AMD Opteron™ 3300 Series processor

AMD Opteron™ 3300 Series processor
Real-World Performance. Real-World Value. Do the Math.
Quick Reference Guide
AMD Opteron™ 3300 Series processor
Entry level, enterprise-class servers at desktop pricing – a single-socket, money-in-pocket server solution
What’s New?

Second generation of AMD’s modular core architecture – codenamed “Piledriver”

13% higher performance expected1

New 25W EE power band offering at 6.25W/core
Product Specifications
1
Model
Num ber
Core
Count
3380
8
3365
8
3350 HE
4
3320 EE
4
Base Frequency/
North Bridge
2.6 GHz/
2.0 GHz
2.3 GHz/
2.0 Ghz
2.8 GHz/
2.0 GHz
1.9 GHz/
1.4 GHz
AMD Turbo
AMD Turbo
CORE
CORE
Frequency P1 Frequency P0
Pow er
Band
Max
DDR3 speed
L2 Cache
L3 Cache
2.9 GHz
3.6 GHz
65W
1866 MHz
4 x 2M
8M
2.6 GHz
3.3 Ghz
65W
1866 MHz
4 x 2M
8M
3.1 GHz
3.8 GHz
45W
1866 MHz
2 x 2M
8M
2.1 GHz
2.5 GHz
25W
1333 MHz
2 x 2M
8M
Estimate based on preliminary SPECint®_rate2006 results in
AMD labs as of October 2012 comparing AMD Opteron™
processor Models 3380 and 3280. SVR-310.
AMD Opteron™ 3300 Series Processor Specifications
Total Cache: 16MB (8 core), 12MB (4 core)
Cache Sizes
AMD SP5100 Southbridge Product Specifications
L2 Cache: up to 8MB total
L3 Cache: up to 8MB total
Processor Technology
HyperTransport™
32nm technology
1x HT3 at up to 5.2GT/s* per link
Technology Links
Memory
Integrated DDR3 memory controller with up to 32 GB
memory per socket
Number of Channels/
Types of Memory
Dual Channel DDR3 ECC UDIMM, SODIMM support;
1333, 1600, 1866* MHz memory speeds
Die Size
315 mm2
Package
AM3+
USB Ports
12 USB 2.0 + 2 USB 1.1
PCI Bus Support
PCI rev 2.3
Serial ATA
AHCI 1.1 SATA 3.0Gb/s with SW RAID Support
SATA Ports
6 (can be independently disabled)
Max TDP/Idle
4W/1W
Process Technology
TSMC .13um
Package
528 ball FCBGA, 21x21mm, 0.8mm pitch
*
*1866MHz supported only with a single physical DIMM per memory channel in
AMD Opteron processor models 3350 HE, 3365 and 3380.
AMD SR5650, SR5670, SR5690 I/O Hub Product Specifications
Model
Num ber
Processor
Interface
SR5650
HyperTransport™
3.0 Technology
(5.2 GT/s)
SR5670
HyperTransport™
3.0 Technology
(5.2 GT/s)
Num ber of
PCI
PCIe® Ports/ Virtualization
Express®
Engines
Error Detection/
Isolation
Hy perTransport error
handling, PCIe® Adv anced
Error Reporting, PCIe® endto-end Cy cle Redundancy
Check
Max TDP/Idle
Process
(w /c1e)
Technology
Package
v2.0
22 lanes/
8 engines
AMD-Vi (IOMMU
1.26)
TSMC 65nm
29 x 29 mm
FCBGA
v2.0
30 lanes/
9 engines
AMD-Vi (IOMMU
Error Reporting, PCIe® end- 15.4W/5.75W TSMC 65nm
1.26)
to-end Cy cle Redundancy
29 x 29 mm
FCBGA
12.6W/5.4W
Hy perTransport error
handling, PCIe® Adv anced
Check
SR5690
HyperTransport™
3.0 Technology
(5.2 GT/s)
v2.0
42 lanes/
11 engines
AMD-Vi (IOMMU
1.26)
Hy perTransport error
handling, PCIe® Adv anced
Error Reporting, PCIe® endto-end Cy cle Redundancy
Check
18W/6.15W
TSMC 65nm
29 x 29 mm
FCBGA
©2013 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, AMD Opteron, AMD Virtualization, AMD -V and
combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a lic ensed trademark of the HyperTransport
Technology Consortium. Other names are for reference only and may be the trademarks of their respective owners.