MODEL 165 Custom Hybrid Military Grade Microcircuit DESCRIPTION Hybrid microcircuits offer a reliable, cost effective alternative to larger and heavier circuit boards and to the costly design effort and implementation of a custom IC. Hybrids also offer the advantage of a much broader combination of components and resistor technologies. Generally, a circuit board schematic can be directly converted to hybrid technology with little or no change in component selection. The implementation of a custom hybrid requires a partnership between the customer and BI. A project engineer and a program manager work with you throughout the design and manufacturing cycle. BI specialist will assist in proper package and process selection to meet your environmental requirements. Our design engineers will develop a CAD layout design and the documents required for proper manufacturability. Our quality assurance personnel will develop appropriate inspection and qualification plans. Our hybrids consist of a ceramic substrate on which multiple layers of gold conductors, resistive inks and insulative materials are screened. Components are then epoxy mounted to the substrate. Semiconductors are wire bonded with gold and aluminum bonds. The substrate is then placed into a package and affixed with an epoxy preform. The package is sealed, marked and subjected to various environmental screens as required to meet customer specifications. All parts are 100% electrically tested over the operating temperature range using our custom automated test system. The microcircuit quality, engineering and manufacturing systems are certified to QS 9000 and have has been listed on the QML-38534 since 1989 for custom circuits. FEATURES TYPICAL APPLICATIONS • • • • • • • • • • • • • • • Fully customized circuit and package Wide package variety Thick film and thin film technology QML-38534 listed Reduced package size Improved circuit performance Improved reliability Specifications subject to change without notice. 7-9 7 Analog signal conditioning Instrumentation amplifiers Power amplifiers Data acquisition Data convertors Line driver/receiver Analog switching DC/DC convertors Model 165 ELECTRICAL Thick Film Resistors Absolute Accuracy Temperature Coefficient of Resistance Temperature Coefficient of Resistance Tracking to 0.5% ±50ppm/°C to ±200ppm/°C ±10ppm/°C Thin Film Resistors Absolute Accuracy Temperature Coefficient of Resistance Temperature Coefficient of Resistance Tracking Operating Temperature Range Functional Trimming to 0.1% ±5ppm/°C to ±50ppm/°C ±2ppm/°C -55°C to +125°C Circuit accuracies can be tightened on certain parameters by performing active functional trimming on resistor elements COMPONENT TECHNOLOGIES Semiconductor Components Integrated Circuits Capacitors Other Components All transistors & diodes in die form IC or ASIC in die form Ceramic chip, tantalum chip and bondable MOS capacitors Wide range of components including inductors, transformers, crystals, etc MECHANICAL Substrate Interconnect Layers Interconnect Material Die Attach Package Construction Alumina (beryllia also available) 1 to 6 Gold or palladium silver Epoxy (solder, eutectic also available) Metal with glass insulated feedthroughs and cofired ceramic PACKAGING Package Size Package types Package configurations A wide variety of custom packaging from 0.25" to 3.0" on a side Metal (seam weld), metal (solder seal), ceramic (seam weld),ceramic (solder seal), ceramic (epoxy seal) and polymer encapsulated (PEP) SIP, DIP, Plug-in (platform or sidewall),Planar (flatpack) and LCC 7-10 Model 165 QUALITY ISO 9001, QS 9000, QML-38534 ORDERING INFORMATION During the proposal phase, a customer interface will be set up to develop and price alternate design approaches. A schematic with basic dimensional and environmental requirements are sufficient at this stage. ENVIRONMENTAL Environmental screens include, but are not limited to MIL-STD-883 such as: leak test, centrifuge, temperature cycling, burn-in and stabilization bake. 7 7-11 Model 165