AN119 – Using CC1190 Front End with

Application Note AN119
Using the CC1190 Front End with CC1100E in the 470 MHz510 MHz band
By Torstein Ermesjø
Keywords
Range Extender
External PA
External LNA
1
CC1100E
Introduction
The CC1100E is a sub-GHz, high
performance radio transceiver designed
for very low power RF applications. It is
intended for the Industrial, Scientific and
Medical (ISM) and Short Range Device
(SRD) frequency bands at 470-510 MHz
and 950-960 MHz. The CC1100E is
especially suited for wireless applications
targeted at the Japanese ARIB STD-T96
and the Chinese Short Range Device
Regulations at 470-510 MHz.
The CC1190 is a range extender for RF
transceivers, transmitters, and System-onChip devices from Texas Instruments. It
increases the link budget by providing a
power amplifier (PA) for increased output
power, and a low-noise amplifier (LNA)
with low noise figure for improved receiver
sensitivity in addition to switches and RF
matching for simple design of high
performance wireless systems.
This application note outlines the expected
performance when using a CC1100ECC1190 design in the 470-510 MHz
frequency band used in China. The
maximum allowed output power in the
470-510 MHz band is +17 dBm (50 mW),
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Table of Contents
KEYWORDS.............................................................................................................................. 1
1
INTRODUCTION ............................................................................................................. 1
2
ABBREVIATIONS ........................................................................................................... 2
3
ABSOLUTE MAXIMUM RATINGS ................................................................................. 3
4
ELECTRICAL SPECIFICATIONS ................................................................................... 3
4.1
OPERATING CONDITIONS............................................................................................ 3
4.2
CURRENT CONSUMPTION ........................................................................................... 3
4.3
RECEIVE PARAMETERS .............................................................................................. 4
4.3.1
Typical RX Performance vs. Temperature and VDD @510 MHz .................................... 4
4.3.2
Typical RX Performance vs. Temperature and VDD @470 MHz .................................... 6
4.4
TRANSMIT PARAMETERS ............................................................................................ 7
4.4.1
Typical TX Performance vs. Temperature and VDD ........................................................ 9
4.5
MEASUREMENT EQUIPMENT ..................................................................................... 12
5
CONTROLLING THE CC1190...................................................................................... 12
6
SMARTRF STUDIO AND SMARTRF04EB .................................................................. 14
6.1
SMARTRF STUDIO ................................................................................................... 14
6.2
SMARTRF04EB ....................................................................................................... 14
7
REFERENCE DESIGN.................................................................................................. 14
7.1
POWER DECOUPLING ............................................................................................... 14
7.2
INPUT/ OUTPUT MATCHING AND FILTERING ............................................................... 14
7.3
BIAS RESISTOR........................................................................................................ 15
7.4
PCB LAYOUT CONSIDERATIONS ............................................................................... 15
8
DISCLAIMER ................................................................................................................ 16
9
REFERENCES .............................................................................................................. 16
10
GENERAL INFORMATION ........................................................................................... 16
10.1
DOCUMENT HISTORY ............................................................................................... 16
11
APPENDIX – CC1100E-CC1190EM 470-510 MHZ SCHEMATIC ............................... 17
2
Abbreviations
EB
EM
HGM
LNA
LGM
PA
PCB
PER
RF
RSSI
RX
TrxEB
TX
Evaluation Board
Evaluation Modul
High Gain Mode
Low Noise Amplifier
Low Gain Mode
Power Amplifier
Printed Circuit Board
Packet Error Rate
Radio Frequency
Receive Signal Strength Indicator
Receive, Receive Mode
SmartRF Transceiver EB
Transmit, Transmit Mode
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Application Note AN119
3
Absolute Maximum Ratings
The absolute maximum ratings and operating conditions listed in the CC1100E datasheet [1]
and the CC1190 datasheet [2] must be followed at all times. Stress exceeding one or more of
these limiting values may cause permanent damage to any of the devices.
4
Electrical Specifications
Note that the characteristics in Chapter 4 are only valid when using the CC1100E-CC1190EM
470-510 MHz reference design [3] and register settings recommended by the SmartRF Studio
software [4].
4.1
Operating Conditions
Parameter
Min
Max
Unit
Operating Frequency
Operating Supply Voltage
Operating Temperature
470
2.0
-40
510
3.6
+85
MHz
V
°C
Table 4.1. Operating Conditions
4.2
Current Consumption
TC = 25°C, VDD = 3.0 V if nothing else is stated. All parameters are measured on the
CC1100E-CC1190EM 470 - 510 MHz reference design [3] with a 50 load.
Parameter
Condition
Typical
Unit
Receive Current, HGM
1.2 kbps, 2GFSK, ±5.2 kHz
deviation
18.1
mA
Transmit Current
@ 470 MHz
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
216
185
168
145
130
116
108
95
mA
Transmit Current
@ 510 MHz
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
236
206
191
169
147
131
121
105
mA
370
nA
1
Power Down Current
Table 4.2. Current Consumption
1
Input signal at -80 dBm
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4.3
Receive Parameters
TC = 25°C, VDD = 3.0 V, if nothing else is stated. All parameters are measured on the
CC1100E-CC1190EM 470-510 MHz reference design [3] with a 50 load.
Parameter
Condition
2
Sensitivity , HGM
@470 MHz
2
Sensitivity , HGM
@510 MHz
Typical
Unit
1.2 kbps, 2GSK, ±5.2 kHz deviation, 58 kHz RX filter
bandwidth. See Figure 4.4
-115
dBm
2.4 kbps, 2GFSK, ±5.2 kHz deviation, 58 kHz RX filter
bandwidth @470 MHz. See Figure 4.5
-113
dBm
38.4 kbps, 2GFSK, ±20 kHz deviation, 100 kHz RX filter
bandwidth. See Figure 4.6
-107
dBm
1.2 kbps, 2GSK, ±5.2 kHz deviation, 58 kHz RX filter
bandwidth. See Figure 4.1
-116
dBm
2.4 kbps, 2GFSK, ±5.2 kHz deviation, 58 kHz RX filter
bandwidth. See Figure 4.2
-113
dBm
38.4 kbps, 2GFSK, ±20 kHz deviation, 100 kHz RX filter
bandwidth. See Figure 4.3
-108
dBm
Table 4.3. Receive Parameters
4.3.1
Typical RX Performance vs. Temperature and VDD @510 MHz
Sensitivity 1.2kbps @510MHz Detailed data 510.000000
-113.5
-114
-114.5
Sensitivity [dBm]
-115
-115.5
-116
-116.5
-117
-117.5
-40
2.00V Avg
3.00V Avg
3.60V Avg
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.1. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 1.2 kbps
2
Sensitivity limit is defined as 1% bit error rate (BER). Packet length is 3 bytes.
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Sensitivity 2.4kbps @510MHz Detailed data 510.000000
-110.5
-111
-111.5
Sensitivity [dBm]
-112
-112.5
-113
-113.5
-114
-114.5
-40
2.00V Avg
3.00V Avg
3.60V Avg
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.2. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 2.4 kbps
Sensitivity 38.4kbps @510MHz Detailed data 510.000000
-105
-105.5
-106
Sensitivity [dBm]
-106.5
-107
-107.5
-108
-108.5
-109
-109.5
-40
2.00V Avg
3.00V Avg
3.60V Avg
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.3. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 38.4
kbps
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4.3.2
Typical RX Performance vs. Temperature and VDD @470 MHz
Sensitivity 1.2kbps @470MHz Detailed data 470.000000
-112.5
-113
-113.5
Sensitivity [dBm]
-114
-114.5
-115
-115.5
2.00V Avg
3.00V Avg
3.60V Avg
-116
-116.5
-117
-40
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.4. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 1.2 kbps
Sensitivity 2.4kbps @470MHz Detailed data 470.000000
-109.5
-110
-110.5
Sensitivity [dBm]
-111
-111.5
-112
-112.5
-113
-113.5
-114
-40
2.00V Avg
3.00V Avg
3.60V Avg
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.5. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 2.4 kbps
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Sensitivity 38.4kbps @470MHz Detailed data 470.000000
-104.5
-105
-105.5
Sensitivity [dBm]
-106
-106.5
-107
-107.5
-108
-108.5
-40
2.00V Avg
3.00V Avg
3.60V Avg
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.6. Typical Sensitivity vs. Temperature and Power Supply Voltage, HGM, 38.4
kbps
4.4
Transmit Parameters
TC = 25°C, VDD = 3.0 V if nothing else is stated. All parameters are measured on the
CC1100E-CC1190EM 470 - 510 MHz reference design [3] with a 50 load
Parameter
Condition
Output Power; HGM
Spurious Emission
nd
Conducted 2 Harmonic
Spurious Emission
nd
Conducted 3 Harmonic
Typical
Unit
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
22.1
20.8
20.0
18.7
17.1
15.8
14.7
12.7
dBm
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
-34
-35
-35
-36
-38
-40
-41
-44
dBm
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
-33
-35
-36
-37
-40
-41
-43
-46
dBm
Table 4.4. Transmit Parameters @510MHz
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Parameter
Condition
Output Power; HGM
Spurious Emission
nd
Conducted 2 Harmonic
Spurious Emission
nd
Conducted 3 Harmonic
Typical
Unit
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
21.3
19.6
18.6
17.0
15.7
14.3
13.3
11.3
dBm
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
-43
-44
-44
-46
-47
-49
-50
-53
dBm
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
-27
-29
-31
-33
-35
-37
-38
-42
dBm
Typical
Unit
Table 4.5. Transmit Parameters @490MHz
Parameter
Condition
Output Power; HGM
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
20.2
19.2
18.3
16.6
15.3
14.0
13.0
11.0
dBm
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
-37
-37
-39
-39
-40
-42
-43
-46
dBm
PA_TABLE0 = 0x86
PA_TABLE0 = 0x8A
PA_TABLE0 = 0x8C
PA_TABLE0 = 0x8E
PA_TABLE0 = 0x50
PA_TABLE0 = 0x40
PA_TABLE0 = 0x63
PA_TABLE0 = 0x66
-23
-27
-29
-32
-34
-36
-38
-42
dBm
Spurious Emission
nd
Conducted 2 Harmonic
Spurious Emission
nd
Conducted 3 Harmonic
Table 4.6. Transmit Parameters @470MHz
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4.4.1
Typical TX Performance vs. Temperature and VDD
Output power @510MHz Detailed data 8C
23
22
2.00V Avg
3.00V Avg
3.60V Avg
Output power [dBm]
21
20
19
18
17
16
15
-40
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.7. Typical TX Output Power vs. Temperature and Power Supply Voltage.
PA_TABLE = 0x8C @510MHz
Current consumption @510MHz Detailed data 8C
260
240
2.00V Avg
3.00V Avg
3.60V Avg
Current [mA]
220
200
180
160
140
120
-40
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.8. Typical TX Current Consumption vs. Temperature and Power Supply Voltage.
PA_TABLE = 0x8C @510MHz
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Current consumption @490MHz Detailed data 8C
260
240
2.00V Avg
3.00V Avg
3.60V Avg
Current [mA]
220
200
180
160
140
120
-40
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.9. Typical Output Power vs. Temperature and Power Supply Voltage. PA_TABLE
= 0x8C @490MHz
Output power @490MHz Detailed data 8C
22
21
2.00V Avg
3.00V Avg
3.60V Avg
Output power [dBm]
20
19
18
17
16
15
14
-40
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.10. Typical TX Output Power vs. Temperature and Power Supply Voltage.
PA_TABLE = 0x8C @490MHz
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Application Note AN119
Output power @470MHz Detailed data 8C
22
21
2.00V Avg
3.00V Avg
3.60V Avg
Output power [dBm]
20
19
18
17
16
15
14
-40
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.11. Typical TX Output Power vs. Temperature and Power Supply Voltage.
PA_TABLE = 0x8C @470MHz
Current consumption @470MHz Detailed data 8C
240
220
2.00V Avg
3.00V Avg
3.60V Avg
Current [mA]
200
180
160
140
120
-40
-20
0
20
40
Temperature [degC]
60
80
100
Figure 4.12. Typical Output Power vs. Temperature and Power Supply Voltage.
PA_TABLE = 0x8C @470MHz
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4.5
Measurement Equipment
The following equipment was used for the measurements.
Measurement
Instrument Type
RX
Signal Generator
TX
Signal Analyzer
RX/TX
Power Supply
Multimeter
Instrument Model
Rohde & Schwarz
SMIQ 3B
Rohde & Schwarz
FSU26
Agilent E3631A
Keithley 2000
Table 4.6. Measurement Equipment
5
Controlling the CC1190
There are three digital control pins (PA_EN, LNA_EN, and HGM) that sets the CC1190 mode
of operation.
PA_EN
0
0
0
1
1
LNA_EN
0
1
1
0
0
HGM
X
0
1
0
1
Mode of Operation
Power Down
RX LGM
RX HGM
TX LGM
TX HGM
Table 5.1. CC1190 Control Logic
There are different ways of controlling the CC1190 mode of operation in a CC1100E-CC1190
design.
Using CC1100E GDO0/ GDO2 pins to set two of the CC1190 control signals (e.g.
PA_EN and LNA_EN). The third control signal (e.g. HGM) can be hardwired to
GND/VDD or connected to an external MCU.
Using an external MCU to control PA_EN, LNA_EN, and HGM.
Using an external MCU to set two (or all three) digital control signals is the recommended
solution for a CC1100E-CC1190 design since GDO0 or GDO2 are typically programmed to
provide a signal related to the CC1100E packet handler engine to the interfacing MCU and
GDO1 is the same pin as the SO pin on the SPI interface. Figure 13 shows a simplified
application circuit where an external MCU controls the HGM pin. LNA_EN and PA_EN may be
controlled by external MCU or GDO pins on CC1100E.
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Application Note AN119
Figure 13: Simplified application circuit
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6
SmartRF Studio and SmartRF04EB
The CC1100E-CC1190 470-510 MHz board together with SmartRF™ Studio 7 software [4]
and SmartRF04EB can be used to evaluate performance and functionality.
6.1
SmartRF Studio
The CC1100E-CC1190 can be configured using the SmartRF Studio 7 software [4]. The
SmartRF Studio software is highly recommended for obtaining optimum register settings.
SmartRF Studio has not implemented direct support for the CC1100E-CC1190 board. For
testing, the PA_EN and LNA_EN on CC1190 have to be controlled by GDO2 and GDO0 or
they can be hardwired.
6.2
SmartRF04EB
If the SmartRF04EB is connected to a USB socket on a PC, it will draw power from the USB
bus when the switch is in the position shown in Figure 6.1. The onboard voltage regulator
supplies 3.3 V to the board, but has limited current source capability and cannot supply the
CC1100E-CC1190 board. An external supply is therefore needed and shall be connected as
shown in Figure 6.1, where the red wire is the positive supply and the black wire is GND. With
the test setup in Figure 6.1 the SmartRF04EB is connected to a 3.3 V supply through the USB
and voltage regulator and CC1100E-CC1190 is powered by the external supply. Since the
SmartRF04EB is connected to a regulated 3.3 V supply the signals going from CC1100ECC1190 to SmartRF04EB (and vice versa) need to be within 3.0 V to 3.6 V. The external
supply connected to CC1100E-CC1190 when using the test setup in Figure 6.1 is therefore
limited to 3.0 V to 3.6 V.
Figure 6.1. SmartRF04EB Connection
7
Reference Design
The CC1100E-CC1190EM 470 - 510 MHz reference design includes schematic and gerber
files [3]. It is highly recommended to follow the reference design for optimum performance.
The reference design also includes bill of materials with manufacturers and part numbers. The
schematic is shown in Appendix – CC1100E-CC1190EM 470-510 MHz Schematic
7.1
Power Decoupling
Proper power supply decoupling must be used for optimum performance. The capacitors C33,
C34 and C36 ensure good RF ground after L26 and thus prevent RF leakage into the power
supply lines causing oscillations. The power supply filtering consisting of C5, C6 and L3
ensure well defined impedance looking towards the power supply.
7.2
Input/ Output Matching and Filtering
The PA and the LNA of the CC1190 are single ended input/output. A balun is required to
transform the differential LNA input of the CC1100E to single ended output of the CC1190 PA.
The values of the matching components between the C127 and the CC1190 PA input are
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Application Note AN119
chosen to present optimum source impedance to the CC1190 PA input with respect to
stability. The PA_IN and the LNA_out require different impedances provided by C113, C111,
C101
The CC1190 PA performance is highly dependent on the impedance presented at the output,
and the LNA performance is highly dependent on the impedance presented at the input. The
impedance is defined by L26 and all components towards the antenna. These components
also ensure the required filtering of harmonics to pass regulatory requirements.
The layout and component values need to be copied exactly to obtain the same performance
as presented in this application note.
7.3
Bias Resistor
R142 is a bias resistor. The bias resistor is used to set an accurate bias current for internal
use in the CC1190.
7.4
PCB Layout Considerations
The Texas Instruments reference design uses a 1.6 mm (0.062”) 4-layer PCB solution. Note
that the different layers have different thickness. It is recommended to follow the
recommendation given in the CC1100E-CC1190EM 470 - 510 MHz reference design [3] to
ensure optimum performance.
The top layer is used for components and signal routing, and the open areas are filled with
metallization connected to ground using several vias. The areas under the two chips are used
for grounding and must be well connected to the ground plane with multiple vias. Footprint
recommendation for the CC1190 is given in the CC1190 datasheet [2].
Layer two is a complete ground plane and is not used for any routing. This is done to ensure
short return current paths. The low impedance of the ground plane prevents any unwanted
signal coupling between any of the nodes that are decoupled to it.
Layer three is a power plane. The power plane ensures low impedance traces at radio
frequencies and prevents unwanted radiation from power traces. Two different power planes
for CC1100E and CC1190 are used and they are surrounded by ground to reduce unwanted
radiation from the board.
Layer four is used for routing, and as for layer one, open areas are filled with metallization
connected to ground using several vias.
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Application Note AN119
8
Disclaimer
The CC1100E-CC1190EM evaluation board is intended for use for ENGINEERING
DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not
considered by TI to be a finished end-product fit for general consumer use. Persons handling
the product(s) must have electronics training and observe good engineering practice
standards. As such, the goods being provided are not intended to be complete in terms of
required design-, marketing-, and/or manufacturing-related protective considerations,
including product safety and environmental measures typically found in end products that
incorporate such semiconductor components or circuit boards. It is the end user's
responsibility to ensure that his system complies with applicable regulations.
9
References
[1] CC1100E Datasheet (cc1100E)
[2] CC1190 Datasheet (SWRS089.pdf)
[3] CC1100E–CC1190EM 470 – 510 MHz Reference Design (swrr108)
™
[4] SmartRF Studio 7 (SWRC176.zip)
10 General Information
10.1 Document History
Revision
SWRA412
Date
2012.10.02
Description/Changes
Initial release.
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Application Note AN119
11 Appendix – CC1100E-CC1190EM 470-510 MHz Schematic
Figure 11.1. CC1100E-CC1190EM 470-510 MHz Schematic
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Computers and Peripherals
www.ti.com/computers
DLP® Products
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Logic
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Microcontrollers
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Video and Imaging
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RFID
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