BTP2907SL3

Spec. No. : C824L3
Issued Date : 2003.07.31
Revised Date :2013.11.12
Page No. : 1/7
CYStech Electronics Corp.
Low VCE(sat) PNP Epitaxial Planar Transistor
BTP2907SL3
Features
• Excellent DC current gain characteristics
• Low Saturation Voltage
VCE(sat)=-0.5V(max) (IC=-1A, IB=-100mA).
• Pb-free lead plating and halogen-free package
Symbol
Outline
BTP2907SL3
SOT-223
C
E
B：Base
C：Collector
E：Emitter
C
B
Ordering Information
Device
BTP2907SL3-0-T3-G
Package
SOT-223
(Pb-free lead plating and halogen-free package)
Shipping
2500 pcs / tape & reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T3 : 2500 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
BTP2907SL3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C824L3
Issued Date : 2003.07.31
Revised Date :2013.11.12
Page No. : 2/7
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limits
Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
VCBO
VCEO
VEBO
-100
-80
-6
V
V
V
Collector Current(DC)
Collector Current(Pulsed) (Note 1)
Power Dissipation @ TC=25℃
Junction Temperature
Storage Temperature
IC
ICP
Pd
Tj
Tstg
-1
-2 (Note)
2
150
-55~+150
A
W
°C
°C
Note : Single pulse, Pw≤10ms, Duty Cycle≤30%.
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*hFE
fT
Cob
Min.
-100
-80
-5
180
-
Typ.
125
10
Max.
-100
-100
-0.5
390
20
Unit
V
V
V
nA
nA
V
MHz
pF
Test Conditions
IC=-50μA
IC=-1mA
IE=-50μA
VCB=-80V
VEB=-6V
IC=-1A, IB=-100mA
VCE=-2V, IC=-100mA
VCE=-10V, IC=-50mA, f=100MHz
VCB=-10V, IE=0A, f=1MHz
*Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%
Recommended soldering footprint
BTP2907SL3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C824L3
Issued Date : 2003.07.31
Revised Date :2013.11.12
Page No. : 3/7
Typical Characteristics
Emitter Grounded Output Characteristics
Emitter Grounded Output Characteristics
0.8
0.25
5mA
0.7
0.2
-IC , Collector Current(A)
-IC , Collector Current(A)
1mA
0.15
500uA
400uA
0.1
300uA
0.05
200uA
0.6
2.5mA
0.5
2mA
0.4
1.5mA
0.3
1mA
0.2
-IB=500uA
0.1
-IB=100uA
0
0
0
1
2
3
4
5
-VCE , Collector-to-Emitter Voltage(V)
0
6
1000
HFE, Current Gain
1000
HFE, Current Gain
6
Current Gain vs Collector Current
Current Gain vs Collector Current
Ta=125°C
Ta= 75°C
Ta= 25°C
Ta= -25°C
100
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
-VCE =2V
-VCE =1V
10
10
1
10
100
-IC , Collector Current(mA)
1
1000
Current Gain vs Collector Current
10
100
-IC , Collector Current(mA)
1000
Saturation Voltage vs Collector Current
1000
-VCE(SAT), Saturation Voltage(mV)
1000
-VCE =5V
HFE, Current Gain
1
2
3
4
5
-VCE , Collector-to-Emitter Voltage(V)
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
10
VCESAT @IC=10IB
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
10
1
BTP2907SL3
10
100
-IC , Collector Current(mA)
1000
1
10
100
-IC, Collector Current(mA)
1000
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C824L3
Issued Date : 2003.07.31
Revised Date :2013.11.12
Page No. : 4/7
Typical Characteristics(Cont.)
Saturation Voltage vs Collector Current
Saturation Voltage vs Collector Current
10000
-VCES(SAT), Saturation Voltage(mV)
-VCE(SAT), Saturation Voltage(mV)
1000
VCE(SAT) @IC=20IB
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
VCE(SAT) @IC=50IB
1000
100
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
10
10
1
10
100
-IC , Collector Current(mA)
1
1000
10000
1000
VBE(SAT) @IC=10IB
-VBE(ON), On Voltage(mV)
-VCE(SAT), Saturation Voltage(mV)
1000
On Voltage vs Collector Current
Saturation Voltage vs Collector Current
1000
Ta=-25°C
Ta=25°C
Ta=75°C
Ta=125°C
Ta=-25°C
Ta=25°C
Ta=75°C
Ta=125°C
VBE(ON) @VCE =-5V
100
100
1
10
100
-IC , Collector Current(mA)
1
1000
Capacitance vs Reverse-biased Voltage
10
100
-IC , Collector Current(mA)
1000
Power Derating Curve
1000
2.5
PD, Power Dissipation(W)
Capacitance(pF)
10
100
-IC , Collector Current(mA)
Cib
100
10
Cob
1
2
1.5
1
0.5
0
0.1
BTP2907SL3
1
10
VR, Reverse-biased Voltage(V)
100
0
50
100
150
TC , Case Temperature(℃)
200
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C824L3
Issued Date : 2003.07.31
Revised Date :2013.11.12
Page No. : 5/7
Reel Dimension
Carrier Tape Dimension
BTP2907SL3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C824L3
Issued Date : 2003.07.31
Revised Date :2013.11.12
Page No. : 6/7
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTP2907SL3
CYStek Product Specification
Spec. No. : C824L3
Issued Date : 2003.07.31
Revised Date :2013.11.12
Page No. : 7/7
CYStech Electronics Corp.
SOT-223 Dimension
A
Marking:
B
C
1
2
Device Name
2907S
Date Code
□□□□
3
D
E
Style: Pin 1.Base 2.Collector 3.Emitter
F
H
G
a1
I
a2
3-Lead SOT-223 Plastic
Surface Mounted Package
CYStek Package Code: L3
*: Typical
Inches
Min.
Max.
0.1142
0.1220
0.2638
0.2874
0.1299
0.1457
0.0236
0.0315
*0.0906
0.2480
0.2638
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
2.90
3.10
6.70
7.30
3.30
3.70
0.60
0.80
*2.30
6.30
6.70
DIM
G
H
I
a1
a2
Inches
Min.
Max.
0.0551
0.0709
0.0098
0.0138
0.0008
0.0039
*13o
0o
10 o
Millimeters
Min.
Max.
1.40
1.80
0.25
0.35
0.02
0.10
*13o
0o
10 o
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTP2907SL3
CYStek Product Specification