AMD SR5690 Databook

AMD SR5690 Databook
Technical Reference Manual
Rev 2.20
P/N: 43869_sr5690_ds_pub
© 2012 Advanced Micro Devices, Inc.
Trademarks
AMD, the AMD Arrow logo, AMD PowerNow!, AMD Virtualization, AMD-V, and combinations thereof are trademarks of Advanced Micro Devices, Inc.
HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.
Microsoft, Windows, and Windows Server are registered trademarks of Microsoft Corporation.
PCI Express and PCIe are registered trademarks of PCI-SIG.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
Disclaimer
The contents of this document are provided in connection with Advanced Micro Devices, Inc. ("AMD") products. AMD makes no representations or warranties with
respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time
without notice. AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to this document including, but not limited to, the implied
warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD shall not be liable for any damage, loss, expense,
or claim of loss of any kind or character (including without limitation direct, indirect, consequential, exemplary, punitive, special, incidental or reliance damages) arising
from use of or reliance on this document. No license, whether express, implied, arising by estoppel, or otherwise, to any intellectual property rights are granted by this
publication. Except for AMD product purchased pursuant to AMD's Standard Terms and Conditions of Sale, and then only as expressly set forth therein, AMD's products
are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to
support or sustain life, or in any other application in which the failure of AMD's product could create a situation where personal injury, death, or severe property or
environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice.
© 2012 Advanced Micro Devices, Inc. All rights reserved.
Table of Contents
Chapter 1: Overview
1.1 Introducing the SR5690 ......................................................................................................................................................1-1
1.2 SR5690 Features .................................................................................................................................................................1-1
1.2.1
CPU Interface .......................................................................................................................................................1-1
1.2.2
PCI Express® Interface ........................................................................................................................................1-1
1.2.3
A-Link Express II Interface..................................................................................................................................1-1
1.2.4
Multiple Processor Support ..................................................................................................................................1-2
1.2.5
Multiple Northbridge Support ..............................................................................................................................1-2
1.2.6
Power Management Features ...............................................................................................................................1-2
1.2.7
PC Design Guide Compliance..............................................................................................................................1-2
1.2.8
Test Capability Features .......................................................................................................................................1-2
1.2.9
Packaging .............................................................................................................................................................1-2
1.3 Software Features................................................................................................................................................................1-2
1.4 Device ID ............................................................................................................................................................................1-3
1.5 Branding Diagrams .............................................................................................................................................................1-3
1.6 Conventions and Notations .................................................................................................................................................1-4
1.6.1
Pin Names.............................................................................................................................................................1-4
1.6.2
Pin Types ..............................................................................................................................................................1-4
1.6.3
Numeric Representation .......................................................................................................................................1-5
1.6.4
Hyperlinks ............................................................................................................................................................1-5
1.6.5
Acronyms and Abbreviations ...............................................................................................................................1-5
Chapter 2: Functional Descriptions
2.1 HyperTransport™ Interface ................................................................................................................................................2-1
2.1.1
Overview ..............................................................................................................................................................2-1
2.1.2
HyperTransport™ Flow Control Buffers .............................................................................................................2-3
2.2 IOMMU ..............................................................................................................................................................................2-4
2.3 Multiple Northbridge Support.............................................................................................................................................2-4
2.4 Interrupt Handling...............................................................................................................................................................2-4
2.4.1
Legacy INTx Handling.........................................................................................................................................2-4
2.4.2
Non-SB IOAPIC Support .....................................................................................................................................2-4
2.4.3
Integrated IOAPIC Support..................................................................................................................................2-5
2.4.4
MSI Interrupt Handling and MSI to HT Interrupt Conversion ............................................................................2-5
2.4.5
Internally Generated Interrupts.............................................................................................................................2-5
2.4.6
IOMMU Interrupt Remapping .............................................................................................................................2-5
2.4.7
Interrupt Routing Architecture .............................................................................................................................2-5
2.5 RAS Features ......................................................................................................................................................................2-7
2.5.1
Parity Protection ...................................................................................................................................................2-7
2.5.2
SERR_FATAL# and NON_FATAL_CORR# Pins .............................................................................................2-7
2.5.3
NMI# and SYNCFLOODIN# ..............................................................................................................................2-8
2.5.4
Suggested Platform Level RAS Sideband Signal Connections............................................................................2-8
2.5.5
Error Reporting and Logging ...............................................................................................................................2-9
2.5.6
Interrupt Generation on Errors ........................................................................................................................... 2-11
2.5.7
Poisoned Data Support ....................................................................................................................................... 2-11
2.5.8
PCIe® Link Disable State .................................................................................................................................. 2-11
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2.5.9
HT Syncflood Based on PCIe® Error ............................................................................................................... 2-12
2.6 PCI Express® .................................................................................................................................................................. 2-12
2.6.1
PCIe® Ports ....................................................................................................................................................... 2-12
2.6.2
PCIe® Reset Signals.......................................................................................................................................... 2-12
2.6.3
PCIe® Hot-Pug.................................................................................................................................................. 2-13
2.7 External Clock Chip ......................................................................................................................................................... 2-14
Chapter 3: Pin Descriptions and Strap Options
3.1 Pin Assignment Top View ................................................................................................................................................. 3-2
3.2 SR5690 Interface Block Diagram ...................................................................................................................................... 3-4
3.3 CPU HyperTransport™ Interface ...................................................................................................................................... 3-4
3.4 PCI Express® Interfaces .................................................................................................................................................... 3-5
3.4.1
PCI Express® Interface for General Purpose External Devices ......................................................................... 3-5
3.4.2
A-Link Express II Interface to Southbridge ........................................................................................................ 3-5
3.4.3
Miscellaneous PCI Express® Signals ................................................................................................................. 3-6
3.5 Clock Interface ................................................................................................................................................................... 3-6
3.6 Power Management Pins .................................................................................................................................................... 3-7
3.7 Miscellaneous Pins............................................................................................................................................................. 3-7
3.8 Power Pins.......................................................................................................................................................................... 3-8
3.9 Ground Pins........................................................................................................................................................................ 3-9
3.10 Strapping Options........................................................................................................................................................... 3-10
Chapter 4: Timing Specifications
4.1 HyperTransport™ Bus Timing .......................................................................................................................................... 4-1
4.2 PCI Express® Differential Clock AC Specifications......................................................................................................... 4-1
4.3 HyperTransport™ Reference Clock Timing Parameters ................................................................................................... 4-1
4.4 OSCIN Reference Clock Timing Parameters..................................................................................................................... 4-2
4.5 Power Rail Sequence.......................................................................................................................................................... 4-2
4.5.1
Power Up ............................................................................................................................................................. 4-3
4.5.2
Power Down ........................................................................................................................................................ 4-4
Chapter 5: Electrical Characteristics and Physical Data
5.1 Electrical Characteristics.................................................................................................................................................... 5-1
5.1.1
Maximum and Minimum Ratings........................................................................................................................ 5-1
5.1.2
DC Characteristics ............................................................................................................................................... 5-1
5.2 SR5690 Thermal Characteristics........................................................................................................................................ 5-2
5.2.1
SR5690 Thermal Limits ...................................................................................................................................... 5-2
5.2.2
Thermal Diode Characteristics ............................................................................................................................ 5-3
5.3 Package Information .......................................................................................................................................................... 5-4
5.3.1
Pressure Specification.......................................................................................................................................... 5-5
5.3.2
Board Solder Reflow Process Recommendations ............................................................................................... 5-6
Chapter 6: Power Management and ACPI
6.1 ACPI Power Management Implementation ....................................................................................................................... 6-1
Chapter 7: Testability
7.1 Test Capability Features..................................................................................................................................................... 7-1
7.2 Test Interface...................................................................................................................................................................... 7-1
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7.3 XOR Tree ............................................................................................................................................................................7-1
7.3.1
Brief Description of an XOR Tree .......................................................................................................................7-1
7.3.2
Description of the XOR Tree for the SR5690 ......................................................................................................7-2
7.3.3
XOR Tree Activation ...........................................................................................................................................7-2
7.3.4
XOR Tree for the SR5690....................................................................................................................................7-3
7.4 VOH/VOL Test...................................................................................................................................................................7-4
7.4.1
Brief Description of a VOH/VOL Tree................................................................................................................7-4
7.4.2
VOH/VOL Tree Activation..................................................................................................................................7-5
7.4.3
VOH/VOL pin list ................................................................................................................................................7-6
Appendix A: Pin Listings
7.5 SR5690 Pin Listing Sorted by Ball Reference................................................................................................................... A-2
A.1 SR5690 Pin Listing Sorted by Pin Name .......................................................................................................................... A-9
Appendix B: Revision History
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List of Figures
Figure 1-1:
Figure 1-2:
Figure 1-3:
Figure 2-1:
Figure 2-2:
Figure 2-3:
Figure 2-4:
Figure 2-5:
Figure 2-6:
Figure 2-7:
Figure 2-8:
Figure 2-9:
Figure 3-1:
Figure 4-1:
Figure 5-2:
Figure 5-3:
Figure 5-4:
Figure 7-1:
Figure 7-2:
SR5690 Branding Diagram for A21 Production ASIC (RoHS-compliant Part) ......................................................... 1-3
SR5690 Branding Diagram for A21 Production ASIC (Lead Free Part) .................................................................... 1-4
SR5690 Alternate Branding for A21 Production ASIC (Lead Free Part) ................................................................... 1-4
SR5690 Internal Blocks and Interfaces ....................................................................................................................... 2-1
HyperTransport™ Interface Block Diagram ............................................................................................................... 2-2
SR5690 HyperTransport™ Interface Signals .............................................................................................................. 2-3
Interrupt Routing Paths in Legacy Mode .................................................................................................................... 2-6
Interrupt Routing Paths in Legacy Mode with Integrated IOAPIC ............................................................................. 2-6
Interrupt Routing Path in MSI Mode .......................................................................................................................... 2-7
Suggested Platform Level RAS Sideband Signal Connections ................................................................................... 2-9
Hot-plug Interface Connections ................................................................................................................................ 2-13
Hot-plug Signals between PCIe® Slot and I/O Expander ......................................................................................... 2-14
SR5690 Interface Block Diagram ............................................................................................................................... 3-4
SR5690 Power Rail Power Up Sequence .................................................................................................................... 4-3
SR5690 692-Pin FCBGA Package Outline ................................................................................................................. 5-4
SR5690 Ball Arrangement (Bottom View) ................................................................................................................. 5-5
RoHS/Lead-Free Solder (SAC305/405 Tin-Silver-Copper) Reflow Profile .............................................................. 5-7
XOR Tree .................................................................................................................................................................... 7-2
Sample of a Generic VOH/VOL Tree ......................................................................................................................... 7-5
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List of Tables
Table 1-1: Device IDs for the SR5690/5670/5650 Chipset Family ................................................................................................1-3
Table 1-2: Pin Type Codes ..............................................................................................................................................................1-5
Table 1-3: Acronyms and Abbreviations ........................................................................................................................................1-5
Table 2-1: SR5690 HyperTransport™ Flow Control Buffers .........................................................................................................2-3
Table 2-2: Types of Errors Detectable by the SR5690 AER Implementation ..............................................................................2-10
Table 2-3: Types of HyperTransport™ Errors Supported by the SR5690 ....................................................................................2-11
Table 2-4: Possible Configurations for the PCI Express® General Purpose Links ......................................................................2-12
Table 2-5: GPP3a Ports with PCIe® Hot-Plug Support (Shaded) ................................................................................................2-14
Table 3-1: HyperTransport™ Interface ...........................................................................................................................................3-4
Table 3-2: PCI Express® Interface for General Purpose External Devices ....................................................................................3-5
Table 3-3: 1 x 4 Lane A-Link Express II Interface for Southbridge ...............................................................................................3-5
Table 3-4: Miscellaneous PCI Express® Signals ............................................................................................................................3-6
Table 3-5: Clock Interface ...............................................................................................................................................................3-6
Table 3-6: Power Management Pins ...............................................................................................................................................3-7
Table 3-7: Miscellaneous Pins ........................................................................................................................................................3-7
Table 3-8: Power Pins .....................................................................................................................................................................3-8
Table 3-9: Ground Pins ...................................................................................................................................................................3-9
Table 3-10: Strap Definitions for the SR5690 ..............................................................................................................................3-10
Table 3-11: Strap Definition for STRAP_PCIE_GPP_CFG .........................................................................................................3-10
Table 4-1: Timing Requirements for PCIe® Differential Clocks (GPP1_REFCLK, GPP2_REFCLK, and GPP3_REFCLK at
100MHz) .........................................................................................................................................................................................4-1
Table 4-2: Timing Requirements for HyperTransport™ Reference Clock (100MHz) ...................................................................4-1
Table 4-3: Timing Requirements for OSCIN Reference Clock (14.3181818MHz) .......................................................................4-2
Table 4-4: Power Rail Groupings for the SR5690 ..........................................................................................................................4-2
Table 4-5: SR5690 Power Rail Power-up Sequence .......................................................................................................................4-3
Table 5-1: Power Rail Maximum and Minimum Voltage Ratings .................................................................................................5-1
Table 5-2: Power Rail Current Ratings ...........................................................................................................................................5-1
Table 5-1: DC Characteristics for PCIe® Differential Clocks (GPP1_REFCLK, GPP2_REFCLK, and GPP3_REFCLK at
100MHz) ...................................................................................................................................................................................
5-1
Table 5-3: DC Characteristics for 1.8V GPIO Pads ........................................................................................................................5-2
Table 5-4: DC Characteristics for the HyperTransport™ 100MHz Differential Clock (HT_REFCLK) .......................................5-2
Table 5-5: SR5690 Thermal Limits ................................................................................................................................................5-2
Table 5-6: SR5690 692-Pin FCBGA Package Physical Dimensions .............................................................................................5-4
Table 5-7: Recommended Board Solder Reflow Profile - RoHS/Lead-Free Solder ......................................................................5-6
Table 6-1: ACPI States Supported by the SR5690 .........................................................................................................................6-1
Table 7-1: Pins on the Test Interface ..............................................................................................................................................7-1
Table 7-2: Example of an XOR Tree ..............................................................................................................................................7-2
Table 7-3: SR5690 XOR Tree .........................................................................................................................................................7-3
Table 7-4: Truth Table for the VOH/VOL Tree Outputs ................................................................................................................7-5
Table 7-5: SR5690 VOH/VOL Tree ...............................................................................................................................................7-6
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Chapter 1
Overview
1.1
Introducing the SR5690
The SR5690 (formerly RD890S) is the system logic of the latest server/workstation platform from AMD that enables its
next generation CPUs. The SR5690 has a total of 46 PCI Express® (PCIe®) lanes: 42 lanes are dedicated for external PCIe
devices, and 4 are dedicated for the A-Link Express II interface to AMD’s Southbridges such as the SP5100 (formerly
SB700S). The SR5690 also comes equipped with the new HyperTransport™ 3 and PCIe Gen 2 technologies. All of these
are achieved by a highly integrated, thermally efficient design in a 29mm x 29mm package.
The SR5690 introduces a variety of Reliability, Availability and Serviceability (RAS) capabilities. These include parity
protection for on-chip memories, PCI Express Advanced Error Reporting (AER), and advanced error handling
capabilities for HyperTransport.
The SR5690 also supports a revision 1.26 compliant IOMMU (Input/Output Memory Management Unit) implementation
for address translation and protection services. This feature allows virtual addresses from PCI Express endpoint devices to
be translated to physical memory addresses. On-chip caching of address translations is provided to improve I/O
performance. The device is also compliant with revision 1.0 of the PCI Express Address Translation Services (ATS)
specification to enable ATS-compliant endpoint devices to cache address translation. These features enhance memory
protection and support hardware-based I/O virtualization when combined with appropriate operating system or hypervisor
software. Combined with AMD Virtualization™ (AMD-V™) technology, these features are designed to provide
comprehensive platform level virtualization support.
1.2
SR5690 Features
1.2.1
CPU Interface
1.2.2
1.2.3
•
•
•
Supports 16-bit up/down HyperTransport™ (HT) 3.0 interface up to 5.2 GT/s.
•
Supports “Shanghai” and subsequent series of AMD server/workstation and desktop processors through sockets F,
AM3, G34, and C32.
•
Supports LDTSTOP interface and CPU throttling.
Supports 200, 400, 600, 800, and 1000 MHz HT1 frequencies.
Supports 1200, 1400, 1600, 1800, 2000, 2200, 2400, and 2600 MHz HT3 frequencies (up to 2400 MHz only for the
RX980) .
PCI Express® Interface
•
•
•
Supports PCIe Gen 2 (version 2.0).
•
Supports a revision 1.26 compliant IOMMU (Input/Output Memory Management Unit) implementation for address
translation and protection services. Please refer to the AMD I/O Virtualization Technology (IOMMU) Specification
for more details.
•
Supports PCIe hot-plug function for up to eight slots (firmware support required).
Optimized peer-to-peer and general purpose link performance.
Supports 42 PCIe Gen 2 general purpose lanes, and up to 11 devices on specific ports (possible configurations are
described in Section 2.6, “PCI Express®”).
A-Link Express II Interface
•
One x4 A-Link Express II interface for connection to an AMD Southbridge. The A-Link Express II is a proprietary
interface developed by AMD based on the PCI Express technology, with additional Northbridge-Southbridge
messaging functionalities.
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Software Features
1.2.4
Multiple Processor Support
•
1.2.5
Multiple Northbridge Support
•
1.2.6
1.2.7
Supports multiple-socket configurations for up to 8 processors on the same system.
Supports multiple-SR5690/5670/5650 configurations on the same system. See Section 2.3, “Multiple Northbridge
Support,” for details.
Power Management Features
•
•
Fully supports ACPI states S1, S3, S4, and S5.
•
•
Support for AMD PowerNow!™ technology.
•
Supports dynamic lane reduction for the PCIe interfaces, adjusting to the task the number of lanes employed.
The Chip Power Management Support logic supports four device power states defined for the OnNow Architecture—
On, Standby, Suspend, and Off. Each power state can be achieved by software control bits.
Clocks are controlled dynamically using a mechanism that is transparent to the software. The ASIC hardware detects
idle blocks and turns off the clocks to those blocks in order to reduce power consumption.
PC Design Guide Compliance
The SR5690 complies with all relevant Windows Logo Program (WLP) requirements from Microsoft® for WHQL
certification.
1.2.8
Test Capability Features
The SR5690 has a variety of test modes and capabilities that provide a very high fault coverage and low DPM (Defect Per
Million) ratio:
•
Full scan implementation on the digital core logic which provides about 97% fault coverage through ATPG
(Automatic Test Pattern Generation Vectors).
•
•
•
•
Dedicated test logic for the on-chip custom memory macros to provide complete coverage on these modules.
•
•
IDDQ mode support to allow chip evaluation through current leakage measurements.
A JTAG test mode in order to allow board level testing of neighboring devices.
An XOR tree test mode on all the digital I/O's to allow for proper soldering verification at the board level.
Access to the analog modules and PLLs in the SR5690 in order to allow full evaluation and characterization of these
modules.
Highly advanced signal observability through the debug port.
These test modes can be accessed through the settings of the instruction register of the JTAG circuitry.
1.2.9
Packaging
•
•
1.3
Single chip solution in 65nm, 1.1V CMOS technology.
Flip chip design in a 29mm x 29mm 692-FCBGA package.
Software Features
•
•
•
•
•
•
Supports Windows Server® 2003, Windows Server® 2008, Red Hat Enterprise Linux, SUSE Linux, and Solaris.
Supports corporate manageability requirements such as DMI.
ACPI support.
Full write combining support for maximum performance.
Comprehensive OS and API support.
Extensive Power Management support.
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Device ID
1.4
Device ID
The SR5690 is a member of the AMD chipset family, which consists of different devices designed to support different
platforms. Each device is identified by a device ID, which is stored in the NB_DEVICE_ID register. The device IDs for
the SR5650/5690/5670 chipset family are as follows:
Table 1-1 Device IDs for the SR5690/5670/5650 Chipset Family
1.5
Device
Device ID
SR5690
5A10h
SR5670
5A12h
SR5650
5A13h
Branding Diagrams
AMD Logo
Northbridge
YYWW
MADE IN TAIWAN
WXXXXX
215-0716022
AMD Product Type
Date Code*
Country of Origin
Wafer Lot Number
Part Number
* YY - Assembly Start Year
WW - Assembly Start Week
Note: Branding can be in laser, ink, or
mixed laser-and-ink marking.
Figure 1-1 SR5690 Branding Diagram for A21 Production ASIC (RoHS-compliant Part)
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43869 SR5690 Databook 2.20
1-3
Conventions and Notations
AMD Logo
Northbridge
YYWW
MADE IN TAIWAN
WXXXXX
215-0716038
AMD Product Type
Date Code*
Country of Origin
Wafer Lot Number
Part Number
* YY - Assembly Start Year
WW - Assembly Start Week
Note: Branding can be in laser, ink, or
mixed laser-and-ink marking.
Figure 1-2 SR5690 Branding Diagram for A21 Production ASIC (Lead Free Part)
AMD Logo
Northbridge
YYWW
MADE IN TAIWAN
WXXXXX
215-0716056
AMD Product Type
Date Code*
Country of Origin
Wafer Lot Number
Part Number
* YY - Assembly Start Year
WW - Assembly Start Week
Note: Branding can be in laser, ink, or
mixed laser-and-ink marking.
Figure 1-3 SR5690 Alternate Branding for A21 Production ASIC (Lead Free Part)
1.6
Conventions and Notations
The following sections explain the conventions used throughout this manual.
1.6.1
Pin Names
Pins are identified by their pin names or ball references. All active-low signals are identified by the suffix ‘#’ in their
names (e.g., SYSRESET#).
1.6.2
Pin Types
The pins are assigned different codes according to their operational characteristics. These codes are listed in Table 1-2.
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Conventions and Notations
Table 1-2 Pin Type Codes
Code
1.6.3
Pin Type
I
Digital Input
O
Digital Output
I/O
Bi-Directional Digital Input or Output
M
Multifunctional
Pwr
Power
Gnd
Ground
A-O
Analog Output
A-I
Analog Input
A-I/O
Analog Bi-Directional Input/Output
A-Pwr
Analog Power
A-Gnd
Analog Ground
Other
Pin types not included in any of the categories above
Numeric Representation
Hexadecimal numbers are appended with “h” whenever there is a risk of ambiguity. Other numbers are in decimal.
Pins of identical functions but different trailing digits (e.g., DFT_GPIO0, DFT_GPIO1, ...DFT_GPIO5) are referred to
collectively by specifying their digits in square brackets and with colons (i.e., “DFT_GPIO[5:0]”). A similar short-hand
notation is used to indicate bit occupation in a register. For example, NB_COMMAND[15:10] refers to the bit positions
10 through 15 of the NB_COMMAND register.
1.6.4
Hyperlinks
Phrases or sentences in blue italic font are hyperlinks to other parts of the manual. Users of the PDF version of this manual
can click on the links to go directly to the referenced sections, tables, or figures.
1.6.5
Acronyms and Abbreviations
The following is a list of the acronyms and abbreviations used in this manual.
Table 1-3 Acronyms and Abbreviations
Acronym
Full Expression
ACPI
Advanced Configuration and Power Interface
ASPM
Active State Power Management
A-Link-E
A-Link Express interface between the Northbridge and Southbridge.
BGA
Ball Grid Array
BIOS
Basic Input Output System. Initialization code stored in a ROM or Flash RAM used to start up a
system or expansion card.
BIST
Built In Self Test.
DBI
Dynamic Bus Inversion
DPM
Defects per Million
EPROM
Erasable Programmable Read Only Memory
FCBGA
Flip Chip Ball Grid Array
FIFO
First In, First Out
VSS
Ground
GPIO
General Purpose Input/Output
HT
IDDQ
IOMMU
JTAG
HyperTransport™ interface
Direct Drain Quiescent Current
Input/Output Memory Management Unit
Joint Test Access Group. An IEEE standard.
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Conventions and Notations
Table 1-3 Acronyms and Abbreviations (Continued)
Acronym
Full Expression
MB
Mega Byte
NB
Northbridge
PCI
PCIe
®
PLL
Peripheral Component Interface
PCI Express®
Phase Locked Loop
POST
Power On Self Test
PD
Pull-down Resistor
PU
Pull-up Resistor
RAS
Reliability, Availability and Serviceability
SB
Southbridge
TBA
To Be Added
VRM
Voltage Regulation Module
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Chapter 2
Functional Descriptions
This chapter describes the functional operation of the major interfaces of the SR5690 system logic chip. Figure 2-1
illustrates the SR5690 internal blocks and interfaces.
CPU
Interface
CPU
PCIe
GPP2 Interface
(1 x 16 or 2 x 8 Lanes)
IO Controller
Root
Complex
IOMMU
PCIe®
GPP1 Interface
PCIe
GPP3 Interface
(6 Lanes for 6 ports, plus
4 Lanes for 1 port)
Expansion
Slots
(1 x 16 or 2 x 8 Lanes)
Expansion
Slots
A-Link-E
Interface
Expansion
Slots
(1 x 4 Lanes)
Southbridge
HyperTransport™ 3
Unit
Register Interface
Figure 2-1 SR5690 Internal Blocks and Interfaces
2.1
HyperTransport™ Interface
2.1.1
Overview
The SR5690 is optimized to interface with “Shanghai” and subsequent series of AMD server/workstation and desktop
processors through sockets F, AM3, G34, and C32. The SR5690 supports HyperTransport™ 3 (HT3), as well as
HyperTransport 1 (HT1) for backward compatibility and for initial boot-up. For a detailed description of the interface,
please refer to the HyperTransport I/O Link Specification from the HyperTransport Consortium. Figure 2-2,
“HyperTransport™ Interface Block Diagram,” illustrates the basic blocks of the host bus interface of the SR5690.
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2-1
HyperTransport™ Interface
10.4 GB/s to
CPU
10.4 GB/s from
CPU
Tx PHY
Rx PHY
Tx PHY Interface
Rx PHY Interface
Protocol Transmitter
Protocol Receiver
Response
Interface
Upstream Arbitration
Host Interface
Host read
responses
DMA requests
IOMMU
requests
DMA
read
response
data
Host
requests
Host read
responses
IOMMU L2
PCIe® Cores
I/O Controller
Figure 2-2 HyperTransport™ Interface Block Diagram
The SR5690 HyperTransport bus interface consists of 16 unidirectional differential Command/Address/Data pins, and 2
differential Control pins and 2 differential Clock pins in both the upstream and downstream directions. On power up, the
link is 8-bit wide and runs at a default speed of 400MT/s in HyperTransport 1 mode. After negotiation, carried out by the
HW and SW together, the link width can be brought up to the full 16-bit width and the interface can run up to 5.2GT/s in
HyperTransport 3 mode. In HyperTransport 1 mode, the interface operates by clock-forwarding while in HyperTransport
3 mode, the interface operates by dynamic phase recovery, with frequency information propagated over the clock pins.
The interface is illustrated below in Figure 2-3, “SR5690 HyperTransport™ Interface Signals.” The signal name and
direction for each signal is shown with respect to the SR5690. Detailed descriptions of the signals are given in Section 3.3,
“CPU HyperTransport™ Interface‚’ on page 3-4.
43869 SR5690 Databook 2.20
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© 2012 Advanced Micro Devices, Inc.
Proprietary
HyperTransport™ Interface
HT_TXCALN
HT_TXCALP
HT_RXCALP
2
HT_TXCLKN
2
HT_TXCTLP
2
HT_TXCTLN
2
HT_TXCADP
16
HT_TXCADN
16
HT_RXCLKP
2
HT_RXCLKN
2
HT_RXCTLP
2
HT_RXCTLN
2
HT_RXCADP
16
HT_RXCADN
16
CPU
SR5690
HT_RXCALN
HT_TXCLKP
Figure 2-3 SR5690 HyperTransport™ Interface Signals
The SR5690 HyperTransport interface has the following features:
•
•
•
•
•
•
•
•
•
•
2.1.2
HyperTransport 3.0 compliant
16-bit and 8-bit link widths supported. Width for each direction of the link is independently controlled.
400MT/s to 5.2GT/s link speeds in increments of 400MT/s (up to 2GT/s only for HyperTransport 1 mode)
DC-coupled HyperTransport mode only
UnitID clumping for x16 PCI Express® ports
Isochronous flow-control mode for Southbridge audio and IOMMU traffic
64-bit address extension support (52-bit physical addressing)
Link disconnection with tristate, LS1, and LS2 low-power modes
Error retry in HyperTransport 3 mode
Full HyperTransport-defined BIST support for both internal and external loopback modes
HyperTransport™ Flow Control Buffers
The SR5690 HTIU implements the following flow control buffers in its receiver:
Table 2-1 SR5690 HyperTransport™ Flow Control Buffers
Flow Control Buffer Type
Posted
Non-Posted
Cmd
16
16
Data
16
1
Advertise 63 credits.
ISOC Cmd
0
0
Advertise 63 credits.
ISOC Data
0
0
Advertise 63 credits.
© 2012 Advanced Micro Devices, Inc.
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Response
Advertise 63 credits.
43869 SR5690 Databook 2.20
2-3
IOMMU
2.2
IOMMU
The SR5690’s IOMMU (Input/Output Memory Management Unit) block provides address translation and protection
services as described in version 1.26 of the AMD I/O Virtualization Technology (IOMMU) Specification. The SR5690
also supports the PCI Express Address Translation Services 1.0 Specification, which allows the supporting of endpoint
devices to request and cache address translations.
When DMA requests containing virtual addresses are received, the IOMMU looks up the page translation tables located
in the system memory in order to convert the virtual addresses into physical addresses and to verify access privileges.
On-chip caching is provided in order to speed up translation and reduce or eliminate the number of system memory
accesses required. Every PCIe core contains a local translation cache, and the SR5690 also contains a shared global
translation cache.
The SR5690 supports up to 216 domains, each of which can utilize a separate 64-bit virtual address space. It supports a
52-bit physical address space.
2.3
Multiple Northbridge Support
Multiple SR5690/5670/5650 (referred to as “SR56x0”below) Northbridges may be implemented in the same system given
enough free HyperTransport links from the processor complex. However, only a single Southbridge may be used. The
SR56x0 attached to the Southbridge is called the primary SR56x0, and any other instance of SR56x0 is called a secondary
SR56x0. The A-Link Express interface on any secondary SR56x0 must be left unconnected, and it cannot be used to
support any PCI Express endpoint devices.
The PWM_GPIO5 pin-strap is used to indicate whether an SR56x0 is a primary or a secondary Northbridge. If no
pull-down resistor is attached on the pin, the internal pull-up resistor on it will set the strap value to “1,” indicating the
device to be a primary Northbridge. On any secondary SR56x0, the PWM_GPIO5 pin-strap must be pulled low.
In the multi-NB mode, special PCI Express messages for functions such as PME may be passed from a secondary SR56x0
to the primary SR56x0 or the Southbridge over the HyperTransport bus. If the SR56x0’s internal IOAPIC is not used,
INTx messages may also be forwarded over the HyperTransport bus to the Southbridge IOAPIC. Peer-to-peer writes
between PCI Express endpoints are also allowed between any SR56x0 and another by routing peer-to-peer requests over
the HyperTransport bus.
Note: As it is possible to mix-and-match SR5650, SR5670, and SR5690 on the same system, whenever a
multiple-SR5690 configuration is being referred to in this document, it actually represents any combination of SR5650,
SR5670, and SR5690 possible under that situation. Some constrains may apply.
2.4
Interrupt Handling
2.4.1
Legacy INTx Handling
In legacy interrupt mode, all INTx messages must be routed to the Southbridge IOAPIC. The primary NB directs all INTx
messages directly down to the Southbridge IOAPIC. Secondary NBs direct INTx messages up to the processor complex,
where they are broadcast down to all HT devices. See Section 2.3, “Multiple Northbridge Support‚’ on page 2-4 for
details.
The 4 legacy interrupts sent by endpoint devices (INT A/B/C/D) may undergo a 2-stage programmable swizzling process
that maps them onto the 8 possible internal INTx messages (INT A/B/C/D/E/F/G/H). The first swizzling stage is
performed by rotating the interrupt message number based upon the bridge device number. The second stage is register
controllable on a per-bridge basis and maps the rotated INT A/B/C/D onto INT E/F/G/H. INT A to H messages sent to the
Southbridge are mapped onto the SB IOAPIC interrupt redirection table entries 16 to 23.
2.4.2
Non-SB IOAPIC Support
The SR5690 supports routing legacy IOAPIC memory-mapped I/O addresses (0xFECx_xxxx) to any PCI Express port to
support endpoint devices with integrated IOAPIC.
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Interrupt Handling
2.4.3
Integrated IOAPIC Support
The SR5690 supports routing local INTx messages to its integrated IOAPIC. The integrated IOAPIC contains a 32-entry
redirection table. INTx messages from endpoint devices, bridges, HTIU, and IOMMU can be mapped onto different
redirection entries under register control.
2.4.4
MSI Interrupt Handling and MSI to HT Interrupt Conversion
In MSI interrupt mode, all interrupts are sent directly from the endpoint devices through the SR5690 up to the processor
complex. All MSI interrupts are converted into HT-formatted interrupts. For MSIs from PCI Express endpoint devices
and internally generated PCI Express interrupts, the conversion occurs in the associated IOMMU L1 block. For IOMMU
interrupts and, optionally, HT error interrupts and internal parity error interrupts, the conversion occurs in the HTIU
block. HT error interrupts and internal parity error interrupts may be optionally redirected to an MSI generation block
underneath the SB VC1 IOMMU L1 so that they can be remapped by IOMMU. IOMMU internal MSI interrupts are never
remapped.
The PCI configuration spaces of each on-board device contains a fixed HT MSI mapping capability (except for Device 1,
which is unused). This implies that all MSI interrupts with address 0xFEEx_xxxx have to be converted to HT interrupts.
Because of this, software is required to program all MSI address registers with an 0xFEEx_xxxx address.
2.4.5
Internally Generated Interrupts
The SR5690 may internally generate interrupts for the following purposes:
•
•
•
•
•
•
PCI Express error
PCI Express PME
HT error
Internal parity error
IOMMU command handler
IOMMU event logger
Internally generated interrupts may be in either legacy INTx or MSI format. Internal MSI interrupt sources do not support
per-vector masking.
2.4.6
IOMMU Interrupt Remapping
When the IOMMU is enabled, interrupts generated downstream of the IOMMU are remapped based upon the IOMMU
tables. The following classes of interrupts are not remapped by the IOMMU because they are generated upstream of the
IOMMU:
•
•
•
2.4.7
HT error (optional)
Internal parity error (optional)
IOMMU command handler and event logger
Interrupt Routing Architecture
2.4.7.1 Legacy Mode
Primary SR5690: Legacy INTx messages are routed directly to the SB IOAPIC. The SB IOAPIC generates upstream
interrupt requests, which are translated by the IOMMU before they are delivered up to the processor complex.
Secondary SR5690: Legacy INTx messages are routed over HyperTransport through the processor complex to the
primary SR5690, which forwards them to the SB IOAPIC. The SB IOAPIC generates upstream interrupt requests, which
are translated by the IOMMU before being delivered up to the processor complex.
The routing paths are illustrated in Figure 2-4 below.
© 2012 Advanced Micro Devices, Inc.
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43869 SR5690 Databook 2.20
2-5
Interrupt Handling
PCI-E
Endpoint
Device
CPU
CPU
SR5690
SR5690
PCI-E
Endpoint
Device
INTx Message from device attached to primary SR5690
INTx Message from device attached to secondary SR5690
Interrupts from SB IOAPIC
SB
Figure 2-4 Interrupt Routing Paths in Legacy Mode
2.4.7.2 Legacy Mode with Integrated IOAPIC
For both the primary and secondary SR5690s, legacy INTx messages are routed to the integrated IOAPICs of the
SR5690s, which generates interrupt requests. These requests are remapped by the IOMMU before being delivered up to
the processor complex. If an INTx message gets directed to an IOAPIC table entry that is not enabled, the IOAPIC sends
the INTx message back to the IOC to go to the SB PIC/IOAPIC.
The routing paths are illustrated in Figure 2-5 below.
PCI-E
Endpoint
Device
SR5690
CPU
CPU
HT
IOMMU
PCI-E
Endpoint
Device
PCIExpress
IOAPIC
SR5690
INTx Message from PCI-Express device attached to SR5690
Internal interrupt
Remapped HT Interrupt
SB
Figure 2-5 Interrupt Routing Paths in Legacy Mode with Integrated IOAPIC
43869 SR5690 Databook 2.20
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© 2012 Advanced Micro Devices, Inc.
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RAS Features
2.4.7.3 MSI Mode
For both the primary and secondary SR5690s: MSI interrupt requests are remapped by the IOMMU and sent up to the
processor complex. The routing path is illustrated in Figure 2-6 below.
PCI-E
Endpoint
Device
SR5690
CPU
CPU
HT
IOMMU
PCI-E
Endpoint
Device
PCIExpress
SR5690
MSI Interrupt from PCI-Express device attached to SR5690
Remapped HT Interrupt
SB
Figure 2-6 Interrupt Routing Path in MSI Mode
2.5
RAS Features
2.5.1
Parity Protection
All memories in SR5690 are parity protected to reduce the possibility of silent data corruption. Multiple parity words are
interleaved to convert burst errors (multiple physically adjacent bits corrupted) into multiple single-bit detectable errors to
increase robustness. The minimum number of interleaved parity words in any on-board memory is 4. All macros contain
test circuitry for software to generate false errors on either the read or write side of the memory for verification of error
handling routines. Error injection circuitry only corrupts parity bits rather than real data bits to avoid data corruption.
2.5.1.1 Parity Protection for IOMMU Cache Memories
All IOMMU cache memories are parity protected. When a parity error is detected, the access from the associated bank is
marked as an automatic miss. The cache line is marked as invalid and may later be overwritten with data from system
memory (which is ECC protected). The error is logged in a status bit and an optional interrupt is generated (either fatal,
non-fatal, or correctable parity error).
2.5.1.2 Parity Protection for Normal Memories
All normal memories are also parity protected. When a parity error is detected, the failure is likely to be fatal as there is no
automatic recovery mechanism and no way for hardware to tag a specific request or operation with the error. The error is
logged in a status bit for later diagnosis and an optional interrupt is generated (either fatal or non-fatal parity error).
2.5.2
SERR_FATAL# and NON_FATAL_CORR# Pins
The SR5690 implements a dedicated pin, DBG_GPIO0/SERR_FATAL#, to signal either a system or a fatal error, which
can be used to signal a BMC for further actions. SERR_FATAL# may be asserted on various error conditions like HT
syncflood, as well as internal parity errors or fatal errors for which signalling by SERR_FATAL# is enabled. Fatal errors
are identified via the fatal error status bits.
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43869 SR5690 Databook 2.20
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RAS Features
Non-fatal or correctable errors may be likewise signalled via DBG_GPIO3/NON_FATAL_CORR#.
The SERR_FATAL# and NON_FATAL_CORR# pin functionalities are disabled on warm reset.
2.5.3
NMI# and SYNCFLOODIN#
The SR5690 may configure the DFT_GPIO0/NMI# pin as an input pin for triggering an upstream NMI packet to the
processor complex. The pin should be driven by a BMC. An internal sticky status bit records the use of the NMI# pin.
Also, the SR5690 may configure the DFT_GPIO5/SYNCFLOODIN# pin as an input pin for triggering a HyperTransport
syncflood event. The pin should driven by a BMC. An internal sticky status bit records the use of the SYNCFLOODIN#
pin.
2.5.4
Suggested Platform Level RAS Sideband Signal Connections
Figure 2-7 is a logical diagram showing suggestions for RAS sideband signal connections at the platform level .
43869 SR5690 Databook 2.20
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© 2012 Advanced Micro Devices, Inc.
Proprietary
RAS Features
Separate connections to
debug pins and GPIO
expander for each SR5690
in the system
DBG_GPIO0/
SERR_FATAL#
DBG_GPIO3/
NON_FATAL_CORR#
NMI# only needs to
be connected on
the primary SR5690
BMC, SuperIO or other GPIO
source
Enable signals
should default to
logic 0 on reset/
powergood
DFT_GPIO0/NMI#
Enable only after
reset. This is a pinstrap sampled
shortly after
powergood
Add option to drive
SYNCFLOODIN#
pins on all SR5690s
in the system
SCL/SDA
Interrupt line to
Sys_SMBUS_IO_EXP_INTR_L
OPMA pin
SR5690
DFT_GPIO5/
SYNCFLOODIN#
GPIO Expander
attached to OPMA
SMBus (either private
0 or private 1 SMBus
segments).
Alternately, this can
connect directly to a
BMC
S/W path to
trigger NMI#
pin
From NMI button and
MCARD_NMIBTN_L
OPMA pin
To
SYS_NMIBTN_L
OPMA pin
Enable only after
reset. This is a pinstrap sampled
shortly after
powergood
Attach to a pin that can
generate SMI# like
USB_OC5#/IR_TX0/
GPM5#
PCIe®
SP5100
SERR_FATAL# and
NON_FATAL_CORR#
from other SR5690s.
These are buffered to help
isolate the failing device.
Figure 2-7 Suggested Platform Level RAS Sideband Signal Connections
2.5.5
Error Reporting and Logging
2.5.5.1 PCI Error Logging
The SR5690 implements all PCI standard error logging bits for all on-board devices and functions including the host
bridge device, IOMMU, and PCI Express bridges.
2.5.5.2 PCIe® Advanced Error Reporting
The SR5690 PCIe® cores implement the optional Advanced Error Reporting (AER) feature mechanism in the PCI
Express 2.0 Base Specification. Errors are logged for received packet errors such as poisoned data, malformed TLP, and
etc. within the PCIe core and are accessible via the bridge configuration spaces.
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43869 SR5690 Databook 2.20
2-9
RAS Features
The ACS violations for ACS Source Validation and ACS Translation Blocking are recorded in the AER error log. Errors
due to IOMMU translation failures are not logged as ACS violations, but are logged as UR or CA depending on the error
type.
IOC may abort a non-posted request with UR status if it determines that the request will not hit system memory. Such
errors are pushed back into the PCIe core for logging. The IOC must abort potential peer-to-peer non-posted requests to
avoid a deadlock condition. For posted requests, the IOC can be configured to forward all non-decoded (non system
memory and non-peer-to-peer) posted requests up to the processor, which may abort the request and generate an MCA
error log.
For downstream completions with abort status coming back from the processor, error status is propagated to the endpoint
but no AER header information is logged in the chipset.
For upstream completions, error status is propagated up to the processor and AER information may be logged.
Table 2-2 lists the types of errors that are detectable by the SR5690 AER implementation. For details, see the PCI Express
2.0 Base Specification.
Table 2-2 Types of Errors Detectable by the SR5690 AER Implementation
Error Type
Error Class
ACS Violation
Uncorrectable – Fatal or Non-fatal
Unsupported Request
Uncorrectable – Fatal or Non-fatal
Malformed TLP
Uncorrectable – Fatal or Non-fatal
Unexpected Completion
Uncorrectable – Fatal or Non-fatal
Completer Abort
Uncorrectable – Fatal or Non-fatal
Completion Timeout
Uncorrectable – Fatal or Non-fatal
Poisoned TLP Received
Uncorrectable – Fatal or Non-fatal
Data Link Layer Protocol Error
Uncorrectable – Fatal or Non-fatal
ECRC Error
Uncorrectable – Fatal or Non-fatal
Replay Timeout
Correctable
REPLAY_NUM Rollover
Correctable
Bad DLLP
Correctable
Bad TLP
Correctable
The following error classes are NOT supported:
•
•
•
•
Receiver Overflow Error
Flow Control Error
Surprise Down Error
Receiver Error
2.5.5.3 IOMMU Error Reporting
The IOMMU specification defines a standard error logging facility that logs error events in system memory with register
status bits or interrupt notification to system software. The SR5690 fully supports the generation of logging events
following this standard.
2.5.5.4 HyperTransport™ Error Reporting
The HyperTransport specification defines various levels of error handling for link-related errors. The SR5690 supports
the detection of most error classes including protocol error, overflow error, and response error. The SR5690 also supports
notification of error conditions via fatal interrupts, non-fatal interrupts, or syncflood.
Table 2-3 lists the types of errors supported by the error handling capabilities of the SR5690 for HyperTransport.
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RAS Features
Table 2-3 Types of HyperTransport™ Errors Supported by the SR5690
Error Type
Description
Response Error
Received incorrect response type such as tgtdone for read request, read response for flush, or size of
received data did not match size of requested data.
Overflow Error
Flow-control buffer overflow in the receiver. This is only mapped to a fatal or non-fatal error in HT1
mode. In HT3 mode, this maps onto a retry in the hope that when the packet is subsequently received,
there is space in the FCB. No interrupt will be generated in HT3 mode.
CRC Error
Periodic CRC error
Retry Error
Per-packet CRC error received
Retry Count Rollover
Per-packet CRC error counter overflowed. Non-fatal interrupt only.
Protocol Error
Protocol conditions detected in HT1 mode:
• Data count not matching header
• Invalid command encoding
• Invalid CTL encoding
• Incomplete header
• Unexpected data
Protocol conditions detected in HT3 mode
• Data count not matching header
• Invalid command encoding
• Invalid CTL encoding
• Incomplete header
• Unexpected data
• Unexpected CRC
• Missing CRC
• Non-NOP inserted command
• Inserted command without inserted command CTL encoding
End of chain error is not supported, since the end of the chain is on PCI Express instead HyperTransport.
2.5.5.5 Internal Parity Error Reporting
One register bit per memory macro is used to log parity errors. Values for those bits are persistent across a warm reset for
diagnostic purposes.
2.5.6
Interrupt Generation on Errors
Internal interrupts may be generated on the following error conditions:
•
•
•
•
•
2.5.7
PCI Express errors (fatal, non-fatal, or correctable)
HT errors (fatal or non-fatal)
IOMMU events
Internal parity error (fatal or non-fatal)
Internal parity error in the IOMMU cache (fatal, non-fatal, or correctable)
Poisoned Data Support
The SR5690 supports the propagation of poisoned data attributes (EP in PCIe and Data Error in HT) between PCI Express
endpoints and the processor for both host and DMA requests or responses. The SR5690 cannot actively mark a transaction
with a poisoned data attribute even if the transaction encounters an internal parity error. Received packets containing
ECRC errors are not marked as poisoned.
2.5.8
PCIe® Link Disable State
The SR5690 has the ability to put PCIe links into the disabled state as an error response in order to help stop data
movement within the system. Links which received fatal errors may be disabled. Also, a HyperTransport syncflood event
may be used to trigger all links to enter the disabled state.
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43869 SR5690 Databook 2.20
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PCI Express®
2.5.9
HT Syncflood Based on PCIe® Error
The SR5690 has the ability to put the HyperTransport link into the syncflood state when a fatal or non-fatal error is
received on the PCIe interface. This is done in order to help stop data movement within the system.
2.6
PCI Express®
2.6.1
PCIe® Ports
In total, there are 12 PCIe® ports on the SR5690, divided into 5 groups and implemented in hardware as 5 separate cores:
•
PCIE-GPP1: 2 general purpose ports, 16 lanes in total. Width of each port is x8. In the default configuration, the 2
ports are combined to provide a 1 x16 port.
•
PCIE-GPP2: 2 general purpose ports, 16 lanes in total. Width of each port is x8. In the default configuration, the 2
ports are combined to provide a 1 x16 port.
•
PCIE-GPP3a: 6 general purpose ports, with 6 lanes in total. They support 6 different configurations with respect to
link widths: 4:2, 4:1:1, 2:2:2, 2:2:1:1, 2:1:1:1:1, and 1:1:1:1:1:1 (default configuration).
•
PCIE-GPP3b: 1 general purpose port, with 4 lanes in total. Width of the port is x4. For details on the possible
configurations for the GPP3 lanes, see Table 2-4 below and Table 3-11, “Strap Definition for
STRAP_PCIE_GPP_CFG‚’ on page 3-10.
Table 2-4 Possible Configurations for the PCI Express® General Purpose Links
PCIe Core
Physical Lane
Config. B
Config. C Config. C2 Config. E
Config. K
x2
x2
GPP3 lane 0
GPP3 lane 1
GPP3a
GPP3 lane 2
x4
x4
x2
GPP3 lane 3
GPP3 lane 4
GPP3 lane 5
x2
x1
x1
x2
x2
x1
x1
x2
Config. L
x1
x1
x1
x1
x1
x1
x1
x1
x1
x1
x4
x4
x4
GPP3 lane 6
GPP3b
GPP3 lane 7
GPP3 lane 8
x4
x4
x4
GPP3 lane 9
•
PCIE-SB: The Southbridge port provides a dedicated x4 link to the Southbridge (also referred to as the “A-Link
Express II interface”).
Each port supports the following PCIe functions:
•
•
•
•
•
•
•
•
•
2.6.2
PCIe Gen 1 link speeds
ASPM L0s and L1 states
ACPI power management
Endpoint and root complex initiated dynamic link degradation
Lane reversal
Alternative Routing-ID Interpretation (ARI)
Access Control Services (ACS)
Advanced Error Reporting (AER)
Address Translation Services (ATS)
PCIe® Reset Signals
Reset signals to non-hot-plug PCIe slots, as well as embedded PCIe devices, must be controlled through one or more
software-controllable GPIO pins instead of the global system reset. It is recommended that unique GPIO pins be used for
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PCI Express®
each slot or device. Hot-plug PCIe slots must have their reset signals connected to unique, individually controllable GPIO
pins. The SR5690 has four GPIO pins that may be used for the purpose of driving reset signals (PCIE_GPIO_RESET[5:4]
and PCIE_GPIO_RESET[2:1]). Additional reset GPIO pins may be driven by platform-specific means such as a super I/O
or an I/O expander.
2.6.3
PCIe® Hot-Pug
The SR5690 supports hot-plug function for up to eight PCIe slots. Firmware support, available from AMD, is required for
the function. Hot-plug signals from the PCIe slots are connected to the PCIe hot-plug interface of the SR5690 through
PCA9539 I/O expanders, each of which supports up to two slots. Figure 2-8 illustrates the connections to the hot-plug
interface in the maximal (eight slots) configuration. Figure 2-9 shows the signals that go between the PCA9539 I/O
expander and the PCIe hot-plug slot.
Hot-plug support is available on any PCIe slot connected to the GPP1, GPP2, or GPP3b core, and up to three slots
connected to the GPP3a core (i.e., connected through GPP3 lane 0 to lane 5). When more than three PCIe slots are
connected to the GPP3a core , the PCIe hot-plug function is only available on the three ports on the lower lanes. Table 2-5
shows the ports with hot-plug support for each configuration of the GPP3a core.
SR5690
PWM_GPIO2/PCIE_HP_INT_L
DBG_GPIO1/PCIE_HP_SCL
DBG_GPIO2/PCIE_HP_SDA
SDA
SCL
INT#
PCA9539
PCA9539
PCA9539
PCA9539
Slot 5
Slot 7
Hot-plug
signals
Slot 1
Slot 2
Slot 3
Slot 4
Slot 6
Slot 8
Figure 2-8 Hot-plug Interface Connections
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43869 SR5690 Databook 2.20
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External Clock Chip
IOx.7
IOx.6
IOx.5
IOx.4
IOx.3
IOx.2
IOx.1
IOx.0
PCA9539
PRSNT#
PWRFLT#
ATNSW#
EMILS
PWREN#
ATNLED
PWRLED
EMIL
Figure 2-9 Hot-plug Signals between PCIe® Slot and I/O Expander
Table 2-5 GPP3a Ports with PCIe® Hot-Plug Support (Shaded)
PCIe Core
Physical Lane
Config. B
Config. C Config. C2 Config. E
Config. K
x2
x2
GPP3 lane 0
GPP3 lane 1
GPP3a
GPP3 lane 2
x4
x2
GPP3 lane 3
GPP3 lane 4
GPP3 lane 5
2.7
x4
x2
x1
x1
x2
x2
x1
x1
x2
Config. L
x1
x1
x1
x1
x1
x1
x1
x1
x1
x1
External Clock Chip
On the SR5690 platform, an external clock chip provides the CPU, PCI Express, and A-Link Express II reference clocks.
For requirements on the clock chip, please refer to the 800-Series IGP Express AMD Platform External Clock Generator
Requirements Specification for Server Platforms.
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Chapter 3
Pin Descriptions and Strap Options
This chapter gives the pin descriptions and the strap options for the SR5690. To jump to a topic of interest, use the
following list of hyperlinked cross references:
“Pin Assignment Top View” on page 3-2
“SR5690 Interface Block Diagram” on page 3-4
“CPU HyperTransport™ Interface” on page 3-4
“PCI Express® Interfaces” on page 3-5:
“PCI Express® Interface for General Purpose External Devices” on page 3-5
“A-Link Express II Interface to Southbridge” on page 3-5
“Miscellaneous PCI Express® Signals” on page 3-6
“Clock Interface” on page 3-6
“Power Management Pins” on page 3-7
“Miscellaneous Pins” on page 3-7
“Power Pins” on page 3-8
“Ground Pins” on page 3-9
“Strapping Options” on page 3-10
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
3-1
Pin Assignment Top View
3.1
Pin Assignment Top View
1
2
A
B
3
4
5
6
7
8
9
10
11
12
13
14
VDDPCIE
GPP1_TX6P
VSS
GPP1_TX5P
VSS
GPP1_TX3P
VSS
GPP1_TX1P
VSS
VDDA18PCIE
VDDA18PCIE
VSS
VDDPCIE
VSS
GPP1_TX6N
GPP1_RX6P
GPP1_TX5N
GPP1_TX4P
GPP1_TX3N
GPP1_TX2P
GPP1_TX1N
GPP1_TX0P
VDDA18PCIE
VDDA18PCIE
VSS
C
VDDPCIE
VSS
VDDPCIE
VSS
GPP1_RX6N
VSS
GPP1_TX4N
VSS
GPP1_TX2N
VSS
GPP1_TX0N
VDDA18PCIE
VDDA18PCIE
VSS
D
GPP1_RX7N
GPP1_RX7P
VSS
VDDPCIE
VSS
GPP1_RX5P
VSS
GPP1_RX3P
VSS
GPP1_RX1P
VSS
VDDA18PCIE
VDDA18PCIE
VSS
E
VSS
GPP1_TX7N
GPP1_TX7P
VSS
VDDPCIE
GPP1_RX5N
GPP1_RX4P
GPP1_RX3N
GPP1_RX2P
GPP1_RX1N
GPP1_RX0P
VDDA18PCIE
VDDA18PCIE
PCE_TCALRN
F
GPP1_TX8N
GPP1_TX8P
VSS
GPP1_RX8N
GPP1_RX8P
VDDPCIE
GPP1_RX4N
VSS
GPP1_RX2N
VSS
GPP1_RX0N
VDDA18PCIE
VDDA18PCIE
PCE_TCALRP
G
VSS
GPP1_TX9N
GPP1_TX9P
VSS
GPP1_RX9N
GPP1_RX9P
VDDPCIE
VDDPCIE
VSS
VDDPCIE
VSS
VDDA18PCIE
VDDA18PCIE
VDDA18PCIE
H
GPP1_TX10N
GPP1_TX10P
VSS
GPP1_RX10N
GPP1_RX10P
VSS
VDDPCIE
GPP1_REFCL
KN
VDDPCIE
VSS
VDDPCIE
VDDA18PCIE
VDDA18PCIE
VDDA18PCIE
GPP1_REFCL
KP
J
VSS
GPP1_TX11N
GPP1_TX11P
VSS
GPP1_RX11N
GPP1_RX11P
VSS
K
GPP1_TX12N
GPP1_TX12P
VSS
GPP1_RX12N
GPP1_RX12P
VSS
VDDPCIE
VSS
L
VSS
GPP1_TX13N
GPP1_TX13P
VSS
GPP1_RX13N
GPP1_RX13P
VSS
VDDPCIE
VDDA18PCIE
VSS
VSS
VDDC
M
GPP1_TX14N
GPP1_TX14P
VSS
GPP1_RX14N
GPP1_RX14P
VSS
VDDPCIE
VSS
VSS
VSS
VDDC
VSS
N
VSS
GPP1_TX15N
GPP1_TX15P
VSS
GPP1_RX15N
GPP1_RX15P
VSS
VDDPCIE
VSS
VDDC
VSS
VDDC
P
GPP2_TX0N
GPP2_TX0P
VSS
GPP2_RX0N
GPP2_RX0P
VSS
VDDPCIE
VSS
VSS
VSS
VDDC
VSS
R
VSS
GPP2_TX1N
GPP2_TX1P
VSS
GPP2_RX1N
GPP2_RX1P
VSS
VDDPCIE
VSS
VDDC
VSS
VDDC
T
GPP2_TX2N
GPP2_TX2P
VSS
GPP2_RX2N
GPP2_RX2P
VSS
VDDPCIE
VSS
VSS
VSS
VDDC
VSS
VSS
VSS
VSS
VDDC
VDDA18PCIE
VSS
VSS
VSS
VSS
VDDPCIE
VSS
GPP3_REFCL
KN
VSS
U
VSS
GPP2_TX3N
GPP2_TX3P
VSS
GPP2_RX3N
GPP2_RX3P
VSS
GPP2_REFCL
KN
V
GPP2_TX4N
GPP2_TX4P
VSS
GPP2_RX4N
GPP2_RX4P
VSS
VDDPCIE
GPP2_REFCL
KP
W
VSS
GPP2_TX5N
GPP2_TX5P
VSS
GPP2_RX5N
GPP2_RX5P
VSS
VDDPCIE
Y
GPP2_TX6N
GPP2_TX6P
VSS
GPP2_RX6N
GPP2_RX6P
VSS
VDDPCIE
VSS
AA
VSS
GPP2_TX7N
GPP2_TX7P
VSS
GPP2_RX7N
GPP2_RX7P
VSS
VDDPCIE
VSS
VDDPCIE
AB
GPP2_TX8N
GPP2_TX8P
VSS
GPP2_RX8N
GPP2_RX8P
VSS
VDDPCIE
VSS
VDDPCIE
VSS
VDDPCIE
VSS
VDDPCIE
AC
VSS
GPP2_TX9N
GPP2_TX9P
VSS
VSS
VDDPCIE
GPP2_RX13P
VSS
GPP2_RX15P
VSS
GPP3_RX9N
VSS
GPP3_RX7N
VSS
AD
GPP2_RX9N
GPP2_RX9P
VSS
VSS
VDDPCIE
GPP2_RX12P
GPP2_RX13N
GPP2_RX14P
GPP2_RX15N
PCE_RCALRN
GPP3_RX9P
GPP3_RX8N
GPP3_RX7P
GPP3_RX6N
GPP3_RX6P
AE
VSS
GPP2_TX10N
GPP2_TX10P
VDDPCIE
VSS
GPP2_RX12N
VSS
GPP2_RX14N
VSS
PCE_RCALRP
VSS
GPP3_RX8P
VSS
AF
GPP2_RX10N
GPP2_RX10P
VDDPCIE
VSS
GPP2_RX11P
VSS
GPP2_TX13P
VSS
GPP2_TX15P
VSS
GPP3_TX8N
VSS
GPP3_TX6N
VSS
VDDPCIE
VSS
GPP2_TX11P
GPP2_RX11N
GPP2_TX12P
GPP2_TX13N
GPP2_TX14P
GPP2_TX15N
GPP3_TX9N
GPP3_TX8P
GPP3_TX7N
GPP3_TX6P
GPP3_TX5N
VSS
GPP2_TX11N
VSS
GPP2_TX12N
VSS
GPP2_TX14N
VSS
GPP3_TX9P
VSS
GPP3_TX7P
VSS
GPP3_TX5P
3
4
5
6
7
8
9
10
11
12
13
14
AG
AH
1
2
CPU Interface
A-Link Express II Interface
Clock Interface
PCIe® GPP1 General Purpose Interface
PCIe GPP2 General Purpose Interface
PCIe GPP3 General Purpose Interface
Power Management Interface
Core Power
PCIe Main I/O Power
PCIe 1.8V I/O Power and PLL Power
GPIO 1.8V I/O Power
HyperTransport™ Interface Power
Grounds
Other
43869 SR5690 Databook 2.20
3-2
© 2012 Advanced Micro Devices, Inc.
Proprietary
Pin Assignment Top View
15
16
17
18
19
20
21
DBG_GPIO3/
NON_FATAL_CO
RR#
22
23
24
25
26
VSS
DFT_GPIO1
VSS
DFT_GPIO2
DFT_GPIO3
DFT_GPIO0/
NMI#
27
28
PWM_GPIO4
VSS
POWERGOO
D
VDD18
TESTMODE
VSS
VSS
PWM_GPIO2/P
CIE_HP_INT_L
PWM_GPIO6
OSCIN
VDD18
PCIE_RESET_
GPIO1
I2C_CLK
DBG_GPIO2/
PCIE_HP_
SDA
DFT_GPIO5/
SYNCFLOODIN
#
DBG_GPIO1/
PCIE_HP_SCL
DFT_GPIO4
VSS
PWM_GPIO5
VSS
VDD18
VSS
I2C_DATA
VSS
DBG_GPIO0/S
ERR_FATAL#
VSS
VDDHTTX
VDDHTTX
VDDHTTX
VDDHTTX
VDDHTTX
C
SYSRESET#
VSS
PCIE_RESET_
GPIO2
VDD18
PCIE_RESET_
GPIO3
VSS
ALLOW_LDTS
TOP
VDDHTTX
VDDHTTX
HT_RXCALN
HT_RXCALP
VSS
HT_TXCALN
HT_TXCALP
D
LDTSTOP#
PWM_GPIO1
PCIE_RESET_
GPIO5
VDD18
PCIE_RESET_
GPIO4
VSS
STRP_DATA
VDDHTTX
HT_TXCAD8P
HT_TXCAD8N
VSS
HT_TXCAD0P
HT_TXCAD0N
VSS
E
VSS
PWM_GPIO3
VSS
VSS
VSS
VSS
VSS
VDDHTTX
VSS
HT_TXCAD9P
HT_TXCAD9N
VSS
HT_TXCAD1P
HT_TXCAD1N
F
VSS
VSS
VSS
VSS
VSS
VSS
VDDA18HTPL
L
VDDHTTX
HT_TXCAD10
P
HT_TXCAD10
N
VSS
HT_TXCAD2P
HT_TXCAD2N
VSS
G
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDDHTTX
VSS
HT_TXCAD11
P
HT_TXCAD11
N
VSS
HT_TXCAD3P
HT_TXCAD3N
H
HT_REFCLKN
VSS
HT_TXCLK1P
HT_TXCLK1N
VSS
HT_TXCLK0P
HT_TXCLK0N
VSS
J
HT_TXCAD12
N
K
A
VSS
B
HT_REFCLKP
VDDHT
VSS
HT_TXCAD12
P
VSS
HT_TXCAD4P
HT_TXCAD4N
VSS
VDDC
VSS
VSS
VDDHT
VSS
HT_TXCAD13
P
HT_TXCAD13
N
VSS
HT_TXCAD5P
HT_TXCAD5N
VSS
L
VDDC
VSS
VSS
VSS
VSS
VDDHT
VSS
HT_TXCAD14
P
HT_TXCAD14
N
VSS
HT_TXCAD6P
HT_TXCAD6N
M
VSS
VDDC
VSS
VSS
VDDHT
VSS
HT_TXCAD15
P
HT_TXCAD15
N
VSS
HT_TXCAD7P
HT_TXCAD7N
VSS
N
VDDC
VSS
VDDC
VSS
VSS
VDDHT
VSS
HT_TXCTL1P
HT_TXCTL1N
VSS
HT_TXCTL0P
HT_TXCTL0N
P
VSS
VDDC
VSS
VSS
VDDHT
VSS
HT_RXCTL1N
HT_RXCTL1P
VSS
HT_RXCTL0N
HT_RXCTL0P
VSS
R
VDDC
VSS
VDDC
VSS
VSS
VDDHT
VSS
HT_RXCAD15
N
HT_RXCAD15
P
VSS
HT_RXCAD7N
HT_RXCAD7P
T
VSS
VDDC
VSS
VSS
VDDHT
VSS
HT_RXCAD14
N
HT_RXCAD14
P
VSS
HT_RXCAD6N
HT_RXCAD6P
VSS
U
VSS
VSS
VSS
VDDA18PCIE
VSS
VDDHT
VSS
HT_RXCAD13
N
HT_RXCAD13
P
VSS
HT_RXCAD5N
HT_RXCAD5P
V
VDDHT
VSS
HT_RXCAD12
N
HT_RXCAD12
P
VSS
HT_RXCAD4N
HT_RXCAD4P
VSS
W
THERMALDIO
DE_P
VDDHT
VSS
HT_RXCLK1N
HT_RXCLK1P
VSS
HT_RXCLK0N
HT_RXCLK0P
Y
GPP3_REFCL
KP
VDDPCIE
VSS
VDDPCIE
VSS
VSS
THERMALDIO
DE_N
VDDHT
HT_RXCAD11
N
HT_RXCAD11
P
VSS
HT_RXCAD3N
HT_RXCAD3P
VSS
AA
VDDPCIE
VSS
VDDPCIE
VSS
VDDPCIE
VSS
VSS
VDDHT
VSS
HT_RXCAD10
N
HT_RXCAD10
P
VSS
HT_RXCAD2N
HT_RXCAD2P
AB
GPP3_RX5N
VSS
GPP3_RX3N
VSS
GPP3_RX1N
VSS
SB_RX3P
VDDHT
HT_RXCAD9N
HT_RXCAD9P
VSS
HT_RXCAD1N
HT_RXCAD1P
VSS
AC
GPP3_RX5P
GPP3_RX4N
GPP3_RX3P
GPP3_RX2N
GPP3_RX1P
PCE_BCALRN
SB_RX3N
SB_RX2P
VDDHT
HT_RXCAD8N
HT_RXCAD8P
VSS
HT_RXCAD0N
HT_RXCAD0P
AD
VSS
GPP3_RX4P
VSS
GPP3_RX2P
VSS
PCE_BCALRP
VSS
SB_RX2N
VSS
VDDHT
VDDHT
VDDHT
VDDHT
VDDHT
AE
GPP3_TX4N
VSS
GPP3_TX2N
VSS
GPP3_TX0N
VSS
SB_TX2P
VSS
SB_TX1P
VSS
SB_RX1P
VSS
VDDHT
VSS
GPP3_TX4P
GPP3_TX3N
GPP3_TX2P
GPP3_TX1N
GPP3_TX0P
GPP3_RX0N
SB_TX2N
SB_TX3P
SB_TX1N
SB_TX0P
SB_RX1N
SB_RX0P
VSS
VSS
GPP3_TX3P
VSS
GPP3_TX1P
VSS
GPP3_RX0P
VSS
SB_TX3N
VSS
SB_TX0N
VSS
SB_RX0N
15
16
17
18
19
20
21
22
23
24
25
26
AF
AG
AH
27
28
CPU Interface
A-Link Express II Interface
Clock Interface
PCIe GPP1 General Purpose Interface
PCIe GPP2 General Purpose Interface
PCIe GPP3 General Purpose Interface
Power Management Interface
Core Power
PCIe Main I/O Power
PCIe 1.8V I/O Power and PLL Power
GPIO 1.8V I/O Power
HyperTransport Interface Power
Grounds
Other
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
3-3
SR5690 Interface Block Diagram
3.2
SR5690 Interface Block Diagram
Figure 3-1 shows the different interfaces on the SR5690. Interface names in blue are hyperlinks to the corresponding
sections in this chapter.
HT_RXCAD[15:0]P, HT_RXCAD[15:0]N
HT_RXCLK[1:0]P, HT_RXCLK[1:0]N
HT_RXCTL[1:0]P, HT_RXCTL[1:0]N
HT_TXCAD[15:0]P, HT_TXCAD[15:0]N
HT_TXCLK[1:0]P, HT_TXCLK[1:0]N
HT_TXCTL[1:0]P, HT_TXCTL[1:0]N
HT_RXCALP, HT_RXCALN
HT_TXCALP, HT_TXCALN
HyperTransport™
Interface
PCIe® Interface
for General
Purpose
External
Devices
GPP1_TX[15:0]P, GPP1_TX[15:0]N
GPP1_RX[15:0]P, GPP1_RX[15:0]N
GPP2_TX[15:0]P, GPP2_TX[15:0]N
GPP2_RX[15:0]P, GPP2_RX[15:0]N
GPP3_TX[9:0]P, GPP3_TX[9:0]N
GPP3_RX[9:0]P, GPP3_RX[9:0]N
A-Link Express
II Interface
SB_TX[3:0]P, SB_TX[3:0]N
SB_RX[3:0]P, SB_RX[3:0]N
Power
Management
Interface
SYSRESET#
POWERGOOD
LDTSTOP#
ALLOW_LDTSTOP
PWM_GPIO[6:1]
DBG_GPIO3/NON_FATAL_CORR#
DBG_GPIO2/PCIE_HP_SDA
DBG_GPIO1/PCIE_HP_SCL
DBG_GPIO0/SERR_FATAL#
I2C_CLK
I2C_DATA
STRP_DATA
DFT_GPIO5/SYNCFLOODIN#
DFT_GPIO[4:1]
DFT_GPIO0/NMI#
TESTMODE
THERMALDIODE_P
THERMALDIODE_N
PWM_GPIO[6:3,1]
PWM_GPIO2/PCIE_HP_INT_L
Misc. PCIe
Signals
Clock Interface
PCE_BCALRP, PCE_BCALRN
PCE_RCALRP, PCE_RCALRN
PCE_TCALRP, PCE_TCALRN
PCIE_RESET_GPIO[5:1]
OSCIN
HT_REFCLKP, HT_REFCLKN
GPP1_REFCLKP, GPP1_REFCLKN
GPP2_REFCLKP, GPP2_REFCLKN
GPP3_REFCLKP, GPP3_REFCLKN
Misc. Signals
Power
VDD18
VDDPCIE
VDDA18PCIE
VDDC
VDDHT
VDDHTTX
VDDA18HTPLL
Grounds
VSS
Figure 3-1 SR5690 Interface Block Diagram
3.3
CPU HyperTransport™ Interface
Table 3-1 HyperTransport™ Interface
Pin Name
Type
Power
Domain
Ground
Domain
Functional Description
HT_RXCAD[15:0]P,
HT_RXCAD[15:0]N
I
VDDHT
VSS
Receiver Command, Address, and Data Differential Pairs
HT_RXCLK[1:0]P,
HT_RXCLK[1:0]N
I
VDDHT
VSS
Receiver Clock Signal Differential Pair. Forwarded clock signal. Each byte of
RXCAD uses a separate clock signal. Data is transferred on each clock edge.
HT_RXCTL[1:0]P,
HT_RXCTL[1:0]N
I
VDDHT
VSS
Receiver Control Differential Pair. The pair is for distinguishing control packets
from data packets. Each byte of RXCAD uses a separate control signal.
HT_TXCAD[15:0]P,
HT_TXCAD[15:0]N
O
VDDHT
VSS
Transmitter Command, Address, and Data Differential Pairs
43869 SR5690 Databook 2.20
3-4
© 2012 Advanced Micro Devices, Inc.
Proprietary
PCI Express® Interfaces
Table 3-1 HyperTransport™ Interface
Pin Name
3.4.1
Power
Domain
Ground
Domain
Functional Description
HT_TXCLK[1:0]P,
HT_TXCLK[1:0]N
O
VDDHT
VSS
Transmitter Clock Signal Differential Pair. Forwarded clock signal. Each byte
of TXCAD uses a separate clock signal. Data is transferred on each clock
edge.
HT_TXCTL[1:0]P,
HT_TXCTL[1:0]N
O
VDDHT
VSS
Transmitter Control Differential Pair. The pair is for distinguishing control
packets from data packets. Each byte of TXCAD uses a separate control
signal.
Other
VDDHT
VSS
Receiver Calibration Resistor to HT_RXCALP
HT_RXCALN
3.4
Type
(Continued)
HT_RXCALP
Other
VDDHT
VSS
Receiver Calibration Resistor to HT_RXCALN
HT_TXCALP
Other
VDDHT
VSS
Transmitter Calibration Resistor to HTTX_CALN
HT_TXCALN
Other
VDDHT
VSS
Transmitter Calibration Resistor to HTTX_CALP
PCI Express® Interfaces
PCI Express®
Interface for General Purpose External Devices
Table 3-2 PCI Express® Interface for General Purpose External Devices
Type
Power
Domain
Ground
Domain
GPP1_TX[15:0]P,
GPP1_TX[15:0]N
O
VDDA18PCIE
VSSA_PCIE
General Purpose 1 Transmit Data Differential Pairs.
50 between
Connect to connector[s] for general purpose external
complements
device[s] on the motherboard.
GPP1_RX[15:0]P,
GPP1_RX[15:0]N
I
VDDA18PCIE
VSSA_PCIE
General Purpose 1 Receive Data Differential Pairs.
50 between
Connect to connector[s] for general purpose external
complements
device[s] on the motherboard.
GPP2_TX[15:0]P,
GPP2_TX[15:0]N
O
VDDA18PCIE
VSSA_PCIE
50 between
complements
General Purpose 2 Transmit Data Differential Pairs.
Connect to connector[s] for general purpose external
device[s] on the motherboard.
GPP2_RX[15:0]P,
GPP2_RX[15:0]N
I
VDDA18PCIE
VSSA_PCIE
50 between
complements
General Purpose 2 Receive Data Differential Pairs.
Connect to connector[s] for general purpose external
device[s] on the motherboard.
GPP3_TX[9:0]P,
GPP3_TX[9:0]N
O
VDDA18PCIE
VSSA_PCIE
General Purpose 3 Transmit Data Differential Pairs.
50 between
Connect to connector[s] for general purpose external
complements
device[s] on the motherboard.
GPP3_RX[9:0]P,
GPP3_RX[9:0]N
I
VDDA18PCIE
VSSA_PCIE
General Purpose 3 Receive Data Differential Pairs.
50 between
Connect to connector[s] for general purpose external
complements
device[s] on the motherboard.
Pin Name
3.4.2
Integrated
Termination Functional Description
A-Link Express II Interface to Southbridge
Table 3-3 1 x 4 Lane A-Link Express II Interface for Southbridge
Pin Name
Type
Power
Domain
Ground
Domain
SB_TX[3:0]P,
SB_TX[3:0]N
O
VDDA18PCIE
VSSA_PCIE
Southbridge Transmit Data Differential Pairs. Connect to the
50 between
corresponding Receive Data Differential Pairs on the
complements
Southbridge.
SB_RX[3:0]P,
SB_RX[3:0]N
I
VDDA18PCIE
VSSA_PCIE
Southbridge Receive Data Differential Pairs. Connect to the
50 between
corresponding Transmit Data Differential Pairs on the
complements
Southbridge.
© 2012 Advanced Micro Devices, Inc.
Proprietary
Integrated
Termination Functional Description
43869 SR5690 Databook 2.20
3-5
Clock Interface
3.4.3
Miscellaneous PCI Express® Signals
Table 3-4 Miscellaneous PCI Express® Signals
Type
Power
Domain
Ground
Domain
PCE_BCALRN
I
VDDA18PCIE
VSSA_PCIE
N Channel Driver Compensation Calibration for Rx and Tx Channels
on Bottom Side.
PCE_BCALRP
I
VDDA18PCIE
VSSA_PCIE
P Channel Driver Compensation Calibration for Rx and Tx Channels
on Bottom Side
PCE_TCALRN
I
VDDA18PCIE
VSSA_PCIE
N Channel Driver Compensation Calibration for Rx and Tx Channels
on Top Side.
PCE_TCALRP
I
VDDA18PCIE
VSSA_PCIE
P Channel Driver Compensation Calibration for Rx and Tx Channels
on Top Side
PCE_RCALRN
I
VDDA18PCIE
VSSA_PCIE
N Channel Driver Compensation Calibration for Rx and Tx Channels
on Right Side.
PCE_RCALRP
I
VDDA18PCIE
VSSA_PCIE
P Channel Driver Compensation Calibration for Rx and Tx Channels
on Right Side
PCIE_RESET_GP
IO[5:1]
I/O
VDDA18PCIE
VSS
PCIe Resets. Except for PCIE_RESET_GPIO3, they can also be
used as GPIOs. There are internal pull-downs of 1.7 k on these
pins.
DBG_GPIO2/
PCIE_HP_SDA
I/O
VDD18
VSS
I2C data for PCIe® hot-plug, or Output for Debug Bus. The pin
cannot be used for general GPIO functions.
DBG_GPIO1/
PCIE_HP_SCL
I/O
VDD18
VSS
I2C clock for PCIe hot-plug, or Output for Debug Bus. The pin cannot
be used for general GPIO functions.
PWM_GPIO2/
PCIE_HP_INT_L
I/O
VDD18
VSS
I2C interrupt for PCIe hot-plug, or GPIO. The pin is also used as a
strap pin (see section 3.10, “Strapping Options,” on page 310).
Pin Name
3.5
Functional Description
Clock Interface
Table 3-5 Clock Interface
Type
Power
Domain
Ground
Domain
HT_REFCLKP,
HT_REFCLKN
I
VDDA18HTPLL
VSSA_HT
Disabled
GPP1_REFCLKP,
GPP1_REFCLKN
I
VDDA18PCIE
VSSA_PCIE
–
General Purpose 1 Clock Differential Pair. The pair has to
be connected to an external clock generator on the
motherboard whether the General Purpose 1 link is
used or not.
GPP2_REFCLKP,
GPP2_REFCLKN
I
VDDA18PCIE
VSSA_PCIE
–
General Purpose 2 Clock Differential Pair. The pair has to
be connected to an external clock generator on the
motherboard whether the General Purpose 2 link is
used or not.
GPP3_REFCLKP,
GPP3_REFCLKN
I
VDDA18PCIE
VSSA_PCIE
–
General Purpose 3 Clock Differential Pair. The pair has to
be connected to an external clock generator on the
motherboard whether the General Purpose 3 link is
used or not.
OSCIN
I
VDD18
VSS
Disabled
14.318MHz Reference clock input from the external clock
chip (1.8 volt signaling)
Pin Name
43869 SR5690 Databook 2.20
3-6
Integrated
Termination Functional Description
HyperTransport™ 100 MHz Clock Differential Pair from
external clock source
© 2012 Advanced Micro Devices, Inc.
Proprietary
Power Management Pins
3.6
Power Management Pins
Table 3-6 Power Management Pins
Pin Name
ALLOW_LDTSTOP
Type
Power
Domain
OD
VDD18
VSS
Allow LDTSTOP. This signal is used by the SR5690 to communicate with the
Southbridge and tell it when it can assert the LDTSTOP# signal.
1 = LDTSTOP# can be asserted
0 = LDTSTOP# has to be de-asserted
I
VDD18
VSS
HyperTransport™ Stop. This signal is generated by the Southbridge and is used to
determine when the HyperTransport link should be disconnected and go into a
low-power state. It is a single-ended signal.
LDTSTOP#
3.7
Ground
Domain Functional Description
POWERGOOD
I
VDD18
VSS
Input from the motherboard signifying that the power to the SR5690 is up and
ready. Signal High means all power planes are valid. It is not observed internally
until it has been high for more than 6 consecutive REFCLK cycles. The rising edge
of this signal is deglitched.
SYSRESET#
I
VDD18
VSS
Global Hardware Reset. This signal comes from the Southbridge.
Miscellaneous Pins
Table 3-7 Miscellaneous Pins
Pin Name
Type
Power Ground Integrated
Domain Domain Termination Functional Description
I2C_CLK
I/O
VDD18
VSS
–
I2C interface clock signal. Can also be used as GPIO.
I2C_DATA
I/O
VDD18
VSS
–
I2C interface data signal. Can also be used as GPIO.
STRP_DATA
I/O
VDD18
VSS
–
I2C interface data signal for external EEPROM based strap loading.
See the SR5690 Strap Document for details on the operation.
TESTMODE
I
VDD18
VSS
–
When High, puts the SR5690 in test mode and disables the
SR5690 from operating normally.
DFT_GPIO5/
SYNCFLOODIN#
I/O
VDD18
VSS
Pull Up
Output for DFT TESTMODE, or Syncflood input for triggering a
HyperTransport™ syncflood event.
Because the pin is used as a pin strap during the power-on of the
SR5690, an external device must not drive the pin until after
SYSRESET# is deasserted. Also, the pin is not 3.3V tolerant and
needs a level shifter when interfacing to a 3.3V line.
The pin cannot be used for general GPIO functions.
DFT_GPIO[4:1],
I/O
VDD18
VSS
Pull Up
Outputs for DFT TESTMODE. These pins cannot be used for
general GPIO functions.
Pull Up
Output for DFT TESTMODE, or NMI input for triggering an
upstream NMI packet to the processor complex.
Because the pin is used as a pin strap during the power-on of the
SR5690, an external device must not drive the pin until after
SYSRESET# is deasserted. Also, the pin is not 3.3V tolerant and
needs a level shifter when interfacing to a 3.3V line.
The pin cannot be used for general GPIO functions.
DFT_GPIO0/NMI#
I/O
VDD18
VSS
DBG_GPIO3/
NON_FATAL_CORR#
I/O
VDD18
VSS
Pull Up
Output for Debug Bus, or Non-Fatal or Correctable Error signal to
BMC. The pin is not 3.3V tolerant and needs a level shifter when
interfacing to a 3.3V line. When used as a debug bus output, the
pin’s NON_FATAL_CORR# function is overridden.
The pin cannot be used for general GPIO functions.
DBG_GPIO2/
PCIE_HP_SDA
I/O
VDD18
VSS
Pull Up
Output for Debug Bus, or I2C data for PCIe hot-plug. The pin
cannot be used for general GPIO functions.
DBG_GPIO1/
/PCIE_HP_SCL
I/O
VDD18
VSS
Pull Up
Output for Debug Bus, or I2C clock for PCIe hot-plug. The pin
cannot be used for general GPIO functions.
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
3-7
Power Pins
Table 3-7 Miscellaneous Pins
Pin Name
3.8
Type
Power Ground Integrated
Domain Domain Termination Functional Description
Output for Debug Bus, or System Error or Fatal Error signal to
BMC. The pin is not 3.3V tolerant and needs a level shifter when
interfacing to a 3.3V line. When used as a debug bus output, the
pin’s SERR_FATAL# function is overridden.
The pin cannot be used for general GPIO functions.
DBG_GPIO0/
SERR_FATAL#
I/O
VDD18
VSS
Pull Up
THERMALDIODE_P,
THERMALDIODE_N
A-O
–
–
–
Diode connections to external SM Bus microcontroller for
monitoring IC thermal characteristics.
PWM_GPIO[6:3,1]
I/O
VDD18
VSS
–
GPIOs. PWM_GPIO6 and PWM_GPIO[4:3] are also parts of the
test interface (see section 7.2, “Test Interface,” on page 71). PWM_GPIO5 is also used as a strap pin (see section 3.10,
“Strapping Options,” on page 3- 10).
PWM_GPIO2/
PCIE_HP_INT_L
I/O
VDD18
VSS
–
GPIO, or I2C interrupt for PCIe hot-plug. The pin is also used as a
strap pin (see section 3.10, “Strapping Options,” on
page 3- 10).
Power Pins
Table 3-8 Power Pins
Pin Name
Voltage
Pin
Count Ball Reference
Comments
VDDC
1.1V
18
L14, L16, M13, M15, N12,
N14, N16, P13, P15, P17,
R12, R14, R16, T13, T15,
T17, U14, U16
VDD18
1.8V
5
A18, B18, C18, D18, E18
39
A3, B2, C1, C3, D4, E5, F6,
G8, G10, H7, H9, H11, K7,
L8, M7, N8, P7, R8, T7, V7,
W8, Y7, AA8, AA10, AA12,
PCI Express interface main I/O and PLL power
AA16, AA18, AB7, AB9,
AB11, AB13, AB15, AB17,
AB19, AC6, AD5, AE4, AF3,
AG2
21
A12, A1, B12, B13, C12,
C13, D12, D13, E12, E13,
F12, F13, G12, G13, G14,
H12, H13, H14, L11, V11,
V18
PCI Express interface 1.8V I/O power
HyperTransport™ Interface digital I/O power
VDDPCIE
VDDA18PCIE
1.1 V
1.8 V
Core power
I/O Power for GPIO pads
VDDHT
1.1V
21
AA22, AB22, AC22, K22,
AD23, AE24, AE25, AE26,
AE27, AE28, AF27, L21,
M22, N21, P22, R21, T22,
U21, V22, W21, Y22
VDDHTTX
1.2V
11
C24, C25, C26, C27, C28,
D22, D23, E22, F22, G22,
H22
HyperTransport Transmit Interface I/O power
VDDA18HTPLL
1.8V
1
G21
HyperTransport interface 1.8V PLL Power
Total Power Pin Count
43869 SR5690 Databook 2.20
3-8
116
© 2012 Advanced Micro Devices, Inc.
Proprietary
Ground Pins
3.9
Ground Pins
Table 3-9 Ground Pins
Pin Name
VSS
Pin Count
261
© 2012 Advanced Micro Devices, Inc.
Proprietary
Ball Reference
Comments
A11, A14, A16, A20, A22,
A24, A26, A5, A7, A9, AA1,
AA11, AA13, AA17, AA19,
AA20, AA25, AA28, AA4,
AA7, AA9, AB10, AB12,
AB14, AB16, AB18, AB20,
AB21, AB23, AB26, AB3,
AB6, AB8, AC1, AC10,
AC12, AC14, AC16, AC18,
AC20, AC25, AC28, AC4,
AC5, AC8, AD26, AD3, AD4,
AE1, AE11, AE13, AE15,
AE17, AE19, AE21, AE23,
AE5, AE7, AE9, AF10, AF12,
AF14, AF16, AF18, AF20,
AF22, AF24, AF26, AF28,
AF4, AF6, AF8, AG27, AG3,
AH11, AH13, AH15, AH17,
AH19, AH21, AH23, AH25,
AH3, AH5, AH7, AH9, B14,
B27, B3, C10, C14, C15,
C17, C19, C2, C21, C23, C4,
C6, C8, D11, D14, D16, D20,
D26, D3, D5, D7, D9, E1,
E20, E25, E28, E4, F10, F15,
Common Ground
F17, F18, F19, F20, F21,
F23, F26, F3, F8, G1, G11,
G15, G16, G17, G18, G19,
G20, G25, G28, G4, G9,
H10, H15, H16, H17, H18,
H19, H20, H21, H23, H26,
H3, H6, J1, J22, J25, J28, J4,
J7, K23, K26, K3, K6, K8, L1,
L12, L13, L15, L17, L18, L22,
L25, L28, L4, L7, M11, M12,
M14, M16, M17, M18, M21,
M23, M26, M3, M6, M8,N1
N11, N13, N15, N17, N18,
N22, N25, N28, N4, N7, P11,
P12, P14, P16, P18, P21,
P23, P26, P3, P6, P8, R1,
R11, R13, R15, R17, R18,
R22, 25, R28, R4, R7, T11,
T12, T14, T16, T18, T21,
T23, T26, T3, T6, T8, U1,
U11, U12, U13, U15, U17,
U18, U22, U25, U28, U4, U7,
V12, V13, V14, V15, V16,
V17, V21, V23, V26, V3, V6,
W1, W22, W25, W28, W4,
W7, Y23, Y26, Y3, Y6, Y8
43869 SR5690 Databook 2.20
3-9
Strapping Options
3.10
Strapping Options
The SR5690 provides strapping options to define specific operating parameters. The strap values are latched into internal
registers after the assertion of the POWERGOOD signal to the SR5690. Table 3-10, “Strap Definitions for the SR5690,”
shows the definitions of all the strap functions. These straps are set by one of the following four methods:
•
•
•
•
Allowing the internal pull-up resistors to set all strap values “1”’s automatically.
Attaching pull-down resistors to specific strap pins listed in Table 3-10 to set their values to “0”’s.
Downloading the strap values from an I2C serial EEPROM (for debug purpose only; contact your AMD FAE
representative for details).
Setting through an external debug port, if implemented (contact your AMD FAE representative for details).
Table 3-10 Strap Definitions for the SR5690
Strap Function
Strap Pin
Description
PRIMARY_NB
PWM_GPIO5
Indicates whether the device is a primary or a secondary Northbridge on a
multiple-Northbridge platform. See section 2.3, “Multiple Northbridge Support,”
on page 2- 4 for details. Do not install a resistor for single-Northbridge platforms.
0: Device is a secondary Northbridge
1: Device is the primary Northbridge (Default)
Reserved
PWM_GPIO4
Reserved. Make provision for an external pull-down resistor on this pin, but do not install
a resistor.
Reserved
PWM_GPIO2/
PCIE_HP_INT_L
Reserved. Make provision for an external pull-down resistor on this pin, but do not install
a resistor.
Reserved
DFT_GPIO0/NMI#
Reserved. Make provision for an external pull-down resistor on this pin, but do not install
a resistor.
LOAD_ROM_STRAPS#
DFT_GPIO1
Selects loading of strap values from EEPROM
0: I2C master can load strap values from EEPROM if connected, or use hardware
default values if not connected
1: Use hardware default values (Default)
STRAP_PCIE_GPP_CFG
DFT_GPIO[4:2]
General Purpose Link 3 Configuration.
See Table 3-11 below for details.
Reserved
DFT_GPIO5/
SYNCFLOODIN#
Reserved. Make provision for an external pull-down resistor on this pin, but do not install
a resistor.
Table 3-11 Strap Definition for STRAP_PCIE_GPP_CFG
Strap Pin Value
Link Width
GPP3 GPP3 GPP3 GPP3 GPP3 GPP3 GPP3 GPP3 GPP3 GPP3
DFT_GPIO4 DFT_GPIO3 DFT_GPIO2 Lane Lane Lane Lane Lane Lane Lane Lane Lane Lane
0
1
2
3
4
5
6
7
8
9
Mode
1
1
1
Hardware default (Mode L) or EEPROM strap values
(Default)
-
1
1
0
Hardware default (Mode L) or EEPROM strap values
-
1
0
1
x2
x2
1
0
0
x2
x2
0
1
1
x2
x1
x1
0
1
0
x1
x1
0
0
1
x4
0
0
0
x4
x2
x1
x1
x4
C2
x1
x1
x4
K
x1
x1
x4
E
x1
x1
x4
L (Hardware
Default)
x1
x1
x4
C
x4
B
x2
Note: If the pin straps instead of strap values from EEPROM are used, the GPP3 configuration will then be determined according to this
table and cannot be changed after the system has been powered up.
43869 SR5690 Databook 2.20
3-10
© 2012 Advanced Micro Devices, Inc.
Proprietary
Chapter 4
Timing Specifications
4.1
HyperTransport™ Bus Timing
For HyperTransport™ bus timing information, please refer to specifications by AMD.
4.2
PCI Express® Differential Clock AC Specifications
Table 4-1 Timing Requirements for PCIe® Differential Clocks (GPP1_REFCLK, GPP2_REFCLK, and GPP3_REFCLK
at 100MHz)
Symbol
4.3
Description
Rising Edge Rate
Rising Edge Rate
Falling Edge Rate
Falling Edge Rate
TPERIOD AVG
Average Clock Period Accuracy
TPERIOD ABS
Absolute Period (including jitter and spread spectrum
modulation)
TCCJITTER
Cycle to Cycle Jitter
Duty Cycle
Duty Cycle
Rise-Fall Matching
Rising edge rate (REFCLK+) to falling edge rate
(REFCLK-) matching
Minimum
Maximum
Unit
0.6
4.0
V/ns
0.6
4.0
V/ns
-100
+100
ppm
9.847
10.203
ns
-
150
ps
40
60
%
-
20
%
Minimum
Maximum
Unit
Note
-
140
mV
1
HyperTransport™ Reference Clock Timing Parameters
Table 4-2 Timing Requirements for HyperTransport™ Reference Clock (100MHz)
Symbol
VCROSS
Parameter
Change in Crossing point voltage over all edges
F
Frequency
99.5
100
MHz
2
ppm
Long Term Accuracy
-100
+100
Ppm
3
SFALL
Output falling edge slew rate
-10
-0.5
V/ns
4, 5
SRISE
Output rising edge slew rate
0.5
10
V/ns
4,5
Tjc max
Jitter, cycle to cycle
-
150
ps
6
Tj-accumulated
Accumulated jitter over a 10 s period
-1
1
ns
7
VD(PK-PK)
Peak to Peak Differential Voltage
400
2400
mV
8
VD
Differential Voltage
200
1200
mV
9
VD
Change in VDDC cycle to cycle
-75
75
mV
10
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
4-1
OSCIN Reference Clock Timing Parameters
Table 4-2 Timing Requirements for HyperTransport™ Reference Clock (100MHz) (Continued)
Symbol
DC
Parameter
Minimum
Maximum
Unit
Note
45
55
%
11
Duty Cycle
Notes:
More details are available in AMD HyperTransport 3.0 Reference Clock Specification and AMD Family 10h Processor Reference Clock
Parameters, document # 34864
1 Single-ended measurement at crossing point. Value is maximum-minimum over all time. DC Value of common mode is not important
due to blocking cap.
2 Minimum frequency is a consequence of 0.5% down spread spectrum.
3 Measured with spread spectrum turned off.
4 Only simulated at the receive die pad. This parameter is intended to give guidance for simulation. It cannot be tested on a tester but is
guaranteed by design.
5 Differential measurement through the range of ±100mV, differential signal must remain monotonic and within slew rate specification
when crossing through this region.
6 Tjc max is the maximum difference of tCYCLE between any two adjacent cycles.
7 Accumulated Tjc over a 10s time period, measured with JIT2 TIE at 50ps interval.
8 VD(PK-PK) is the overall magnitude of the differential signal.
9 VD(min) is the amplitude of the ring-back differential measurement, guaranteed by design that the ring-back will not cross 0V VD.
VD(max) is the largest amplitude allowed.
10 The difference in magnitude of two adjacent VDDC measurements. VDDC is the stable post overshoot and ring-back part of the signal.
11 Defined as tHIGH/tCYCLE
4.4
OSCIN Reference Clock Timing Parameters
Table 4-3 Timing Requirements for OSCIN Reference Clock (14.3181818MHz)
Symbol
Parameter
Min
Typical
Max
Unit
0.037
–
1.1
s
1
REFCLK Frequency
0.9
–
27
MHz
2
TIH
REFCLK High Time
2.0
–
–
ns
TIL
REFCLK Low Time
2.0
–
–
ns
TIR
REFCLK Rise Time
–
–
1.5
ns
TIF
REFCLK Fall Time
–
–
1.5
ns
TIJCC
REFCLK Cycle-to-Cycle Jitter Requirement
–
–
200
ps
TIJPP
REFCLK Peak-to-Peak Jitter Requirement
–
–
200
ps
TIJLT
REFCLK Long Term Jitter Requirement (1s after
scope trigger)
–
–
500
ps
TIP
REFCLK Period
FIP
Note
1
Notes:
1 Time intervals measured at 50% threshold point.
2 FIP is the reciprocal of TIP.
4.5
Power Rail Sequence
For the purpose of power rail sequencing, the power rails of the SR5690 are divided into groupings
described in Table 4-4 below.
Table 4-4 Power Rail Groupings for the SR5690
Voltage
ACPI
STATE
VDDC
1.1V
S0-S2
Core power
VDDPCIE
VDDPCIE
1.1V
S0-S2
PCI Express® main IO power
VDDHTTX
VDDHTTX
1.2V
S0-S2
HyperTransport™ transmit interface IO power
HT_1.1V
VDDHT
1.1V
S0-S2
HyperTransport interface digital IO power
Group Name
Power rail name
VDDC
43869 SR5690 Databook 2.20
4-2
Description
© 2012 Advanced Micro Devices, Inc.
Proprietary
Power Rail Sequence
Table 4-4 Power Rail Groupings for the SR5690
Voltage
ACPI
STATE
VDD18
1.8V
S0-S2
I/O power for GPIO pads
VDDA18PCIE
1.8V
S0-S2
PCI Express interface 1.8V IO and PLL
power
VDDA18HTPLL
1.8V
S0-S2
HyperTransport interface 1.8V PLL power
Group Name
Power rail name
1.8V
Description
Note:
1. Power rails from the same group are assumed to be generated by the same voltage regulator.
2. Power rails from different groups but at the same voltage can either be generated by separate regulators or by the same regulators as
long as they comply with the requirements specified in the SR5690 Motherboard Design Guide.
4.5.1
Power Up
Figure 4-1 below illustrates the power up sequencing for the various power groups, and Table 4-5
explains the symbols in the figure, as well as the associated requirements.
1.8V
T10
VDDHTTX
T11
VDDPCIE
T12
HT_1.1V
T13
VDDC
Figure 4-1 SR5690 Power Rail Power Up Sequence
Table 4-5 SR5690 Power Rail Power-up Sequence
Symbol
Parameter
Requirement
Comment
T10
1.8V rails to VDDHTTX (1.2V)
VDDHTTX ramps after 1.8V rails.
See Note 1.
T11
VDDHTTX (1.2V) to VDDPCIE (1.1V)
VDDPCIE ramps together with or after VDDHTTX
See Note 1 and 2.
T12
VDDHTTX(1.2V) to HT_1.1V rails
HT_1.1V rails ramp together with or after VDDHTTX
See Note 1 and 2.
T13
VDDHTTX(1.2V) to VDDC (1.1V)
VDDC ramps together with or after VDDHTTX
See Note 1 and 2.
Notes:
1. Power rail A ramps after power rail B means that the voltage of rail A does not exceed that of rail B at any time.
2. Power rail A ramps together with power rail B means that the two rails are controlled by the same enable signal and the difference
in their ramping rates is only due to the differences in the loadings.
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
4-3
Power Rail Sequence
4.5.2
Power Down
For power down, the rails should either be turned off simultaneously or in the reversed order of the
power up sequence. Variations in speeds of decay due to different capacitor discharge rates can be
safely ignored.
43869 SR5690 Databook 2.20
4-4
© 2012 Advanced Micro Devices, Inc.
Proprietary
Chapter 5
Electrical Characteristics and Physical Data
5.1
5.1.1
Electrical Characteristics
Maximum and Minimum Ratings
Table 5-1 Power Rail Maximum and Minimum Voltage Ratings
Pin
Typical
DC Limit*
Min.
AC Limit*
Max.
Min.
Max.
Unit
Comments
VDDC
1.1
1.067
1.133
1.045
1.155
V
Core power
VDD18
1.8
1.746
1.854
1.71
1.89
V
1.8V I/O Powers
1.1
1.067
1.133
1.045
1.155
V
PCI Express® Interface Main I/O
Power
1.8
1.746
1.854
1.71
1.89
V
PCI Express interface 1.8V I/O and
PLL power
1.1
1.067
1.133
1.045
1.155
V
HyperTransport™ Interface digital
I/O power
1.2
1.164
1.236
1.14
1.26
V
HyperTransport Transmit Interface
I/O power
1.8
1.746
1.854
1.71
1.89
V
HyperTransport interface 1.8V PLL
power
VDDPCIE
VDDA18PCIE
VDDHT
VDDHTTX
VDDA18HTPLL
* Note: The voltage set-point must be contained within the DC specification in order to ensure proper operation. Voltage ripple and transient
events outside the DC specification must remain within the AC specification at all times. Transients must return to within the DC specification
within 20s.
Table 5-2 Power Rail Current Ratings
Min. Load
Average
Current
(A)
Power Rail
5.1.2
Max. Load
Average
Current
(A)
Max. Average
Power-on
Current
(A)
Max. Step Load
Size
(A)
Max. Slew Rate
(A/µs)
VDDC
0.62
6.56
6.56
5.94
300
VDD18
0.00048
0.00060
0.00060
0.00012
-
VDDPCIE
0.31
3.79
3.79
3.48
28
VDDA18PCIE
0.02
1.33
1.33
1.31
23
VDDHT
0.23
1.90
1.90
1.67
28
VDDHTTX
0.08
0.51
0.51
0.43
5
VDDA18HTPLL
0.007
0.013
0.013
0.006
-
DC Characteristics
Table 5-1 DC Characteristics for PCIe® Differential Clocks (GPP1_REFCLK, GPP2_REFCLK, and GPP3_REFCLK at
100MHz)
Minimum
Maximum
Unit
VIL
Symbol
Differential Input Low Voltage
Description
-
-150
mV
VIH
Differential Input High Voltage
+150
-
mV
VCROSS
Absolute Crossing Point Voltage
+250
+550
mV
VCROSS DELTA
Variation of VCROSS over all rising
clock edges
-
+140
mV
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43869 SR5690 Databook 2.20
5-1
SR5690 Thermal Characteristics
Symbol
Description
Minimum
Maximum
Unit
-100
+100
mV
VRB
Ring-back Voltage Margin
VIMAX
Absolute Max Input Voltage
-
+1.15
V
VIMIN
Absolute Min Input Voltage
-
-0.15
V
Table 5-3 DC Characteristics for 1.8V GPIO Pads
Symbol
Description
Minimum Maximum
VIH-DC
Input High Voltage
VIL-DC
Input Low Voltage
VOH
Minimum Output High Voltage @ I=8mA
VOL
Maximum Output Low Voltage @ I=8mA
IOL
Minimum Output Low Current @ V=0.1V
IOH
Minimum Output High Current @ V=VDDR-0.1V
Unit
Notes
1
1.1
-
V
-
0.7
V
1
1.4
-
V
2, 3
-
0.4
V
2, 3
2.0
-
mA
2, 3
2.0
-
mA
2, 3
Notes:
1) Measured with edge rate of 1us at PAD pin.
2) For detailed current/voltage characteristics please refer to IBIS model.
3) Measurement taken with SP/SN set to default values, PVT=Noml Case
Table 5-4 DC Characteristics for the HyperTransport™ 100MHz Differential Clock (HT_REFCLK)
5.2
Symbol
Description
VIL
Input Low Voltage
Minimum
–
Typical
0V
VIH
Input High Voltage
1.4V
VIMAX
Maximum Input Voltage
–
Maximum
Comments
0.2V
–
1.8V
–
–
–
2.1V
–
SR5690 Thermal Characteristics
This section describes some key thermal parameters of the SR5690. For a detailed discussion on these parameters and
other thermal design descriptions, including package level thermal data and analysis, please consult the Thermal Design
and Analysis Guidelines for SR5650/5670/5690, order# 44382.
5.2.1
SR5690 Thermal Limits
Table 5-5 SR5690 Thermal Limits
Parameter
Minimum
Nominal
Maximum
Operating Case Temperature
0
—
95
Unit
°
1
Absolute Rated Junction
Temperature
—
—
115
°
2
Storage Temperature
-40
—
60
°
Ambient Temperature
0
—
55
°C
3
Thermal Design Power
—
18
—
W
4
C
C
Note
C
Notes:
1 - The maximum operating case temperature is the die top-center temperature measured via a thermocouple based on the
methodology given in the document Thermal Design and Analysis Guidelines for SR5650/5670/5690 (Chapter 12). This is the
temperature at which the functionality of the chip is qualified.
2 - The maximum absolute rated junction temperature is the junction temperature at which the device can operate without causing
damage to the ASIC.
3 - The ambient temperature is defined as the temperature of the local intake air at the inlet to the thermal management device. The
maximum ambient temperature is dependent on the heat sink design, and the value given here is based on AMD’s reference heat sink
solution for the SR5690. Refer to Chapter 6 in Thermal Design and Analysis Guidelines for SR5650/5670/5690 for heatsink and thermal
design guidelines. Refer to Chapter 7 for details of ambient conditions.
4 - Thermal Design Power (TDP) is defined as the highest power dissipated while running currently available worst case applications at
nominal voltages. The core voltage was raised to 5% above its nominal value for measuring the ASIC power. Since the core power of
modern ASICs using 65nm and smaller process technology can vary significantly, parts specifically screened for higher core power were
used for TDP measurement. The TDP is intended only as a design reference, and the value given here is preliminary.
43869 SR5690 Databook 2.20
5-2
© 2012 Advanced Micro Devices, Inc.
Proprietary
SR5690 Thermal Characteristics
5.2.2
Thermal Diode Characteristics
The SR5690 has an on-die thermal diode, with its positive and negative terminals connected to the THERMALDIODE_P
and THERMALDIODE_N pins respectively. Combined with a thermal sensor circuit, the diode temperature, and hence
the ASIC junction temperature, can be derived from a differential voltage reading (V). The equation relating the
temperature to V is given below.
  K  T  ln  N 
V = -------------------------------------------q
where:
V = Difference of two base-to-emitter voltage readings, one using current = I and the other using current = N x I
N = Ratio of the two thermal diode currents (=10 when using an ADI thermal sensor, e.g.: ADM 1020, 1030)
 = Ideality factor of the diode
K = Boltzman’s Constant
T = Temperature in Kelvin
q = Electron charge
The series resistance of the thermal diode (RT) must be taken into account as it introduces an error in the reading (for
every 1.0, approximately 0.8oC is added to the reading). The sensor circuit should be calibrated to offset the RT induced,
plus any other known fixed errors. Measured values of diode ideality factor and series resistance for the diode circuit are
defined in Thermal Design and Analysis Guidelines for SR5650/5670/5690.
© 2012 Advanced Micro Devices, Inc.
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43869 SR5690 Databook 2.20
5-3
Package Information
5.3
Package Information
Figure 5-2 and Table 5-6 describe the physical dimensions of the SR5690 package. Figure 5-3 shows the detailed
ball arrangement for the SR5690.
MOD-00094-03
Figure 5-2 SR5690 692-Pin FCBGA Package Outline
Table 5-6 SR5690 692-Pin FCBGA Package Physical Dimensions
Ref.
Min. (mm)
Typical (mm)
Max. (mm)
c
0.56
0.66
0.76
A
1.87
2.02
2.17
A1
0.40
0.50
0.60
A2
0.81
0.86
0.91
b
0.50
0.60
0.70
D1
28.80
29.00
29.20
D2
-
5.62
-
D3
2.00
-
-
D4
1.00
-
-
E1
28.80
29.00
29.20
E2
-
7.39
-
E3
2.00
-
-
E4
1.00
-
-
F1
-
27.00
-
F2
-
27.00
-
e
-
1.00
-
43869 SR5690 Databook 2.20
5-4
© 2012 Advanced Micro Devices, Inc.
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Package Information
Table 5-6 SR5690 692-Pin FCBGA Package Physical Dimensions
Ref.
Min. (mm)
Typical (mm)
Max. (mm)
ddd
-
-
0.20
Note: Maximum height of SMT components is 0.650 mm.
Figure 5-3 SR5690 Ball Arrangement (Bottom View)
5.3.1
Pressure Specification
To avoid damages to the ASIC (die or solder ball joint cracks) caused by improper mechanical assembly of the cooling
device, follow the recommendations below:
•
It is recommended that the maximum load that is evenly applied across the contact area between the thermal
management device and the die does not exceed 6 lbf. Note that a total load of 4-6 lbf is adequate to secure the
thermal management device and achieve the lowest thermal contact resistance with a temperature drop across
the thermal interface material of no more than 3°C. Also, the surface flatness of the metal spreader should be
0.001 inch/1 inch.
•
Pre-test the assembly fixture with a strain gauge to make sure that the flexing of the final assembled board and
the pressure applying around the ASIC package will not exceed 600 micron strain under any circumstances.
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
5-5
Package Information
•
5.3.2
Ensure that any distortion (bow or twist) of the board after SMT and cooling device assembly is within industry
guidelines (IPC/EIA J-STD-001). For measurement method, refer to the industry approved technique described
in the manual IPC-TM-650, section 2.4.22.
Board Solder Reflow Process Recommendations
5.3.2.1 Stencil Opening Size for Solderball Pads on PCB
Warpage of the PCB and the package may cause solderjoint quality issues at the surface mount. Therefore, it is
recommended that the stencil opening sizes be adjusted to compensate for the warpage. The recommendation is for the
stencil aperture of the solderballs to be kept at the same size as the pads.
5.3.2.2 Reflow Profile
A reference reflow profile is given below. Please note the following when using RoHS/lead-free solder (SAC105/305/405
Tin-Silver-Cu):
•
The final reflow temperature profile will depend on the type of solder paste and chemistry of flux used in the SMT
process. Modifications to the reference reflow profile may be required in order to accommodate the requirements of
the other components in the application.
•
•
An oven with 10 heating zones or above is recommended.
•
•
•
Mechanical stiffening can be used to minimize board warpage during reflow.
•
To ensure that the reflow profile meets the target specification on both sides of the board, a different profile and oven
recipe for the first and second reflow may be required.
It is suggested to decrease temperature cooling rate to minimize board warpage.
This reflow profile applies only to RoHS/lead-free (high temperature) soldering process and it should not be used for
Eutectic solder packages. Damage may result if this condition is violated.
Maximum 3 reflows are allowed on the same part.
Table 5-7 Recommended Board Solder Reflow Profile - RoHS/Lead-Free Solder
Profiling Stage
Temperature
Process Range
Overall Preheat
Room temp to 220C
2 mins to 4 mins
Soaking Time
130C to 170C
Typical 60 – 80 seconds
Liquidus
220C
Typical 60 – 80 seconds
Ramp Rate
Ramp up and Cooling
<2C / second
Peak
Max. 245C
235C +/-5C
Temperature at peak
within 5C
240C to 245C
10 – 30 seconds
43869 SR5690 Databook 2.20
5-6
© 2012 Advanced Micro Devices, Inc.
Proprietary
Package Information
o
Solder/Part Surface Temp. ( C )
Peak Temp. (235 oC+/-5% typ., 245 oC max.)
250
220 deg.C
<2.0oC / Sec.
200
170 oC
150
Soaking Zone
130 oC
100
50
Soldering Zone
60 – 120 sec. max
60 – 80 sec. typical
45 - 90 sec. Max.
60 - 80 sec. typical
<2.0o.C / Sec.
Pre-heating Zone
2 min to 4 min Max.
Heating Time
Figure 5-4 RoHS/Lead-Free Solder (SAC305/405 Tin-Silver-Copper) Reflow Profile
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
5-7
Package Information
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43869 SR5690 Databook 2.20
5-8
© 2012 Advanced Micro Devices, Inc.
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Chapter 6
Power Management and ACPI
6.1
ACPI Power Management Implementation
This chapter describes the support for ACPI power management provided by the SR5690. The SR5690 system controller
supports ACPI Revision 2.0. The hardware, system BIOS, and drivers of the SR5690 have the logic required for meeting
the power management specifications of PC2001, OnNow, and the Windows Logo Program and Device Requirements
version 2.1. Table 6-1, “ACPI States Supported by the SR5690,” describes the ACPI states supported by the SR5690
system controller.
Table 6-1 ACPI States Supported by the SR5690
ACPI State
Description
Processor States:
S0/C0: Working State
Working State. The processor is executing instructions.
S0/C1: Halt
CPU Halt state. No instructions are executed. This state has the lowest latency on resume and contributes
minimum power savings.
S0/C2: Stop Grant
Caches Snoopable
Stop Grant or Cache Snoopable CPU state. This state offers more power savings but has a higher latency
on resume than the C1 state.
S0/C3: Stop Grant
Caches Snoopable
Processor is put into the Stop Grant state. Caches are still snoopable. The HyperTransport™ link may be
disconnected and put into a low power state. System memory may be put into self-refresh.
System States:
S1: Standby
Powered On Suspend
System is in Standby mode. This state has low wakeup latency on resume. OEM support of this state is
optional.
S3: Standby
Suspend to RAM
System is off but context is saved to RAM. System memory is put into self-refresh.
S4: Hibernate
Suspend to Disk
System is off but context is saved to disk. When the system transitions to the working state, the OS is
resumed without a system re-boot.
S5: Soft Off
System is off. OS re-boots when the system transitions to the working state.
G3: Mechanical Off
Occurs when system power (AC or battery) is not present or is unable to keep the system in one of the
other states.
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43869 SR5690 Databook 2.20
6-1
ACPI Power Management Implementation
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43869 SR5690 Databook 2.20
6-2
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Chapter 7
Testability
7.1
Test Capability Features
The SR5690 system controller has integrated test modes and capabilities. These test features cover both the ASIC and
board level testing. The ASIC tests provide a very high fault coverage and low DPM (Defect Per Million) ratio of the part.
The board level tests modes can be used for motherboard manufacturing and debug purposes. The following are the test
modes of the SR5690 system controller:
•
Full scan implementation on the digital core logic that provides about 97% fault coverage through ATPG
(Automatic Test Pattern Generation Vectors).
•
Dedicated test logic for the on-chip custom memory macros to provide complete coverage on these modules.
•
Improved access to the analog modules and PLLs in the SR5690 system controller in order to allow full
evaluation and characterization of these modules.
•
A JTAG test mode (which is not entirely compliant to the IEEE 1149.1 standard) in order to allow board level
testing of neighboring devices.
•
An XOR TREE test mode on all the digital I/O’s to allow for proper soldering verification at the board level.
•
A VOH/VOL test mode on all digital I/O’s to allow for proper verification of output high and output low
voltages at the board level.
These test modes can be accessed through the settings on the instruction register of the JTAG circuitry.
7.2
Test Interface
Table 7-1 Pins on the Test Interface
Pin Name
7.3
7.3.1
Ball number
Type
Description
TESTMODE
A19
I
TEST_EN: Test Enable (IEEE 1149.1 test port reset)
PCIE_RESET_GPIO3
D19
I
TMS: Test Mode Select (IEEE 1149.1 test mode select)
I2C_DATA
C20
I
TDI: Test Mode Data In (IEEE 1149.1 data in)
I2C_CLK
B20
I
TCLK: Test Mode Clock (IEEE 1149.1 clock)
PWM_GPIO6
B16
O
TDO: Test Mode Data Out (IEEE 1149.1 data out)
PWM_GPIO4
A15
I
TEST_ODD: Control ODD output in VOH/VOL test
PWM_GPIO3
F16
I
TEST_EVEN: Control EVEN output in VOH/VOL test
POWERGOOD
A17
I
I/O Reset
XOR Tree
Brief Description of an XOR Tree
A sample of a generic XOR tree is shown in the figure below.
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
7-1
XOR Tree
XOR Start Signal
G
F
A
E
D
C
B
Figure 7-1 XOR Tree
Pin A is assigned to the output direction, and pins B through F are assigned to the input direction. It can be seen that after
all pins B to F are assigned to logic 0 or 1, a logic change in any one of these pins will toggle the output pin A.
The following is the truth table for the XOR tree shown in Figure 7-1 The XOR start signal is assumed to be logic 1.
Table 7-2 Example of an XOR Tree
Test Vector
number
7.3.2
Input Pin G
Input Pin F
Input Pin E
Input Pin D
Input Pin C
Input Pin B
Output Pin A
1
0
0
0
0
0
0
1
2
1
0
0
0
0
0
0
3
1
1
0
0
0
0
1
4
1
1
1
0
0
0
0
5
1
1
1
1
0
0
1
6
1
1
1
1
1
0
0
7
1
1
1
1
1
1
1
Description of the XOR Tree for the SR5690
The XOR start signal is applied at the TDI Pin of the JTAG circuitry and the output of the XOR tree is obtained at the
TDO Pin. Refer to Section 7.3.4 for the list of the signals included on the XOR tree. There is no specific order to these
signals in the tree. A toggle of any of these balls in the XOR tree will cause the output to toggle.
7.3.3
XOR Tree Activation
To activate the XOR tree and run a XOR test, perform the sequence below:
1. Supply a 10MHz clock to I2C_CLK (Test Mode Clock) and a differential clock pair to the HT_REFCLKP/N,
GPP1_REFCLKP/N, GPP2_REFCLKP/N, and GPP3_REFCLKP/N pins.
2. Set POWERGOOD to 0.
3. Set TESTMODE to 1.
4. Set PCIE_RESET_GPIO2 to 0.
5. Wait 5 or more I2C_CLK cycles.
6. Load JTAG instruction register with the instruction 0001 1111.
7. Load JTAG instruction register with the instruction 0010 0000.
8. Load JTAG instruction register with the instruction 0000 1000.
9. Go to Run-Test_Idle state.
10. Set POWERGOOD to 1.
43869 SR5690 Databook 2.20
7-2
© 2012 Advanced Micro Devices, Inc.
Proprietary
XOR Tree
7.3.4
XOR Tree for the SR5690
The XOR start signal is applied at the TDI Pin of the JTAG circuitry and the output of the XOR tree is obtained at the
TDO Pin. Refer to Table 7-3 for the list of the signals included on the XOR tree.
There is no specific order to these signals in the tree. A toggle of any of these balls in the XOR tree will cause the output
to toggle. When the XOR tree is activated, any pin on the XOR tree must be either pulled down or pulled up to the I/O
voltage of the pin. Only pins that are not on the XOR tree can be left floating.
When differential signal pairs are listed as single entries on the XOR tree, opposite input values should be applied to the
two signals in each pair (e.g., for entry no. 1 on the tree, when “1” is applied to HT_RXCAD0P, “0” should be applied to
HT_RXCAD0N).
Table 7-3 SR5690 XOR Tree
No.
Pin Name
Ball Ref.
No.
Pin Name
Ball Ref.
1
HT_RXCAD0P/N
AD28/AD27
29
GPP1_RX10P/N
H5/H4
2
HT_RXCAD1P/N
AC27/AC26
30
GPP1_RX11P/N
J6/J5
3
HT_RXCAD2P/N
AB28/AB27
31
GPP1_RX12P/N
K5/K4
4
HT_RXCAD3P/N
AA27/AA26
32
GPP1_RX13P/N
L6/L5
5
HT_RXCAD4P/N
W27/W26
33
GPP1_RX14P/N
M5/M4
6
HT_RXCAD5P/N
V28/V27
34
GPP1_RX15P/N
N6/N5
7
HT_RXCAD6P/N
U27/U26
35
GPP2_RX0P/N
P5/P4
8
HT_RXCAD7P/N
T28/T27
36
GPP2_RX1P/N
R6/R5
9
HT_RXCTL0P/N
R27/R26
37
GPP2_RX2P/N
T5/T4
10
HT_RXCAD8P/N
AD25/AD24
38
GPP2_RX3P/N
U6/U5
11
HT_RXCAD9P/N
AC24/AC23
39
GPP2_RX4P/N
V5/V4
12
HT_RXCAD10P/N
AB25/AB24
40
GPP2_RX5P/N
W6/W5
13
HT_RXCAD11P/N
AA24/AA23
41
GPP2_RX6P/N
Y5/Y4
14
HT_RXCAD12P/N
W24/W23
42
GPP2_RX7P/N
AA6/AA5
15
HT_RXCAD13P/N
V25/V24
43
GPP2_RX8P/N
AB5/AB4
16
HT_RXCAD14P/N
U24/U23
44
GPP2_RX9P/N
AD2/AD1
17
HT_RXCAD15P/N
T25/T24
45
GPP2_RX10P/N
AF2/AF1
18
HT_RXCTL1P/N
R24/R23
46
GPP2_RX11P/N
AF5/AG5
19
GPP1_RX0P/N
E11/F11
47
GPP2_RX12P/N
AD6/AE6
20
GPP1_RX1P/N
D10/E10
48
GPP2_RX13P/N
AC7/AD7
21
GPP1_RX2P/N
E9/F9
49
GPP2_RX14P/N
AD8/AE8
22
GPP1_RX3P/N
D8/E8
50
GPP2_RX15P/N
AC9/AD9
23
GPP1_RX4P/N
E7/F7
51
GPP3_RX0P/N
AH20/AG20
24
GPP1_RX5P/N
D6/E6
52
GPP3_RX1P/N
AD19/AC19
25
GPP1_RX6P/N
B5/C5
53
GPP3_RX2P/N
AE18/AD18
26
GPP1_RX7P/N
D2/D1
54
GPP3_RX3P/N
AD17/AC17
27
GPP1_RX8P/N
F5/F4
55
GPP3_RX4P/N
AE16/AD16
28
GPP1_RX9P/N
G6/G5
56
GPP3_RX5P/N
AD15/AC15
© 2012 Advanced Micro Devices, Inc.
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43869 SR5690 Databook 2.20
7-3
VOH/VOL Test
7.4
7.4.1
No.
Pin Name
Ball Ref.
57
SB_RX0P/N
AG26/AH26
58
SB_RX1P/N
AF25/AG25
59
SB_RX2P/N
AD22/AE22
60
SB_RX3P/N
AC21/AD21
61
GPP3_RX6P/N
AE14/AD14
62
GPP3_RX7P/N
AD13/AC13
63
GPP3_RX8P/N
AE12/AD12
64
GPP3_RX9P/N
AD11/AC11
65
PWM_GPIO1
E16
66
PWM_GPIO2/
PCIE_HP_INT_L
B15
67
PWM_GPIO3
F16
68
PWM_GPIO4
A15
69
PWM_GPIO5
C16
70
PCIE_RESET_GPIO1
B19
71
PCIE_RESET_GPIO4
E19
72
PCIE_RESET_GPIO5
E17
73
DFT_GPIO0
B26
74
DFT_GPIO1
A25
75
DFT_GPIO2
B24
76
DFT_GPIO3
B25
77
DFT_GPIO4
B23
78
DFT_GPIO5
A23
79
DBG_GPIO0
C22
80
DBG_GPIO1/
PCIE_HP_SCL
B22
81
DBG_GPIO2/
PCIE_HP_SDA
B21
82
DBG_GPIO3
A21
83
ALLOW_LDTSTOP
D21
84
LDTSTOP#
E15
VOH/VOL Test
Brief Description of a VOH/VOL Tree
The VOH/VOL logic provides signal output on I/O’s when test patterns are applied to the TEST_ODD and TEST_EVEN
pins. A sample of a generic VOH/VOL tree is shown in the figure below.
43869 SR5690 Databook 2.20
7-4
© 2012 Advanced Micro Devices, Inc.
Proprietary
VOH/VOL Test
TEST_ODD
TEST_EVEN
VOH/VOL
mode
1
2
3
4
5
6
Figure 7-2 Sample of a Generic VOH/VOL Tree
The following is the truth table for the above VOH/VOL tree.
Table 7-4 Truth Table for the VOH/VOL Tree Outputs
Test Vector
Number
TEST_ODD
Input
TEST_EVEN
Input
Output
Pin 1
Output
Pin 2
Output
Pin 3
Output
Pin 4
Output
Pin 5
Output
Pin 6
1
0
0
0
0
0
0
0
0
2
0
1
0
1
0
1
0
1
3
1
0
1
0
1
0
1
0
4
1
1
1
1
1
1
1
1
Refer to Table 7-5 below for the list of pins that are on the VOH/VOL tree.
7.4.2
VOH/VOL Tree Activation
To activate the VOH/VOL tree and run a VOH/VOL test, perform the sequence below:
1. Supply a 10MHz clock to I2C_CLK (Test Mode Clock) and a differential clock pair to the HT_REFCLKP/N,
GPP1_REFCLKP/N, GPP2_REFCLKP/N, and GPP3_REFCLKP/N pins.
2. Set POWERGOOD to 0.
3. Set TESTMODE to 1.
4. Set PCIE_RESET_GPIO2 to 0.
5. Wait 5 or more I2C_CLK cycles.
6. Load JTAG instruction register with the instruction 0001 1111.
7. Load JTAG instruction register with the instruction 0010 0000.
8. Load JTAG instruction register with the instruction 0101 1101.
9. Go to Run-Test_Idle state.
10. Set POWERGOOD to 1.
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
7-5
VOH/VOL Test
7.4.3
VOH/VOL pin list
Table 7-5 below shows the SR5690 VOH/VOL Tree. There is no specific order of connection. Under the Control column,
an “Odd” or “Even” indicates that the logical output of the pin is same as the input to the “TEST_ODD” or the
“TEST_EVEN” pin respectively.
When a differential signal pair appear in the table as a single entry, the output of the positive (“P”) pin is indicated in the
Control column (see last paragraph for explanations) and the output of the negative pin (“N”) will be of the opposite
value. E.g., for entry no. 1 on the tree, when TEST_EVEN is 1, HT_TXCAD0P will give a value of 1 and HT_TXCAD0N
will give a value of 0.
Table 7-5 SR5690 VOH/VOL Tree
No.
Pin Name
Ball Ref.
Control
1
HT_TXCAD0P/N
E26/E27
Even
2
HT_TXCAD1P/N
F27/F28
Odd
3
HT_TXCAD2P/N
G26/G27
Even
4
HT_TXCAD3P/N
H27/H28
Odd
5
HT_TXCAD4P/N
K27/K28
Even
6
HT_TXCAD5P/N
L26/L27
Odd
7
HT_TXCAD6P/N
M27/M28
Even
8
HT_TXCAD7P/N
N26/N27
Odd
9
HT_TXCTL0P/N
P27/P28
Even
10
HT_TXCAD8P/N
E23/E24
Odd
11
HT_TXCAD9P/N
F24/F25
Even
12
HT_TXCAD10P/N
G23/G24
Odd
13
HT_TXCAD11P/N
H24/H25
Even
14
HT_TXCAD12P/N
K24/K25
Odd
15
HT_TXCAD13P/N
L23/L24
Even
16
HT_TXCAD14P/N
M24/M25
Odd
17
HT_TXCAD15P/N
N23/N24
Even
18
HT_TXCTL1P/N
P24/P25
Odd
19
GPP1_TX0P/N
B11/C11
Even
20
GPP1_TX1P/N
A10/B10
Odd
21
GPP1_TX2P/N
B9/C9
Even
22
GPP1_TX3P/N
A8/B8
Odd
23
GPP1_TX4P/N
B7/C7
Even
24
GPP1_TX5P/N
A6/B6
Odd
25
GPP1_TX6P/N
A4/B4
Even
26
GPP1_TX7P/N
E3/E2
Odd
27
GPP1_TX8P/N
F2/F1
Even
28
GPP1_TX9P/N
G3/G2
Odd
29
GPP1_TX10P/N
H2/H1
Even
43869 SR5690 Databook 2.20
7-6
No.
Pin Name
Ball Ref.
Control
30
GPP1_TX11P/N
J3/J2
Odd
31
GPP1_TX12P/N
K2/K1
Even
32
GPP1_TX13P/N
L3/L2
Odd
33
GPP1_TX14P/N
M2/M1
Even
34
GPP1_TX15P/N
N3/N2
Odd
35
GPP2_TX0P/N
P2/P1
Even
36
GPP2_TX1P/N
R3/R2
Odd
37
GPP2_TX2P/N
T2/T1
Even
38
GPP2_TX3P/N
U3/U2
Odd
39
GPP2_TX4P/N
V2/V1
Even
40
GPP2_TX5P/N
W3/W2
Odd
41
GPP2_TX6P/N
Y2/Y1
Even
42
GPP2_TX7P/N
AA3/AA2
Odd
43
GPP2_TX8P/N
AB2/AB1
Even
44
GPP2_TX9P/N
AC3/AC2
Odd
45
GPP2_TX10P/N
AE3/AE2
Even
46
GPP2_TX11P/N
AG4/AH4
Odd
47
GPP2_TX12P/N
AG6/AH6
Even
48
GPP2_TX13P/N
AF7/AG7
Odd
49
GPP2_TX14P/N
AG8/AH8
Even
50
GPP2_TX15P/N
AF9/AG9
Odd
51
GPP3_TX0P/N
AG19/AF19
Even
52
GPP3_TX1P/N
AH18/AG18
Odd
53
GPP3_TX2P/N
AG17/AF17
Even
54
GPP3_TX3P/N
AH16/AG16
Odd
55
GPP3_TX4P/N
AG15/AF15
Even
56
GPP3_TX5P/N
AH14/AG14
Odd
57
SB_TX0P/N
AG24/AH24
Even
58
SB_TX1P/N
AF23/AG23
Odd
© 2012 Advanced Micro Devices, Inc.
Proprietary
VOH/VOL Test
No.
Pin Name
Ball Ref.
Control
59
SB_TX2P/N
AF21/AG21
Even
60
SB_TX3P/N
AG22/AH22
Odd
61
GPP3_TX6P/N
AG13/AF13
Even
62
GPP3_TX7P/N
AH12/AG12
Odd
63
GPP3_TX8P/N
AG11/AF11
Even
64
GPP3_TX9P/N
AH10/AG10
Odd
65
PWM_GPIO1
E16
Even
66
PWM_GPIO2/PCIE_H
P_INT_L
B15
Odd
67
PWM_GPIO5
C16
Even
68
PCIE_RESET_GPIO1
B19
Odd
69
PCIE_RESET_GPIO4
E19
Even
70
PCIE_RESET_GPIO5
E17
Odd
71
DFT_GPIO0
B26
Even
72
DFT_GPIO1
A25
Odd
73
DFT_GPIO2
B24
Even
74
DFT_GPIO3
B25
Odd
75
DFT_GPIO4
B23
Even
76
DFT_GPIO5
A23
Odd
77
DBG_GPIO0
C22
Even
78
DBG_GPIO1/PCIE_H
P_SCL
B22
Odd
79
DBG_GPIO2/PCIE_H
P_SDA
B21
Even
80
DBG_GPIO3
A21
Odd
81
ALLOW_LDTSTOP
D21
Even
82
LDTSTOP#
E15
Odd
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
7-7
VOH/VOL Test
This page intentionally left blank.
43869 SR5690 Databook 2.20
7-8
© 2012 Advanced Micro Devices, Inc.
Proprietary
Appendix A
Pin Listings
This appendix contains pin listings for the SR5690 sorted in different ways. To go to the listing of interest, use the linked
cross-references below:
“SR5690 Pin Listing Sorted by Ball Reference” on page A-2
“SR5690 Pin Listing Sorted by Pin Name” on page A-9
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
Appendix A-1
SR5690 Pin Listing Sorted by Ball Reference
A.1
SR5690 Pin Listing Sorted by Ball Reference
Table A-1 SR5690 Pin Listing Sorted by Ball Reference
Ball #
Ball Name
Ball #
Ball Name
Ball #
Ball Name
A10
GPP1_TX1P
AA18
VDDPCIE
AB22
VDDHT
A11
VSS
AA19
VSS
AB23
VSS
A12
VDDA18PCIE
AA2
GPP2_TX7N
AB24
HT_RXCAD10N
A13
VDDA18PCIE
AA20
VSS
AB25
HT_RXCAD10P
A14
VSS
AA21
THERMALDIODE_
N
AB26
VSS
A15
PWM_GPIO4
AB27
HT_RXCAD2N
AA22
VDDHT
A16
VSS
AB28
HT_RXCAD2P
AA23
HT_RXCAD11N
A17
POWERGOOD
AB3
VSS
AA24
HT_RXCAD11P
A18
VDD18
AB4
GPP2_RX8N
AA25
VSS
A19
TESTMODE
AB5
GPP2_RX8P
AA26
HT_RXCAD3N
A20
VSS
AB6
VSS
AA27
HT_RXCAD3P
A21
DBG_GPIO3/NON
_FATAL_CORR#
AB7
VDDPCIE
AA28
VSS
AB8
VSS
A22
VSS
AA3
GPP2_TX7P
AB9
VDDPCIE
A23
DFT_GPIO5/
SYNCFLOODIN#
AA4
VSS
AC1
VSS
AA5
GPP2_RX7N
AC10
VSS
AA6
GPP2_RX7P
AC11
GPP3_RX9N
AA7
VSS
AC12
VSS
AA8
VDDPCIE
AC13
GPP3_RX7N
AA9
VSS
AC14
VSS
AB1
GPP2_TX8N
AC15
GPP3_RX5N
AB10
VSS
AC16
VSS
AB11
VDDPCIE
AC17
GPP3_RX3N
AB12
VSS
AC18
VSS
AB13
VDDPCIE
AC19
GPP3_RX1N
AB14
VSS
AC2
GPP2_TX9N
AB15
VDDPCIE
AC20
VSS
AB16
VSS
AC21
SB_RX3P
AB17
VDDPCIE
AC22
VDDHT
AB18
VSS
AC23
HT_RXCAD9N
AB19
VDDPCIE
AC24
HT_RXCAD9P
AB2
GPP2_TX8P
AC25
VSS
AB20
VSS
AC26
HT_RXCAD1N
AB21
VSS
AC27
HT_RXCAD1P
A24
VSS
A25
DFT_GPIO1
A26
VSS
A3
VDDPCIE
A4
GPP1_TX6P
A5
VSS
A6
GPP1_TX5P
A7
VSS
A8
GPP1_TX3P
A9
VSS
AA1
VSS
AA10
VDDPCIE
AA11
VSS
AA12
VDDPCIE
AA13
VSS
AA14
GPP3_REFCLKN
AA15
GPP3_REFCLKP
AA16
VDDPCIE
AA17
VSS
43869 SR5690 Databook 2.20
Appendix A-2
© 2012 Advanced Micro Devices, Inc.
Proprietary
SR5690 Pin Listing Sorted by Ball Reference
Ball #
Ball Name
Ball #
Ball Name
Ball #
Ball Name
AC28
VSS
AE10
PCE_RCALRP
AF19
GPP3_TX0N
AC3
GPP2_TX9P
AE11
VSS
AF2
GPP2_RX10P
AC4
VSS
AE12
GPP3_RX8P
AF20
VSS
AC5
VSS
AE13
VSS
AF21
SB_TX2P
AC6
VDDPCIE
AE14
GPP3_RX6P
AF22
VSS
AC7
GPP2_RX13P
AE15
VSS
AF23
SB_TX1P
AC8
VSS
AE16
GPP3_RX4P
AF24
VSS
AC9
GPP2_RX15P
AE17
VSS
AF25
SB_RX1P
AD1
GPP2_RX9N
AE18
GPP3_RX2P
AF26
VSS
AD10
PCE_RCALRN
AE19
VSS
AF27
VDDHT
AD11
GPP3_RX9P
AE2
GPP2_TX10N
AF28
VSS
AD12
GPP3_RX8N
AE20
PCE_BCALRP
AF3
VDDPCIE
AD13
GPP3_RX7P
AE21
VSS
AF4
VSS
AD14
GPP3_RX6N
AE22
SB_RX2N
AF5
GPP2_RX11P
AD15
GPP3_RX5P
AE23
VSS
AF6
VSS
AD16
GPP3_RX4N
AE24
VDDHT
AF7
GPP2_TX13P
AD17
GPP3_RX3P
AE25
VDDHT
AF8
VSS
AD18
GPP3_RX2N
AE26
VDDHT
AF9
GPP2_TX15P
AD19
GPP3_RX1P
AE27
VDDHT
AG10
GPP3_TX9N
AD2
GPP2_RX9P
AE28
VDDHT
AG11
GPP3_TX8P
AD20
PCE_BCALRN
AE3
GPP2_TX10P
AG12
GPP3_TX7N
AD21
SB_RX3N
AE4
VDDPCIE
AG13
GPP3_TX6P
AD22
SB_RX2P
AE5
VSS
AG14
GPP3_TX5N
AD23
VDDHT
AE6
GPP2_RX12N
AG15
GPP3_TX4P
AD24
HT_RXCAD8N
AE7
VSS
AG16
GPP3_TX3N
AD25
HT_RXCAD8P
AE8
GPP2_RX14N
AG17
GPP3_TX2P
AD26
VSS
AE9
VSS
AG18
GPP3_TX1N
AD27
HT_RXCAD0N
AF1
GPP2_RX10N
AG19
GPP3_TX0P
AD28
HT_RXCAD0P
AF10
VSS
AG2
VDDPCIE
AD3
VSS
AF11
GPP3_TX8N
AG20
GPP3_RX0N
AD4
VSS
AF12
VSS
AG21
SB_TX2N
AD5
VDDPCIE
AF13
GPP3_TX6N
AG22
SB_TX3P
AD6
GPP2_RX12P
AF14
VSS
AG23
SB_TX1N
AD7
GPP2_RX13N
AF15
GPP3_TX4N
AG24
SB_TX0P
AD8
GPP2_RX14P
AF16
VSS
AG25
SB_RX1N
AD9
GPP2_RX15N
AF17
GPP3_TX2N
AG26
SB_RX0P
AE1
VSS
AF18
VSS
AG27
VSS
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
Appendix A-3
SR5690 Pin Listing Sorted by Ball Reference
Ball #
Ball Name
AG3
VSS
AG4
GPP2_TX11P
Ball #
Ball Name
Ball #
Ball Name
B15
PWM_GPIO2/
PCIE_HP_INT_L
C21
VSS
B16
PWM_GPIO6
C22
DBG_GPIO0/SER
R_FATAL#
B17
OSCIN
C23
VSS
B18
VDD18
C24
VDDHTTX
C25
VDDHTTX
C26
VDDHTTX
C27
VDDHTTX
C28
VDDHTTX
C3
VDDPCIE
C4
VSS
C5
GPP1_RX6N
C6
VSS
C7
GPP1_TX4N
C8
VSS
C9
GPP1_TX2N
D1
GPP1_RX7N
D10
GPP1_RX1P
D11
VSS
D12
VDDA18PCIE
D13
VDDA18PCIE
D14
VSS
D15
SYSRESET#
D16
VSS
D17
PCIE_RESET_GPI
O2
AG5
GPP2_RX11N
AG6
GPP2_TX12P
AG7
GPP2_TX13N
AG8
GPP2_TX14P
B19
PCIE_RESET_GPI
O1
AG9
GPP2_TX15N
B2
VDDPCIE
AH10
GPP3_TX9P
B20
I2C_CLK
AH11
VSS
B21
AH12
GPP3_TX7P
DBG_GPIO2/
PCIE_HP_SDA
AH13
VSS
B22
DBG_GPIO1/
PCIE_HP_SCL
AH14
GPP3_TX5P
B23
DFT_GPIO4
AH15
VSS
B24
DFT_GPIO2
AH16
GPP3_TX3P
B25
DFT_GPIO3
AH17
VSS
B26
DFT_GPIO0/NMI#
AH18
GPP3_TX1P
B27
VSS
AH19
VSS
B3
VSS
AH20
GPP3_RX0P
B4
GPP1_TX6N
AH21
VSS
B5
GPP1_RX6P
AH22
SB_TX3N
B6
GPP1_TX5N
AH23
VSS
B7
GPP1_TX4P
AH24
SB_TX0N
B8
GPP1_TX3N
AH25
VSS
B9
GPP1_TX2P
AH26
SB_RX0N
C1
VDDPCIE
AH3
VSS
C10
VSS
AH4
GPP2_TX11N
C11
GPP1_TX0N
D18
VDD18
AH5
VSS
C12
VDDA18PCIE
D19
AH6
GPP2_TX12N
PCIE_RESET_GPI
O3
C13
VDDA18PCIE
AH7
VSS
D2
GPP1_RX7P
C14
VSS
AH8
GPP2_TX14N
D20
VSS
C15
VSS
AH9
VSS
C16
PWM_GPIO5
D21
ALLOW_LDTSTO
P
B10
GPP1_TX1N
C17
VSS
D22
VDDHTTX
B11
GPP1_TX0P
C18
VDD18
D23
VDDHTTX
B12
VDDA18PCIE
C19
VSS
D24
HT_RXCALN
B13
VDDA18PCIE
C2
VSS
D25
HT_RXCALP
B14
VSS
C20
I2C_DATA
D26
VSS
43869 SR5690 Databook 2.20
Appendix A-4
© 2012 Advanced Micro Devices, Inc.
Proprietary
SR5690 Pin Listing Sorted by Ball Reference
Ball #
Ball Name
Ball #
Ball Name
Ball #
Ball Name
D27
HT_TXCALN
E8
GPP1_RX3N
G15
VSS
D28
HT_TXCALP
E9
GPP1_RX2P
G16
VSS
D3
VSS
F1
GPP1_TX8N
G17
VSS
D4
VDDPCIE
F10
VSS
G18
VSS
D5
VSS
F11
GPP1_RX0N
G19
VSS
D6
GPP1_RX5P
F12
VDDA18PCIE
G2
GPP1_TX9N
D7
VSS
F13
VDDA18PCIE
G20
VSS
D8
GPP1_RX3P
F14
PCE_TCALRP
G21
VDDA18HTPLL
D9
VSS
F15
VSS
G22
VDDHTTX
E1
VSS
F16
PWM_GPIO3
G23
HT_TXCAD10P
E10
GPP1_RX1N
F17
VSS
G24
HT_TXCAD10N
E11
GPP1_RX0P
F18
VSS
G25
VSS
E12
VDDA18PCIE
F19
VSS
G26
HT_TXCAD2P
E13
VDDA18PCIE
F2
GPP1_TX8P
G27
HT_TXCAD2N
E14
PCE_TCALRN
F20
VSS
G28
VSS
E15
LDTSTOP#
F21
VSS
G3
GPP1_TX9P
E16
PWM_GPIO1
F22
VDDHTTX
G4
VSS
E17
PCIE_RESET_GPI
O5
F23
VSS
G5
GPP1_RX9N
F24
HT_TXCAD9P
G6
GPP1_RX9P
E18
VDD18
F25
HT_TXCAD9N
G7
VDDPCIE
E19
PCIE_RESET_GPI
O4
F26
VSS
G8
VDDPCIE
E2
GPP1_TX7N
F27
HT_TXCAD1P
G9
VSS
E20
VSS
F28
HT_TXCAD1N
H1
GPP1_TX10N
E21
STRP_DATA
F3
VSS
H10
VSS
E22
VDDHTTX
F4
GPP1_RX8N
H11
VDDPCIE
E23
HT_TXCAD8P
F5
GPP1_RX8P
H12
VDDA18PCIE
E24
HT_TXCAD8N
F6
VDDPCIE
H13
VDDA18PCIE
E25
VSS
F7
GPP1_RX4N
H14
VDDA18PCIE
E26
HT_TXCAD0P
F8
VSS
H15
VSS
E27
HT_TXCAD0N
F9
GPP1_RX2N
H16
VSS
E28
VSS
G1
VSS
H17
VSS
E3
GPP1_TX7P
G10
VDDPCIE
H18
VSS
E4
VSS
G11
VSS
H19
VSS
E5
VDDPCIE
G12
VDDA18PCIE
H2
GPP1_TX10P
E6
GPP1_RX5N
G13
VDDA18PCIE
H20
VSS
E7
GPP1_RX4P
G14
VDDA18PCIE
H21
VSS
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
Appendix A-5
SR5690 Pin Listing Sorted by Ball Reference
Ball #
Ball Name
Ball #
Ball Name
Ball #
Ball Name
H22
VDDHTTX
K25
HT_TXCAD12N
M12
VSS
H23
VSS
K26
VSS
M13
VDDC
H24
HT_TXCAD11P
K27
HT_TXCAD4P
M14
VSS
H25
HT_TXCAD11N
K28
HT_TXCAD4N
M15
VDDC
H26
VSS
K3
VSS
M16
VSS
H27
HT_TXCAD3P
K4
GPP1_RX12N
M17
VSS
H28
HT_TXCAD3N
K5
GPP1_RX12P
M18
VSS
H3
VSS
K6
VSS
M2
GPP1_TX14P
H4
GPP1_RX10N
K7
VDDPCIE
M21
VSS
H5
GPP1_RX10P
K8
VSS
M22
VDDHT
H6
VSS
L1
VSS
M23
VSS
H7
VDDPCIE
L11
VDDA18PCIE
M24
HT_TXCAD14P
H8
GPP1_REFCLKN
L12
VSS
M25
HT_TXCAD14N
H9
VDDPCIE
L13
VSS
M26
VSS
J1
VSS
L14
VDDC
M27
HT_TXCAD6P
J2
GPP1_TX11N
L15
VSS
M28
HT_TXCAD6N
J21
HT_REFCLKN
L16
VDDC
M3
VSS
J22
VSS
L17
VSS
M4
GPP1_RX14N
J23
HT_TXCLK1P
L18
VSS
M5
GPP1_RX14P
J24
HT_TXCLK1N
L2
GPP1_TX13N
M6
VSS
J25
VSS
L21
VDDHT
M7
VDDPCIE
J26
HT_TXCLK0P
L22
VSS
M8
VSS
J27
HT_TXCLK0N
L23
HT_TXCAD13P
N1
VSS
J28
VSS
L24
HT_TXCAD13N
N11
VSS
J3
GPP1_TX11P
L25
VSS
N12
VDDC
J4
VSS
L26
HT_TXCAD5P
N13
VSS
J5
GPP1_RX11N
L27
HT_TXCAD5N
N14
VDDC
J6
GPP1_RX11P
L28
VSS
N15
VSS
J7
VSS
L3
GPP1_TX13P
N16
VDDC
J8
GPP1_REFCLKP
L4
VSS
N17
VSS
K1
GPP1_TX12N
L5
GPP1_RX13N
N18
VSS
K2
GPP1_TX12P
L6
GPP1_RX13P
N2
GPP1_TX15N
K21
HT_REFCLKP
L7
VSS
N21
VDDHT
K22
VDDHT
L8
VDDPCIE
N22
VSS
K23
VSS
M1
GPP1_TX14N
N23
HT_TXCAD15P
K24
HT_TXCAD12P
M11
VSS
N24
HT_TXCAD15N
43869 SR5690 Databook 2.20
Appendix A-6
© 2012 Advanced Micro Devices, Inc.
Proprietary
SR5690 Pin Listing Sorted by Ball Reference
Ball #
Ball Name
Ball #
Ball Name
Ball #
Ball Name
N25
VSS
R12
VDDC
T25
HT_RXCAD15P
N26
HT_TXCAD7P
R13
VSS
T26
VSS
N27
HT_TXCAD7N
R14
VDDC
T27
HT_RXCAD7N
N28
VSS
R15
VSS
T28
HT_RXCAD7P
N3
GPP1_TX15P
R16
VDDC
T3
VSS
N4
VSS
R17
VSS
T4
GPP2_RX2N
N5
GPP1_RX15N
R18
VSS
T5
GPP2_RX2P
N6
GPP1_RX15P
R2
GPP2_TX1N
T6
VSS
N7
VSS
R21
VDDHT
T7
VDDPCIE
N8
VDDPCIE
R22
VSS
T8
VSS
P1
GPP2_TX0N
R23
HT_RXCTL1N
U1
VSS
P11
VSS
R24
HT_RXCTL1P
U11
VSS
P12
VSS
R25
VSS
U12
VSS
P13
VDDC
R26
HT_RXCTL0N
U13
VSS
P14
VSS
R27
HT_RXCTL0P
U14
VDDC
P15
VDDC
R28
VSS
U15
VSS
P16
VSS
R3
GPP2_TX1P
U16
VDDC
P17
VDDC
R4
VSS
U17
VSS
P18
VSS
R5
GPP2_RX1N
U18
VSS
P2
GPP2_TX0P
R6
GPP2_RX1P
U2
GPP2_TX3N
P21
VSS
R7
VSS
U21
VDDHT
P22
VDDHT
R8
VDDPCIE
U22
VSS
P23
VSS
T1
GPP2_TX2N
U23
HT_RXCAD14N
P24
HT_TXCTL1P
T11
VSS
U24
HT_RXCAD14P
P25
HT_TXCTL1N
T12
VSS
U25
VSS
P26
VSS
T13
VDDC
U26
HT_RXCAD6N
P27
HT_TXCTL0P
T14
VSS
U27
HT_RXCAD6P
P28
HT_TXCTL0N
T15
VDDC
U28
VSS
P3
VSS
T16
VSS
U3
GPP2_TX3P
P4
GPP2_RX0N
T17
VDDC
U4
VSS
P5
GPP2_RX0P
T18
VSS
U5
GPP2_RX3N
P6
VSS
T2
GPP2_TX2P
U6
GPP2_RX3P
P7
VDDPCIE
T21
VSS
U7
VSS
P8
VSS
T22
VDDHT
U8
GPP2_REFCLKN
R1
VSS
T23
VSS
V1
GPP2_TX4N
R11
VSS
T24
HT_RXCAD15N
V11
VDDA18PCIE
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
Appendix A-7
SR5690 Pin Listing Sorted by Ball Reference
Ball #
Ball Name
Ball #
Ball Name
V12
VSS
W7
VSS
V13
VSS
W8
VDDPCIE
V14
VSS
Y1
GPP2_TX6N
V15
VSS
Y2
GPP2_TX6P
V16
VSS
Y21
V17
VSS
THERMALDIODE_
P
V18
VDDA18PCIE
Y22
VDDHT
V2
GPP2_TX4P
Y23
VSS
V21
VSS
Y24
HT_RXCLK1N
V22
VDDHT
Y25
HT_RXCLK1P
V23
VSS
Y26
VSS
V24
HT_RXCAD13N
Y27
HT_RXCLK0N
V25
HT_RXCAD13P
Y28
HT_RXCLK0P
V26
VSS
Y3
VSS
V27
HT_RXCAD5N
Y4
GPP2_RX6N
V28
HT_RXCAD5P
Y5
GPP2_RX6P
V3
VSS
Y6
VSS
V4
GPP2_RX4N
Y7
VDDPCIE
V5
GPP2_RX4P
Y8
VSS
V6
VSS
V7
VDDPCIE
V8
GPP2_REFCLKP
W1
VSS
W2
GPP2_TX5N
W21
VDDHT
W22
VSS
W23
HT_RXCAD12N
W24
HT_RXCAD12P
W25
VSS
W26
HT_RXCAD4N
W27
HT_RXCAD4P
W28
VSS
W3
GPP2_TX5P
W4
VSS
W5
GPP2_RX5N
W6
GPP2_RX5P
43869 SR5690 Databook 2.20
Appendix A-8
© 2012 Advanced Micro Devices, Inc.
Proprietary
SR5690 Pin Listing Sorted by Ball Reference
A.2
SR5690 Pin Listing Sorted by Pin Name
Ball Name
Ball #
Ball Name
Ball #
Ball Name
Ball #
ALLOW_LDTSTOP
D21
GPP1_RX3P
D8
GPP1_TX5N
B6
DBG_GPIO0/SERR_F
ATAL#
C22
GPP1_RX4N
F7
GPP1_TX5P
A6
GPP1_RX4P
E7
GPP1_TX6N
B4
DBG_GPIO1/
PCIE_HP_SCL
B22
GPP1_RX5N
E6
GPP1_TX6P
A4
DBG_GPIO2/
PCIE_HP_SDA
GPP1_RX5P
D6
GPP1_TX7N
E2
B21
GPP1_RX6N
C5
GPP1_TX7P
E3
DBG_GPIO3/
NON_FATAL_CORR#
A21
GPP1_RX6P
B5
GPP1_TX8N
F1
DFT_GPIO0/NMI#
B26
GPP1_RX7N
D1
GPP1_TX8P
F2
DFT_GPIO1
A25
GPP1_RX7P
D2
GPP1_TX9N
G2
DFT_GPIO2
B24
GPP1_RX8N
F4
GPP1_TX9P
G3
DFT_GPIO3
B25
GPP1_RX8P
F5
GPP2_REFCLKN
U8
DFT_GPIO4
B23
GPP1_RX9N
G5
GPP2_REFCLKP
V8
DFT_GPIO5/
SYNCFLOODIN#
GPP1_RX9P
G6
GPP2_RX0N
P4
A23
GPP1_TX0N
C11
GPP2_RX0P
P5
GPP1_REFCLKN
H8
GPP1_TX0P
B11
GPP2_RX10N
AF1
GPP1_REFCLKP
J8
GPP1_TX10N
H1
GPP2_RX10P
AF2
GPP1_RX0N
F11
GPP1_TX10P
H2
GPP2_RX11N
AG5
GPP1_RX0P
E11
GPP1_TX11N
J2
GPP2_RX11P
AF5
GPP1_RX10N
H4
GPP1_TX11P
J3
GPP2_RX12N
AE6
GPP1_RX10P
H5
GPP1_TX12N
K1
GPP2_RX12P
AD6
GPP1_RX11N
J5
GPP1_TX12P
K2
GPP2_RX13N
AD7
GPP1_RX11P
J6
GPP1_TX13N
L2
GPP2_RX13P
AC7
GPP1_RX12N
K4
GPP1_TX13P
L3
GPP2_RX14N
AE8
GPP1_RX12P
K5
GPP1_TX14N
M1
GPP2_RX14P
AD8
GPP1_RX13N
L5
GPP1_TX14P
M2
GPP2_RX15N
AD9
GPP1_RX13P
L6
GPP1_TX15N
N2
GPP2_RX15P
AC9
GPP1_RX14N
M4
GPP1_TX15P
N3
GPP2_RX1N
R5
GPP1_RX14P
M5
GPP1_TX1N
B10
GPP2_RX1P
R6
GPP1_RX15N
N5
GPP1_TX1P
A10
GPP2_RX2N
T4
GPP1_RX15P
N6
GPP1_TX2N
C9
GPP2_RX2P
T5
GPP1_RX1N
E10
GPP1_TX2P
B9
GPP2_RX3N
U5
GPP1_RX1P
D10
GPP1_TX3N
B8
GPP2_RX3P
U6
GPP1_RX2N
F9
GPP1_TX3P
A8
GPP2_RX4N
V4
GPP1_RX2P
E9
GPP1_TX4N
C7
GPP2_RX4P
V5
GPP1_RX3N
E8
GPP1_TX4P
B7
GPP2_RX5N
W5
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
Appendix A-9
SR5690 Pin Listing Sorted by Ball Reference
Ball Name
Ball #
Ball Name
Ball #
Ball Name
Ball #
GPP2_RX5P
W6
GPP2_TX7P
AA3
GPP3_TX4P
AG15
GPP2_RX6N
Y4
GPP2_TX8N
AB1
GPP3_TX5N
AG14
GPP2_RX6P
Y5
GPP2_TX8P
AB2
GPP3_TX5P
AH14
GPP2_RX7N
AA5
GPP2_TX9N
AC2
GPP3_TX6N
AF13
GPP2_RX7P
AA6
GPP2_TX9P
AC3
GPP3_TX6P
AG13
GPP2_RX8N
AB4
GPP3_REFCLKN
AA14
GPP3_TX7N
AG12
GPP2_RX8P
AB5
GPP3_REFCLKP
AA15
GPP3_TX7P
AH12
GPP2_RX9N
AD1
GPP3_RX0N
AG20
GPP3_TX8N
AF11
GPP2_RX9P
AD2
GPP3_RX0P
AH20
GPP3_TX8P
AG11
GPP2_TX0N
P1
GPP3_RX1N
AC19
GPP3_TX9N
AG10
GPP2_TX0P
P2
GPP3_RX1P
AD19
GPP3_TX9P
AH10
GPP2_TX10N
AE2
GPP3_RX2N
AD18
HT_REFCLKN
J21
GPP2_TX10P
AE3
GPP3_RX2P
AE18
HT_REFCLKP
K21
GPP2_TX11N
AH4
GPP3_RX3N
AC17
HT_RXCAD0N
AD27
GPP2_TX11P
AG4
GPP3_RX3P
AD17
HT_RXCAD0P
AD28
GPP2_TX12N
AH6
GPP3_RX4N
AD16
HT_RXCAD10N
AB24
GPP2_TX12P
AG6
GPP3_RX4P
AE16
HT_RXCAD10P
AB25
GPP2_TX13N
AG7
GPP3_RX5N
AC15
HT_RXCAD11N
AA23
GPP2_TX13P
AF7
GPP3_RX5P
AD15
HT_RXCAD11P
AA24
GPP2_TX14N
AH8
GPP3_RX6N
AD14
HT_RXCAD12N
W23
GPP2_TX14P
AG8
GPP3_RX6P
AE14
HT_RXCAD12P
W24
GPP2_TX15N
AG9
GPP3_RX7N
AC13
HT_RXCAD13N
V24
GPP2_TX15P
AF9
GPP3_RX7P
AD13
HT_RXCAD13P
V25
GPP2_TX1N
R2
GPP3_RX8N
AD12
HT_RXCAD14N
U23
GPP2_TX1P
R3
GPP3_RX8P
AE12
HT_RXCAD14P
U24
GPP2_TX2N
T1
GPP3_RX9N
AC11
HT_RXCAD15N
T24
GPP2_TX2P
T2
GPP3_RX9P
AD11
HT_RXCAD15P
T25
GPP2_TX3N
U2
GPP3_TX0N
AF19
HT_RXCAD1N
AC26
GPP2_TX3P
U3
GPP3_TX0P
AG19
HT_RXCAD1P
AC27
GPP2_TX4N
V1
GPP3_TX1N
AG18
HT_RXCAD2N
AB27
GPP2_TX4P
V2
GPP3_TX1P
AH18
HT_RXCAD2P
AB28
GPP2_TX5N
W2
GPP3_TX2N
AF17
HT_RXCAD3N
AA26
GPP2_TX5P
W3
GPP3_TX2P
AG17
HT_RXCAD3P
AA27
GPP2_TX6N
Y1
GPP3_TX3N
AG16
HT_RXCAD4N
W26
GPP2_TX6P
Y2
GPP3_TX3P
AH16
HT_RXCAD4P
W27
GPP2_TX7N
AA2
GPP3_TX4N
AF15
HT_RXCAD5N
V27
43869 SR5690 Databook 2.20
Appendix A-10
© 2012 Advanced Micro Devices, Inc.
Proprietary
SR5690 Pin Listing Sorted by Ball Reference
Ball Name
Ball #
Ball Name
Ball #
Ball Name
Ball #
HT_RXCAD5P
V28
HT_TXCAD2P
G26
PCIE_RESET_GPIO2
D17
HT_RXCAD6N
U26
HT_TXCAD3N
H28
PCIE_RESET_GPIO3
D19
HT_RXCAD6P
U27
HT_TXCAD3P
H27
PCIE_RESET_GPIO4
E19
HT_RXCAD7N
T27
HT_TXCAD4N
K28
PCIE_RESET_GPIO5
E17
HT_RXCAD7P
T28
HT_TXCAD4P
K27
POWERGOOD
A17
HT_RXCAD8N
AD24
HT_TXCAD5N
L27
PWM_GPIO1
E16
HT_RXCAD8P
AD25
HT_TXCAD5P
L26
B15
HT_RXCAD9N
AC23
HT_TXCAD6N
M28
PWM_GPIO2/
PCIE_HP_INT_L
HT_RXCAD9P
AC24
HT_TXCAD6P
M27
PWM_GPIO3
F16
HT_RXCALN
D24
HT_TXCAD7N
N27
PWM_GPIO4
A15
HT_RXCALP
D25
HT_TXCAD7P
N26
PWM_GPIO5
C16
HT_RXCLK0N
Y27
HT_TXCAD8N
E24
PWM_GPIO6
B16
HT_RXCLK0P
Y28
HT_TXCAD8P
E23
SB_RX0N
AH26
HT_RXCLK1N
Y24
HT_TXCAD9N
F25
SB_RX0P
AG26
HT_RXCLK1P
Y25
HT_TXCAD9P
F24
SB_RX1N
AG25
HT_RXCTL0N
R26
HT_TXCALN
D27
SB_RX1P
AF25
HT_RXCTL0P
R27
HT_TXCALP
D28
SB_RX2N
AE22
HT_RXCTL1N
R23
HT_TXCLK0N
J27
SB_RX2P
AD22
HT_RXCTL1P
R24
HT_TXCLK0P
J26
SB_RX3N
AD21
HT_TXCAD0N
E27
HT_TXCLK1N
J24
SB_RX3P
AC21
HT_TXCAD0P
E26
HT_TXCLK1P
J23
SB_TX0N
AH24
HT_TXCAD10N
G24
HT_TXCTL0N
P28
SB_TX0P
AG24
HT_TXCAD10P
G23
HT_TXCTL0P
P27
SB_TX1N
AG23
HT_TXCAD11N
H25
HT_TXCTL1N
P25
SB_TX1P
AF23
HT_TXCAD11P
H24
HT_TXCTL1P
P24
SB_TX2N
AG21
HT_TXCAD12N
K25
I2C_CLK
B20
SB_TX2P
AF21
HT_TXCAD12P
K24
I2C_DATA
C20
SB_TX3N
AH22
HT_TXCAD13N
L24
LDTSTOP#
E15
SB_TX3P
AG22
HT_TXCAD13P
L23
OSCIN
B17
STRP_DATA
E21
HT_TXCAD14N
M25
PCE_BCALRN
AD20
SYSRESET#
D15
HT_TXCAD14P
M24
PCE_BCALRP
AE20
TESTMODE
A19
HT_TXCAD15N
N24
PCE_RCALRN
AD10
THERMALDIODE_N
AA21
HT_TXCAD15P
N23
PCE_RCALRP
AE10
THERMALDIODE_P
Y21
HT_TXCAD1N
F28
PCE_TCALRN
E14
VDD18
A18
HT_TXCAD1P
F27
PCE_TCALRP
F14
VDD18
B18
HT_TXCAD2N
G27
PCIE_RESET_GPIO1
B19
VDD18
C18
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
Appendix A-11
SR5690 Pin Listing Sorted by Ball Reference
Ball Name
Ball #
Ball Name
Ball #
Ball Name
Ball #
VDD18
D18
VDDC
R16
VDDHTTX
G22
VDD18
E18
VDDC
T13
VDDHTTX
H22
VDDA18HTPLL
G21
VDDC
T15
VDDPCIE
A3
VDDA18PCIE
A12
VDDC
T17
VDDPCIE
AA10
VDDA18PCIE
A13
VDDC
U14
VDDPCIE
AA12
VDDA18PCIE
B12
VDDC
U16
VDDPCIE
AA16
VDDA18PCIE
B13
VDDHT
AA22
VDDPCIE
AA18
VDDA18PCIE
C12
VDDHT
AB22
VDDPCIE
AA8
VDDA18PCIE
C13
VDDHT
AC22
VDDPCIE
AB11
VDDA18PCIE
D12
VDDHT
AD23
VDDPCIE
AB13
VDDA18PCIE
D13
VDDHT
AE24
VDDPCIE
AB15
VDDA18PCIE
E12
VDDHT
AE25
VDDPCIE
AB17
VDDA18PCIE
E13
VDDHT
AE26
VDDPCIE
AB19
VDDA18PCIE
F12
VDDHT
AE27
VDDPCIE
AB7
VDDA18PCIE
F13
VDDHT
AE28
VDDPCIE
AB9
VDDA18PCIE
G12
VDDHT
AF27
VDDPCIE
AC6
VDDA18PCIE
G13
VDDHT
K22
VDDPCIE
AD5
VDDA18PCIE
G14
VDDHT
L21
VDDPCIE
AE4
VDDA18PCIE
H12
VDDHT
M22
VDDPCIE
AF3
VDDA18PCIE
H13
VDDHT
N21
VDDPCIE
AG2
VDDA18PCIE
H14
VDDHT
P22
VDDPCIE
B2
VDDA18PCIE
L11
VDDHT
R21
VDDPCIE
C1
VDDA18PCIE
V11
VDDHT
T22
VDDPCIE
C3
VDDA18PCIE
V18
VDDHT
U21
VDDPCIE
D4
VDDC
L14
VDDHT
V22
VDDPCIE
E5
VDDC
L16
VDDHT
W21
VDDPCIE
F6
VDDC
M13
VDDHT
Y22
VDDPCIE
G10
VDDC
M15
VDDHTTX
C24
VDDPCIE
G7
VDDC
N12
VDDHTTX
C25
VDDPCIE
G8
VDDC
N14
VDDHTTX
C26
VDDPCIE
H11
VDDC
N16
VDDHTTX
C27
VDDPCIE
H7
VDDC
P13
VDDHTTX
C28
VDDPCIE
H9
VDDC
P15
VDDHTTX
D22
VDDPCIE
K7
VDDC
P17
VDDHTTX
D23
VDDPCIE
L8
VDDC
R12
VDDHTTX
E22
VDDPCIE
M7
VDDC
R14
VDDHTTX
F22
VDDPCIE
N8
43869 SR5690 Databook 2.20
Appendix A-12
© 2012 Advanced Micro Devices, Inc.
Proprietary
SR5690 Pin Listing Sorted by Ball Reference
Ball Name
Ball #
Ball Name
Ball #
Ball Name
Ball #
VDDPCIE
P7
VSS
AB3
VSS
AF24
VDDPCIE
R8
VSS
AB6
VSS
AF26
VDDPCIE
T7
VSS
AB8
VSS
AF28
VDDPCIE
V7
VSS
AC1
VSS
AF4
VDDPCIE
W8
VSS
AC10
VSS
AF6
VDDPCIE
Y7
VSS
AC12
VSS
AF8
VSS
A11
VSS
AC14
VSS
AG27
VSS
A14
VSS
AC16
VSS
AG3
VSS
A16
VSS
AC18
VSS
AH11
VSS
A20
VSS
AC20
VSS
AH13
VSS
A22
VSS
AC25
VSS
AH15
VSS
A24
VSS
AC28
VSS
AH17
VSS
A26
VSS
AC4
VSS
AH19
VSS
A5
VSS
AC5
VSS
AH21
VSS
A7
VSS
AC8
VSS
AH23
VSS
A9
VSS
AD26
VSS
AH25
VSS
AA1
VSS
AD3
VSS
AH3
VSS
AA11
VSS
AD4
VSS
AH5
VSS
AA13
VSS
AE1
VSS
AH7
VSS
AA17
VSS
AE11
VSS
AH9
VSS
AA19
VSS
AE13
VSS
B14
VSS
AA20
VSS
AE15
VSS
B27
VSS
AA25
VSS
AE17
VSS
B3
VSS
AA28
VSS
AE19
VSS
C10
VSS
AA4
VSS
AE21
VSS
C14
VSS
AA7
VSS
AE23
VSS
C15
VSS
AA9
VSS
AE5
VSS
C17
VSS
AB10
VSS
AE7
VSS
C19
VSS
AB12
VSS
AE9
VSS
C2
VSS
AB14
VSS
AF10
VSS
C21
VSS
AB16
VSS
AF12
VSS
C23
VSS
AB18
VSS
AF14
VSS
C4
VSS
AB20
VSS
AF16
VSS
C6
VSS
AB21
VSS
AF18
VSS
C8
VSS
AB23
VSS
AF20
VSS
D11
VSS
AB26
VSS
AF22
VSS
D14
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
Appendix A-13
SR5690 Pin Listing Sorted by Ball Reference
Ball Name
Ball #
Ball Name
Ball #
Ball Name
Ball #
VSS
D16
VSS
H15
VSS
M16
VSS
D20
VSS
H16
VSS
M17
VSS
D26
VSS
H17
VSS
M18
VSS
D3
VSS
H18
VSS
M21
VSS
D5
VSS
H19
VSS
M23
VSS
D7
VSS
H20
VSS
M26
VSS
D9
VSS
H21
VSS
M3
VSS
E1
VSS
H23
VSS
M6
VSS
E20
VSS
H26
VSS
M8
VSS
E25
VSS
H3
VSS
N1
VSS
E28
VSS
H6
VSS
N11
VSS
E4
VSS
J1
VSS
N13
VSS
F10
VSS
J22
VSS
N15
VSS
F15
VSS
J25
VSS
N17
VSS
F17
VSS
J28
VSS
N18
VSS
F18
VSS
J4
VSS
N22
VSS
F19
VSS
J7
VSS
N25
VSS
F20
VSS
K23
VSS
N28
VSS
F21
VSS
K26
VSS
N4
VSS
F23
VSS
K3
VSS
N7
VSS
F26
VSS
K6
VSS
P11
VSS
F3
VSS
K8
VSS
P12
VSS
F8
VSS
L1
VSS
P14
VSS
G1
VSS
L12
VSS
P16
VSS
G11
VSS
L13
VSS
P18
VSS
G15
VSS
L15
VSS
P21
VSS
G16
VSS
L17
VSS
P23
VSS
G17
VSS
L18
VSS
P26
VSS
G18
VSS
L22
VSS
P3
VSS
G19
VSS
L25
VSS
P6
VSS
G20
VSS
L28
VSS
P8
VSS
G25
VSS
L4
VSS
R1
VSS
G28
VSS
L7
VSS
R11
VSS
G4
VSS
M11
VSS
R13
VSS
G9
VSS
M12
VSS
R15
VSS
H10
VSS
M14
VSS
R17
43869 SR5690 Databook 2.20
Appendix A-14
© 2012 Advanced Micro Devices, Inc.
Proprietary
SR5690 Pin Listing Sorted by Ball Reference
Ball Name
Ball #
Ball Name
Ball #
VSS
R18
VSS
V23
VSS
R22
VSS
V26
VSS
R25
VSS
V3
VSS
R28
VSS
V6
VSS
R4
VSS
W1
VSS
R7
VSS
W22
VSS
T11
VSS
W25
VSS
T12
VSS
W28
VSS
T14
VSS
W4
VSS
T16
VSS
W7
VSS
T18
VSS
Y23
VSS
T21
VSS
Y26
VSS
T23
VSS
Y3
VSS
T26
VSS
Y6
VSS
T3
VSS
Y8
VSS
T6
VSS
T8
VSS
U1
VSS
U11
VSS
U12
VSS
U13
VSS
U15
VSS
U17
VSS
U18
VSS
U22
VSS
U25
VSS
U28
VSS
U4
VSS
U7
VSS
V12
VSS
V13
VSS
V14
VSS
V15
VSS
V16
VSS
V17
VSS
V21
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
Appendix A-15
SR5690 Pin Listing Sorted by Ball Reference
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43869 SR5690 Databook 2.20
Appendix A-16
© 2012 Advanced Micro Devices, Inc.
Proprietary
Appendix B
Revision History
Rev. 2.00 (Dec 2010)
•
First release of the public version.
Rev. 2.10 (June 2011)
•
Added alternate branding for ASIC A21 in Section 1.5, “Branding Diagrams.”
Rev. 2.20 (Jan 2012)
•
Updated title of Figure 1-1, “SR5690 Branding Diagram for A21 Production ASIC (RoHS-compliant Part).”
•
Updated Table 3-5, “Clock Interface”: Made connections of GPP[3:1]_REFCLKP/N mandatory.
© 2012 Advanced Micro Devices, Inc.
Proprietary
43869 SR5690 Databook 2.20
Appendix B-1
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43869 SR5690 Databook 2.20
Appendix B-2
© 2012 Advanced Micro Devices, Inc.
Proprietary