ITEM DESC. Q’TY MATERIALS TREATMENT WITH TIN PLATING 100u”MIN REMARK 1. COVER 1 STEEL 2. STEM 1 THERMOPLASTIC NYLON UL 94V-0 - - 3. CONTACT 1 PHOSPHOR BRONZE WITH SILVER CLADDING - 4. TERMINAL 1 BRASS WITH SILVER PLATING - 5. BASE 1 MOLDED BLACK - 6 CAP 1 - - THERMOPLASTIC NYLON UL 94V-0 THERMOPLASTIC ABS - Prod. No. : D T S □ □- 6 □ □ □ - V Prod. Series: A = Right Angle Type Soldering: V=Lead Free K = With Cap Dimension H: 1 = 3.15 ㎜ 2 = 3.85 ㎜ 3 = 5.85 ㎜ 44(48)= 6.15 ㎜ 5 = 8.35 ㎜ 6 = 11.85 ㎜ Operating Force: K = Black , 100g. N = Brown , 160g. R = Red , 260g. S = Salmon, 320g Y = Yellow, 520g APPD.: TACTILE SWITCH 6x6 CHKD.: PRROD.NO.:DTSA□-6□□□-□-□-V PR. : 張慧羚 TITLE: A DWG.REL. REV ECO. NO. APPD. FILE NO.:E-V-CT02 REV : A SHEET : 1 of 1 P.3/3 DTS□-6□□-□-V SPECIFICATION FILE NO. REV. Page. : : : E-V-AT01 1 C / 4 ELECTRIC PERFORMANCE APPEARANCE 1. Style This specification describes “TACTILE SWITCH”, mainly used as signal switch of electric devices, with the general requirements of mechanical and electrical characteristic. 1.1 Operating Temperature Range: -25℃+70℃ 1.2 Storage Temperature Range : -30℃+80℃ 2. Current Range: 50mA, 12 VDC 3.Type of Actuation: Tactile feedback 4.Test Sequence: ITEM DESCRIPTION TEST CONDITIONS REQUIREMENTS 1 There shall be no Visual By visual examination check without defects that affect the serviceability of the Examination any out pressure & testing. product. 2 Contact Resistance 3 Insulation Resistance 5 Dielectric Withstanding Voltage Capacitance 6. Bounce 4 Applying a static load 1.5~2 times the operating force to the center 100mΩ Max. made with a 1 kHz small current contact resistance meter. Measurements shall be made following application of 500 V DC 100MΩ Min. potential across terminals and cover for 1 minute ±5 seconds. 250 V AC(50Hz or 60Hz) shall be There shall be no applied across terminals and cover breakdown or flashover. for 1 minute 1 MHz ±10kHz 5 pF max. 3 to 4 operations at a rate of 1 5 m seconds Max. cycles per second 5V DC 5KΩ DTS□-6□□-□-V SPECIFICATION MECHANICAL PERFORMANCE 7. Operating Force Applied in the direction of operation. FILE NO. REV. Page. : : : E-V-AT01 2 C / 4 OF K N R S Y 100±50 160±50 260±50 320±80 520±130 [.98N±.49N] [1.568N±.49N] [2.548N±.49N] [3.136N±.784N [5.096N±1.274N] Placing the switch such that the direction of switch operation is vertical and then 8. Stroke gradually increasing the load 0.25 +0.2/-0.1 ㎜ applied to the stem, the stroke distance for the stem to come to a stop shall be measured. Placing the switch such that As shown in item 4~7 the direction of switch Contact Resistance: operation is vertical, a static 200mΩ Max Stop 9. load of 3 kgf(29.4N) shall be Strength applied in the direction of stem Insulation Resistance: 10MΩ Min operation for a period of 15 seconds Through Hole Type Shall be free from pronounced Soldering Temperature:260 backlash and falling-off or ±5℃ breakage terminals Duration of Solder Solder Heat As shown in item 4、5 10. Immersion: 5 ± 1 seconds. (Contact Resistance: Resistance Frequency of Soldering Process 2 times max. (PCB is 1.6 ㎜ in thickness) ■SMT Type ~DTSM Series(4/4) 11. Vibration 200mΩ Max ( Insulation Resistance: 10MΩ Min Shall be vibrated in accordance with As shown in item 4~7 Method 201A of MIL-STD-202F (Contact Resistance: (Frequency: 10-55-10Hz in 200mΩ Max 1-min/cycle. (Insulation Resistance: (Direction: 3 vertical 10MΩ Min directions including the directions of operation (Test time: 2 hours each direction. ( Swing distance=1.5mm DTS□-6□□-□-V SPECIFICATION MECHANICAL PERFORMANCE 12 13 FILE NO. REV. Page. : : : E-V-AT01 3 C / Shall be shocked in accordance with 1)As shown in item 4~7 Method 213B condition A of 2)Contact Resistance: MIL-STD-202F 200mΩ Max Shock 1)Acceleration; 50G 2)Action time:11±1m seconds 3)Insulation Resistance: 3)Testing Direction: 6 sides 10MΩ Min 4)Test Cycle: 3 times in each direction Through Hole Soldering 1)Temperature： No anti-soldering and the 245±3℃ coverage of dipping into Lead-Free solder：M705E JIS Z 3282 solder must more than A (Tin 96.5%，Silver 3%，Copper Solder ability 66% was requested. 0.5%) 2)Flux：5~10 sec 3)Duration of solder Immersion：5±1 sec WEATHER-PROOF DURABILITY Measurements shall be made following the test forth below: 14 Operating Life 4 1)As shown in item 4、5 2)Operating force:±50% of 1)5 mA,5 VDC resistive load initial force. 2)Applying a static load the operating 3)Contact Resistance: force to the center of the stem in 10Ω Max the direction of operation 4)Insulation Resistance: 3)Cycle of Operation: 10MΩ Min (Through Hole、S.M.T 5)Bounce: Dome=Phosphor Bronze) 10 m seconds Max 200,000 cycle’s Min. For 100,160gf 100,000 cycle’s Min. For 260gf 50,000 cycle’s Min. For 320,520gf (S.M.T Dome=Stainless Steel) 1,000,000 cycle’s Min~100,160gf 500,000 cycle’s Min~260gf 300,000 cycle’s Min~320、520gf Following the test set forth below the sample shall be left in normal Resistance temperature and humidity conditions for an hour before the 15 Low Temperature measurements are made: 1)Temperature:-25±3℃ 2)Time:96 hours Following the test set forth below the sample shall be left in normal Resistance temperature and humidity 16 High conditions for an hour before the Temperature measurements are made: 1)Temperature:80±2℃ 2)Time:96 hours 1)As shown in item 4~7 2)Contact Resistance: 200mΩ Max 3)Insulation Resistance: 10MΩ Min 1)As shown in item 4~7 2)Contact Resistance: 200mΩ Max 3)Insulation Resistance: 10MΩ Min FILE NO. REV. Page. DTS□-6□□-□-V SPECIFICATION Resistance 17 Humidity Following the test set forth below the sample shall be left in normal temperature and humidity conditions for an hour before the measurements are made: 1)Temperature:40±2℃ 2)Relative Humidity:90~95% : : : E-V-AT01 4 C / 1)As shown in item 4~7 2)Contact Resistance: 200mΩ Max 3)Insulation Resistance: 10MΩ Min 3)Time:96 hours 5. SOLDERING CONDITIONS: Condition for Reflow Soldering – S.M.T Series MAX 260° 255° 230° 150° Room Temperature 120~150sec 5~10sec 60sec TIME(sec) The condition mentioned above is the temperature on the Cu foil of the PCB surface. There are cases where board's temperature greatly differs from switch's surface be used not to allow switch's surface temperature to exceed 260℃. Manual Soldering Soldering Temperature Continuous Soldering Time Max.350℃ Max. 5 seconds Precautions in Handling 1. Care should be exercised so that flux from the upper part of the printed circuit board does not adhere to the switch. 2. Except for washable type do not wash the switch body. 3. 4. Please make sure that there is no flux rose over the surface of the PCB 4