SPECIFICATIONS 仕様書 DATE NOV/13/2008 S. C. MODEL NO.: SCJ316P00WS0B00G（For Pb Free Process） DESCRIPTION: 3.5Ø PHONE JACK PAGE 4/6 5. Physical物理的性能 5.1 Resistance to soldering heat半田耐熱試験 The jack shall be tested under condition as specified in items (1) or (2) below, shall not occur remarkable deterioration of the part contracted and electrical damage or failure to the extent of practical use, shall comply with paragraphs 3, 3.1, 4, and 4.1. (1)もしくは(2)の試験を行ない、著しい部品構造の悪化と使用に耐えない電気的欠損がな く3, 3.1, 4, 4.1を満足すること。 (1) Condition of the jack for printed circuit board: The jack shall be mounted or plant to 1.6 millimeters thickness copper coil laminated board with a suitable hole layout to meet terminal arrangement of the jack tested, the area to be soldered of the terminal shall immersed into molten solder at a temperature of above 260℃ for 5±1 seconds. プリント基板用：1.6mm厚の銅メッキフェノ－ル箔板に適合した端子孔に端子を通して、 はめ込む、もしくは取りつけてその状態で端子部を銅箔面まで半田槽に260℃で5±1秒の 間浸漬する。 (2) Condition of the jack for hand soldering: The terminal of jack tested shall be heated to 1.5 millmeters over from the wiring hole or slit of the terminal by a soldering iron to have a capacity of 60 watts consumption at a temperature controlled of 350℃±10℃for a period of 3±0.5 seconds. リ－ド配線用：端子先端より配線用孔をさらに1.5mm超える部分まで半田で濡れるよう 、350℃±10℃，60Wで3±0.5秒半田ゴテを当てがう。 5.2 Soldering test 半田付性試験 The terminal of jack tested shall be dipped into soldering flux of GX-7(ASAHI CHEMICAL) or Equivalent for a period of 5 to 10 seconds to pre-flux and shall be immersed into molten solder of lead free (Sn 97% and Ag 3%) or equivalent to 2±0.5 millimeters from a tip of the terminal for a dwell time of 3±0.5 seconds. At the conclusion of this test, the tested area shall be covered more than three quarters of immersed area with fresh solder. 端子をGX7(アサヒ化学)または相当品のフラックスに5から10秒浸し無鉛(すず97%、銀3%)もしくは 相当品の半田槽に端子先端より2±0.5mm、3±0.5秒の間浸す。この試験 結果において浸漬部の3/4以上が半田で覆われていること。