AGILENT HPMD-7904

Agilent HPMD-7904
FBAR Duplexer for
US PCS Band
Data Sheet
Features
• Miniature size: less than 2 mm high;
5.6 x 11.9 footprint
General Description
The HPMD-7904 is a miniaturized
duplexer designed for US PCS
handset, designed using Agilent
Technologies’ Film Bulk Acoustic
Resonator (FBAR) Technology.
The HPMD-7904 features a very
small size: it is less than 2 mm
thick and has a footprint of only
5.6 x 11.9 mm2.
The HPMD-7904 enhances the
sensitivity and dynamic range of
CDMA receivers, providing more
than 50 dB attenuation of
transmitted signal at the receiver
input, and more than 40 dB
rejection of the transmitgenerated noise in the receive
band. Typical insertion loss in
the Tx channel is only 1.8 dB,
minimizing current drain from
the power amplifier. Typical
insertion loss in the Rx channel
is 2.2 dB, improving receiver
sensitivity.
Agilent’s thin-Film Bulk Acoustic
Resonator (FBAR) technology
makes possible high-Q filters at a
fraction their usual size. The
excellent power handling of the
bulk-mode resonators supports
the high output powers needed in
PCS handsets, with virtually no
added distortion.
• Rx Band: 1930-1990 MHz
Typical performance:
Rx noise blocking: 42dB
Insertion loss: 2.2 dB typical
3.0 dB band edge
Board Diagram
• Tx Band: 1850-1910 MHz
Typical performance:
Tx interferer blocking: 54dB
Insertion Loss: 1.8 dB typical
2.5 dB band edge
Functional Block Diagram
Tx
λ/4
1
Ant
3
port numbers are circled
• 30 dBm Tx power handling
Rx
2
Applications
• Handsets or data terminals
operating in the US PCS frequency
band
HPMD-7904 Electrical Specifications, ZO = 50Ω, TC[1] as indicated
Symbol
Parameters
Units
+25°C[1,3]
Min Typ Max
fRX
Receive Bandwidth
MHz
1930.6 —
1989.4
1930.6 —
1989.4
1930.6 —
1989.4
S23 Rx
Attenuation in Transmit Band
(1850.6 – 1909.4 MHz)
dB
50
54
—
50
52
—
50
52
—
S23 Rx
Typical Insertion Loss in Receive Band
(1935–1985MHz)
dB
—
2.2
3.5
—
2.2
3.8
—
2.2
3.8
S23 Rx
Insertion Loss at Edges of Receive
Band (1930.6-1935 MHz and
1985-1989.4 MHZ)
dB
—
3.0
3.5
—
3.0
3.8
—
3.0
4.5
∆ S23
Ripple in Receive Band
dB
—
1.5
—
—
1.5
—
—
2.0
—
S22 Rx
Return Loss in Receive Band
dB
8.0
10
—
8.0
10
—
8.0
10
—
fTX
Transmit Bandwidth
MHz
1850.6 —
1909.4
1850.6 —
1909.4
1850.6 —
1909.4
S31 Tx
Attenuation in Receive Band
(1930.6 – 1935 MHz)
dB
40
42
—
40
42
—
37
42
—
S31 Tx
Attenuation in Receive Band
(1935– 1989.4 MHz)
dB
40
42
—
40
42
—
40
42
—
S31 Tx
Insertion Loss in Transmit Band
(1855– 1905 MHz)
dB
—
1.8
3.0
—
1.8
3.5
—
1.8
3.5
S31 Tx
Insertion Loss at Edges of
Transmit Band (1850.6-1855 MHz
and 1905-1909.4 MHz)
dB
—
2.5
3.0
—
3.0
3.8
—
3.0
3.6
∆ S31
Ripple in Transmit Band
dB
—
2.0
—
—
3.0
—
—
2.0
—
S11 Tx
Return Loss in Transmit Band
dB
8.0
10
—
8.0
10
—
8.0
10
—
S33 Ant
Return Loss, Tx and Rx bands
dB
8.0
—
—
—
—
—
—
—
—
S21
Tx-Rx Isolation, 1850.6 – 1909.4 MHz
(Transmit Band)
dB
50
54
—
50
54
—
50
54
—
S21
Tx-Rx Isolation, 1930.6 – 1935 MHz
(Receive Band)
dB
40
42
—
40
42
—
38
42
—
S21
Tx-Rx Isolation, 1935– 1989.4 MHz
(Receive Band)
dB
40
42
—
40
42
—
40
42
—
Absolute Maximum Ratings[4]
Parameter
Unit
Value
Operating temperature[1]
°C
-30 to +85
Storage temperature[1]
°C
-30 to +100
Notes:
1. TC is defined as case temperature, the temperature of the underside of the duplexer where it
makes contact with the circuit board.
2. Specifications are given at operating temperature limits and room temperature. To estimate
performance at some intermediate temperature, use linear interpolation.
3. Specifications are guaranteed over the given temperature range, with the input power to the Tx
port equal to +30 dBm (or lower) over all Tx frequencies. The application of input power levels in
excess of +30 dBm will not destroy the duplexer, but its performance may exceed the specification
limits given above.
4. Operation in excess of any one of these conditions may result in permanent damage to the device.
2
+85°C[1,2,3]
Min Typ Max
–30°C[1,2,3]
Min Typ Max
The plots below provide typical
performance obtained from
samples of the HPMD-7904
duplexer.
In order to obtain the best
performance from the
HPMD-7904 duplexer, refer to
Design Note D007, which is
0
available from your Agilent
Technologies technical support
or sales departments.
0
INSERTION LOSS AND REJECTION (dB)
INSERTION LOSS AND REJECTION (dB)
S31
-10
-20
-30
-40
-50
S23
-60
-70
1.82
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
-1
-2
S31
S23
-3
-4
-5
1.82
2.02
1.84
1.86
1.88
FREQUENCY (GHz)
0
0
-5
-5
-10
S22
1.84
1.86
1.88
1.90
1.92
1.94
1.96
FREQUENCY (GHz)
Figure 3. Tx and Rx Port Return Loss (typical).
freq (1.850 GHz to 1.910 GHz)
Figure 5. S11, Tx Port Impedance (typical).
3
1.94
1.96
1.98
2.00
2.02
1.96
1.98
2.00
2.02
-10
S33
-15
-15
-20
1.82
1.92
Figure 2. Insertion Loss Detail (typical).
RETURN LOSS (dB)
RETURN LOSS (dB)
Figure 1. Tx and Rx Port Insertion Loss (typical).
S11
1.90
FREQUENCY (GHz)
1.98
2.00
2.02
-20
1.82
1.84
1.86
1.88
1.90
1.92
1.94
FREQUENCY (GHz)
Figure 4. Ant Port Return Loss (typical).
freq (1.930 GHz to 1.990 GHz)
Figure 6. S22, Rx Port Impedance (typical).
-20
-30
ISOLATION (dB)
A
-40
S21
-50
-60
B
-70
-80
1.82
A: freq (1.850 GHz to 1.910 GHz)
B: freq (1.930 GHz to 1.990 GHz)
1.84
1.86
1.88
1.90
1.92
1.94
1.96
1.98
2.00
2.02
FREQUENCY (GHz)
Figure 8. S21, Isolation (typical).
Figure 7. S33, Ant Port Impedance.
0
-10
S31
-5
-15
-10
ISOLATION (dB)
RETURN LOSS (dB)
-20
-15
-20
S23
-25
-30
-35
-25
-30
S21
-35
-40
-40
-45
-45
-50
-50
2.0
2.5
3.0
3.5
4.0
4.5
FREQUENCY (GHz)
Figure 9. Wideband Insertion Loss (typical).
4
5.0
5.5
6.0
2.0
2.5
3.0
3.5
4.0
FREQUENCY (GHz)
Figure 10. Wideband Isolation (typical).
4.5
5.0
5.5
6.0
Note that the specifications given
on page 2 are guaranteed when
the duplexer is mounted on a
ground surface with a hole
pattern like that one shown in
Figure 11. See Design Note D007,
Tx input
which is available from your
Agilent Technologies technical
support or sales departments.
Note that it is important that
proper heat sinking be provided
Rx output
0.4 mm diameter plated through holes
typical spacing is 0.77 to 0.9 mm
Ant input/output
Duplexer outline shown in dashed line
Figure 11. Mounting (grounding) Pattern.
5.625 ± 0.05
4.763
4.256
Port 1
Tx
3.494
2.985
4.389
3.881
Port 2
Rx
3.119
2.611
Port 3
Ant
via hole, 0.28 dia
3 places
10.859
11.367
11.875 ± 0.05
4.631
5.139
3.361
3.869
0
0.508
1.016
1.016
0.508
0
Notes:
View of the duplexer underside, seen from the top.
All dimensions in millimeters.
Pin assignments are as shown above.
Maximum duplexer height is 1.9 mm.
Figure 12. Outline Drawing.
5
in order to remove the heat
generated in the Tx filter by the
handset’s power amplifier.
Failure to do so may result in
excessive losses, especially at the
top end of the Tx band.
0.030±0.05
Note 2
4.00 ± 0.10
Note 6
2.00 ± 0.10
φ1.50 ± 0.10
1.75 ± 0.1
Note 6
11.50 ± 0.10
24.00 ± 0.30
12.20 Note 4
2.25 Note 5
6.60
Note 4
12.00 ± 0.10
φ1.50
Notes:
1. All dimensions in mm.
2. 10 sprocket hole pitch accumulative tolerance ± 0.10 mm
3. Camber not exceed 1 mm in 250 mm
4. Pocket dimensions measured on a plane 0.3 mm above the bottom of the pocket.
5. Pocket depth measured from a plane on the inside bottom of the pocket to the top surface of the carrier.
6. Pocket position on relative to sprocket hole measure as true position of pocket, not the pocket hole.
Figure 13. Tape Drawing.
R 6.26"
+1.00"
-0.50"
120.00° ± 0.50°
R 5.27"
+1.00"
-0.50"
R 0.20"
+1.00"
R 5:49" -0.50"
2.00 ± 0.50
+0.40"
13.00"
-0"
+0.50"
φ13.00" -0.20"
φ21.00±0.80
100.00
CONVEX = 0.5mm
0.22"
+1.00"
R 6.26" -0.50"
R 2.00"
+1.00"
-0.50"
2.20
Notes:
1. All dimensions in mm, unless otherwise noted.
2. Material: polystyrene
3. Surface resistivity: 1x109 ohm-mm2
Figure 14. Reel Drawing.
6
R 2.00"
+1.00"
-0.50"
+2.00
-0
User Feed Direction
REEL
CARRIER
TAPE
xx DO
xx 1x
xx DO
xx 1x
xx DO
xx 1x
xx DO
xx 1x
xx DO
xx 1x
xx DO
xx 1x
xx DO
xx 1x
xx DO
xx 1x
USER
FEED
DIRECTION
COVER TAPE
Top View
End View
Empty Pocket/Cavity
Leader: 100 pocket – 1 Meter
Trailer: 100 pocket – 1 Meter
Figure 15. Device Orientation.
Solder Recommendations
The HPMD-7904 FBAR duplexer
(and its variants) is an assembly
consisting of two LCC ceramic
packages, containing the Tx and
Rx filters, mounted to a small
circuit board. Both packages on
the circuit board are mounted in
place using Sn96.5/Ag3.5 solder
(shaded in Table 1).
The recommended solder profile
for the FBAR duplexer is shown
in Figure 16. Guidelines and a
typical profile are both shown.
This typical profile was tested on
ten samples of the duplexer, each
of which was subjected to the
profile six times without effect
upon the mechanical or electrical
characteristics of the device.
Solder temperatures and times in
excess of those given in the
guidelines of Table 1 may result
in damage to the duplexer or
changes in its characteristics.
Table 1. Solder Compositions
Alloy type
Melting temp.
(oC)
Recommended working
temperature (oC)
Comments
Sn42Bi58
138
160 – 180
Lead free
Sn43Pb43Bi14
144 – 163
165 – 185
Contains lead – some customers prohibit it.
Sn63Pb37
183
200 – 240
Contains lead – some customers prohibit it.
Sn60Pb40
186
200 – 240
Contains lead – some customers prohibit it.
Sn91/Zn9
199
200 – 240
May have oxidation problems
Sn96.2Ag2.5Cu0.8Sb0.5
216
235 – 255
Popular lead free composition
Sn95.8Ag3.5Cu0.7
217
235 – 255
Other alloy ratios are available
Sn96.5Ag3.5
221
240 – 260
Used in the assembly of duplexers
Sn100
232
260 – 280
Too hot – will melt the duplexer
Sn95Sb5
235
260 – 280
Too hot – will melt the duplexer
Sn97Cu3
240
260 – 300
Too hot – will melt the duplexer
7
10 to 20 sec.
250
235°C ± 5°C
217°C
TEMPERATURE, °C
200
60 to 120 sec.
125°C ± 25°C
150
-6°C/sec. max
3°C/sec. max
100
120 sec. max.
Guidelines
Tested profile
50
0
0
100
200
300
TIME, seconds
Figure 16. Recommended Solder Profile.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
May 30, 2002
5988-6610EN
400
500
600