MB89630R Series

The following document contains information on Cypress products.
FUJITSU MICROELECTRONICS
DATA SHEET
DS07-12531-4E
8-bit Proprietary Microcontroller
CMOS
F2MC-8L MB89630R Series
MB89635R/636R/637R/P637/PV630
■ OUTLINE
The MB89630R series has been developed as a general-purpose version of the F2MC*-8L family consisting of
proprietary 8-bit, single-chip microcontrollers.
In addition to a compact instruction set, the microcontrollers contain a variety of peripheral functions such as
dual-clock control system, five operating speed control stages, a UART, timers, a PWM timer, a serial interface,
an A/D converter, an external interrupt, and a watch prescaler.
* : F2MC is the abbreviation for Fujitsu Flexible Microcontroller.
■ FEATURES
• High-speed operating capability at low voltage
• Minimum execution time: 0.4 μ[email protected] V, 0.8 μ[email protected] V
• F2MC-8L family CPU core
Instruction set optimized for controllers
Multiplication and division instructions
16-bit arithmetic operations
Test and branch instructions
Bit manipulation instructions, etc.
• Five types of timers
8-bit PWM timer: 2 channels (Also usable as a reload timer)
8-bit pulse-width count timer (Continuous measurement capable, applicable to remote control, etc.)
16-bit timer/counter
21-bit timebase timer
(Continued)
For the information for microcontroller supports, see the following web site.
http://edevice.fujitsu.com/micom/en-support/
Copyright©1998-2009 FUJITSU MICROELECTRONICS LIMITED All rights reserved
2009.5
MB89630R Series
(Continued)
• UART
CLK-synchronous/CLK-asynchronous data transfer capable (6, 7, and 8 bits)
• Serial interface
Switchable transfer direction to allows communication with various equipment.
• 10-bit A/D converter
Start by an external input capable
• External interrupt: 4 channels
Four channels are independent and capable of wake-up from low-power consumption modes (with an edge
detection function).
• Low-power consumption modes
Stop mode (Oscillation stops to minimize the current consumption.)
Sleep mode (The CPU stops to reduce the current consumption to approx. 1/3 of normal.)
Subclock mode
Watch mode
• Bus interface function
With hold and ready function
2
DS07-12531-4E
MB89630R Series
■ PRODUCT LINEUP
Part number
MB89635R
Item
MB89636R
MB89637R
Classification
One-time
PROM
product
Mass-produced products
(mask ROM products)
16 K × 8 bits
ROM size
(internal mask
ROM)
RAM size
512 × 8 bits
24 K × 8 bits
(internal mask
ROM)
768 × 8 bits
MB89P637
32 K × 8 bits
(internal mask
ROM)
1024 × 8 bits
MB89PV630
Piggyback/
evaluation product
(for evaluation and
development)
32 K × 8 bits
(Internal PROM,
to be programmed
32 K × 8 bits
with general(external ROM)
purpose
EPROM
programmer)
1024 × 8 bits
1024 × 8 bits
CPU functions
The number of instructionns:
Instruction bit length:
Instruction length:
Data bit length:
Minimum execution time:
Interrupt processing time:
136
8 bits
1 to 3 bytes
1, 8, 16 bits
0.4 μs/10 MHz, 61 μ[email protected] kHz
3.6 to 57.6 μs/10 MHz, 562.5 μ[email protected] kHz
Ports
Input ports:
Output ports (N-ch open-drain):
I/O ports (N-ch open-drain):
Output ports (CMOS):
I/O ports (CMOS):
Total:
5 (All also serve as peripherals.)
8 (All also serve as peripherals.)
4 (All also serve as peripherals.)
8 (All also serve as bus control.)
28 (27 ports also serve as bus pins and peripherals.)
53
Watch timer
21 bits × 1 (in main clock)/15 bits × 1 (at 32.768 kHz)
8-bit PWM
timer
8-bit reload timer operation (toggled output capable, operating clock cycle: 0.4 μs to 3.3 ms) × 2
channels
7/8-bit resolution PWM operation (conversion cycle: 51.2 μs to 839 ms) × 2 channels
8-bit pulse
width count
timer
8-bit timer operation (overflow output capable, operating clock cycle: 0.4 to 12.8 μs)
8-bit reload timer operation (toggled output capable, operating clock cycle: 0.4 to 12.8 μs)
8-bit pulse width measurement operation (capable of continuous measurement, and
measurement of “H” pulse width/ “L” pulse width/ from ↑ to ↑/from ↓ to ↓)
16-bit timer/
counter
16-bit timer operation (operating clock cycle: 0.4 μs)
16-bit event counter operation (rising edge/falling edge/both edge selectable)
8-bit serial I/O
UART
10-bit A/D
converter
8 bits
LSB first/MSB first selectable
One clock selectable from four transfer clocks
(one external shift clock, three internal shift clocks: 0.8 μs, 3.2 μs, 12.8 μs)
Capable of switching two I/O systems by software
Transfer data length (6, 7, and 8 bits)
Transfer rate (300 to 62500 bps. at 10 MHz oscillation)
10-bit resolution × 8 channels
A/D conversion mode (conversion time: 13.2 μs)
Sense mode (conversion time: 7.2 μs)
Capable of continuous activation by an external activation or an internal timer
(Continued)
DS07-12531-4E
3
MB89630R Series
(Continued)
Part number
MB89635R
Item
MB89636R
MB89637R
MB89P637
MB89PV630
External
interrupt input
4 independent channels (edge selection, interrupt vector, source flag).
Rising edge/falling edge selectable
Used also for wake-up from stop/sleep mode. (Edge detection is also permitted in stop mode.)
Standby mode
Sleep mode, stop mode, watch mode, and subclock mode
Process
CMOS
Operating
voltage*
2.2 V to 6.0 V
2.7 V to 6.0 V
MBM27C256A-20CZ
MBM27C256A-20TV
EPROM for use
* : Varies with conditions such as the operating frequency. (See section “■ Electrical Characteristics.”)
In the case of the MB89PV630, the voltage varies with the restrictions of the EPROM for use.
■ PACKAGE AND CORRESPONDING PRODUCTS
Package
MB89635R
MB89636R
MB89637R
MB89P637
MB89PV630
DIP-64P-M01
×
FPT-64P-M06
×
×
FPT-64P-M23
MQP-64C-P01
×
×
×
MDP-64C-P02
×
×
×
: Available
×
×: Not available
Note: For more information about each package, see section “■ Package Dimensions.”
4
DS07-12531-4E
MB89630R Series
■ DIFFERENCES AMONG PRODUCTS
1. Memory Size
Before evaluating using the piggyback product, verify its differences from the product that will actually be used.
Take particular care on the following points:
• On the MB89P637, the program area starts from address 8007H but on the MB89PV630 and MB89637R starts
from 8000H.
(On the MB89P637, addresses 8000H to 8006H comprise the option setting area, option settings can be read
by reading these addresses. On the MB89PV630/MB89637R, addresses 8000H to 8006H could also be used
as a program ROM. However, do not use these addresses in order to maintain compatibility of the MB89P637.)
• The stack area, etc., is set at the upper limit of the RAM.
• The external area is used.
2. Current Consumption
• In the case of the MB89PV630, add the current consumed by the EPROM which connected to the top socket.
• When operated at low speed, the product with an OTPROM (one-time PROM) or an EPROM will consume
more current than the product with a mask ROM. However, the current consumption in sleep/stop modes is
the same. (For more information, see sections “■ Electrical Characteristics” and “■ Example Characteristics”.)
3. Mask Options
Functions that can be selected as options and how to designate these options vary by the product.
Before using options check section “■ Mask Options”.
Take particular care on the following points:
• A pull-up resistor cannot be set for P50 to P53 on the MB89P637.
• Options are fixed on the MB89PV630.
4. Differences between the MB89630 and MB89630R Series
• Memory access area
There are no difference between the access area of MB89635/MB89635R, and that of MB89637/MB89637R.
The access area of MB89636 is different from that of the MB89636R when using in external bus mode.
Memory area
Address
MB89636
MB89636R
0000H to 007FH
I/O area
I/O area
0080H to 037FH
RAM area
RAM area
Access prohibited
0380H to 047FH
0480H to 7FFFH
External area
8000H to 9FFFH
A000H to FFFFH
DS07-12531-4E
External area
Access prohibited
ROM area
ROM area
5
MB89630R Series
• Other specifications
Both MB89630 series and MB89635R/636R/637R is the same.
• Electrical specifications/electrical characteristics
Electrical specifications of the MB89635R/636R/637R series are the same as that of the MB89630 series.
Electrical characteristics of both the series are much the same.
■ CORRESPONDENCE BETWEEN THE MB89630 AND MB89630R SERIES
• The MB89630R series is the reduction version of the MB89630 series.
• The the MB89630 and MB89630R series consist of the following products:
MB89630 series
MB89635
MB89636
MB89637
MB89630R series
MB89635R
MB89636R
MB89637R
6
MB89P637
MB89PV630
DS07-12531-4E
MB89630R Series
■ PIN ASSIGNMENT
(Top view)
P31/UO1
P30/UCK1
P43/PTO1
P42/UI2
P41/UO2
P40/UCK2
P53/PTO2
P52
P51/BZ
P50/ADST
P60/AN0
P61/AN1
P62/AN2
P63/AN3
P64/AN4
P65/AN5
P66/AN6
P67/AN7
AVCC
AVR
AVSS
P74/EC
P73/INT3
P72/INT2
P71/INT1/X0A*
P70/INT0/X1A*
RST
MOD0
MOD1
X0
X1
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
VPP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O1
O2
O3
VSS
65
66
67
68
69
70
71
72
73
74
75
76
77
78
64
63
62
92
61
91
60
90
59
89
58
88
57
87
56
86
55
85
54
84
53
83
52
82
51
81
50
80
49
79
48
47
46
45
44
Each pin inside
43
the dashed line is
42
for MB89PV630 only. 41
40
39
38
37
36
35
34
33
(DIP-64P-M01)
(MDP-64C-P02)
VCC
A14
A13
A8
A9
A11
OE
A10
CE
O8
O7
O6
O5
O4
VCC
P32/UI1
P33/SCK1
P34/SO1
P35/SI1
P36/PWC
P37/WTO
VSS
P00/AD0
P01/AD1
P02/AD2
P03/AD3
P04/AD4
P05/AD5
P06/AD6
P07/AD7
P10/A08
P11/A09
P12/A10
P13/A11
P14/A12
P15/A13
P16/A14
P17/A15
P20/BUFC
P21/HAK
P22/HRQ
P23/RDY
P24/CLK
P25/WR
P26/RD
P27/ALE
*: When the dual-clock system is selected.
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
P52
P53/PTO2
P40/UCK2
P41/UO2
P42/UI2
P43/PTO1
P30/UCK1
P31/UO1
VCC
P32/UI1
P33/SCK1
P34/SO1
P35/SI1
P36/PWC
P37/WTO
VSS
(Top view)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
P00/AD0
P01/AD1
P02/AD2
P03/AD3
P04/AD4
P05/AD5
P06/AD6
P07/AD7
P10/A08
P11/A09
P12/A10
P13/A11
P14/A12
P15/A13
P16/A14
P17/A15
P71/INT1/X0A*
P70/INT0/X1A*
RST
MOD0
MOD1
X0
X1
VSS
P27/ALE
P26/RD
P25/WR
P24/CLK
P23/RDY
P22/HRQ
P21/HAK
P20/BUFC
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
P51/BZ
P50/ADST
P60/AN0
P61/AN1
P62/AN2
P63/AN3
P64/AN4
P65/AN5
P66/AN6
P67/AN7
AVCC
AVR
AVSS
P74/EC
P73/INT3
P72/INT2
(FPT-64P-M23)
DS07-12531-4E
*: When the dual-clock system is selected.
7
MB89630R Series
64
63
62
61
60
59
58
57
56
55
54
53
52
P53/PTO2
P40/UCK2
P41/UO2
P42/UI2
P43/PTO1
P30/UCK1
P31/UO1
VCC
P32/UI1
P33/SCK1
P34/SO1
P35/SI1
P36/PWC
(Top view)
1
2
3
4
5
6
85
77
7
86
76
8
87
75
9
88
74
10
89
73
11
90
72
12
91
71
13
92
70
14
93
69
15
16
17
18
19 Each pin inside the dashed line
is for MB89PV630 only.
94
95
96
65
66
67
68
84
83
82
81
80
79
78
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P37/WTO
VSS
P00/AD0
P01/AD1
P02/AD2
P03/AD3
P04/AD4
P05/AD5
P06/AD6
P07/AD7
P10/A08
P11/A09
P12/A10
P13/A11
P14/A12
P15/A13
P16/A14
P17/A15
P20/BUFC
RST
MOD0
MOD1
X0
X1
VSS
P27/ALE
P26/RD
P25/WR
P24/CLK
P23/RDY
P22/HRQ
P21/HAK
20
21
22
23
24
25
26
27
28
29
30
31
32
P52
P51/BZ
P50/ADST
P60/AN0
P61/AN1
P62/AN2
P63/AN3
P64/AN4
P65/AN5
P66/AN6
P67/AN7
AVCC
AVR
AVSS
P74/EC
P73/INT3
P72/INT2
P71/INT1/X0A*
P70/INT0/X1A*
(FPT-64P-M06)
(MQP-64C-P01)
*: When the dual-clock system is selected.
• Pin assignment on package top (MB89PV630 only)
Pin no.
Pin name
Pin no.
Pin name
Pin no.
Pin name
Pin no.
Pin name
65
N.C.
73
A2
81
N.C.
89
OE
66
VPP
74
A1
82
O4
90
N.C.
67
A12
75
A0
83
O5
91
A11
68
A7
76
N.C.
84
O6
92
A9
69
A6
77
O1
85
O7
93
A8
70
A5
78
O2
86
O8
94
A13
71
A4
79
O3
87
CE
95
A14
72
A3
80
VSS
88
A10
96
VCC
N.C.: Internally connected. Do not use.
8
DS07-12531-4E
MB89630R Series
■ PIN DESCRIPTION
Pin no.
Pin name
SH-DIP*1
MDIP*2
QFP2*3
QFP1*4
MQFP*5
30
22
23
X0
31
23
24
X1
28
20
21
MOD0
29
21
22
MOD1
27
19
20
RST
56 to 49
48 to 41
48 to 41
40 to 33
40
32
33
39
31
38
Circuit
type
Function
A
Main clock crystal oscillator pins
D
Operating mode selection pins
Connect directly to VCC or VSS.
C
Reset I/O pin
This pin is an N-ch open-drain output type with a
pull-up resistor, and a hysteresis input type.
“L” is output from this pin by an internal reset
source. The internal circuit is initialized by the
input of “L”.
49 to 42 P00/AD0 to
P07/AD7
F
General-purpose I/O ports
When an external bus is used, these ports
function as the multiplex pins of the lower address
output and the data I/O.
41 to 34 P10/A08 to
P17/A157
F
General-purpose I/O ports
When an external bus is used, these ports
function as an upper address output.
P20/BUFC
H
General-purpose output port
When an external bus is used, this port can also
be used as a buffer control output by setting the
BCTR.
32
P21/HAK
H
General-purpose output port
When an external bus is used, this port can also
be used as a hold acknowledge by setting the
BCTR.
30
31
P22/HRQ
F
General-purpose output port
When an external bus is used, this port can also
be used as a hold request input by setting the
BCTR.
37
29
30
P23/RDY
F
General-purpose output port
When an external bus is used, this port functions
as a ready input.
36
28
29
P24/CLK
H
General-purpose output port
When an external bus is used, this port functions
as a clock output.
35
27
28
P25/WR
H
General-purpose output port
When an external bus is used, this port functions
as a write signal output.
34
26
27
P26/RD
H
General-purpose output port
When an external bus is used, this port functions
as a read signal output.
*1: DIP-64P-M01
*2: MDP-64C-P02
*3: FPT-64P-M23
DS07-12531-4E
*4: FPT-64P-M06
*5: MQP-M64C-P01
(Continued)
9
MB89630R Series
Pin no.
Circuit
type
Function
QFP2*3
33
25
26
P27/ALE
H
General-purpose output port
When an external bus is used, this port functions
as an address latch signal output.
2
58
59
P30/UCK1
G
General-purpose I/O port
Also serves as the clock I/O 1 for the UART.
This port is a hysteresis input type.
1
57
58
P31/UO1
F
General-purpose I/O port
Also serves as the data output 1 for the UART.
63
55
56
P32/UI1
G
General-purpose I/O port
Also serves as the data input 1 for the UART.
This port is a hysteresis input type.
62
54
55
P33/SCK1
G
General-purpose I/O port
Also serves as the data input for the 8-bit serial
I/O.
This port is a hysteresis input type.
61
53
54
P34/SO1
F
General-purpose I/O port
Also serves as the data output for the 8-bit serial
I/O.
60
52
53
P35/SI1
G
General-purpose I/O port
Also serves as the data input for the 8-bit serial
I/O.
This port is a hysteresis input type.
59
51
52
P36/PWC
G
General-purpose I/O port
Also serves as the measured pulse input for the
8-bit pulse width counter.
This port is a hysteresis input type.
58
50
51
P37/WTO
F
General-purpose I/O port
Also serves as the toggle output for the 8-bit pulse
width counter.
6
62
63
P40/UCK2
G
General-purpose I/O port
Also serves as the clock I/O 2 for the UART.
This port is a hysteresis input type.
5
61
62
P41/UO2
F
General-purpose I/O port
Also serves as the data output 2 for the UART.
4
60
61
P42/UI2
G
General-purpose I/O port
Also serves as the data input 2 for the UART.
This port is a hysteresis input type.
3
59
60
P43/PTO1
F
General-purpose I/O port
Also serves as the toggle output for the 8-bit PWM
timer.
10
2
3
P50/ADST
K
General-purpose I/O port
Also serves as an A/D converter external
activation.
This port is a hysteresis input type.
*1: DIP-64P-M01
*2: MDP-64C-P02
*3: FPT-64P-M23
10
QFP1*4
MQFP*5
Pin name
SH-DIP*1
MDIP*2
*4: FPT-64P-M06
*5: MQP-M64C-P01
(Continued)
DS07-12531-4E
MB89630R Series
(Continued)
Pin no.
Circuit
type
Function
QFP2
9
1
2
P51/BZ
J
General-purpose I/O port
Also serves as a buzzer output.
8
64
1
P52
J
General-purpose I/O port
7
63
64
P53/PTO2
J
General-purpose I/O port
Also serves as the toggle output for the 8-bit PWM
timer.
11 to 18
3 to 10
4 to 11
P60/AN0 to
P67/AN7
I
N-ch open-drain output ports
Also serve as an A/D converter analog input.
26,
25
18,
17
19,
18
P70/INT0/X1A,
P71/INT1/X0A
24,
23
16,
15
17,
16
P72/INT2,
P73/INT3
E
Input-only ports
Also serve as an external interrupt input.
These ports are a hysteresis input type.
22
14
15
P74/EC
E
General-purpose input port
Also serves as the external clock input for the
16-bit timer/counter.
This port is a hysteresis input type.
64
56
57
VCC
—
Power supply pin
32, 57
24,49
25, 50
VSS
—
Power supply (GND) pin
19
11
12
AVCC
—
A/D converter power supply pin
20
12
13
AVR
—
A/D converter reference voltage input pin
21
13
14
AVSS
—
A/D converter power supply pin
Use this pin at the same voltage as VSS.
*3
*1: DIP-64P-M01
*2: MDP-64C-P02
*3: FPT-64P-M23
DS07-12531-4E
QFP1*4
MQFP*5
Pin name
SH-DIP*1
MDIP*2
B/E
Input-only ports
These ports are a hysteresis input type.
Also serve as an external interrupt input (at singleclock operation).
Subclock crystal oscillator pins (at dual-clock
operation)
*4: FPT-64P-M06
*5: MQP-M64C-P01
11
MB89630R Series
• External EPROM pins (MB89PV630 only)
Pin no.
12
Pin name
I/O
Function
MDIP
MQFP
65
66
VPP
O
“H” level output pin
66
67
68
69
70
71
72
73
74
67
68
69
70
71
72
73
74
75
A12
A7
A6
A5
A4
A3
A2
A1
A0
O
Address output pins
75
76
77
77
78
79
O1
O2
O3
I
Data input pins
78
80
VSS
O
Power supply (GND) pin
79
80
81
82
83
82
83
84
85
86
O4
O5
O6
O7
O8
I
Data input pins
84
87
CE
O
ROM chip enable pin
Outputs “H” during standby.
85
88
A10
O
Address output pin
86
89
OE
O
ROM output enable pin
Outputs “L” at all times.
87
88
89
91
92
93
A11
A9
A8
O
Address output pins
90
94
A13
O
91
95
A14
O
92
96
VCC
O
EPROM power supply pin
—
65
76
81
90
N.C.
—
Internally connected pins
Be sure to leave them open.
DS07-12531-4E
MB89630R Series
■ I/O CIRCUIT TYPE
Type
A
Circuit
Remarks
• Crystal or ceramic oscillation type (main clock)
External clock input selection versions of MB89PV630,
MB89P637, MB89635R, MB89636R, and MB89637R
At an oscillation feedback resistor of approximately
1 MΩ@5.0 V
X1
X0
Standby control signal
B
• Crystal or ceramic oscillation type (subclock)
MB89PV630, MB89P637, MB89635R, MB89636R, and
MB89637R with dual-clock system
At an oscillation feedback resistor of approximately
4.5 MΩ@5.0 V
X1A
X0A
Standby control signal
C
• At an output pull-up resistor (P-ch) of approximately
50 kΩ@5.0 V
• Hysteresis input
R
P-ch
N-ch
D
E
R
• Hysteresis input
• Pull-up resistor optional (except P70 and P71)
P-ch
• CMOS output
• CMOS input
• Pull-up resistor optional (except P22 and P23)
F
R
P-ch
N-ch
(Continued)
DS07-12531-4E
13
MB89630R Series
(Continued)
Type
Circuit
Remarks
G
• CMOS output
• Hysteresis input
• Pull-up resistor optional
R
P-ch
P-ch
N-ch
H
CMOS output
P-ch
N-ch
I
Analog input
N-ch
Analog input
J
• CMOS input
• Pull-up resistor optional
R
P-ch
N-ch
K
• Hysteresis input
• Pull-up resistor optional
R
P-ch
N-ch
14
DS07-12531-4E
MB89630R Series
■ HANDLING DEVICES
1. Preventing Latchup
Latchup may occur on CMOS ICs if voltage higher than VCC or lower than VSS is applied to input and output pins
other than medium- and high-voltage pins or if higher than the voltage which shows on “1. Absolute Maximum
Ratings” in section “■ Electrical Characteristics” is applied between VCC and VSS.
When latchup occurs, power supply current increases rapidly and might thermally damage elements. When
using, take great care not to exceed the absolute maximum ratings.
Also, take care to prevent the analog power supply (AVCC and AVR) and analog input from exceeding the digital
power supply (VCC) when the analog system power supply is turned on and off.
2. Treatment of Unused Input Pins
Leaving unused input pins open could cause malfunctions. They should be connected to a pull-up or pull-down
resistor.
3. Treatment of Power Supply Pins on Microcontrollers with A/D and D/A Converters
Connect to be AVCC = DAVC = VCC and AVSS = AVR = VSS even if the A/D and D/A converters are not in use.
4. Treatment of N.C. Pins
Be sure to leave (internally connected) N.C. pins open.
5. Power Supply Voltage Fluctuations
Although VCC power supply voltage is assured to operate within the rated range, a rapid fluctuation of the voltage
could cause malfunctions, even if it occurs within the rated range. Stabilizing voltage supplied to the IC is
therefore important. As stabilization guidelines, it is recommended to control power so that VCC ripple fluctuations
(P-P value) will be less than 10% of the standard VCC value at the commercial frequency (50 Hz to 60 Hz) and
the transient fluctuation rate will be less than 0.1 V/ms at the time of a momentary fluctuation such as when
power is switched.
6. Precautions when Using an External Clock
When an external clock is used, oscillation stabilization time is required even for power-on reset (option selection)
and wake-up from stop mode.
DS07-12531-4E
15
MB89630R Series
■ PROGRAMMING TO THE EPROM ON THE MB89P637
The MB89P637 is an OTPROM version of the MB89630 series.
1. Features
• 32-Kbytes PROM on chip
• Options can be set using the EPROM programmer.
• Equivalency to the MBM27C256A in EPROM mode (when programmed with the EPROM programmer)
2. Memory Space
Memory space in each mode is illustrated below.
EPROM mode
(Corresponding addresses
on the EPROM programmer)
Normal operating mode
0000H
I/O
0080H
0100H
Register
RAM
0200H
0480H
External area
0000H
8000H
Option setting area
Option setting area
0007H
8007H
Program area
(EPROM)
PROM
32 KB
FFFFH
32 KB
7FFFH
3. Programming to the EPPROM
In EPROM mode, the MB89P637 functions equivalent to the MBM27C256A. This allows the PROM to be
programmed with a general-purpose EPROM programmer by using the dedicated socket adapter.
However, the electronic signature mode cannot be used.
When the operating ROM area for a single chip is 32 Kbytes (8007H to FFFFH) the EPROM can be programmed
as follows:
16
DS07-12531-4E
MB89630R Series
• Programming procedure
(1) Set the EPROM programmer to the MBM27C256A.
(2) Load program data into the EPROM programmer at 0007H to 7FFFH. (Note that addresses 8000H to FFFFH
in the operating mode assign to 0000H to 7FFFH in EPROM mode).
(3) Load option data into addresses 0000H to 0006H of the EPROM programmer.
(For information about each corresponding option, see “8. OTPROM Option Bit Map”.)
(4) Program with the EPROM programmer.
4. Recommended Screening Conditions
High-temperature aging is recommended as the pre-assembly screening procedure for a product with a blanked
OTPROM microcomputer program.
Program, verify
Aging
+150°C, 48 Hrs.
Data verification
Assembly
5. Programming Yield
All bits cannot be programmed at Fujitsu shipping test to a blanked OTPROM microcomputer, due to its nature.
For this reason, a programming yield of 100% cannot be assured at all times.
DS07-12531-4E
17
MB89630R Series
6. OTPROM Option Bit Map
Address
Bit 7
Bit 3
Reset pin
output
1: Yes
0: No
P07
P06
P05
P04
P03
Pull-up
Pull-up
Pull-up
Pull-up
Pull-up
1: No
1: No
1: No
1: No
1: No
0: Yes
0: Yes
0: Yes
0: Yes
0: Yes
P17
P16
P15
P14
P13
Pull-up
Pull-up
Pull-up
Pull-up
Pull-up
1: No
1: No
1: No
1: No
1: No
0: Yes
0: Yes
0: Yes
0: Yes
0: Yes
P37
P36
P35
P34
P33
Pull-up
Pull-up
Pull-up
Pull-up
Pull-up
1: No
1: No
1: No
1: No
1: No
0: Yes
0: Yes
0: Yes
0: Yes
0: Yes
Vacancy
Vacancy
Vacancy
Vacancy
P43
Pull-up
Readable
Readable
Readable
Readable
1: No
and writable and writable and writable and writable 0: Yes
Vacancy
Vacancy
Vacancy
P74
P73
Pull-up
Pull-up
Readable
Readable
Readable
1: No
1: No
and writable and writable and writable 0: Yes
0: Yes
Bit 2
Power-on
reset
1: Yes
0: No
P02
Pull-up
1: No
0: Yes
P12
Pull-up
1: No
0: Yes
P32
Pull-up
1: No
0: Yes
P42
Pull-up
1: No
0: Yes
P72
Pull-up
1: No
0: Yes
Vacancy
Vacancy
Vacancy
0000H
0001H
0002H
0003H
0004H
0005H
0006H
Bit 6
Vacancy
Bit 5
Bit 4
Single/dualclock system
Readable
Readable
Readable
1: Dual clock
and writable and writable and writable 0: Single clock
Vacancy
Vacancy
Vacancy
Vacancy
Vacancy
Bit 1
Bit 0
Oscillation stabilization (/FCH)
11:218/FCH 01:217/FCH
10:214/FCH 00:24/FCH
P01
P00
Pull-up
Pull-up
1: No
1: No
0: Yes
0: Yes
P11
P10
Pull-up
Pull-up
1: No
1: No
0: Yes
0: Yes
P31
P30
Pull-up
Pull-up
1: No
1: No
0: Yes
0: Yes
P41
P40
Pull-up
Pull-up
1: No
1: No
0: Yes
0: Yes
Vacancy
Vacancy
Readable
Readable
and writable and writable
Vacancy
Reserved bit
Readable
Readable
Readable
Readable
Readable
Readable
Readable
Readable
and writable and writable and writable and writable and writable and writable and writable and writable
Note: Each bit is set to ‘1’ as the initialized value.
18
DS07-12531-4E
MB89630R Series
■ PROGRAMMING TO THE EPROM WITH PIGGYBACK/EVALUATION DEVICE
1. EPROM for Use
MBM27C256A-20CZ, MBM27C256A-20TV
2. Memory Space
Memory space in each mode, such as 32-Kbyte PROM, option area is diagrammed below.
Address
Single chip
Corresponding addresses on the EPROM programmer
0000H
I/O
0080H
RAM
0480H
Not available
8000H
0000H
Not available
Not available
8007H
0007H
PROM
32 KB
FFFFH
EPROM
32 KB
7FFFH
3. Programming to the EPROM
(1) Set the EPROM programmer to the MBM27C256A.
(2) Load program data into the EPROM programmer at 0007H to 7FFFH.
(3) Program to 0000H to 7FFFH with the EPROM programmer.
DS07-12531-4E
19
MB89630R Series
■ BLOCK DIAGRAM
Main clock oscillator
X0A
X1A
Subclock oscillator
(32.768 kHz)
21-bit timebase timer
Clock controller
CMOS I/O port
Reset circuit
(Watchdog timer)
8-bit PWC timer
Watch prescaler
P10/A08
t o P 1 7 / A 15
8
P35/SI1
P34/SO1
P33/SCK 1
P32/UI1
P31/UO1
P30/UCK1
UART
P40/UCK2
P41/UO2
P42/UI2
MOD 0
MOD 1
External bus
interface
UART baud rate
generator
CMOS I/O port
Port 2
P43/PTO 1
N-ch open-drain I/O port
CMOS output port
8-bit PWM timer
P53/PTO 2
P52
Port 5
P27/ALE
P26/RD
P 2 5 / WR
P24/CLK
P23/RDY
P22/HRQ
P21/HAK
P20/BUFC
8-bit serial I/O
Port 4
8
CMOS I/O port
Port0 and port1
P00/AD0
t o P 0 7 / A D7
P37/W TO
P36/PW C
Port 3
RST
Internal data bus
X0
X1
Buzzer output
P51/BZ
RAM
3
10-bit A/D converter
F 2 M C-8L
CP U
N-ch open-drain output port
8
Port 6
8
P50/ADS T
AV CC, AV SS ,
AVR
P60/AN0
to P67/AN7
ROM
External interrupt
Other pins
VCC × 2, VSS × 2
20
16-bit timer/counter
4
Port 7
Input port
P70/INT0
P71/INT1
P72/INT2
P73/INT3
P74/EC
DS07-12531-4E
MB89630R Series
■ CPU CORE
1. Memory Space
The microcontrollers of the MB89630R series offer 64 Kbytes of memory for storing all of I/O, data, and program
areas. The I/O area is located at the lowest address. The data area is provided immediately above the I/O area.
The data area can be divided into register, stack, and direct areas according to the application. The program
area is located at exactly the opposite end of I/O area, that is, near the highest address. Provide the tables of
interrupt reset vectors and vector call instructions toward the highest address within the program area. The
memory space of the MB89630R series is structured as illustrated below.
• Memory space
0000H
MB89PV630
0000H
0080H
0200H
0380H
0480H
External area
8000H
Register
Register
0200H
0200H
0480H
RAM
1024 B
0100H
0100H
0280H
*3
0480H
External area
External area
External area
*2
8000H
8000H
8007H
MB89637R
MB89P637
0080H
RAM
768 B
Register
0200H
0000H
I/O
0080H
0100H
Register
MB89636R
I/O
RAM
512 B
RAM
1024 B
0100H
0000H
I/O
I/O
0080H
MB89635R
8007H
*3
*2
A000H
External ROM
32 KB
C000H
ROM*
24 KB
ROM*1
16 KB
FFFFH
ROM*1
32 KB
1
FFFFH
FFFFH
FFFFH
*1: The ROM area is an external area depending on the mode.
*2: Addresses 8000H to 8006H for the MB89P637 comprise an option area, do not use
this area for the MB89PV630 and MB89637R.
*3: The access is forbidden in the external bus mode.
DS07-12531-4E
21
MB89630R Series
2. Registers
The F2MC-8L family has two types of registers; dedicated registers in the CPU and general-purpose registers
in the memory. The following dedicated registers are provided:
Program counter (PC):
A 16-bit register for indicating the instruction storage positions
Accumulator (A):
A 16-bit temporary register for storing arithmetic operations, etc. When the
instruction is an 8-bit data processing instruction, the lower byte is used.
Temporary accumulator (T):
A16-bit register which performs arithmetic operations with the accumulator
When the instruction is an 8-bit data processing instruction, the lower byte is used.
Index register (IX):
A16-bit register for index modification
Extra pointer (EP):
A16-bit pointer for indicating a memory address
Stack pointer (SP):
A16-bit register for indicating a stack area
Program status (PS):
A16-bit register for storing a register pointer, a condition code
Initial value
16 bits
FFFDH
: Program counter
PC
A
: Accumulator
Indeterminate
T
: Temporary accumulator
Indeterminate
IX
: Index register
Indeterminate
EP
: Extra pointer
Indeterminate
SP
: Stack pointer
Indeterminate
PS
: Program status
I-flag = 0, IL1, IL0 = 11
The other bit values are indeterminate.
The PS can further be divided into higher 8 bits for use as a register bank pointer (RP) and the lower 8 bits for
use as a condition code register (CCR). (See the diagram below.)
• Structure of the program status register
15
PS
14
13
12
RP
10
9
8
Vacancy Vacancy Vacancy
RP
22
11
7
6
5
4
3
2
1
0
H
I
IL1, IL0
N
Z
V
C
CCR
DS07-12531-4E
MB89630R Series
The RP indicates the address of the register bank currently in use. The relationship between the pointer contents
and the actual address is based on the conversion rule illustrated below.
• Rule for conversion of actual addresses of the general-purpose register area
RP
Lower OP codes
“0” “0” “0” “0” “0” “0” “0” “1” R4 R3 R2 R1 R0 b2
↓
↓
↓
↓
↓
↓
↓
↓
↓
↓
↓
↓
↓
↓
b1
b0
↓
↓
Generated addresses A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
The CCR consists of bits indicating the results of arithmetic operations and the contents of transfer data and
bits for control of CPU operations at the time of an interrupt.
H-flag: Set to ‘1’ when a carry or a borrow from bit 3 to bit 4 occurs as a result of an arithmetic operation.
Cleared to ‘0’ otherwise. This flag is for decimal adjustment instructions.
I-flag:
Interrupt is enabled when this flag is set to ‘1’. Interrupt is disabled when the flag is cleared to ‘0’. Cleared
to ‘0’ at the reset.
IL1, IL0: Indicates the level of the interrupt currently allowed. Processes an interrupt only if its request level is
higher than the value indicated by this bit.
IL1
IL0
Interrupt level
0
0
0
1
1
0
2
1
1
3
1
High-low
High
Low
N-flag: Set to ‘1’ if the MSB becomes to ‘1’ as the result of an arithmetic operation. Cleared to ‘0’ when the bit
is cleared to ‘0’.
Z-flag:
Set to ‘1’ when an arithmetic operation results in 0. Cleared to ‘0’ otherwise.
V-flag:
Set to ‘1’ if the complement on 2 overflows as a result of an arithmetic operation. Cleared to ‘0’ if the
overflow does not occur.
C-flag: Set to ‘1’ when a carry or a borrow from bit 7 occurs as a result of an arithmetic operation. Cleared to ‘0’
otherwise.
Set to the shift-out value in the case of a shift instruction.
DS07-12531-4E
23
MB89630R Series
The following general-purpose registers are provided:
General-purpose registers: An 8-bit register for storing data
The general-purpose registers are 8 bits and located in the register banks of the memory. One bank contains
eight registers and up to a total of 32 banks can be used on the MB89630R series. The bank currently in use
is indicated by the register bank pointer (RP).
• Register bank configuration
This address = 0100H + 8 × (RP)
R0
R1
R2
R3
R4
R5
R6
R7
32 banks
Memory area
24
DS07-12531-4E
MB89630R Series
■ I/O MAP
Address
Read/write
Register name
Register description
00H
(R/W)
PDR0
Port 0 data register
01H
(W)
DDR0
Port 0 data direction register
02H
(R/W)
PDR1
Port 1 data register
03H
(W)
DDR1
Port 1 data direction register
04H
(R/W)
PDR2
Port 2 data register
05H
(W)
BCTR
External bus pin control register
Vacancy
06H
07H
(R/W)
SYCC
System clock control register
08H
(R/W)
STBC
System clock control register
09H
(R/W)
WDTE
Watchdog timer control register
0AH
(R/W)
TBCR
Timebase timer control register
0BH
(R/W)
WPCR
Watch prescaler control register
0CH
(R/W)
CHG3
Port 3 switching register
0DH
(R/W)
PDR3
Port 3 data register
0EH
(W)
DDR3
Port 3 data direction register
0FH
(R/W)
PDR4
Port 4 data register
10H
(W)
DDR4
Port 4 data direction register
11H
(R/W)
BUZR
Buzzer register
12H
(R/W)
PDR5
Port 5 data register
13H
(R/W)
PDR6
Port 6 data register
14H
(R)
PDR7
Port 7 data register
15H
(R/W)
PCR1
PWC pulse width control register 1
16H
(R/W)
PCR2
PWC pulse width control register 2
17H
(R/W)
RLBR
PWC reload buffer register
18H
(R/W)
TMCR
16-bit timer control register
19H
(R/W)
TCHR
16-bit timer count register (H)
1AH
(R/W)
TCLR
16-bit timer count register (L)
Vacancy
1BH
1CH
(R/W)
SMR1
Serial mode register
1DH
(R/W)
SDR1
Serial data register
1EH
Vacancy
1FH
Vacancy
(Continued)
DS07-12531-4E
25
MB89630R Series
(Continued)
Address
Read/write
Register name
Register description
20H
(R/W)
ADC1
A/D converter control register 1
21H
(R/W)
ADC2
A/D converter control register 2
22H
(R/W)
ADDH
A/D converter data register (H)
23H
(R/W)
ADDL
A/D converter data register (L)
24H
(R/W)
EIC1
External interrupt control register 1
25H
(R/W)
EIC2
External interrupt control register 2
26H
Vacancy
27H
Vacancy
28H
(R/W)
CNTR1
PWM timer control register 1
29H
(R/W)
CNTR2
PWM timer control register 2
2AH
(R/W)
CNTR3
PWM timer control register 3
2BH
(W)
COMR1
PWM timer compare register 1
2CH
(W)
COMR2
PWM timer compare register 2
2DH
(R/W)
SMC
UART serial mode control register
2EH
(R/W)
SRC
UART serial rate control register
2FH
(R/W)
SSD
UART serial status/data register
30H
(R)
(W)
SIDR
SODR
31H to 7BH
UART serial input data control register
UART serial output data control register
Vacancy
7CH
(W)
ILR1
Interrupt level setting register 1
7DH
(W)
ILR2
Interrupt level setting register 2
7EH
(W)
ILR3
Interrupt level setting register 3
7FH
Vacancy
Note: Do not use vacancies.
26
DS07-12531-4E
MB89630R Series
■ ELECTRICAL CHARACTERISTICS
1. Absolute Maximum Ratings
(AVSS = VSS = 0.0 V)
Parameter
Symbol
Value
Unit
Remarks
Min.
Max.
VCC
VSS – 0.3
VSS + 7.0
V
*
AVCC
VSS – 0.3
VSS + 7.0
V
*
AVR
VSS – 0.3
VSS + 7.0
V
AVR must not exceed
“AVCC + 0.3 V”.
VI
VSS – 0.3
VCC + 0.3
V
Except P50 to P53
VI2
VSS – 0.3
VSS + 7.0
V
P50 to P53
VO
VSS – 0.3
VCC + 0.3
V
Except P50 to P53
VO2
VSS – 0.3
VSS + 7.0
V
P50 to P53
“L” level maximum output current
IOL
⎯
20
mA
“L” level average output current
IOLAV
⎯
4
mA
“L” level total maximum output current
ΣIOL
⎯
100
mA
“L” level total average output current
ΣIOLAV
⎯
40
mA
“H” level maximum output current
IOH
⎯
–20
mA
“H” level average output current
IOHAV
⎯
–4
mA
“H” level total maximum output current
ΣIOH
⎯
–50
mA
“H” level total average output current
ΣIOHAV
⎯
–20
mA
Power consumption
PD
⎯
500
mW
Operating temperature
TA
–40
+85
°C
Storage temperature
Tstg
–55
+150
°C
Power supply voltage
A/D converter reference input voltage
Input voltage
Output voltage
Average value (operating
current × operating rate)
Average value (operating
current × operating rate)
Average value (operating
current × operating rate)
Average value (operating
current × operating rate)
* : Use AVCC and VCC set at the same voltage.
Take care so that AVCC does not exceed VCC, such as when power is turned on.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
DS07-12531-4E
27
MB89630R Series
2. Recommended Operating Conditions
(AVSS = VSS = 0.0 V)
Value
Symbol
Parameter
Unit
Remarks
Min.
Max
2.2*
6.0*
V
Normal operation
assurance range*
MB89635R/636R/637R
2.7*
6.0*
V
Normal operation
assurance range*
MB89PV630/P637
AVCC
1.5
6.0
V
Retains the RAM state in
stop mode
A/D converter reference input voltage
AVR
3.0
AVCC
V
Operating temperature
TA
–40
+85
°C
VCC
Power supply voltage
* : These values vary with the operating frequency, instruction cycle, and analog assurance range. See Figure 1
and “5. A/D Converter Electrical Characteristics”.
Figure 1 Operating Voltage vs. Main Clock Operating Frequency
6
Operating voltage (V)
5
Analog accuracy assured in the
AVCC = 3.5 V to 6.0 V range
Operation assurance range
4
3
2
1
1.0
2.0 3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
Main clock operating frequency (at an instruction cycle of 4/FCH) (MHz)
4.0 2.0
0.8
0.4
Minimum execution time (instruction cycle) (μs)
Note: The shaded area is assured only for the MB89635R/636R/637R.
Figure 1 indicates the operating frequency of the external oscillator at an instruction cycle of 4/FCH.
Since the operating voltage range is dependent on the instruction cycle, see minimum execution time if the
operating speed is switched using a gear.
28
DS07-12531-4E
MB89630R Series
WARNING: The recommended operating conditions are required in order to ensure the normal operation of
the semiconductor device. All of the device's electrical characteristics are warranted when the
device is operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges.
Operation outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented
on the data sheet. Users considering application outside the listed conditions are advised to contact
their representatives beforehand.
DS07-12531-4E
29
MB89630R Series
3. DC Characteristics
(AVCC = VCC = 5.0 V, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Condition
Value
Unit
Remarks
Min.
Typ.
Max.
VIH1
P00 to P07, P10 to P17,
P22, P23, P31, P34,
P37, P41, P43,
P51 to P53
0.7 VCC
⎯
VCC + 0.3
V
P51 to P53
with pull-up
resistor
VIH2
P51 to P53
0.7 VCC
⎯
VSS + 6.0
V
Without pull-up
resistor
VIHS
RST, MOD0, MOD1,
P30, P32, P33, P35,
P36, P40, P42,P50,
P72 to P74
0.8 VCC
⎯
VCC + 0.3
V
P50 with
pull-up resistor
VIHS2
P50, P70, P71
0.8 VCC
⎯
VSS + 6.0
V
Without pull-up
resistor
VIL
P00 to P07, P10 to P17,
P22, P23, P31, P34,
P37, P41, P43
VSS − 0.3
⎯
0.3 VCC
V
VILS
P30, P32, P33, P35,
P36, P40, P42,
P50 to P53,
P70 to P74,
RST,
MOD0, MOD1
VSS − 0.3
⎯
0.2 VCC
V
VD
P50 to P53
VSS − 0.3
⎯
VSS + 6.0
V
“H” level input
voltage
“L” level input
voltage
Open-drain
output pin
application
voltage
Pin name
⎯
“H” level output
VOH
voltage
P00 to P07, P10 to P17,
P20 to P27, P30 to P37, IOH = –2.0 mA
P40 to P43
4.0
⎯
⎯
V
“L” level output
voltage
P00 to P07, P10 to P17,
P20 to P27, P30 to P37,
IOL = 4.0 mA
P40 to P43, P50 to P53,
P60 to P67, RST
⎯
⎯
0.4
V
P00 to P07, P10 to P17,
P20 to P23, P30 to P37,
P40 to P43, P50 to P53, 0.0 V < VI < VCC
P70 to P74,
MOD0, MOD1
⎯
⎯
±5
μA
VOL
Input leakage
current
ILI
(Hi-z output
leakage current)
Without pull-up
resistor
(Continued)
30
DS07-12531-4E
MB89630R Series
(AVCC = VCC = 5.0 V, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
Pull-up
resistance
Pin name
Symbol
RPULL
Condition
Max.
25
50
100
kΩ
—
12
20
mA
—
1.0
2
mA
MB89635R/
636R/637R/
PV630
—
1.5
2.5
mA
MB89P637
FCH = 10 MHz
VCC = 5.0 V
tinst*2 = 0.4 μs
—
3
7
mA
FCH = 10 MHz
VCC = 3.0 V
tinst*2 = 6.4 μs
—
0.5
1.5
mA
—
50
100
μA
MB89635R/
636R/637R/
PV630
—
500
700
μA
MB89P637
—
25
50
μA
—
3
15
μA
—
—
1
μA
FCH = 10 MHz
VCC = 5.0 V
tinst*2 = 0.4 μs
ICC2
FCH = 10 MHz
VCC = 3.0 V
tinst*2 = 6.4 μs
Sleep mode
FCL = 32.768 kHz,
Power supply
current*1
ICCL
VCC
Remarks
Typ.
ICC1
ICCS2
Unit
Min.
P00 to P07, P10 to P17,
P30 to P37, P40 to P43, VI = 0.0 V
P50 to P53, P72 to P74
ICCS1
Value
VCC = 3.0 V
Subclock mode
With pull-up
resistor
FCL = 32.768 kHz,
ICCLS
VCC = 3.0 V
Subclock sleep
mode
FCL = 32.768 kHz,
ICCT
ICCH
VCC = 3.0 V
• Watch mode
• Main clock stop
mode at dualclock system
TA = +25°C
• Subclock stop
mode
• Main clock stop
mode at singleclock system
(Continued)
DS07-12531-4E
31
MB89630R Series
(Continued)
(AVCC = VCC = 5.0 V, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
Pin name
Symbol
IA
Power supply
current*1
AVCC
IAH
Input capacitance CIN
Value
Condition
Other than AVCC,
AVSS, VCC, and VSS
Unit
Min.
Typ.
Max.
FCH = 10 MHz,
when A/D
conversion
operates.
—
6
—
mA
FCH = 10 MHz,
TA = +25°C,
when A/D
conversion in
a stop.
—
—
1
μA
f = 1 MHz
—
10
—
pF
Remarks
*1: The power supply current is measured at the external clock.
In the case of the MB89PV630, the current consumed by the connected EPROM and ICE is not counted.
*2: For information on tinst, see “(4) Instruction Cycle” in “4. AC Characteristics”.
4. AC Characteristics
(1) Reset Timing
(VCC = 5.0 V±10%, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
RST “L” pulse width
Symbol
Condition
tZLZH
—
Value
Min.
Max.
48 tHCYL
—
Unit
Remarks
ns
tZLZH
RST
0.2 VCC
32
0.2 VCC
DS07-12531-4E
MB89630R Series
(2) Specification for Power-on Reset
(AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Symbol
Parameter
Power supply rising time
tR
Power supply cut-off time
tOFF
Condition
Value
Unit
Remarks
Min.
Max.
—
50
ms
Power-on reset function only
1
—
ms
Min. interval time for the next
power-on reset
—
Note: Make sure that power supply rises within the selected oscillation stabilization time.
If power supply voltage needs to be varied in the course of operation, a smooth voltage rise is recommended.
tOFF
tR
2.0 V
0.2 V
0.2 V
VCC
0.2 V
(3) Clock Timing
(AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
Clock frequency
Clock cycle time
Input clock pulse width
Input clock rising/
falling time
DS07-12531-4E
Symbol
Pin name
FCH
Condition
Value
Unit
Remarks
Min.
Typ.
Max.
X0, X1
1
—
10
MHz
FCL
X0A, X1A
—
32.768
—
kHz
tHCYL
X0, X1
100
—
1000
ns
tLCYL
X0A, X1A
—
30.5
—
μs
PWH
PWL
X0
20
—
—
ns
External clock
PWLH
PWLL
X0A
—
15.2
—
μs
External clock
tCR
tCF
X0
—
—
10
ns
External clock
—
33
MB89630R Series
• Main clock timing condition
tHCYL
PWH
PWL
tCR
tCF
0.8 VCC
0.8 VCC
X0
0.2 VCC
0.2 VCC
0.2ÊVCC
• Main clock configurations
When a crystal
or
ceramic reasonator is used
X0
When an external clock is used
X1
X0
X1
Open
FCH
• Subclock timing condition
tLCYL
PWLH
tCR
PWLL
tCF
0.8 VCC
0.8 VCC
X0A
0.2 VCC
0.2 VCC
0.2ÊVCC
• Subclock configurations
When a crystal
or
ceramic reasonator is used
X0A
X1A
When an external clock is used
X0A
X1A
Open
FCL
34
DS07-12531-4E
MB89630R Series
(4) Instruction Cycle
Symbol
Parameter
Instruction cycle
(minimum execution time)
Value (typical)
Unit
Remarks
4/FCH, 8/FCH, 16/FCH, 64/FCH
μs
(4/FCH) tinst = 0.4 μs, operating at
FCH = 10 MHz
2/FCL
μs
tinst = 61.036 μs, operating at
FCL = 32.768 kHz
tinst
Note: Operating at 10 MHz, the cycle varies with the set execution time.
(5) Clock Output Timing
(VCC = 5.0 V±10%, AVSS = VSS= 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Pin
name
Cycle time
tCYC
CLK
CLK ↑ → CLK ↓
tCHCL
CLK
Condition
—
Value
Unit
Min.
Max.
1/2 tinst*
—
μs
1/4 tinst* – 70 ns
1/4 tinst*
μs
Remarks
* : For information on tinst, see “(4) Instruction Cycle”.
tCYC
tCHCL
2.4 V
2.4 V
CLK
0.8 V
DS07-12531-4E
35
MB89630R Series
(6) Bus Read Timing
(VCC = 5.0 V±10%, 10 MHz, AVSS = VSS= 0.0 V, TA = –40°C to +85°C)
Symbol
Parameter
Valid address → RD ↓ time tAVRL
RD pulse width
tRLRH
Pin name
Value
Condition
Unit
Remarks
Min.
Max.
RD, A15 to A08,
AD7 to AD0
1/4 tinst*– 64 ns
—
μs
RD
1/2 tinst*– 20 ns
—
μs
1/2 tinst*
200
μs
No wait
1/2 tinst*– 80 ns
120
μs
No wait
0
—
μs
1/4 tinst*– 40 ns
—
μs
1/4 tinst*– 40 ns
—
μs
1/4 tinst*– 40 ns
—
μs
0
—
ns
–5
—
μs
5
—
μs
Valid address → data read
tAVDV
time
AD7 to AD0,
A15 to A08
RD ↓ → data read time
tRLDV
RD, AD7 to AD0
RD ↑ → data hold time
tRHDX
AD7 to AD0,
RD
RD ↑ → ALE ↑ time
tRHLH
RD, ALE
RD ↑ → address loss time
tRHAX
RD, A15 to A08
RD ↓ → CLK ↑ time
tRLCH
CLK ↓ → RD ↑ time
tCLRH
RD ↓ → BUFC ↓ time
tRLBL
RD, BUFC
BUFC ↑ → valid address
time
tBHAV
A15 to A08,
AD7 to AD0,
BUFC
—
RD, CLK
* : For information on tinst, see “(4) Instruction Cycle”.
2.4 V
CLK
0.8 V
tRHLH
ALE
0.8 V
2.4 V
0.7 VCC
0.7 VCC
2.4 V
0.8 V
0.3 VCC
0.3 VCC
0.8 V
AD7 to AD0
tRHDX
tAVDV
A15 to A08
2.4 V
tRLCH
0.8 V
tAVRL
2.4V
tCLRH
2.4 V
0.8V
0.8 V
tRHAX
tRLDV
tRLRH
RD
2.4 V
0.8 V
tRLBL
tBHAV
2.4 V
BUFC
36
0.8 V
DS07-12531-4E
MB89630R Series
(7) Bus Write Timing
(VCC = 5.0 V±10%, FCH = 10 MHz, AVSS = VSS= 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Valid address → ALE ↓ time tAVLL
Pin name
ALE ↓ time → address loss
time
tLLAX
AD7 to AD0,
ALE
A15 to A08
Valid address → WR ↓ time
tAVWL
WR, ALE
WR pulse width
tWLWH
WR
Write data → WR ↑ time
tDVWH
AD7 to AD0, WR
WR ↑ → address loss time
tWHAX
WR, A15 to A08
WR ↑ → data hold time
tWHDX
AD7 to AD0, WR
WR ↑ → ALE ↑ time
tWHLH
WR, ALE
WR ↓ → CLK ↑ time
tWLCH
CLK ↓ → WR ↑ time
tCLWH
ALE pulse width
tLHLL
ALE
ALE ↓ → CLK ↑ time
tLLCH
ALE,CLK
Condition
Value
Max.
1/4 tinst*1 – 64 ns*2
—
μs
5
—
ns
1/4 tinst*1 – 60 ns*2
—
μs
1
2
—
μs
1
2
1/2 tinst* – 60 ns*
—
μs
1/4 tinst*1 – 40 ns*2
—
μs
1/4 tinst*1 – 40 ns*2
1/2 tinst* – 20 ns*
—
—
μs
1
2
—
μs
1
2
—
μs
—
ns
—
μs
—
μs
1/4 tinst* – 40 ns*
1/4 tinst* – 40 ns*
WR, CLK
Unit Remarks
Min.
0
1/4 tinst*1 – 35 ns*2
1
2
1/4 tinst* – 30 ns*
*1: For information on tinst, see “(4) Instruction Cycle”.
*2: This characteristics are also applicable to the bus read timing.
2.4 V
CLK
0.8 V
tLHLL
ALE
tWHLH
2.4 V
0.8 V
0.8 V
tAVLL
AD7 to AD0
tLLCH
tLLAX
2.4 V 2.4 V
2.4 V
0.8 V 0.8 V
0.8 V
2.4 V
0.8 V
tDVWH
A15 to A08
2.4 V
tWHDX
2.4 V
tCLWH
tWLCH
0.8 V
0.8 V
tWHAX
tAVWL
tWLWH
WR
2.4 V
0.8V
DS07-12531-4E
37
MB89630R Series
(8) Ready Input Timing
(VCC = 5.0 V±10%, FCH = 10 MHz, AVSS = VSS= 0.0 V, TA = –40°C to +85°C)
Symbol
Parameter
RDY valid → CLK ↑ time
tYVCH
CLK ↑ → RDY loss time
tCHYX
Pin name
Condition
RDY, CLK
—
Value
Unit
Remarks
Min.
Max.
60
—
ns
*
0
—
ns
*
* : This characteristics are also applicable to the read cycle.
CLK
2.4 V
2.4 V
ALE
AD7 to AD0
Address
Data
A15 to A08
WR
tYVCH tCHYX
RDY
tYVCH
tCHYX
Note: The bus cycle is also extended in the read cycle in the same manner.
38
DS07-12531-4E
MB89630R Series
(9) Serial I/O Timing
(VCC = 5.0 V±10%, FCH = 10 MHz, AVSS = VSS= 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Pin name
Condition
Value
Unit Remarks
Min.
Max.
2 tinst*
—
μs
–200
200
ns
1/2 tinst*
—
μs
1/2 tinst*
—
μs
Serial clock cycle time
tSCYC
SCK1, UCK1,
UCK2
SCK1 ↓ → SO1 time
UCK1 ↓ → UO1 time
UCK2 ↓ → UO2 time
tSLOV
SCK1, SO1
UCK1, UO1
UCK2, UO2
Valid SI1 → SCK1 ↑
Valid UI1 → UCK1 ↑
Valid UI2 → UCK2 ↑
tIVSH
SI1, SCK1
UI1, UCK1
UI2, UCK2
SCK1 ↑ → valid SI1 hold time
UCK1 ↑ → valid UI1 hold time tSHIX
UCK2 ↑ → valid UI2 hold time
SCK1, SI1
UCK1, UI1
UCK2, UI2
Serial clock “H” pulse width
tSHSL
SCK1, UCK1,
UCK2
1 tinst*
—
μs
Serial clock “L” pulse width
tSLSH
SCK1, UCK1,
UCK2
1 tinst*
—
μs
SCK1 ↓ → SO1 time
UCK1 ↓ → UO1 time
UCK2 ↓ → UO2 time
tSLOV
SCK1, SO1
UCK1, UO1
UCK2, UO2
0
200
ns
Valid SI1 → SCK1 ↑
Valid UI1 → UCK1 ↑
Valid UI2 → UCK2 ↑
tIVSH
SI1, SCK1
UI1, UCK1
UI2, UCK2
1/2 tinst*
—
μs
SCK1 ↓ → valid SI1 hold time
UCK1 ↓ → valid UI1 hold time tSHIX
UCK2 ↓ → valid UI2 hold time
SCK1, SI1
UCK1, UI1
UCK2, UI2
1/2 tinst*
—
μs
Internal
shift clock
mode
External
shift clock
mode
* : For information on tinst, see “(4) Instruction Cycle”.
DS07-12531-4E
39
MB89630R Series
• Internal shift clock mode
tSCYC
SCK1
UCK1
UCK2
2.4 V
0.8 V
0.8 V
tSLOV
2.4 V
SO1
UO1
UO2
0.8 V
tIVSH
SI1
UI1
UI2
tSHIX
0.8 VCC
0.8 VCC
0.2 VCC
0.2 VCC
• External shift clock mode
tSHSL
tSLSH
SCK1
UCK1
UCK2
0.8 VCC
0.2 VCC
0.8 VCC
0.2 VCC
tSLOV
SO1
UO1
UO2
2.4 V
0.8 V
tIVSH
SI1
UI1
UI2
40
tSHIX
0.8 VCC
0.8 VCC
0.2 VCC
0.2 VCC
DS07-12531-4E
MB89630R Series
(10) Peripheral Input Timing
(VCC = 5.0 V±10%, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Peripheral input “H” pulse width 1
tILIH1
Peripheral input “L” pulse width 1
tIHIL1
Peripheral input “H” pulse width 2
tILIH2
Peripheral input “L” pulse width 2
tIHIL2
Peripheral input “H” pulse width 3
tILIH3
Peripheral input “L” pulse width 3
tIHIL3
Pin name
PWC, INT0 to INT3,EC
ADST
ADST
Value
Unit
Remarks
Min.
Max.
2 tinst*
—
μs
2 tinst*
—
μs
8 inst
2 t *
—
μs
A/D mode
28 tinst*
—
μs
A/D mode
28 tinst*
—
μs
Sense mode
8 inst
—
μs
Sense mode
2 t *
* : For information on tinst, see “(4) Instruction Cycle”.
tIHIL1
PWC,
EC,
INT0 to INT3
tILIH1
0.8 VCC
0.2 VCC
0.8 VCC
0.2 VCC
tIHIL2
(tIHIL3)
tILIH2
(tILIH3)
ADST
0.8 VCC
0.2 VCC
DS07-12531-4E
0.8 VCC
0.2 VCC
41
MB89630R Series
5. A/D Converter Electrical Characteristics
(AVCC = VCC = 3.5 V to 6.0 V, FCH = 10 MHz, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Pin
name
Resolution
Linearity error
—
Differential linearity error
—
Total error
Zero transition voltage
VOT
Full-scale transition
voltage
VFST
—
Analog port input current
IAIN
Analog input voltage
Reference voltage
supply current
42
AN0 to
AN7
—
Reference voltage
IR
Typ.
Max.
—
—
10
bit
—
—
±2.0
LSB
—
—
±1.5
LSB
—
—
±3.0
LSB
AN0 to
AN7
AVR – 3.5 LSB AVR – 1.5 LSB AVR + 0.5 LSB
—
—
Unit
Min.
AVSS – 1.5 LSB AVSS + 0.5 LSB AVSS + 2.5 LSB
Interchannel disparity
A/D mode conversion time
Value
Remarks
At AVCC = VCC
V
V
—
—
4
LSB
—
13.2
—
μs
—
—
10
μA
0.0
—
AVR
V
0.0
—
AVCC
V
—
200
⎯
At 10 MHz
oscillation
μA AVR = 5.0 V
DS07-12531-4E
MB89630R Series
6. A/D Converter Glossary
• Resolution
Analog changes that are identifiable with the A/D converter
• Linearity error
The deviation of the straight line connecting the zero transition point (“00 0000 0000” ↔ “00 0000 0001”) with
the full-scale transition point (“11 1111 1110” ↔ “11 1111 1111”) from actual conversion characteristics
• Differential linearity error
The deviation of input voltage needed to change the output code by 1 LSB from the theoretical value
• Total error (unit: LSB)
The difference between theoretical and actual conversion values caused by the zero transition error, full-scale
transition error, linearity error, quantization error, and noise
Total error
Theoretical I/O characteristics
3FF
3FF
VFST
3FE
3FE
3FD
1.5 LSB
Digital output
Digital output
3FD
004
003
Actual conversion
value
{1 LSB × N + 0.5 LSB}
004
VNT
003
VOT
002
Actual conversion
value
002
1 LSB
Theoretical value
001
001
0.5 LSB
AVR
AVSS
Analog input
1 LSB =
VFST – VOT
1022
AVR
AVSS
Analog input
(V)
Digital output N total error = VNT – {1 LSB × N + 0.5 LSB}
1 LSB
(Continued)
DS07-12531-4E
43
MB89630R Series
(Continued)
Zero transition error
Full-scale transition error
004
Theoretical value
Actual conversion
value
3FF
Actual conversion
value
Digital output
Digital output
003
002
3FE
VFST
(Actual
measurement)
3FD
Actual conversion
value
001
Actual conversion value
3FC
VOT (Actual measurement)
AVR
AVSS
Analog input
Differential linearity error
Linearity error
Theoretical value
3FF
Actual conversion
value
3FE
N+1
{1 LSB × N + VOT}
Actual conversion
value
VNT
VFST
(Actual
measurement)
004
Digital output
3FD
Digital output
AVR
AVSS
Analog input
V(N + 1)T
N
N-1
003
VNT
Actual conversion value
Actual conversion value
002
Theoretical value
001
N-2
VOT (Actual measurement)
AVR
AVSS
Analog input
Digital output N linearity error =
44
VNT - {1 LSB × N + V OT }
1 LSB
AVR
AVSS
Analog input
Digital output N differential linearity error =
V(N + 1)T - V NT
1 LSB
-1
DS07-12531-4E
MB89630R Series
7. Notes on Using A/D Converter
• Input impedance of the analog input pins
The output impedance of the external circuit for the analog input must satisfy the following conditions.
If the output impedance of the external circuit is too high, an analog voltage sampling time might be insufficient
(sampling time = 6 μs at 10 MHz oscillation.) Therefore, it is recommended to keep the output impedance of the
external circuit below 10 kΩ.
• Analog input circuit model
Analog input
C0
Converter
RON1
RON2
C1
RON1:
RON2:
C0:
C1:
Approx. 1.5 kΩ
Approx. 1.5 kΩ
Approx. 60 pF
Approx. 4 pF
Note: The values mentioned here should be used as a guideline.
• Error
The smaller the | AVR–AVss |, the greater the error would become relatively.
DS07-12531-4E
45
MB89630R Series
■ CHARACTERISTICS EXAMPLE
(2) “H” Level Output Voltage
(1) “L” Level Output Voltage
VOL vs. IOL
VOL (V)
VCC = 3.0 V
VCC = 4.0 V
TA = +25°C
0.5
VCC = 5.0 V
VCC - VOH vs. IOH
VCC - VOH (V)
1.0
0.9
TA = +25°C
VCC = 2.5 V
0.8
0.7
0.4
VCC = 6.0 V
0.3
0.6
VCC = 3.0 V
0.5
VCC = 4.0 V
VCC = 5.0 V
VCC = 6.0 V
0.4
0.2
0.3
0.2
0.1
0.1
0
1
2
3
4
5
6
7
8
9
0.0
0.0
10
IOL (mA)
(3) “H” Level Input Voltage/“L” Level Input
Voltage (CMOS Input)
–0.5
–1.0
VIN vs. VCC
–2.5
TA = +25°C
VIHS
4.0
4.5
3.5
4.0
3.0
3.5
2.5
3.0
2.0
2.5
1.5
2.0
1.0
1.5
0.5
1.0
0.0
VILS
0
0.5
0.0
1
2
3
4
5
6
7
VCC (V)
–3.0
IOH (mA)
VIN vs. VCC
4.5
TA = +25°C
0
–2.0
(4) “H” Level Input Voltage/“L” Level Input
Voltage (Hysteresis Input)
VIN (V)
5.0
VIN (V)
5.0
–1.5
1
2
3
4
5
6
7
VCC (V)
VIHS: Threshold as the input voltage in hysteresis
characteristics is set to “H” level
VILS: Threshold as the input voltage in hysteresis
characteristics is set to “L” level
46
DS07-12531-4E
MB89630R Series
(5) Power Supply Current (External Clock)
ICC1 vs. VCC, ICC2 vs. VCC
ICC (mA)
16
ICCS (mA)
5.0
FCH = 10MHz
TA = +25°C
14
Divide by 4
(ICC1)
4.0
3.5
10
3.0
8
2.5
Divide by 4
(ICCS1)
2.0
6
Divide by 8
1.5
Divide by 16
1.0
Divide by 64
(ICC2)
6.0 6.5
VCC (V)
0.5
4
2
2.5
3.0
3.5
4.0
4.5
5.0
5.5
ICCL vs. VCC
ICCL (μA)
200
TA = +25°C
180
0
2.0
40
35
120
30
100
25
80
20
60
15
40
10
20
5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
VCC (V)
Divide by 16
Divide by 64
(ICCS2)
2.5
3.0
3.5
4.0
4.5
5.0
0
2.0
5.5
6.0
6.5
VCC (V)
ICCLS vs. VCC
TA = +25°C
45
140
2.5
Divide by 8
ICCLS (μA)
50
160
0
2.0
FCH = 10MHz
TA = +25°C
4.5
12
0
2.0
ICCS1 vs. VCC, ICCS2 vs. VCC
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
VCC (V)
(Continued)
DS07-12531-4E
47
MB89630R Series
(Continued)
I CCT vs. V CC
I CCT (μA)
20
TA = +25°C
18
1.6
14
1.4
12
1.2
10
1.0
8
0.8
6
0.6
4
0.4
2
0.2
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
TA = +25°C
1.8
16
0
2.0
I CCH vs. V CC
I CCH (μA)
2.0
6.5
V CC (V)
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
V CC (V)
(6) Pull-up Resistance
R PULL vs. V CC
R PULL (kΩ)
1000
TA = +25°C
100
10
1
48
2
3
4
5
6
V CC (V)
DS07-12531-4E
MB89630R Series
■ MASK OPTIONS
Part number
MB89635R
MB89636R
MB89637R
MB89P637
MB89PV630
Specifying procedure
Specify when
ordering
masking
Set with EPROM
programmer
Setting not possible
No.
1
Pull-up resistors
P00 to P07, P10 to P17,
P30 to P37, P40 to P43,
P50 to P53, P72 to P74
2
Power-on reset selection
With power-on reset
Without power-on reset
Selectable
Setting possible
Fixed to “with power-on reset”
3
Selection of the main clock
oscillation stabilization time
(at 10 MHz)
218/FCH (Approx. 26.2 ms)
217/FCH (Approx. 13.1 ms)
214/FCH (Approx. 1.6 ms)
24/FCH (Approx. 1.6 μs)
FCH : Main clock frequency
Selectable
Setting possible
Fixed to 218/FCH
(Approx. 26.2 ms)
4
Reset pin output
Reset output provided
No reset output
Selectable
Setting possible
Fixed to “with reset output”
5
Single/dual-clock system option
Single clock
Dual clock
Selectable
Setting possible
Selectable by
Can be set per pin*
pin
Fixed to “without pull-up
resistor”
MB89PV630-101 Single-clock system
MB89PV630-102 Dual-clock systems
* : For P50 to P53, fixed to "Without pull-up resistor."
DS07-12531-4E
49
MB89630R Series
■ ORDERING INFORMATION
Part number
MB89635RP-SH
MB89636RP-SH
MB89637RP-SH
MB89P637P-SH
Package
64-pin Plastic SH-DIP
(DIP-64P-M01)
MB89635RPF
MB89636RPF
MB89637RPF
MB89P637PF
64-pin Plastic QFP
(FPT-64P-M06)
MB89635RPMC
MB89636RPMC
MB89637RPMC
64-pin Plastic QFP
(FPT-64P-M23)
MB89PV630-101CF
MB89PV630-102CF
64-pin Ceramic MQFP
(MQP-64C-P01)
MB89PV630-101C
MB89PV630-102C
64-pin Ceramic MDIP
(MDP-64C-P02)
50
Remarks
DS07-12531-4E
MB89630R Series
■ PACKAGE DIMENSIONS
64-pin plastic SH-DIP
Lead pitch
1.778mm(70mil)
Package width ×
package length
17 × 58 mm
Sealing method
Plastic mold
Mounting height
5.65 mm MAX
(DIP-64P-M01)
64-pin plastic SH-DIP
(DIP-64P-M01)
Note: Pins width and pins thickness include plating thickness.
+0.22
+.009
58.00 –0.55 2.283 –.022
INDEX-1
17.00±0.25
(.669±.010)
INDEX-2
+0.70
4.95 –0.20
+.028
.195 –.008
+0.50
0.70 –0.19
+.020
.028 –.007
0.27±0.10
(.011±.004)
+0.20
3.30 –0.30
.130
+.008
–.012
1.378
.0543
C
+0.40
–0.20
+.016
–.008
1.778(.0700)
0.47±0.10
(.019±.004)
19.05(.750)
+0.50
0.25(.010)
M
2001-2008 FUJITSU MICROELECTRONICS LIMITED D64001S-c-4-6
1.00 –0
+.020
0~15
.039 –.0
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
DS07-12531-4E
51
MB89630R Series
64-pin plastic QFP
Lead pitch
1.00 mm
Package width ×
package length
14 × 20 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
3.35 mm MAX
Code
(Reference)
P-QFP64-14×20-1.00
(FPT-64P-M06)
64-pin plastic QFP
(FPT-64P-M06)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
24.70±0.40(.972±.016)
* 20.00±0.20(.787±.008)
51
0.17±0.06
(.007±.002)
33
32
52
18.70±0.40
(.736±.016)
*14.00±0.20
(.551±.008)
INDEX
Details of "A" part
+0.35
3.00 –0.20
+.014
.118 –.008
(Mounting height)
20
64
0~8°
1
19
1.00(.039)
0.42±0.08
(.017±.003)
0.20(.008)
+0.15
M
0.25 –0.20
1.20±0.20
(.047±.008)
+.006
.010 –.008
(Stand off)
"A"
0.10(.004)
C
2003-2008 FUJITSU MICROELECTRONICS LIMITED F64013S-c-5-6
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
52
DS07-12531-4E
MB89630R Series
64-pin plastic LQFP
Lead pitch
0.65 mm
Package width ×
package length
12.0 × 12.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Code
(Reference)
P-LFQFP64-12×12-0.65
(FPT-64P-M23)
64-pin plastic LQFP
(FPT-64P-M23)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
14.00±0.20(.551±.008)SQ
*12.00±0.10(.472±.004)SQ
48
0.145±0.055
(.0057±.0022)
33
49
32
0.10(.004)
Details of "A" part
+0.20
1.50 –0.10
+.008
(Mounting height)
.059 –.004
0.25(.010)
INDEX
0~8˚
64
17
1
"A"
16
0.65(.026)
0.32±0.05
(.013±.002)
0.13(.005)
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.10±0.10
(.004±.004)
(Stand off)
M
©2003-2008
FUJITSU
LIMITED F64034S-c-1-2
C
2003 FUJITSU
LIMITEDMICROELECTRONICS
F64034S-c-1-1
Dimensions in mm (inches).
Note: The values in parentheses are reference values
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
DS07-12531-4E
53
MB89630R Series
64-pin ceramic MQFP
Lead pitch
1.00 mm
Lead shape
Straight
Motherboard
material
Ceramic
Mounted package
material
Plastic
(MQP-64C-P01)
64-pin ceramic MQFP
(MQP-64C-P01)
18.70(.736)TYP
INDEX AREA
16.30±0.33
(.642±.013)
15.58±0.20
(.613±.008)
12.00(.472)TYP
+0.40
1.20 Ð0.20
.047
1.00±0.25
(.039±.010)
+.016
Ð.008
1.00±0.25
(.039±.010)
1.27±0.13
(.050±.005)
18.12±0.20
12.02(.473)
(.713±.008)
TYP
10.16(.400)
14.22(.560)
TYP
TYP
22.30±0.33
(.878±.013)
24.70(.972)
TYP
0.30(.012)
TYP
1.27±0.13
(.050±.005)
0.30(.012)TYP
18.00(.709)
TYP
0.40±0.10
(.016±.004)
7.62(.300)TYP
0.40±0.10
(.016±.004)
+0.40
1.20 Ð0.20
+.016
.047 Ð.008
9.48(.373)TYP
11.68(.460)TYP
0.50(.020)TYP
C
10.82(.426)
0.15±0.05 MAX
(.006±.002)
1994-2008 FUJITSU MICROELECTRONICS LIMITED M64004SC-1-4
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
(Continued)
54
DS07-12531-4E
MB89630R Series
(Continued)
64-pin ceramic MDIP
Lead pitch
1.778mm (70mil)
Row spacing
19.05mm (750mil)
Motherboard
material
Ceramic
Mounted
packing material
Plastic
(MDP-64C-P02)
64-pin ceramic MDIP
(MDP-64C-P02)
0°~9°
56.90±0.64
(2.240±.025)
15.24(.600)
TYP
18.75±0.30
(.738±.012)
INDEX AREA
2.54±0.25
(.100±.010)
33.02(1.300)REF
0.25±0.05
(.010±.002)
1.27±0.25
(.050±.010)
10.16(.400)MAX
1.778±0.25
(.070±.010)
C
19.05±0.30
(.750±.012)
+0.13
0.46 –0.08
+.005
.018 –.003
55.12(2.170)REF
0.90±0.13
(.035±.005)
1994-2008 FUJITSU MICROELECTRONICS LIMITED M64002SC-1-5
3.43±0.38
(.135±.015)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
DS07-12531-4E
55
MB89630R Series
■ MAIN CHANGES IN THIS EDITION
Page
49
Section
■ MASK OPTIONS
Change Results
Changed the explanation for "*" in "■ MASK OPTIONS".
The vertical lines marked in the left side of the page show the changes.
56
DS07-12531-4E
MB89630R Series
MEMO
DS07-12531-4E
57
MB89630R Series
MEMO
58
DS07-12531-4E
MB89630R Series
MEMO
DS07-12531-4E
59
MB89630R Series
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome,
Shinjuku-ku, Tokyo 163-0722, Japan
Tel: +81-3-5322-3329
http://jp.fujitsu.com/fml/en/
For further information please contact:
North and South America
FUJITSU MICROELECTRONICS AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94085-5401, U.S.A.
Tel: +1-408-737-5600 Fax: +1-408-737-5999
http://www.fma.fujitsu.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE. LTD.
151 Lorong Chuan,
#05-08 New Tech Park 556741 Singapore
Tel : +65-6281-0770 Fax : +65-6281-0220
http://www.fmal.fujitsu.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Pittlerstrasse 47, 63225 Langen, Germany
Tel: +49-6103-690-0 Fax: +49-6103-690-122
http://emea.fujitsu.com/microelectronics/
FUJITSU MICROELECTRONICS SHANGHAI CO., LTD.
Rm. 3102, Bund Center, No.222 Yan An Road (E),
Shanghai 200002, China
Tel : +86-21-6146-3688 Fax : +86-21-6335-1605
http://cn.fujitsu.com/fmc/
Korea
FUJITSU MICROELECTRONICS KOREA LTD.
206 Kosmo Tower Building, 1002 Daechi-Dong,
Gangnam-Gu, Seoul 135-280, Republic of Korea
Tel: +82-2-3484-7100 Fax: +82-2-3484-7111
http://kr.fujitsu.com/fmk/
FUJITSU MICROELECTRONICS PACIFIC ASIA LTD.
10/F., World Commerce Centre, 11 Canton Road,
Tsimshatsui, Kowloon, Hong Kong
Tel : +852-2377-0226 Fax : +852-2376-3269
http://cn.fujitsu.com/fmc/en/
Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose
of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS
does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating
the device based on such information, you must assume any responsibility arising out of such use of the information.
FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use
or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS
or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or
other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured
as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to
the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear
facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon
system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising
in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current
levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of
the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited: Sales Promotion Department