CYStech Electronics Corp. Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 1/12 N- AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET MTC4501Q8 Description The MTC4501Q8 consists of a N-channel and a P-channel enhancement-mode MOSFET in a single SOP-8 package, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SOP-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Features • Simple drive requirement • Low on-resistance • Fast switching speed • Pb-free lead plating package Applications • Power management in notebook computer, portable equipment and battery powered systems. Equivalent Circuit MTC4501Q8 Outline SOP-8 G：Gate S：Source D：Drain MTC4501Q8 CYStek Product Specification Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 2/12 CYStech Electronics Corp. Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Drain-Source Breakdown Voltage Gate-Source Voltage Continuous Drain Current @TA=25 °C Continuous Drain Current @TA=70 °C Pulsed Drain Current (Note 2) BVDSS VGS ID ID IDM Pd (Note 1) (Note 1) Total Power Dissipation (Note 1) Linear Derating Factor Operating Junction Temperature Storage Temperature Thermal Resistance, Junction-to-Ambient (Note 1) Tj Tstg Rth,ja Limits N-channel P-channel 30 ±20 7 5.8 20 -30 ±16 -5.3 -4.7 -20 2 0.016 -55~+150 -55~+150 62.5 Unit V V A A A W W / °C °C °C °C/W Note : 1.Surface mounted on 1 in² copper pad of FR-4 board, 135°C/W when mounted on minimum copper pad 2.Pulse width limited by maximum junction temperature N-Channel Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Static BVDSS ∆BVDSS/∆Tj VGS(th) IGSS IDSS IDSS *RDS(ON) Min. Typ. Max. Unit 30 1.0 - 0.02 13 3.0 ±100 1 25 28 42 - V V/°C V nA μA μA 645 150 95 6 5.2 18.8 4.4 8.4 2.1 4.7 - - 1.2 1.67 *GFS Dynamic Ciss Coss Crss *td(ON) *tr *td(OFF) *tf *Qg *Qgs *Qgd Source-Drain Diode *VSD *IS - Test Conditions S VGS=0, ID=250μA Reference to 25°C, ID=1mA VDS=VGS, ID=250μA VGS=±20V, VDS=0 VDS=30V, VGS=0 VDS=24V, VGS=0, Tj=70°C ID=7A, VGS=10V ID=5A, VGS=4.5V VDS=10V, ID=7A pF VDS=25V, VGS=0, f=1MHz ns VDS=15V, ID=1A, VGS=10V, RG=3.3Ω, RD=15Ω nC VDS=24V, ID=7A, VGS=4.5V V A VGS=0V, IS=7A VD=VG=0V, VS=1.2V mΩ *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MTC4501Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 3/12 P-Channel Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Static BVDSS ∆BVDSS/∆Tj VGS(th) IGSS IDSS IDSS *RDS(ON) Min. Typ. Max. Unit -30 -1.0 - -0.028 8.5 -3.0 ±100 -1 -25 50 90 - V V/°C V nA μA μA 790 440 120 12 20 45 27 20 3.5 2 - ns ns ns ns nC nC nC - -1.2 -1.67 V A *GFS Dynamic Ciss Coss Crss *td(ON) *tr *td(OFF) *tf *Qg *Qgs *Qgd Source-Drain Diode *VSD *IS - Test Conditions S VGS=0, ID=-250μA Reference to 25°C, ID=-1mA VDS=VGS, ID=-250μA VGS=±16V, VDS=0 VDS=-30V, VGS=0 VDS=-24V, VGS=0, Tj=70°C ID=-5.3A, VGS=-10V ID=-4.2A, VGS=-4.5V VDS=-10V, ID=-5.3A pF VDS=-15V, VGS=0, f=1MHz mΩ VDS=-15V, ID=-1A, VGS=-10V, RG=6Ω, RD=15Ω VDS=-15V, ID=-5.3A, VGS=-10V VGS=0V, IS=-2.6A VD=VG=0V, VS=-1.2V *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Ordering Information Device MTC4501Q8 MTC4501Q8 Package SOP-8 (Pb-free lead plating package) Shipping Marking 3000 pcs / Tape & Reel 4501SS CYStek Product Specification CYStech Electronics Corp. Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 4/12 N-channel Characteristic Curves MTC4501Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 5/12 N-channel Characteristic Curves(Cont.) MTC4501Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 6/12 N-channel Characteristic Curves(Cont.) MTC4501Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 7/12 P-channel Characteristic Curves MTC4501Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 8/12 P-channel Characteristic Curves(Cont.) MTC4501Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 9/12 P-channel Characteristic Curves(Cont.) MTC4501Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 10/12 Reel Dimension Carrier Tape Dimension MTC4501Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 11/12 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTC4501Q8 CYStek Product Specification Spec. No. : C385Q8 Issued Date : 2007.06.13 Revised Date : 2011.03.18 Page No. : 12/12 CYStech Electronics Corp. SOP-8 Dimension Right side View G Top View A I C B Marking: Device Name 4501SS Date Code □□□□ H J E D K Front View Part A Part A M L 8-Lead SOP-8 Plastic Package CYStek Package Code: Q8 N O F *: Typical Inches Min. Max. 0.1890 0.2007 0.1496 0.1654 0.2283 0.2441 0.0480 0.0519 0.0138 0.0193 0.1472 0.1527 0.0531 0.0689 0.1889 0.2007 DIM A B C D E F G H Millimeters Min. Max. 4.80 5.10 3.80 4.20 5.80 6.20 1.22 1.32 0.35 0.49 3.74 3.88 1.35 1.75 4.80 5.10 DIM I J K L M N O Inches Min. Max. 0.0098 REF 0.0118 0.0354 0.0074 0.0098 0.0145 0.0204 0.0118 0.0197 0.0031 0.0051 0.0000 0.0059 Millimeters Min. Max. 0.25 REF 0.30 0.90 0.19 0.25 0.37 0.52 0.30 0.50 0.08 0.13 0.00 0.15 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTC4501Q8 CYStek Product Specification