CYStech Electronics Corp. Spec. No. : C384Q8 Issued Date : 2015.01.06 Revised Date : Page No. : 1/10 N- AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET MTC4503LQ8 Description The MTC4503LQ8 consists of a N-channel and a P-channel enhancement-mode MOSFET in a single SOP-8 package, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SOP-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Features • Simple drive requirement • Low on-resistance • Fast switching speed • Pb-free lead plating and halogen-free package Applications • Power management in notebook computer, portable equipment and battery powered systems. Equivalent Circuit MTC4503LQ8 Outline SOP-8 G：Gate S：Source D：Drain MTC4503LQ8 CYStek Product Specification Spec. No. : C384Q8 Issued Date : 2015.01.06 Revised Date : Page No. : 2/10 CYStech Electronics Corp. Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Drain-Source Breakdown Voltage BVDSS Limits N-channel P-channel 30 -30 Unit V Gate-Source Voltage VGS ±20 ±20 V Continuous Drain Current @TA=25 °C (Note 1) ID 6.9 -6.3 A Continuous Drain Current @TA=70 °C (Note 1) ID 5.5 -5.0 A Pulsed Drain Current (Note 2) IDM 30 -30 A Single Avalanche Current IAS 6.9 -6.3 A Total Power Dissipation @TA=25°C (Note 1) Linear Derating Factor Pd 2 W 0.016 W / °C Tj; Tstg -55~+150 °C Thermal Resistance, Junction-to-Case RθJC 25 °C/W Thermal Resistance, Junction-to-Ambient (Note 1) RθJA 62.5 °C/W Operating Junction and Storage Temperature Range Note : 1.Surface mounted on 1 in² copper pad of FR-4 board, 135°C/W when mounted on minimum copper pad 2.Pulse width limited by maximum junction temperature N-Channel Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit 30 1.0 - 0.005 5.7 2.5 ±100 1 25 28 42 - V V/°C V nA μA μA - 610 160 120 8 7 19 6 9 2 6 970 15 - - 0.88 18 - 11 Test Conditions Static BVDSS ∆BVDSS/∆Tj VGS(th) IGSS IDSS IDSS *RDS(ON) *GFS Dynamic Ciss Coss Crss *td(ON) *tr *td(OFF) *tf *Qg *Qgs *Qgd Body Diode *VF(S-D) *trr *Qrr S VGS=0, ID=250μA Reference to 25°C, ID=1mA VDS=VGS, ID=250μA VGS=±20V, VDS=0 VDS=30V, VGS=0 VDS=24V, VGS=0, Tj=70°C ID=6A, VGS=10V ID=4A, VGS=4.5V VDS=10V, ID=6A pF VDS=25V, VGS=0, f=1MHz ns VDS=15V, ID=1A, VGS=10V, RG=3.3Ω, RD=15Ω nC VDS=24V, ID=6A, VGS=4.5V 1.2 - V ns VGS=0V, IF=6.9A - nC mΩ IF=6.9A, VGS=0V, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MTC4503LQ8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C384Q8 Issued Date : 2015.01.06 Revised Date : Page No. : 3/10 P-Channel Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit -30 -0.8 - -0.004 5.8 -1.5 ±100 -1 -25 36 55 - V V/°C V nA μA μA Ciss Coss Crss *td(ON) *tr *td(OFF) *tf *Qg *Qgs *Qgd Body Diode *VF(S-D) *trr - 960 300 220 12 8 42 34 15 3 9 1540 24 - ns ns ns ns nC nC nC - 0.89 24 1.2 - V ns *Qrr - 18 - nC Test Conditions Static BVDSS ∆BVDSS/∆Tj VGS(th) IGSS IDSS IDSS *RDS(ON) *GFS S VGS=0, ID=-250μA Reference to 25°C, ID=-1mA VDS=VGS, ID=-250μA VGS=±20V, VDS=0 VDS=-30V, VGS=0 VDS=-24V, VGS=0, Tj=70°C ID=-6A, VGS=-10V ID=-4A, VGS=-4.5V VDS=-10V, ID=-6A pF VDS=-25V, VGS=0, f=1MHz mΩ Dynamic VDS=-15V, ID=-1A, VGS=-10V, RG=3.3Ω, RD=15Ω VDS=-24V, ID=-6A, VGS=-4.5V VGS=0V, IF=6.3A IF=6.3A, VGS=0V, dI/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Ordering Information Device MTC4503LQ8-0-T3-G Package SOP-8 (Pb-free lead plating and halogen-free package) Shipping 2500 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T3 : 2500 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name MTC4503LQ8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C384Q8 Issued Date : 2015.01.06 Revised Date : Page No. : 4/10 N-channel Characteristic Curves MTC4503LQ8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C384Q8 Issued Date : 2015.01.06 Revised Date : Page No. : 5/10 N-channel Characteristic Curves(Cont.) MTC4503LQ8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C384Q8 Issued Date : 2015.01.06 Revised Date : Page No. : 6/10 P-channel Characteristic Curves MTC4503LQ8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C384Q8 Issued Date : 2015.01.06 Revised Date : Page No. : 7/10 P-channel Characteristic Curves(Cont.) MTC4503LQ8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C384Q8 Issued Date : 2015.01.06 Revised Date : Page No. : 8/10 Reel Dimension Carrier Tape Dimension MTC4503LQ8 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C384Q8 Issued Date : 2015.01.06 Revised Date : Page No. : 9/10 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTC4503LQ8 CYStek Product Specification Spec. No. : C384Q8 Issued Date : 2015.01.06 Revised Date : Page No. : 10/10 CYStech Electronics Corp. SOP-8 Dimension Marking: Device Name 4503L Date Code 8-Lead SOP-8 Plastic Package CYStek Package Code: Q8 Millimeters Min. Max. 1.350 1.750 0.100 0.250 1.350 1.550 0.330 0.510 0.170 0.250 4.700 5.100 DIM A A1 A2 b c D Inches Min. Max. 0.053 0.069 0.004 0.010 0.053 0.061 0.013 0.020 0.006 0.010 0.185 0.200 DIM E E1 e L θ Millimeters Min. Max. 3.800 4.000 5.800 6.200 1.270 (BSC) 0.400 1.270 8° 0 Inches Min. Max. 0.150 0.157 0.228 0.244 0.050 (BSC) 0.016 0.050 8° 0 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTC4503LQ8 CYStek Product Specification