8 7 6 5 4 3 1 2 Pin1 indicator Pattern is vendor’s option 826.772 506.000 446.000 D D VSS VDD1 VDDCQ VSS 3.386 VDD1 7.559 VDDCQ 4.000 3.780 3.559 4ptSPW_die C C VSS VDD1 VDDCQ VDDCQ VSS VDD1 22.636 B B 17.386 38.386 60.000 20.000 10.000 40.000 50.000 3.000 752.000 31.500 45.000 35.000 30.000 10 10 6 10 10 6 112.000 10 6 10 NOTES: 6 6 6 6 Top not used 10mils 10 L1 Tier 2 6mils Sig1 L2 Tier 1 10mils Sig2 L3 Tier1sub 10mils VDD IO L4 D/A Seal Ring10mils 6mils VSS VSS VSS L5 10mils VDD C L6 6mils VSS A L7 10mils VDD A L8 L9 6mils 6mils Sig3 VSS L10 L11 6mils 6mils Sig4 VDD IO L12 10mils VSS DESIGN NOTES: 1. PACKAGE MATERIAL: OPAQUE 90% MINIMUM ALUMINA CERAMIC. 1. DRAWING UNITS ARE IN MILS Stack-Up 2. ALL EXPOSED METAL AREAS MUST BE GOLD PLATED 100 2. PACKAGE OUTLINE IS 21X21MM A TO 225 MICROINCHES THICK OVER ELECTROPLATED NICKEL 3. DIE SIZE IS 446 MILS SQUARE UNDERCOATING 100 TO 350 MICROINCHES THICK PER 4. DIE BOND PAD PITCH IS 3.78 UM MIN 5. STANDARD ROUTING TRACE WIDTH IS ~4 MILS MIL-PRF-38535. A 6. VIA SIZES ARE 4 MILS AND 8 MILS 3. THE SEAL RING MUST BE ELECTRICALLY CONNECTED TO VSS. 4. SEE UTMC SPEC. 40-7150-XX FOR FURTHER REQUIREMENTS. 5. PIN 1 ID MUST BE GOLD PLATED. NO ALPHANUMERIC FIGURES DRAWING UNITS ARE IN MILS. 7. LGA PAD/OPENING SIZE IS 31.5 MILS TITLE UNLESS OTHERWISE SPECIFIED: 8. LAYOUT WILL REQUIRE LENGTH MATCHING AND ALL DIMENSIONS ARE IN INCHES. 255 LGA PACKAGE CONTROLLED IMPEDANCE TRACES. TOLERANCES: 0.506 SQ. CAVITY 21x21mm BODY 9. ROUTING AND STACK-UP PLANS WILL BE PROVIDED. ALLOWED. MAY BE CONNECTED TO VSS FOR PLATING OPTIONAL. DETAIL DRAWING 10. CONNECT FIDUCIALS TO VSS. 6. BONDFINGER NUMBERS, LETTERS, AND I.D. ARE FOR REFERENCE 11. TYPICAL BONDFINGERS ARE 4 MILS WIDE, 3.56 MILS GAP. DRAWING DATE ONLY. REV DWG.#/DOC. CTRL.# 40-72018-YY PRELIM 26 FEB 2008 SCALE 8 7 6 5 4 3 2 CAD SIZE D SHEET 1 1 OF 1 L1-Tier2 L2-Tier1