Application Note AN119 Using the CC1190 Front End with CC1100E in the 470 MHz510 MHz band By Torstein Ermesjø Keywords Range Extender External PA External LNA 1 CC1100E Introduction The CC1100E is a sub-GHz, high performance radio transceiver designed for very low power RF applications. It is intended for the Industrial, Scientific and Medical (ISM) and Short Range Device (SRD) frequency bands at 470-510 MHz and 950-960 MHz. The CC1100E is especially suited for wireless applications targeted at the Japanese ARIB STD-T96 and the Chinese Short Range Device Regulations at 470-510 MHz. The CC1190 is a range extender for RF transceivers, transmitters, and System-onChip devices from Texas Instruments. It increases the link budget by providing a power amplifier (PA) for increased output power, and a low-noise amplifier (LNA) with low noise figure for improved receiver sensitivity in addition to switches and RF matching for simple design of high performance wireless systems. This application note outlines the expected performance when using a CC1100ECC1190 design in the 470-510 MHz frequency band used in China. The maximum allowed output power in the 470-510 MHz band is +17 dBm (50 mW), SWRA412 Page 1 of 17 Application Note AN119 Table of Contents KEYWORDS.............................................................................................................................. 1 1 INTRODUCTION ............................................................................................................. 1 2 ABBREVIATIONS ........................................................................................................... 2 3 ABSOLUTE MAXIMUM RATINGS ................................................................................. 3 4 ELECTRICAL SPECIFICATIONS ................................................................................... 3 4.1 OPERATING CONDITIONS............................................................................................ 3 4.2 CURRENT CONSUMPTION ........................................................................................... 3 4.3 RECEIVE PARAMETERS .............................................................................................. 4 4.3.1 Typical RX Performance vs. Temperature and VDD @510 MHz .................................... 4 4.3.2 Typical RX Performance vs. Temperature and VDD @470 MHz .................................... 6 4.4 TRANSMIT PARAMETERS ............................................................................................ 7 4.4.1 Typical TX Performance vs. Temperature and VDD ........................................................ 9 4.5 MEASUREMENT EQUIPMENT ..................................................................................... 12 5 CONTROLLING THE CC1190...................................................................................... 12 6 SMARTRF STUDIO AND SMARTRF04EB .................................................................. 14 6.1 SMARTRF STUDIO ................................................................................................... 14 6.2 SMARTRF04EB ....................................................................................................... 14 7 REFERENCE DESIGN.................................................................................................. 14 7.1 POWER DECOUPLING ............................................................................................... 14 7.2 INPUT/ OUTPUT MATCHING AND FILTERING ............................................................... 14 7.3 BIAS RESISTOR........................................................................................................ 15 7.4 PCB LAYOUT CONSIDERATIONS ............................................................................... 15 8 DISCLAIMER ................................................................................................................ 16 9 REFERENCES .............................................................................................................. 16 10 GENERAL INFORMATION ........................................................................................... 16 10.1 DOCUMENT HISTORY ............................................................................................... 16 11 APPENDIX – CC1100E-CC1190EM 470-510 MHZ SCHEMATIC ............................... 17 2 Abbreviations EB EM HGM LNA LGM PA PCB PER RF RSSI RX TrxEB TX Evaluation Board Evaluation Modul High Gain Mode Low Noise Amplifier Low Gain Mode Power Amplifier Printed Circuit Board Packet Error Rate Radio Frequency Receive Signal Strength Indicator Receive, Receive Mode SmartRF Transceiver EB Transmit, Transmit Mode SWRA412 Page 2 of 17 Application Note AN119 3 Absolute Maximum Ratings The absolute maximum ratings and operating conditions listed in the CC1100E datasheet [1] and the CC1190 datasheet [2] must be followed at all times. Stress exceeding one or more of these limiting values may cause permanent damage to any of the devices. 4 Electrical Specifications Note that the characteristics in Chapter 4 are only valid when using the CC1100E-CC1190EM 470-510 MHz reference design [3] and register settings recommended by the SmartRF Studio software [4]. 4.1 Operating Conditions Parameter Min Max Unit Operating Frequency Operating Supply Voltage Operating Temperature 470 2.0 -40 510 3.6 +85 MHz V °C Table 4.1. Operating Conditions 4.2 Current Consumption TC = 25°C, VDD = 3.0 V if nothing else is stated. All parameters are measured on the CC1100E-CC1190EM 470 - 510 MHz reference design [3] with a 50 load. Parameter Condition Typical Unit Receive Current, HGM 1.2 kbps, 2GFSK, ±5.2 kHz deviation 18.1 mA Transmit Current @ 470 MHz PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 216 185 168 145 130 116 108 95 mA Transmit Current @ 510 MHz PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 236 206 191 169 147 131 121 105 mA 370 nA 1 Power Down Current Table 4.2. Current Consumption 1 Input signal at -80 dBm SWRA412 Page 3 of 17 Application Note AN119 4.3 Receive Parameters TC = 25°C, VDD = 3.0 V, if nothing else is stated. All parameters are measured on the CC1100E-CC1190EM 470-510 MHz reference design [3] with a 50 load. Parameter Condition 2 Sensitivity , HGM @470 MHz 2 Sensitivity , HGM @510 MHz Typical Unit 1.2 kbps, 2GSK, ±5.2 kHz deviation, 58 kHz RX filter bandwidth. See Figure 4.4 -115 dBm 2.4 kbps, 2GFSK, ±5.2 kHz deviation, 58 kHz RX filter bandwidth @470 MHz. See Figure 4.5 -113 dBm 38.4 kbps, 2GFSK, ±20 kHz deviation, 100 kHz RX filter bandwidth. See Figure 4.6 -107 dBm 1.2 kbps, 2GSK, ±5.2 kHz deviation, 58 kHz RX filter bandwidth. See Figure 4.1 -116 dBm 2.4 kbps, 2GFSK, ±5.2 kHz deviation, 58 kHz RX filter bandwidth. See Figure 4.2 -113 dBm 38.4 kbps, 2GFSK, ±20 kHz deviation, 100 kHz RX filter bandwidth. See Figure 4.3 -108 dBm Table 4.3. Receive Parameters 4.3.1 Typical RX Performance vs. Temperature and VDD @510 MHz Sensitivity 1.2kbps @510MHz Detailed data 510.000000 -113.5 -114 -114.5 Sensitivity [dBm] -115 -115.5 -116 -116.5 -117 -117.5 -40 2.00V Avg 3.00V Avg 3.60V Avg -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.1. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 1.2 kbps 2 Sensitivity limit is defined as 1% bit error rate (BER). Packet length is 3 bytes. SWRA412 Page 4 of 17 Application Note AN119 Sensitivity 2.4kbps @510MHz Detailed data 510.000000 -110.5 -111 -111.5 Sensitivity [dBm] -112 -112.5 -113 -113.5 -114 -114.5 -40 2.00V Avg 3.00V Avg 3.60V Avg -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.2. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 2.4 kbps Sensitivity 38.4kbps @510MHz Detailed data 510.000000 -105 -105.5 -106 Sensitivity [dBm] -106.5 -107 -107.5 -108 -108.5 -109 -109.5 -40 2.00V Avg 3.00V Avg 3.60V Avg -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.3. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 38.4 kbps SWRA412 Page 5 of 17 Application Note AN119 4.3.2 Typical RX Performance vs. Temperature and VDD @470 MHz Sensitivity 1.2kbps @470MHz Detailed data 470.000000 -112.5 -113 -113.5 Sensitivity [dBm] -114 -114.5 -115 -115.5 2.00V Avg 3.00V Avg 3.60V Avg -116 -116.5 -117 -40 -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.4. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 1.2 kbps Sensitivity 2.4kbps @470MHz Detailed data 470.000000 -109.5 -110 -110.5 Sensitivity [dBm] -111 -111.5 -112 -112.5 -113 -113.5 -114 -40 2.00V Avg 3.00V Avg 3.60V Avg -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.5. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 2.4 kbps SWRA412 Page 6 of 17 Application Note AN119 Sensitivity 38.4kbps @470MHz Detailed data 470.000000 -104.5 -105 -105.5 Sensitivity [dBm] -106 -106.5 -107 -107.5 -108 -108.5 -40 2.00V Avg 3.00V Avg 3.60V Avg -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.6. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 38.4 kbps 4.4 Transmit Parameters TC = 25°C, VDD = 3.0 V if nothing else is stated. All parameters are measured on the CC1100E-CC1190EM 470 - 510 MHz reference design [3] with a 50 load Parameter Condition Output Power; HGM Spurious Emission nd Conducted 2 Harmonic Spurious Emission nd Conducted 3 Harmonic Typical Unit PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 22.1 20.8 20.0 18.7 17.1 15.8 14.7 12.7 dBm PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 -34 -35 -35 -36 -38 -40 -41 -44 dBm PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 -33 -35 -36 -37 -40 -41 -43 -46 dBm Table 4.4. Transmit Parameters @510MHz SWRA412 Page 7 of 17 Application Note AN119 Parameter Condition Output Power; HGM Spurious Emission nd Conducted 2 Harmonic Spurious Emission nd Conducted 3 Harmonic Typical Unit PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 21.3 19.6 18.6 17.0 15.7 14.3 13.3 11.3 dBm PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 -43 -44 -44 -46 -47 -49 -50 -53 dBm PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 -27 -29 -31 -33 -35 -37 -38 -42 dBm Typical Unit Table 4.5. Transmit Parameters @490MHz Parameter Condition Output Power; HGM PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 20.2 19.2 18.3 16.6 15.3 14.0 13.0 11.0 dBm PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 -37 -37 -39 -39 -40 -42 -43 -46 dBm PA_TABLE0 = 0x86 PA_TABLE0 = 0x8A PA_TABLE0 = 0x8C PA_TABLE0 = 0x8E PA_TABLE0 = 0x50 PA_TABLE0 = 0x40 PA_TABLE0 = 0x63 PA_TABLE0 = 0x66 -23 -27 -29 -32 -34 -36 -38 -42 dBm Spurious Emission nd Conducted 2 Harmonic Spurious Emission nd Conducted 3 Harmonic Table 4.6. Transmit Parameters @470MHz SWRA412 Page 8 of 17 Application Note AN119 4.4.1 Typical TX Performance vs. Temperature and VDD Output power @510MHz Detailed data 8C 23 22 2.00V Avg 3.00V Avg 3.60V Avg Output power [dBm] 21 20 19 18 17 16 15 -40 -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.7. Typical TX Output Power vs. Temperature and Power Supply Voltage. PA_TABLE = 0x8C @510MHz Current consumption @510MHz Detailed data 8C 260 240 2.00V Avg 3.00V Avg 3.60V Avg Current [mA] 220 200 180 160 140 120 -40 -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.8. Typical TX Current Consumption vs. Temperature and Power Supply Voltage. PA_TABLE = 0x8C @510MHz SWRA412 Page 9 of 17 Application Note AN119 Current consumption @490MHz Detailed data 8C 260 240 2.00V Avg 3.00V Avg 3.60V Avg Current [mA] 220 200 180 160 140 120 -40 -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.9. Typical Output Power vs. Temperature and Power Supply Voltage. PA_TABLE = 0x8C @490MHz Output power @490MHz Detailed data 8C 22 21 2.00V Avg 3.00V Avg 3.60V Avg Output power [dBm] 20 19 18 17 16 15 14 -40 -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.10. Typical TX Output Power vs. Temperature and Power Supply Voltage. PA_TABLE = 0x8C @490MHz SWRA412 Page 10 of 17 Application Note AN119 Output power @470MHz Detailed data 8C 22 21 2.00V Avg 3.00V Avg 3.60V Avg Output power [dBm] 20 19 18 17 16 15 14 -40 -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.11. Typical TX Output Power vs. Temperature and Power Supply Voltage. PA_TABLE = 0x8C @470MHz Current consumption @470MHz Detailed data 8C 240 220 2.00V Avg 3.00V Avg 3.60V Avg Current [mA] 200 180 160 140 120 -40 -20 0 20 40 Temperature [degC] 60 80 100 Figure 4.12. Typical Output Power vs. Temperature and Power Supply Voltage. PA_TABLE = 0x8C @470MHz SWRA412 Page 11 of 17 Application Note AN119 4.5 Measurement Equipment The following equipment was used for the measurements. Measurement Instrument Type RX Signal Generator TX Signal Analyzer RX/TX Power Supply Multimeter Instrument Model Rohde & Schwarz SMIQ 3B Rohde & Schwarz FSU26 Agilent E3631A Keithley 2000 Table 4.6. Measurement Equipment 5 Controlling the CC1190 There are three digital control pins (PA_EN, LNA_EN, and HGM) that sets the CC1190 mode of operation. PA_EN 0 0 0 1 1 LNA_EN 0 1 1 0 0 HGM X 0 1 0 1 Mode of Operation Power Down RX LGM RX HGM TX LGM TX HGM Table 5.1. CC1190 Control Logic There are different ways of controlling the CC1190 mode of operation in a CC1100E-CC1190 design. Using CC1100E GDO0/ GDO2 pins to set two of the CC1190 control signals (e.g. PA_EN and LNA_EN). The third control signal (e.g. HGM) can be hardwired to GND/VDD or connected to an external MCU. Using an external MCU to control PA_EN, LNA_EN, and HGM. Using an external MCU to set two (or all three) digital control signals is the recommended solution for a CC1100E-CC1190 design since GDO0 or GDO2 are typically programmed to provide a signal related to the CC1100E packet handler engine to the interfacing MCU and GDO1 is the same pin as the SO pin on the SPI interface. Figure 13 shows a simplified application circuit where an external MCU controls the HGM pin. LNA_EN and PA_EN may be controlled by external MCU or GDO pins on CC1100E. SWRA412 Page 12 of 17 Application Note AN119 Figure 13: Simplified application circuit SWRA412 Page 13 of 17 Application Note AN119 6 SmartRF Studio and SmartRF04EB The CC1100E-CC1190 470-510 MHz board together with SmartRF™ Studio 7 software [4] and SmartRF04EB can be used to evaluate performance and functionality. 6.1 SmartRF Studio The CC1100E-CC1190 can be configured using the SmartRF Studio 7 software [4]. The SmartRF Studio software is highly recommended for obtaining optimum register settings. SmartRF Studio has not implemented direct support for the CC1100E-CC1190 board. For testing, the PA_EN and LNA_EN on CC1190 have to be controlled by GDO2 and GDO0 or they can be hardwired. 6.2 SmartRF04EB If the SmartRF04EB is connected to a USB socket on a PC, it will draw power from the USB bus when the switch is in the position shown in Figure 6.1. The onboard voltage regulator supplies 3.3 V to the board, but has limited current source capability and cannot supply the CC1100E-CC1190 board. An external supply is therefore needed and shall be connected as shown in Figure 6.1, where the red wire is the positive supply and the black wire is GND. With the test setup in Figure 6.1 the SmartRF04EB is connected to a 3.3 V supply through the USB and voltage regulator and CC1100E-CC1190 is powered by the external supply. Since the SmartRF04EB is connected to a regulated 3.3 V supply the signals going from CC1100ECC1190 to SmartRF04EB (and vice versa) need to be within 3.0 V to 3.6 V. The external supply connected to CC1100E-CC1190 when using the test setup in Figure 6.1 is therefore limited to 3.0 V to 3.6 V. Figure 6.1. SmartRF04EB Connection 7 Reference Design The CC1100E-CC1190EM 470 - 510 MHz reference design includes schematic and gerber files [3]. It is highly recommended to follow the reference design for optimum performance. The reference design also includes bill of materials with manufacturers and part numbers. The schematic is shown in Appendix – CC1100E-CC1190EM 470-510 MHz Schematic 7.1 Power Decoupling Proper power supply decoupling must be used for optimum performance. The capacitors C33, C34 and C36 ensure good RF ground after L26 and thus prevent RF leakage into the power supply lines causing oscillations. The power supply filtering consisting of C5, C6 and L3 ensure well defined impedance looking towards the power supply. 7.2 Input/ Output Matching and Filtering The PA and the LNA of the CC1190 are single ended input/output. A balun is required to transform the differential LNA input of the CC1100E to single ended output of the CC1190 PA. The values of the matching components between the C127 and the CC1190 PA input are SWRA412 Page 14 of 17 Application Note AN119 chosen to present optimum source impedance to the CC1190 PA input with respect to stability. The PA_IN and the LNA_out require different impedances provided by C113, C111, C101 The CC1190 PA performance is highly dependent on the impedance presented at the output, and the LNA performance is highly dependent on the impedance presented at the input. The impedance is defined by L26 and all components towards the antenna. These components also ensure the required filtering of harmonics to pass regulatory requirements. The layout and component values need to be copied exactly to obtain the same performance as presented in this application note. 7.3 Bias Resistor R142 is a bias resistor. The bias resistor is used to set an accurate bias current for internal use in the CC1190. 7.4 PCB Layout Considerations The Texas Instruments reference design uses a 1.6 mm (0.062”) 4-layer PCB solution. Note that the different layers have different thickness. It is recommended to follow the recommendation given in the CC1100E-CC1190EM 470 - 510 MHz reference design [3] to ensure optimum performance. The top layer is used for components and signal routing, and the open areas are filled with metallization connected to ground using several vias. The areas under the two chips are used for grounding and must be well connected to the ground plane with multiple vias. Footprint recommendation for the CC1190 is given in the CC1190 datasheet [2]. Layer two is a complete ground plane and is not used for any routing. This is done to ensure short return current paths. The low impedance of the ground plane prevents any unwanted signal coupling between any of the nodes that are decoupled to it. Layer three is a power plane. The power plane ensures low impedance traces at radio frequencies and prevents unwanted radiation from power traces. Two different power planes for CC1100E and CC1190 are used and they are surrounded by ground to reduce unwanted radiation from the board. Layer four is used for routing, and as for layer one, open areas are filled with metallization connected to ground using several vias. SWRA412 Page 15 of 17 Application Note AN119 8 Disclaimer The CC1100E-CC1190EM evaluation board is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards. It is the end user's responsibility to ensure that his system complies with applicable regulations. 9 References [1] CC1100E Datasheet (cc1100E) [2] CC1190 Datasheet (SWRS089.pdf) [3] CC1100E–CC1190EM 470 – 510 MHz Reference Design (swrr108) ™ [4] SmartRF Studio 7 (SWRC176.zip) 10 General Information 10.1 Document History Revision SWRA412 Date 2012.10.02 Description/Changes Initial release. SWRA412 Page 16 of 17 Application Note AN119 11 Appendix – CC1100E-CC1190EM 470-510 MHz Schematic Figure 11.1. 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