SMD SOLID ALUMINUM ELECTROLYTIC CAPACITOR WITH CONDUCTIVE POLYMER LEAD-FREE REFLOW SOLDERING CONDITIONS 1. A thermal condition system such as infrared radiation (IR) or hot blast should be adopted, and vapor heat transfer systems (VPS) are not recommended. 2. Reflow soldering should be performed only one time. 3. Please follow following conditions for reflow soldering: - The time of preheating from 150°C to 200°C shall be within 180 seconds maximum; - The time of soldering temperature at 217°C and more measured on capacitors top shall not exceed tL(second); - The peak temperature on capacitors top shall not exceed TP(°C). - The maximum time within a 5K area below TP(°C) shall not exceed tP(second) (in diagram marked in red color). ● Reflow Soldering Profile tP TP TP –5K TP tL *1. Average ramp-up rate is 3°C/second max. *2. Ramp-down rate is 6°C/second max. *3. Time from 25°C to peak temperature is 8 minutes max. ● Classified at Temperature and Time Size Ø8x11.8 Ø10x12.7 Thickness (mm) Soldering paste ≥ 2.5 ≥ 2.5 TP (°C) tL(second) tP(second) 240 ±0 235 ±0 90 60 30 30 1/1 Direct Contact & Support: Jianghai Europe GmbH • +49 (0)21 51-65 20 88 -0 • www.jianghai-europe.com • [email protected]