CYStech Electronics Corp. Spec. No. : C391Q8-A Issued Date : 2008.07.17 Revised Date : Page No. : 1/7 P-CHANNEL ENHANCEMENT MODE POWER MOSFET MEP4435Q8 Description The MEP4435Q8 is a P-channel enhancement-mode MOSFET, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. The SOP-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Features • RDS(ON)=20mΩ@VGS=-10V, ID=-10A RDS(ON)=35mΩ@VGS=-5V, ID=-7A • Simple drive requirement • Low on-resistance • Fast switching speed • Pb-free package Equivalent Circuit MEP4435Q8 Outline SOP-8 G：Gate S：Source D：Drain MEP4435Q8 CYStek Product Specification Spec. No. : C391Q8-A Issued Date : 2008.07.17 Revised Date : Page No. : 2/7 CYStech Electronics Corp. Absolute Maximum Ratings (Ta=25°C) Parameter Drain-Source Breakdown Voltage Gate-Source Voltage Continuous Drain Current @TA=25 °C Continuous Drain Current @TA=100 °C Pulsed Drain Current (Note 1) Total Power Dissipation @ TA=25 °C (Note 2) Linear Derating Factor Operating Junction Temperature Storage Temperature Thermal Resistance, Junction-to-Ambient (Note 2) Symbol Limits Unit BVDSS VGS ID ID IDM Pd -30 ±25 -10 -8 -40 2.5 0.02 -55~+150 -55~+150 50 V V A A A W W / °C °C °C °C/W Tj Tstg Rth,j-a Note : 1.Pulse width limited by maximum junction temperature. 2. Surface mounted on 1 in² copper pad of FR-4 board; 125 °C/W when mounted on minimum copper pad Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS ΔVDSS/ΔTj VGS(th) IGSS IDSS IDSS ID(ON) *RDS(ON) *GFS Dynamic Ciss Coss Crss td(ON) tr td(OFF) tf Qg Qgs Qgd Rg MEP4435Q8 -30 -1 40 - -0.037 15 25 24 -3 ±100 -1 -10 20 35 - - 2815 1060 955 12 10 35 7 25 7 9 4 - V V/°C V nA μA μA A S VGS=0, ID=-250μA Reference to 25°C, ID=-1mA VDS=VGS, ID=-250μA VGS=±25V, VDS=0 VDS=-24V, VGS=0 VDS=-20V, VGS=0, Tj=125°C VDS=-5V, VGS=-10V ID=-10A, VGS=-10V ID=-7A, VGS=-5V VDS=-5V, ID=-10A pF VDS=-15V, VGS=0, f=1MHz ns VDD=-15V, ID=-1A, VGS=-10V, RG=2.7Ω nC VDS=-15V, ID=-10A, VGS=-10V, Ω VGS=15mV, VDS=0, f=1MHz mΩ CYStek Product Specification CYStech Electronics Corp. Spec. No. : C391Q8-A Issued Date : 2008.07.17 Revised Date : Page No. : 3/7 Electrical Characteristics(Cont.) (Tj=25°C, unless otherwise specified) Symbol Min. Source-Drain Diode IS ISM *VSD *trr *Qrr - Typ. Max. 32 26 -3 -12 -1.3 - Unit A V ns nC Test Conditions VD=VG=0, VS=-1.2V VGS=0V, ISD=-2.1A IF=IS, VGS=0V IF=IS, dIF/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MEP4435Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C391Q8-A Issued Date : 2008.07.17 Revised Date : Page No. : 4/7 Characteristic Curves MEP4435Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C391Q8-A Issued Date : 2008.07.17 Revised Date : Page No. : 5/7 Characteristic Curves(Cont.) MEP4435Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C391Q8-A Issued Date : 2008.07.17 Revised Date : Page No. : 6/7 Characteristic Curves(Cont.) MEP4435Q8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C391Q8-A Issued Date : 2008.07.17 Revised Date : Page No. : 7/7 SOP-8 Dimension Right side View G Top View A Marking: 4435SC □□□□ I Date Code C B H J E D K Front View Part A Part A M L 8-Lead SOP-8 Plastic Package CYStek Package Code: Q8 N O F *: Typical Inches Min. Max. 0.1909 0.2007 0.1515 0.1555 0.2283 0.2441 0.0480 0.0519 0.0145 0.0185 0.1472 0.1527 0.0570 0.0649 0.1889 0.2007 DIM A B C D E F G H Millimeters Min. Max. 4.85 5.10 3.85 3.95 5.80 6.20 1.22 1.32 0.37 0.47 3.74 3.88 1.45 1.65 4.80 5.10 DIM I J K L M N O Inches Min. Max. 0.0019 0.0078 0.0118 0.0275 0.0074 0.0098 0.0145 0.0204 0.0118 0.0197 0.0031 0.0051 0.0000 0.0059 Millimeters Min. Max. 0.05 0.20 0.30 0.70 0.19 0.25 0.37 0.52 0.30 0.50 0.08 0.13 0.00 0.15 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Tin plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MEP4435Q8 CYStek Product Specification