LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS Pb Lead-Free Parts LPT3323/TBS-X-PF DATA SHEET DOC. NO : QW0905- LPT3323/TBS-X-PF REV. : D DATE : 19 - Sep. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TBS-X-PF Page 1/5 Package Dimension H2 5.0 5.9 7.6 8.6 ΔH P2 W2 H1 12.5MIN L W0 1.EMITTER 2.COLLECTOR W1 W3 1.0MIN 2.3TYP 1 2 - + D P1 F P T Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted 2.Specifications are subject to change without notice Features . High illumination sensitivity . Stable characteristics . Spectrally and mechanically matched with IR emitter Description The LPT3323/TBS-X-PF series are silicon nitride passivated NPN planar phototransistors with exceptionally table characteristics and igh illumination sensitivity the cases of LPT3323/TBS-X-PF are ncapsulated in water clear plastic T1 3/4 package individuallt •MAXIMUM RATINGS(Ta=25℃) MAXIMUM RATINGS UNIT Power Dissipation 100 mw Collector-Emitter Voltage 30 V Emitter-Collector Voltage 5 V PARAMETER Operating Temperature -50℃ TO +100℃ Storage Temperature -50℃ TO +100℃ •ELECTRICAL CHARACTERISTICS(Ta=25℃) PARAMETER Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Saturation Voltage Rise Time Fall Time Collector Dark Current Wavelength of Peak Sensitivity Range of Spectral Bandwidth On State Collector Current Typ. SYMBOL Min. V(BR)CEO 30 V V(BR)ECO 5 V VCE(sat) Max. 0.4 UNIT V Tr 5 μs Tf 5 μs ICEO 100 nA TEST CONDITION Ic=1mA Ee=0mw/c ㎡ IE=100μA Ee=0mw/c㎡ Ic=0.5mA Ee=20mw/c ㎡ VCE=30V IC=800μA,RL=1KΩ VCE=10V Ee=0mw/c ㎡ λP 800 --- nm --- λ0.5 400-1100 --- nm --- 1 2 mA 2 4 mA 4 8 mA Ip(on) 8 mA VCE=5v Ee=1mw/c ㎡ λP=940nm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TBS-X-PF Page 2/5 •Dimension Symbol Information SPECIFICATIONS OPTION CODE SYMBOL ITEMS SYMBOL Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------ D 3.8 0.15 4.2 0.17 Component Lead Pitch ------ F 2.2 0.09 3.0 0.12 Front-To-Rear Deflection ------ △H ----- ----- 2.0 0.08 TBS-1 17.5 0.69 18.5 0.73 TBS-2 21.5 0.85 22.5 0.89 TBS-3 25.5 1.0 26.5 1.04 TBS-4 27.5 1.08 28.5 1.12 TBS-5 22.5 0.89 23.5 0.93 19.9 0.78 20.9 0.82 TBS-7 24.0 0.94 25.0 0.98 TBS-8 24.5 0.96 25.5 1.0 TBS-9 19.0 0.75 20.0 0.79 TBS-10 18.4 0.72 19.4 0.76 TBS-11 21.0 0.83 22.0 0.87 TBS-12 20.5 0.81 21.5 0.85 TBS-13 18.0 0.71 19.0 0.75 ----- ----- 36.0 1.42 11.0 0.43 TBS-6 Feed Hole To Bottom Of Component H1 Feed Hole To Overall Component Height ------ H2 Lead LengthAfter Component Height ------ L Feed Hole Pitch ------ P 12.4 0.49 13.0 0.51 Lead Location ------ P1 4.4 0.17 2.8 0.23 Center Of Component Location ------ P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------ T ----- ----- 1.42 0.06 Feed Hole Location ------ W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------ W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------ W2 0.0 0.0 4.0 0.16 Tape Width ------ W3 17.5 0.69 19.0 0.75 W0 REMARK : TBS = Tape And Box Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50.0 1.97 60.0 2.40 Quantity/Box 2000PCS W L H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TBS-X-PF Typical Electro-Optical Characteristics Curve Page 3/5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LPT3323/TBS-X-PF Page 4/5 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 50 100 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/5 PART NO.LPT3323/TBS-X-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=85 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11