral Density requirement of EN 300 328 requires maximum +10 dBm/ 1 MHz. The final output power level will depend on the antenna used. BLE requires that the max power emitted by the DUT not exceed +10dBm EIRP FCC Part 15.247 limits the output power to 1 W or +30 dBm when Direct Sequence Spread Spectrum (DSSS) modulation or Frequency Hopping Spread Spectrum (FHSS) with at least 75 hop channels is used. The spectral density of digital modulation systems (not including FHSS) shall not exceed 8 dBm/ 3 kHz. The minimum 6 dB bandwidth of such systems is 500 kHz. Since the CC2541 is a Bluetooth® low energy compliant transceiver, FCC classifies the system, as a digitally modulated system. The +30 dBm limit therefore applies to the CC2541 with the CC2590 combination. Page 13 of 19 SWRA422 Application Note AN120 When complying with Part 15.247, in any 100 kHz bandwidth outside the operating band, the power level shall be at least 20 dB below the level in the 100 kHz bandwidth with the highest power level in the operating band. Attenuation below limits given in 15.209 is not required. Emission that fall within restricted bands (15.205) must meet general limits given in 15.209. This is summarized in Table 7.1 below. More details about the 2.4 GHz FCC regulations are found in application note AN032 [7]. Standard Relevant Frequency Radiated Power (EIRP) Conducted Power 1 +10 dBm 2 (+30dBm) 2400 – 2483.5 MHz FCC 15.247 Restricted bands defined by 15.205, nd rd including the 2 , 3 th and 5 harmonics All frequencies not covered in above cells Comment Maximum 6 dBi antenna gain -41.2 dBm -20 dBc Table 7.1 Summarized FCC 15.247 Regulations for the 2.4 GHz Band 1 2 BLE limits the output power to +10dBm FCC Part 15.247 limits the output power to 1 W or +30 dBm 7.1 Duty Cycling when Complying with FCC For frequencies above 1 GHz, the field strength limits are based on average limits. When using an averaging detector, a minimum bandwidth of 1 MHz shall be employed and the measurement time shall not exceed 100 ms. Due to the averaging detector, pulsed transmissions are allowed higher peak fundamental, harmonic, and spurious power. This is a benefit for duty-cycled transmissions. The relaxation factor is 20 log (TX on-time/100 ms) [dB]. A 50 % duty cycle will therefore allow for 6 dB higher peak emission than without duty cycling. Notice however that, even when an averaging detector is called for, there is still a limit on emissions measured using a peak detector function with a limit 20 dB above the average limit. 7.2 Compliance of FCC Part 15.247 when using the CC2541 with the CC2590 When using CC2541 with the CC2590, duty cycling or back-off is only needed for highest frequency (2.48GHz) to comply with FCC at maximum recommended output power (TXPOWER = 0xE1). Table 7.2 below shows the duty cycling or back-off needed to comply with the FCC Part 15.247 limits at typical conditions (TC = 25°C, VDD = 3.0 V, TXPOWER = 0xE1). Bluetooth® low energy systems are however typically low duty cycle systems. Note that the numbers in Table 7.2 are based on conducted emission measurements from the CC2541 - CC2590EM reference design [9]. The real required duty cycling or back-off may be different for applications with different antennas, plastic covers, or other factors that amplify/ attenuate the radiated power. Figure 7.1 below shows the level of the conducted spurious emission and margins to the FCC Part 15.247 limits for the Bluetooth® low energy channels under typical conditions (TC = 25°C, VDD = 3.0 V) when transmitting at maximum recommended power (TXPOWER = 0xE1) using the CC2541 - CC2590EM [9]. Figure 7.2 and Figure 7.3 show the margins versus the FCC 15.247 for the lowest frequency channels at the lower band edge and for the upper frequency channels at the upper band edge respectively. At the band edge the FCC allows for a Markerdelta method measurement [8] to determine the amount of back off or duty cycle needed to comply with the FCC Part 15.247. With Marker-delta method the field strength of the in-band fundamental frequency is subtracted from the difference between the highest fundamental emission level measured with a lower reference bandwidth and the emission level at the band edge, as shown in Figure 7.3. Page 14 of 19 SWRA422 Application Note AN120 BLE Channel 37 0 1 2 3 4 5 6 7 8 9 10 38 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 39 Frequency [MHz] 2402 2404 2406 2408 2410 2412 2414 2416 2418 2420 2422 2424 2426 2428 2430 2432 2434 2436 2438 2440 2442 2444 2446 2448 2450 2452 2454 2456 2458 2460 2462 2464 2466 2468 2470 2472 2474 2476 2478 2480 Back-Off [dB] 20 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 20 Duty Cycle 10% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 10% Table 7.2 Duty-Cycle or Back-Off Requirement for FCC Part 15.247 Compliance under Typical Conditions Page 15 of 19 SWRA422 Application Note AN120 Figure 7.1 Conducted Spurious Emission vs. FCC Part 15.247 Limit (TXPOWER = 0xE1, RBW = 1 MHz, VBW = 1 MHz) Figure 7.2 Conducted Spurious Emission, Lower Band Edge (TXPOWER = 0xE1, RBW = 1 MHz, VBW = 1 MHz) Page 16 of 19 SWRA422 Application Note AN120 Figure 7.3 Conducted Spurious Emission, Upper Band Edge (TXPOWER = 0xE1, RBW = 1 MHz, VBW = 1 MHz) Page 17 of 19 SWRA422 Application Note AN120 8 Controlling the CC2590 There are four digital control pins (PAEN, EN, HGM, and RXTX) on the CC2590 control the state the chip is in. Table 8.1 below shows the control logic when connecting the CC2590 to a CC2541 device. PAEN 0 0 0 1 1 EN 0 1 1 0 1 RXTX NC NC NC NC NC HGM X 0 1 X X Mode of Operation Power Down RX LGM RX HGM TX Not allowed Table 8.1 Control Logic for Connecting the CC2590 to a CC2541 Device The CC2541 – CC2590EM reference design from TI uses three of the CC2541 GPIO pins on the CC2541 to control the CC2590. The I/O pins used is shown in Figure 8.1. CC2541 CC2590 P1_2 P1_3 P1_1 PA_EN EN HGM Figure 8.1 CC2541-CC2590 Interconnect When using the configuration used in the CC2541 – CC2590EM reference design, the registers listed in Table 8.2 need to be changed from the recommended CC2541 settings to control the CC2590 and give optimum performance. The new recommended values are listed in Table 8.2. CC2541 REGISTER RFC_OBS_CTRL0 RFC_OBS_CTRL1 TXPOWER OBSSEL1 OBSSEL3 P1DIR ADDRESS 0x61EB 0x61EC 0x6186 0x6244 0x6247 0xFD RECCOMMENED VALUE 0x68 0x6A See Table 4.6 0xFB 0xFC 0x02 Table 8.2 New Recommended Register Settings for the CC2541 - CC2590 combination The TI BLE software stack supports CC2590 and the automatic control is enabled by the use of HCI_EXT_ExtendRFRangeCmd. This command is used to configure the CC254x to automatically control the CC2590. Once this command is used, the configuration will not change unless the CC254x is reset. The software stack uses specific pins which cannot be modified. The I/O pins are shown in Figure 8.1. For more information on the automatic control please refer to the TI BLE HCI Vendor Specific HCI Guide, which is included in the stack installer found at www.ti.com/ble-stack. All the recommended register CC2541 settings when including the CC2590 are automatically implemented in SmartRF Studio when checking the Range Extender box. SmartRF Studio is available on the TI website www.ti.com. Page 18 of 19 SWRA422 Application Note AN120 9 References [1] CC2541 Datasheet (http://www.ti.com/lit/pdf/SWRS110 ) [2] CC2540 Datasheet (http://www.ti.com/lit/pdf/SWRS084 ) [3] CC253x/4x User Guide (http://www.ti.com/lit/SWRU191 ) [4] CC2590 Datasheet (http://www.ti.com/lit/pdf/SWRS080 ) [5] AN058 Antenna Selection Guide (http://www.ti.com/lit/SWRA161 ) [6] DN007 2.4 GHz Inverted F Antenna (http://www.ti.com/lit/SWRU120 ) [7] AN032 SRD Regulations for License-free Transceiver Operation in the 2.4 GHz Band (http://www.ti.com/lit/SWRA060 ) [8] DA 00-705 (http://www.fcc.gov/Bureaus/Engineering_Technology/Public_Notices/2000/da000 705.doc) [9] CC2541 – CC2590EM Reference Design (http://www.ti.com/lit/zip/SWRR116 ) [10] Titanis 2.4GHz Antenna (http://www.antenova.com/Product%20Specs/AE030054-IProduct-Specification-Titanis.pdf ) 10 General Information 10.1 Document History Revision SWRA422 Date 2013.03.13 Description/Changes Initial release. Page 19 of 19 SWRA422 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated